CN107530703B - Heating device and biochemical reactor with same - Google Patents
Heating device and biochemical reactor with same Download PDFInfo
- Publication number
- CN107530703B CN107530703B CN201580008295.XA CN201580008295A CN107530703B CN 107530703 B CN107530703 B CN 107530703B CN 201580008295 A CN201580008295 A CN 201580008295A CN 107530703 B CN107530703 B CN 107530703B
- Authority
- CN
- China
- Prior art keywords
- hole
- heating
- plate
- conducting layer
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L7/00—Heating or cooling apparatus; Heat insulating devices
-
- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
- C12M1/00—Apparatus for enzymology or microbiology
- C12M1/36—Apparatus for enzymology or microbiology including condition or time responsive control, e.g. automatically controlled fermentors
- C12M1/38—Temperature-responsive control
Abstract
A heating device and a biochemical reactor with the heating device are provided, the heating device comprises an upper plate, a lower plate, a middle plate and an electric heating element, the upper plate is provided with an upper heating hole, an upper containing hole and an upper conducting layer, the lower plate is provided with a lower heating hole, a lower containing hole and a first lower conducting layer, the middle plate is arranged between the upper plate and the lower plate and is provided with a middle heating hole and a middle containing hole, the upper, the middle and the lower containing holes are mutually communicated to form a containing through hole, the electric heating element is arranged in the containing through hole and is connected with the upper conducting layer and the first lower conducting layer by two ends thereof, so that the cracking of the electric heating element and the joints of the conducting layers due to thermal expansion and cold contraction is avoided, and the short circuit between the conducting layers is also avoided. The biochemical reactor comprises a first body with a first through hole; the second body is positioned below the first body and is provided with a second through hole; the heating device is arranged between the first body and the second body; the heating through hole is communicated with the first through hole and the second through hole to form a test tube groove for the test tube to extend into.
Description
Technical Field
The present invention relates to a temperature control device, and more particularly to a heating device and a biochemical reactor having the same.
Background
Many biochemical reactors have a heating device to make the biochemical reaction proceed in the test tube at a specific temperature, the heating device in the prior art mainly comprises a substrate, two conductive layers and a heating element, the substrate has at least one through hole for the test tube to extend into, and at least one containing hole is near the through hole for containing the heating element, the two conductive layers are covered on the part of the substrate and not communicated, the upper and lower ends of the heating element can be respectively connected with the two conductive layers by soldering tin, after the electricity is on, the heating element can convert the electric energy into heat energy, and then heats the test tube.
However, the solder connecting the heating element and the two conductive layers is often cracked due to stress caused by repeated thermal expansion and contraction for a long time, which affects the service life of the heating device; in addition, when welding operation is carried out, part of the soldering tin in a molten state can permeate into the pores between the heating element and the accommodating hole due to capillarity or gravity, when one end of the heating element is welded and the other end of the heating element is still in a partially molten state, because the pores are closed spaces, and the air temperature in the pores is reduced in the cooling process of the substrate, the volume is reduced, a vacuum suction force is formed in the pores to enable the part of the soldering tin in the molten state to be sucked into the pores, if the soldering tin at the two ends of the heating element is mutually connected in the pores, short circuit can occur between the two conducting layers, and the qualification rate of products is reduced.
DISCLOSURE OF THE INVENTION
The technical problem to be solved by the invention is to provide a heating device, which can improve the production yield and prolong the service life. Another object of the present invention is to provide a biochemical reactor, which can improve the yield and prolong the service life.
In order to achieve the above object, the present invention provides a heating device comprising an upper plate, a lower plate, a middle plate and an electric heating element; the upper plate is provided with an upper heating hole, at least one upper accommodating hole positioned beside the upper heating hole and an upper conducting layer, the upper conducting layer is provided with an upper part which covers the upper surface of the upper plate and surrounds the upper accommodating hole and an accommodating pipe part which covers the hole wall of the upper accommodating hole and is connected with the upper part of the upper conducting layer; the lower plate is provided with a lower heating hole, at least one lower containing hole positioned beside the lower heating hole and a first lower conducting layer, the first lower conducting layer is provided with a lower part which is covered on the lower surface of the lower plate and surrounds the lower containing hole and a containing pipe part which is covered on the hole wall of the lower containing hole and is connected with the lower part of the first lower conducting layer; the middle plate is arranged between the upper plate and the lower plate and is provided with a middle heating hole and at least one middle containing hole positioned beside the middle heating hole, wherein the upper heating hole, the middle heating hole and the lower heating hole are communicated with each other to form a heating through hole, and the upper containing hole, the middle containing hole and the lower containing hole are communicated with each other to form an containing through hole; the electric heating element is arranged in the accommodating through hole and is electrically connected with the upper conducting layer and the first lower conducting layer by two ends respectively.
