CN107529539A - A kind of LED lamp chip encapsulation material - Google Patents
A kind of LED lamp chip encapsulation material Download PDFInfo
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- CN107529539A CN107529539A CN201710587693.2A CN201710587693A CN107529539A CN 107529539 A CN107529539 A CN 107529539A CN 201710587693 A CN201710587693 A CN 201710587693A CN 107529539 A CN107529539 A CN 107529539A
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- led lamp
- encapsulation material
- chip encapsulation
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Abstract
The present invention relates to a kind of LED lamp chip encapsulation material, it is made up of the component of following mass fraction：Rubber powder is 15~19 parts, 6~12 parts of methyl phenyl vinyl polysiloxanes, tetraethyl orthosilicate are 4~8 parts, phenyl polysiloxane is 18~22 parts, castor oil is 8~10 parts, aluminium hydroxide is 3~5 parts.The present invention significantly improves the refractive index, hardness and adhesion strength of light emitting diode by being optimized to the material of Light-Emitting Diode.The refractive index of LED lamp chip encapsulation material that the method for the present invention is prepared is 1.64 to 1.68, and shore hardness is 64A to 70A, and adhesion strength is 6.6MPa to 7.2MPa.
Description
Technical field
The present invention relates to a kind of LED lamp chip encapsulation material, belong to LED technology field.
Background technology
LED is new generation of green environment-friendly products, is widely used in automobile, illumination, electronic equipment backlight, traffic lights etc.
Field.In order to protect chip, prevent the undesirable element of external environment condition from being caused damage to chip, extend LED service life, to it
Chip is packaged.
The content of the invention
It is an object of the invention to provide a kind of LED lamp chip encapsulation material, preferably to be sealed for LED
Dress, improve LED using effect.
To achieve these goals, technical scheme is as follows.
A kind of LED lamp chip encapsulation material, is made up of the component of following mass fraction：Rubber powder be 15~19 parts,
6~12 parts of methyl phenyl vinyl polysiloxanes, tetraethyl orthosilicate are 4~8 parts, phenyl polysiloxane is 18~22 parts, castor oil
It it is 3~5 parts for 8~10 parts, aluminium hydroxide.
The preparation method of above-mentioned encapsulating material is following steps：
(1) rubber powder, methyl phenyl vinyl polysiloxanes, castor oil, the aluminium hydroxide of above-mentioned mass fraction are taken, by rubber
Dissolve, stirred after dissolving to mixed after four kinds of rubber powder, methyl phenyl vinyl polysiloxanes, castor oil, aluminium hydroxide composition heating
Close uniform；
(2) tetraethyl orthosilicate, the phenyl polysiloxane of above-mentioned mass fraction are added again, are stirred；
(3) mixture is subjected to deaeration, inclined heated plate 3h in vacuum degasing machine；
(4) feed the mixture into mould and solidified again, solidification temperature is 140 DEG C~150 DEG C, and room is cooled to after solidification
Temperature, LED lamp chip encapsulation material is prepared.
The beneficial effect of the invention is：The present invention is significant to improve by being optimized to the material of Light-Emitting Diode
The refractive index of light emitting diode, hardness and adhesion strength.The LED lamp chip package material that the method for the present invention is prepared
The refractive index of material is 1.64 to 1.68, and shore hardness is 64A to 70A, and adhesion strength is 6.6MPa to 7.2MPa.
Embodiment
The embodiment of the present invention is described with reference to embodiment, to be better understood from the present invention.
Embodiment 1
LED lamp chip encapsulation material in the present embodiment, is made up of the component of following mass fraction：Rubber powder is 15
Part, 6 parts of methyl phenyl vinyl polysiloxanes, tetraethyl orthosilicate are 4 parts, phenyl polysiloxane is 18 parts, castor oil is 8 parts, hydrogen
Aluminum oxide is 3 parts.
Above-mentioned encapsulation preparation method is following steps：
(1) rubber powder, methyl phenyl vinyl polysiloxanes, castor oil, the aluminium hydroxide of above-mentioned mass fraction are taken, by rubber
Dissolve, stirred after dissolving to mixed after four kinds of rubber powder, methyl phenyl vinyl polysiloxanes, castor oil, aluminium hydroxide composition heating
Close uniform；
(2) tetraethyl orthosilicate, the phenyl polysiloxane of above-mentioned mass fraction are added again, are stirred；
(3) mixture is subjected to deaeration, inclined heated plate 3h in vacuum degasing machine；
(4) feed the mixture into mould and solidified again, solidification temperature is 140 DEG C DEG C, and room temperature is cooled to after solidification, is made
It is standby to obtain LED lamp chip encapsulation material.
The refractive index for the LED lamp chip encapsulation material that the method for the present invention is prepared is 1.64, and shore hardness is
64A, adhesion strength 6.6MPa.
