CN107557173A - A kind of Wafer Cleaning formula of liquid - Google Patents

A kind of Wafer Cleaning formula of liquid Download PDF

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Publication number
CN107557173A
CN107557173A CN201610511084.4A CN201610511084A CN107557173A CN 107557173 A CN107557173 A CN 107557173A CN 201610511084 A CN201610511084 A CN 201610511084A CN 107557173 A CN107557173 A CN 107557173A
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CN
China
Prior art keywords
parts
liquid
wafer cleaning
cleaning formula
water
Prior art date
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Pending
Application number
CN201610511084.4A
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Chinese (zh)
Inventor
崔敏娟
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Individual
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Individual
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Priority to CN201610511084.4A priority Critical patent/CN107557173A/en
Publication of CN107557173A publication Critical patent/CN107557173A/en
Pending legal-status Critical Current

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  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention discloses a kind of Wafer Cleaning formula of liquid, is prepared from the following raw materials in parts by weight:1~3 part of citric acid, 15~25 parts of neopelex, 6~10 parts of ethanol, 3~5 parts of triethanolamine, 1~3 part of hydrogen peroxide, remaining is water.A kind of Wafer Cleaning formula of liquid is simple to operation, has the characteristics of strong detergency, cleaning performance is good.

Description

A kind of Wafer Cleaning formula of liquid
Technical field
The present invention relates to photovoltaic art, more particularly to a kind of Wafer Cleaning formula of liquid.
Background technology
With the development of society, today of energy crisis getting worse, utilization new energy is increasingly by people Concern, solar energy due to its it is pollution-free, renewable, without region the advantages that, increasingly favored by people, solar energy The development of industry is more and more faster.It is and also more and more along with the maturation of solar photovoltaic industry, the use of silicon chip.
Cleaning one of production process of silicon chip the most, its whether clean performance to silicon chip cleaned have very big Influence.The main purpose of cleaning be in order to wash the caused grains of sand in cutting process, the cutting abrasive material of residual, metal ion and Fingerprint etc., silicon chip surface is set to reach the technical indicator such as corrosion-free, non-oxidation, noresidue.The Wafer Cleaning used on existing market There is the problem of cleaning performance difference in liquid, thus, be badly in need of solving.
The content of the invention
It is clear to solve existing silicon chip it is an object of the invention in view of the above-mentioned problems, provide a kind of Wafer Cleaning formula of liquid The problem of washing lotion cleaning performance difference.
The purpose of the present invention is to be achieved through the following technical solutions:
A kind of Wafer Cleaning formula of liquid, is prepared from the following raw materials in parts by weight:
1~3 part of citric acid, 15~25 parts of neopelex, 6~10 parts of ethanol, 3~5 parts of triethanolamine, dioxygen 1~3 part of water, remaining is water.
As a preferred embodiment of the present invention, 12 parts of citric acid, 20 parts of neopelex, 8 parts of ethanol, three second 4 parts of hydramine, 2 parts of hydrogen peroxide, remaining is water.
As a preferred embodiment of the present invention, the water is deionized water.
Beneficial effects of the present invention are that a kind of Wafer Cleaning formula of liquid is simple to operation, have strong detergency, cleaning The characteristics of effect is good.
Embodiment
Technical scheme is further illustrated below by embodiment.It is understood that this place The embodiment of description is used only for explaining the present invention, rather than limitation of the invention.
Embodiment 1
In the present embodiment, a kind of Wafer Cleaning formula of liquid, it is prepared from the following raw materials in parts by weight:
1 part of citric acid, 15 parts of neopelex, 6 parts of ethanol, 3 parts of triethanolamine, 1 part of hydrogen peroxide, remaining is to go Ionized water.
Embodiment 2
In the present embodiment, a kind of Wafer Cleaning formula of liquid, it is prepared from the following raw materials in parts by weight:
3 parts of citric acid, 25 parts of neopelex, 10 parts of ethanol, 5 parts of triethanolamine, 3 parts of hydrogen peroxide, remaining is Deionized water.
Embodiment 3
In the present embodiment, a kind of Wafer Cleaning formula of liquid, it is prepared from the following raw materials in parts by weight:
2 parts of citric acid, 20 parts of neopelex, 8 parts of ethanol, 4 parts of triethanolamine, 2 parts of hydrogen peroxide, remaining is to go Ionized water.
Above example is to elaborate the general principle and characteristic of the present invention, and the present invention is not limited by above-described embodiment, Without departing from the spirit and scope of the present invention, the present invention also has various change and change, and these changes and modifications all fall Enter in scope of the claimed invention.The claimed scope of the invention is defined by the following claims.

Claims (3)

  1. A kind of 1. Wafer Cleaning formula of liquid, it is characterised in that:It is prepared from the following raw materials in parts by weight:
    1~3 part of citric acid, 15~25 parts of neopelex, 6~10 parts of ethanol, 3~5 parts of triethanolamine, hydrogen peroxide 1 ~3 parts, remaining is water.
  2. A kind of 2. Wafer Cleaning formula of liquid according to claim 1, it is characterised in that:12 parts of citric acid, detergent alkylate 20 parts of sodium sulfonate, 8 parts of ethanol, 4 parts of triethanolamine, 2 parts of hydrogen peroxide, remaining is water.
  3. A kind of 3. Wafer Cleaning formula of liquid according to claim 1 or 2, it is characterised in that:The water is deionized water.
CN201610511084.4A 2016-06-30 2016-06-30 A kind of Wafer Cleaning formula of liquid Pending CN107557173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610511084.4A CN107557173A (en) 2016-06-30 2016-06-30 A kind of Wafer Cleaning formula of liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610511084.4A CN107557173A (en) 2016-06-30 2016-06-30 A kind of Wafer Cleaning formula of liquid

Publications (1)

Publication Number Publication Date
CN107557173A true CN107557173A (en) 2018-01-09

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ID=60969703

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610511084.4A Pending CN107557173A (en) 2016-06-30 2016-06-30 A kind of Wafer Cleaning formula of liquid

Country Status (1)

Country Link
CN (1) CN107557173A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108831966A (en) * 2018-07-06 2018-11-16 安徽腾奎智能科技有限公司 A kind of cleaning solution for photovoltaic cell board group

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108831966A (en) * 2018-07-06 2018-11-16 安徽腾奎智能科技有限公司 A kind of cleaning solution for photovoltaic cell board group

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WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180109