In order to better achieve the above object, the present invention further provides a biochemical reactor having the heating device, the biochemical reactor is used for inserting a test tube and comprises a first body, a second body and a heating device disposed between the first body and the second body, the first body has a first through hole, the second body is disposed under the first body and has a second through hole, wherein the heating through hole is communicated with the first through hole and the second through hole to form a test tube slot for the test tube to extend into.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Brief description of the drawings
FIG. 1 is a perspective view of a heating apparatus according to a first embodiment of the present invention;
FIG. 2 is an exploded view of a heating device according to a first embodiment of the present invention;
FIG. 3 is a perspective view of a portion of an upper plate of the first embodiment of the present invention;
FIG. 4 is a perspective view of a partial midplane in accordance with a first embodiment of the present invention;
FIG. 5 is a perspective view of a portion of a lower plate of the first embodiment of the present invention;
FIG. 6 is a cross-sectional view of the heating apparatus of the first embodiment of the present invention as indicated by line A-A in FIG. 1;
FIG. 7 is a perspective view of a biochemical reactor according to the first embodiment of the present invention;
FIG. 8 is a cross-sectional view of the biochemical reactor of the first embodiment as viewed along line B-B in FIG. 7 according to the present invention;
fig. 9 is a sectional view of a heating apparatus according to a second embodiment of the present invention.
Wherein the reference numerals
1 heating device 27 lower through groove
10 upper plate 28 hole group
101 lower through groove of partition 29
11 upper surface 3 test tube
12 lower surface 30 middle plate
13 heating hole 301 middle partition plate
Upper surface of the upper receiving hole 31 of 14
15 lower surface of the conductive layer 32
151 upper portion 33 with heating holes therein
152 lower portion 34 contains a hole therein
153 conductive layer in the accommodation tube portion 35
154 heating the upper part of the tube part 351
17 upper through groove 352 lower part
18-hole group 353 heating tube part
19 upper through groove 37 middle through groove
2 biochemical reactor 4 first body
20 lower plate 40 electric heating element
201 lower partition 401 first through hole
21 upper surface 5 second body
22 lower surface 50 heated via
23 lower heating hole 501 second through hole
24 lower containing hole 6 test tube groove
25 first lower conductive layer 60 accommodating through-hole
251 upper part 7 heating device
252 lower part 70 upper plate
253 accommodating tube 701 insulation layer
26 second lower conductive layer 71 upper surface
261 upper part 80 lower plate
262 lower surface of lower portion 81
263 heating pipe part 90 middle plate
G gap
Best mode for carrying out the invention
The invention will be described in detail with reference to the following drawings, which are provided for illustration purposes and the like:
fig. 1 to 6 show a heating device 1 according to a first embodiment of the present invention, which includes an upper plate 10, a lower plate 20, a middle plate 30 and four electric heating elements 40.
First, referring to fig. 2, 3 and 6, the upper plate 10 is made of a heat conductive insulating material such as fiberglass resin, and has an upper surface 11, a lower surface 12, four upper heating holes 13, four upper accommodating holes 14 respectively located beside the upper heating holes 13, four upper conductive layers 15 and five upper through slots 17, each upper heating hole 13 and the upper accommodating hole 14 beside it form a hole group 18 as shown in fig. 2, so that the upper plate 10 of the present embodiment forms four hole groups 18; the upper conductive layer 15 can be made of copper or other material with good electrical and thermal conductivity, and has an upper portion 151 covering the upper surface 11 and surrounding the upper accommodating hole 14 and the upper heating hole 13, a lower portion 152 covering the lower surface 12 and surrounding the upper accommodating hole 14 and the upper heating hole 13, an accommodating tube portion 153 covering the wall of the upper accommodating hole 14 and connecting the upper portion 151 and the lower portion 152, and a heating tube portion 154 covering the wall of the upper heating hole 13 and connecting the upper portion 151 and the lower portion 152, wherein the upper portion 151 and the lower portion 152 are annular, but not limited thereto; the five upper through slots 17 are located on two sides of each hole group 18 one by one to separate the hole groups 18, an upper partition plate 101 is defined between every two upper through slots 17, so that the four hole groups 18 are located on the four upper partition plates 101, and the upper plate 10 further has an upper through slot 19 connected to one end of each upper through slot 17, in other words, three sides of each hole group 18 are surrounded by two upper through slots 17 and the upper through slot 19. In other embodiments, more than one upper accommodating hole 14 may be disposed beside one upper heating hole 13 without limitation.