Embodiment 2
LED lamp chip encapsulation material in the present embodiment, is made up of the component of following mass fraction：Rubber powder is 17
Part, 9 parts of methyl phenyl vinyl polysiloxanes, tetraethyl orthosilicate are 6 parts, phenyl polysiloxane is 20 parts, castor oil is 9 parts, hydrogen
Aluminum oxide is 4 parts.
Above-mentioned encapsulation preparation method is following steps：
(1) rubber powder, methyl phenyl vinyl polysiloxanes, castor oil, the aluminium hydroxide of above-mentioned mass fraction are taken, by rubber
Dissolve, stirred after dissolving to mixed after four kinds of rubber powder, methyl phenyl vinyl polysiloxanes, castor oil, aluminium hydroxide composition heating
Close uniform；
(2) tetraethyl orthosilicate, the phenyl polysiloxane of above-mentioned mass fraction are added again, are stirred；
(3) mixture is subjected to deaeration, inclined heated plate 3h in vacuum degasing machine；
(4) feed the mixture into mould and solidified again, solidification temperature is 145 DEG C, and room temperature is cooled to after solidification, is prepared
Obtain LED lamp chip encapsulation material.
The refractive index for the LED lamp chip encapsulation material that the method for the present invention is prepared is 1.68, and shore hardness is
70A, adhesion strength 7.2MPa.
Embodiment 3
LED lamp chip encapsulation material in the present embodiment, is made up of the component of following mass fraction：Rubber powder is 19
Part, 12 parts of methyl phenyl vinyl polysiloxanes, tetraethyl orthosilicate are 8 parts, phenyl polysiloxane is 22 parts, castor oil is 10 parts,
Aluminium hydroxide is 5 parts.
Above-mentioned encapsulation preparation method is following steps：
(1) rubber powder, methyl phenyl vinyl polysiloxanes, castor oil, the aluminium hydroxide of above-mentioned mass fraction are taken, by rubber
Dissolve, stirred after dissolving to mixed after four kinds of rubber powder, methyl phenyl vinyl polysiloxanes, castor oil, aluminium hydroxide composition heating
Close uniform；
(2) tetraethyl orthosilicate, the phenyl polysiloxane of above-mentioned mass fraction are added again, are stirred；
(3) mixture is subjected to deaeration, inclined heated plate 3h in vacuum degasing machine；
(4) feed the mixture into mould and solidified again, solidification temperature is 150 DEG C, and room temperature is cooled to after solidification, is prepared
Obtain LED lamp chip encapsulation material.
The refractive index for the LED lamp chip encapsulation material that the method for the present invention is prepared is 1.66, and shore hardness is
68A, adhesion strength 6.9MPa.
Described above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (2)
- A kind of 1. LED lamp chip encapsulation material, it is characterised in that:It is made up of the component of following mass fraction：Rubber powder is 15~19 parts, 6~12 parts of methyl phenyl vinyl polysiloxanes, tetraethyl orthosilicate be 4~8 parts, phenyl polysiloxane be 18~22 Part, castor oil are 8~10 parts, aluminium hydroxide is 3~5 parts.
- 2. LED lamp chip encapsulation material according to claim 1, it is characterised in that：The preparation of the encapsulating material Method is following steps：(1) rubber powder, methyl phenyl vinyl polysiloxanes, castor oil, the aluminium hydroxide of above-mentioned mass fraction are taken, by rubber Dissolved after four kinds of powder, methyl phenyl vinyl polysiloxanes, castor oil, aluminium hydroxide composition heating, stirring extremely mixing after dissolving Uniformly；(2) tetraethyl orthosilicate, the phenyl polysiloxane of above-mentioned mass fraction are added again, are stirred；(3) mixture is subjected to deaeration in vacuum degasing machine, inclined heated plate is about 3h；(4) feed the mixture into mould and solidified again, solidification temperature is about 140 DEG C~150 DEG C, and room is cooled to after solidification Temperature, LED lamp chip encapsulation material is prepared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710587693.2A CN107529539A (en) | 2017-07-18 | 2017-07-18 | A kind of LED lamp chip encapsulation material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710587693.2A CN107529539A (en) | 2017-07-18 | 2017-07-18 | A kind of LED lamp chip encapsulation material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107529539A true CN107529539A (en) | 2018-01-02 |
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ID=60766354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710587693.2A Pending CN107529539A (en) | 2017-07-18 | 2017-07-18 | A kind of LED lamp chip encapsulation material |
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| CN (1) | CN107529539A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104788961A (en) * | 2015-05-20 | 2015-07-22 | 龚灿锋 | LED encapsulating material |
| CN104893311A (en) * | 2015-07-01 | 2015-09-09 | 杨高林 | LED packaging material |
-
2017
- 2017-07-18 CN CN201710587693.2A patent/CN107529539A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104788961A (en) * | 2015-05-20 | 2015-07-22 | 龚灿锋 | LED encapsulating material |
| CN104893311A (en) * | 2015-07-01 | 2015-09-09 | 杨高林 | LED packaging material |
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Application publication date: 20180102 |