Referring to fig. 2, 5 and 6, the lower plate 20 is made of a heat conductive insulating material such as fiberglass resin, and has an upper surface 21, a lower surface 22, four lower heating holes 23, four lower accommodating holes 24 respectively beside the lower heating holes 23, four first lower conductive layers 25, four second lower conductive layers 26 and five lower through slots 27, each of the lower heating holes 23 and the lower accommodating hole 24 beside it form a hole group 28, so that the lower plate 20 of the present embodiment forms four hole groups 28; the first lower conductive layer 25 can be made of copper or other material with good electrical and thermal conductivity, and has an upper portion 251 covering the upper surface 21 and surrounding the lower receiving hole 24, a lower portion 252 covering the lower surface 22 and surrounding the lower receiving hole 24, and a receiving tube 253 covering the hole wall of the lower receiving hole 24 and connecting the upper portion 251 and the lower portion 252; the second lower conductive layer 26 can be made of copper or other material with good electrical and thermal conductivity, and has an upper portion 261 covering the upper surface 21 and surrounding the lower heating hole 23, a lower portion 262 covering the lower surface 22 and surrounding the lower heating hole 23, and a heating tube portion 263 covering the wall of the lower heating hole 23 and connecting the upper portion 261 and the lower portion 262, wherein the lower portion 252 of the first lower conductive layer 25 also surrounds the lower portion 262 of the second lower conductive layer 26, and a gap G is formed between the lower portion 252 and the lower portion 262, the upper portion 251 of the first lower conductive layer 25 also surrounds the upper portion 261 of the second lower conductive layer 26, and a gap G is formed between the upper portion 251 and the upper portion 261, in other words, the first conductive layer 25 and the second conductive layer 26 are not connected, and the upper portion 251, the lower portion 252, the upper portion 261 and the lower portion 262 are annular, but not limited thereto; the five lower through grooves 27 are located at two sides of each hole group 28 one by one to separate the hole groups 28, a lower partition plate 201 is defined between every two lower through grooves 27, so that the four hole groups 28 are located at the four lower partition plates 201, and the lower plate 20 further has a lower through groove 29 connected to one end of each lower through groove 27, in other words, three sides of each hole group 28 are surrounded by two lower through grooves 27 and the lower through groove 29. In other embodiments, more than one lower accommodating hole 24 may be disposed beside a lower heating hole 23 without limitation.
Referring to fig. 2, 4 and 6, the middle plate 30 is made of a heat conductive insulating material such as fiberglass resin and is disposed between the upper plate 10 and the lower plate 20, the middle plate 30 has an upper surface 31, a lower surface 32, four middle heating holes 33, four middle accommodating holes 34 respectively located beside the middle heating holes 33, four middle conductive layers 35 and three middle through grooves 37; the middle conductive layer 35 can be made of copper or other material with good electrical and thermal conductivity, and has an upper portion 351 covering the upper surface 31 and surrounding the middle heating hole 33, a lower portion 352 covering the lower surface 32 and surrounding the middle heating hole 33, and a heating tube portion 353 covering the wall of the middle heating hole 33 and connecting the upper portion 351 and the lower portion 352, wherein the upper portion 351 and the lower portion 352 are generally annular but not limited thereto; one of the through slots 37 is elongated and located approximately corresponding to the upper through slot 19 and the lower through slot 29, and the other two through slots 37 are generally L-shaped and form a middle partition 301 together with the elongated through slot 37, and the middle heating holes 33 and the middle accommodating holes 34 are surrounded by the through slots 37. In other embodiments, more than one accommodating hole 34 may be disposed beside one central heating hole 33 without limitation, and the shape of the central through-grooves 37 may be changed according to the requirement. When the upper plate 10, the middle plate 30 and the lower plate 20 are sequentially stacked together, the upper heating hole 13, the middle heating hole 33 and the lower heating hole 23 are communicated with each other to form a heating through hole 50, the upper accommodating hole 14, the middle accommodating hole 34 and the lower accommodating hole 24 are communicated with each other to form an accommodating through hole 60, at this time, the lower portion 352 of the middle conducting layer 35 is connected with the upper portion 261 of the second lower conducting layer 26 to conduct heat and electricity, but is not connected with the upper portion 251 of the first lower conducting layer 25, and the upper portion 351 of the middle conducting layer 35 is connected with the lower portion 152 of the upper conducting layer 15 to conduct heat and electricity; in other embodiments, the surfaces of the upper, middle and second lower conductive layers may be covered with a solder mask layer, so that the conductive layers can conduct heat but not conduct electricity.
The four electric heating elements 40 are respectively disposed in the accommodating through holes 60, and two ends of the four electric heating elements are respectively electrically connected to the upper conductive layer 15 and the first lower conductive layer 25, in this embodiment, the electric heating element 40 is a resistive electric heater, and the upper end and the lower end of the electric heating element are electrically connected to the upper conductive layer 15 and the first lower conductive layer 25 by solder, in other embodiments, the type of the electric heating element 40 can be changed according to different requirements.
The present invention further provides a biochemical reactor 2 having the heating device 1 for inserting four test tubes 3, as shown in fig. 7 and 8, the biochemical reactor 2 further comprises a first body 4 and a second body 5, the heating device 1 is disposed between the first body 4 and the second body 5, the first body 4 has four first through holes 401, the second body 5 is disposed below the first body 4 and has four second through holes 501, wherein each of the heating through holes 50 is respectively communicated with the first through hole 401 above and the second through hole 501 below the heating through hole to form a test tube slot 6, so that the biochemical reactor 2 has four test tube slots 6 for inserting the four test tubes 3, and the number of the test tubes 3 can be changed according to the requirement in other embodiments.
Thus, the heating device 1 can provide heat energy by the electric heating element 40 and transmit the heat energy to the heating through hole 50, so as to maintain a local portion of the test tube 3 within a stable temperature range for biochemical reaction, and for this purpose, a power source (not shown) can utilize the upper conductive layer 15 and the first lower conductive layer 15 to supply power to the electric heating element 40, the electric heating element 40 converts electric energy into heat energy, and transmits the heat energy to the heating through hole 50 through the solder, the air in the accommodating through hole 60, the upper conductive layer 15, the middle conductive layer 35, the first lower conductive layer 25, the second lower conductive layer 26, the upper plate 10, the middle plate 30 and the lower plate 20. Wherein the lower portion 152 of the upper conductive layer 15 surrounding the upper receiving hole 14 is for further assisting the heat conduction of the upper plate 10, and is optionally omitted in other embodiments; the upper portion 251 of the first lower conductive layer 25 is for further assisting the heat conduction of the lower plate 20, in other embodiments, the upper portion 251 may optionally surround only the lower receiving hole 24 and not the lower heating hole 23, even though the upper portion 251 may be omitted; thus, the heating through hole 50 can obtain a uniform heating temperature, and further, the local portions of the test tubes 3 can be maintained in a stable temperature range for biochemical reaction. In fact, the conductive layer can be omitted except for the upper portion 151 and the receiving pipe portion 153 of the upper conductive layer 15, and the receiving pipe portion 253 and the lower portion 252 of the first lower conductive layer 25, and the heat conduction effect of the omitted heating device is inevitably worse than before.
Because the upper through grooves 17 of the upper plate 10 make the upper partition plates 101 have elasticity, it can absorb the stress when the electric heating element 40 expands with heat and contracts with cold, it can effectively reduce the probability of the crack of the welding joint of the electric heating element 40 and the upper conductive layer 15, thus prolonging the service life of the heating device 1, and the upper through grooves 19 can further increase the elastic deformation of the upper partition plates 10, but because the upper plate 10 itself has elasticity, it can absorb the stress when the electric heating element 40 expands with heat and contracts with cold, so the upper through grooves 17 and the upper through grooves 19 can be omitted as appropriate; on the other hand, since the upper through grooves 17 separate the hole groups 18, the heat of the electric heating element 40 in each upper partition 101 is not dissipated to other upper partitions 101, so as to ensure that each upper heating hole 13 can have a uniform and stable heating effect, and the upper through grooves 17 can be omitted. Similarly, the through grooves 27, the through grooves 29 and the lower partitions 201 of the lower plate 20 also have the same functions as described above, and therefore, the description thereof will not be repeated.
In addition, the design of the through slots 37 surrounding the middle heating holes 33 and the middle accommodating holes 34 can make the heat generated by each electric heating element 40 substantially remain in the middle partition 301 without being dissipated to other areas of the middle plate 30, so that the temperature between the middle heating holes 33 can be maintained uniform, but the through slots 37 can be omitted.
The upper plate 10, the middle plate 30, and the lower plate 20 of the heating device 1 are manufactured by using the prior art printed circuit board process, and not only are the manufacturing process fast and the overall structure light, but also the upper plate 10, the middle plate 30, and the lower plate 20 can be locked together by a plurality of bolts after being sequentially stacked, or can be adhered together by using glue layers such as double-sided adhesive tape, and the upper plate 10, the middle plate 30, and the lower plate 20 (hereinafter referred to as assembly plates) after being sequentially combined can also be arranged in the biochemical reactor 2 in an upside-down manner in other embodiments. Because there are still gaps between the plates, when the two ends of the electric heating element 40 are welded, the receiving through hole 60 is not a closed space, so that during the cooling process of the soldering tin, the air in the receiving through hole 60 will not generate vacuum suction force due to temperature reduction and volume reduction to suck the unsolidified soldering tin into the pores between the electric heating element 40 and the receiving through hole 60, thereby avoiding the short circuit caused by the mutual connection of the soldering tin at the two ends of the electric heating element 40, even if the melted soldering tin infiltrates into the pores due to capillary phenomenon or gravity, because the soldering tin only has adhesive force with the conductive layer and the wall of the receiving hole 34 has no conductive layer, the soldering tin will only infiltrate into the upper receiving hole 14 covered with the upper conductive layer 15 and the lower receiving hole 24 covered with the first lower conductive layer 25, and will not further infiltrate into the receiving hole 34, thereby further avoiding the soldering tin at the two ends of the electric heating element 40 from being connected together, avoiding the occurrence of electrical short circuit, thereby effectively improving the product percent of pass.
The material of the upper plate 10, the middle plate 30 and the lower plate 20 can be changed, as shown in fig. 9, which is the heating device 7 according to the second embodiment of the present invention, the upper plate 70, the middle plate 90 and the lower plate 80 are formed by coating an insulating layer 701 on the outside of an electrically conductive material, such as aluminum or iron, so as to have high thermal conductivity; since each board has better heat conductivity than an insulating material, a partial conductive layer can be selectively omitted to simplify the process, for example, the upper conductive layer 15 can omit the heating pipe portion 154, a portion of the upper portion 151 surrounding the upper heating hole 13, or the lower portion 152, the second lower conductive layer 26 can omit the heating pipe portion 263, the upper portion 261, or the lower portion 262, the first lower conductive layer 25 can omit a portion of the lower portion 252, the upper portion 251 surrounding the second lower conductive layer 26, the middle conductive layer 35 can omit the heating pipe portion 353, the upper portion 351, or the lower portion 352, in this embodiment, even if each board does not have the partial conductive layer, the heat generated by the heating element 40 can still be effectively transferred to the heating through hole 50, but the heating device 7 still needs to be electrically connected to the heating element 40 by solder having a conductive function, so the upper conductive layer 15 disposed on the upper board 70 includes the upper portion 151 and the receiving pipe portion 153, the first lower conductive layer 25 disposed on the lower plate 80 includes a lower portion 252 and a receiving tube portion 253.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. A heating device, comprising:
the upper conductive layer is provided with an upper part which covers the upper surface of the upper plate, surrounds the upper accommodating hole, and covers the hole wall of the upper accommodating hole and is connected with the upper part of the upper conductive layer;
a heat-conducting lower plate, which is provided with a lower heating hole, at least one lower containing hole positioned beside the lower heating hole, a first lower conducting layer conducting electricity and heat, and a lower containing pipe part, wherein the lower conducting layer is provided with a lower part covering the lower surface of the lower plate and surrounding the lower containing hole, and the lower containing pipe part covers the hole wall of the lower containing hole and is connected with the lower part of the first lower conducting layer;
a heat conducting middle plate arranged between the upper plate and the lower plate, wherein the middle plate is provided with a middle heating hole and at least one middle containing hole positioned beside the middle heating hole;
the upper, middle and lower heating holes are communicated with each other to form a heating through hole, and the upper, middle and lower accommodating holes are communicated with each other to form an accommodating through hole; and
and the electric heating element is arranged in the accommodating through hole, two ends of the electric heating element are respectively and electrically connected with the upper conducting layer and the first lower conducting layer, and the heat of the electric heating element is conducted to a heated element in the heating through hole through the upper plate, the middle plate and the lower plate.
2. The heating apparatus as claimed in claim 1, wherein the upper conductive layer further has an upper portion surrounding the upper heating hole, the upper conductive layer further has a lower portion overlying the lower surface of the upper plate and surrounding the upper heating hole, an upper heating tube portion overlying the wall of the upper heating hole and connecting the upper and lower portions of the upper conductive layer; the lower plate is also provided with a second lower conducting layer, the second lower conducting layer is provided with a lower part which covers the lower surface of the lower plate and surrounds the lower heating hole, an upper part which covers the upper surface of the lower plate and surrounds the lower heating hole, a lower heating pipe part which covers the hole wall of the lower heating hole and is connected with the upper part and the lower part of the second lower conducting layer, the lower part of the first lower conducting layer also surrounds the lower part of the second lower conducting layer, and a gap is arranged between the lower part of the first lower conducting layer and the lower part of the second lower conducting layer; the middle plate is also provided with a middle conducting layer, the middle conducting layer is provided with an upper part which covers the upper surface of the middle plate and surrounds the middle heating hole, a lower part which covers the lower surface of the middle plate and surrounds the middle heating hole, and a middle heating pipe part which covers the hole wall of the middle heating hole and is connected with the upper part and the lower part of the middle conducting layer.
3. The heating apparatus of claim 2, wherein the lower portion of the upper conductive layer further surrounds the upper receiving hole and is connected to the upper receiving tube.
4. The heating apparatus as claimed in claim 2, wherein the first lower conductive layer further has an upper portion covering the upper surface of the lower plate and surrounding the lower receiving hole, the upper portion being connected to the lower receiving pipe portion, the upper portion of the first lower conductive layer further surrounding the upper portion of the second lower conductive layer, and a gap is provided between the upper portion of the first lower conductive layer and the upper portion of the second lower conductive layer.
5. The heating apparatus according to claim 1, wherein the upper plate has a plurality of the upper heating holes, each of the upper heating holes has at least one of the upper receiving holes beside it, each of the upper heating holes forms a hole group with the upper receiving hole beside it, the upper plate is formed into a plurality of hole groups, and the upper plate has a plurality of upper through grooves for separating the plurality of hole groups.
6. The heating apparatus of claim 1, wherein the lower plate has a plurality of the lower heating holes, each of the lower heating holes has at least one of the lower receiving holes beside it, each of the lower heating holes forms a hole group with the lower receiving hole beside it, the lower plate forms a plurality of hole groups together, and the lower plate has a plurality of lower through grooves separating the plurality of hole groups.
7. The heating apparatus as claimed in claim 1, wherein the middle plate has a plurality of the middle heating holes, each of the middle heating holes has at least one of the middle accommodating holes beside it, and the middle plate further has a plurality of middle through grooves, each of the middle heating holes and the middle accommodating hole beside it form a hole group, and the hole group is surrounded by the middle through grooves.
8. The heating apparatus as claimed in claim 1, wherein the upper, middle and lower plates are made of a heat conductive and electrically insulating material, or are formed by coating a heat conductive and electrically insulating layer in an electrically conductive material.
9. A biochemical reactor for inserting a test tube, comprising:
a first body having a first through hole;
the second body is positioned below the first body and is provided with a second through hole;
a heating device as claimed in any one of claims 1 to 8, provided between the first and second bodies;
wherein, the heating through hole is communicated with the first through hole and the second through hole to form a test tube groove for the test tube to extend into.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/074208 WO2016145573A1 (en) | 2015-03-13 | 2015-03-13 | Heating device and biochemical reactor having same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107530703A CN107530703A (en) | 2018-01-02 |
| CN107530703B true CN107530703B (en) | 2020-02-07 |
Family
ID=56918197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580008295.XA Active CN107530703B (en) | 2015-03-13 | 2015-03-13 | Heating device and biochemical reactor with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107530703B (en) |
| WO (1) | WO2016145573A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102423452B1 (en) * | 2017-09-19 | 2022-07-20 | 제네리치 바이오테크놀로지 코포레이션 | Heating apparatus of biochemical reaction device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102791847A (en) * | 2010-01-12 | 2012-11-21 | 阿赫姆生物系统公司 | Three-stage thermal convection apparatus and uses thereof |
| CN103228360A (en) * | 2010-12-01 | 2013-07-31 | 精工爱普生株式会社 | Thermal cycler and thermal cycle method |
| US20130260421A1 (en) * | 2012-03-30 | 2013-10-03 | Seiko Epson Corporation | Thermal cycler and control method of thermal cycler |
| CN104293662A (en) * | 2014-09-10 | 2015-01-21 | 瑞基海洋生物科技股份有限公司 | Biochemical reactor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2003055973A1 (en) * | 2001-12-26 | 2005-05-12 | オリンパス株式会社 | Reaction vessel and reaction vessel holding mechanism |
| CN200960457Y (en) * | 2006-10-26 | 2007-10-17 | 深圳迈瑞生物医疗电子股份有限公司 | Solid directly-heated reacting disc structure |
| KR20090110161A (en) * | 2008-04-17 | 2009-10-21 | 이상수 | Electric incense burner |
-
2015
- 2015-03-13 CN CN201580008295.XA patent/CN107530703B/en active Active
- 2015-03-13 WO PCT/CN2015/074208 patent/WO2016145573A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102791847A (en) * | 2010-01-12 | 2012-11-21 | 阿赫姆生物系统公司 | Three-stage thermal convection apparatus and uses thereof |
| CN103228360A (en) * | 2010-12-01 | 2013-07-31 | 精工爱普生株式会社 | Thermal cycler and thermal cycle method |
| US20130260421A1 (en) * | 2012-03-30 | 2013-10-03 | Seiko Epson Corporation | Thermal cycler and control method of thermal cycler |
| CN104293662A (en) * | 2014-09-10 | 2015-01-21 | 瑞基海洋生物科技股份有限公司 | Biochemical reactor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107530703A (en) | 2018-01-02 |
| WO2016145573A1 (en) | 2016-09-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9907117B2 (en) | Heating device and biochemical reactor having the same | |
| US9538692B2 (en) | Integrated heat exchanger and power delivery system for high powered electronic modules | |
| CN103796488A (en) | Cooling apparatus for an electrical substrate | |
| CN105472865B (en) | Circuit board including heat transfer structure | |
| EP2690656B1 (en) | Power device insulating heat radiation structure and circuit board | |
| JP2015152218A (en) | fluid heating device | |
| CN102202459A (en) | PCB (printed circuit board) with metal micro radiator | |
| CN102164453A (en) | Circuit module | |
| CN107530703B (en) | Heating device and biochemical reactor with same | |
| US20160308106A1 (en) | Floating heat sink support with copper sheets and led package assembly for led flip chip package | |
| CN102163910B (en) | Power module and electronic apparatus using power module | |
| CN113133261B (en) | Heat dissipation device, circuit board assembly and electronic equipment | |
| JP2014120549A (en) | Insulation heat radiation substrate and circuit module using the same | |
| KR20130006003A (en) | Apparatus for heating fluid | |
| TWM503946U (en) | Heating device and bioreactor having the same | |
| CN213280199U (en) | Multilayer PCB substrate with local heat dissipation enhancement and electrical connection optimization | |
| CN104124213A (en) | Method for balancing stress on DBC (Direct Bonding Copper) board and DBC board package structure | |
| US20170089650A1 (en) | Flexible heat transfer structure | |
| CN108135075A (en) | A kind of high heat conduction printed circuit board | |
| CN214705908U (en) | Power module, motor controller, power electronic device and new energy automobile | |
| JP2015162294A (en) | electrochemical device | |
| CN102130571B (en) | Power supply package and device thereof | |
| US20240098878A1 (en) | Pin-fin cooling for printed circuit boards (pcbs) | |
| TWI599285B (en) | Circuit board structure with chip embedded therein and power module | |
| TW200539789A (en) | Heat conductive base plate device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |