CN106957511A - A kind of LED light source thin plate encapsulating material - Google Patents
A kind of LED light source thin plate encapsulating material Download PDFInfo
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- CN106957511A CN106957511A CN201610014906.8A CN201610014906A CN106957511A CN 106957511 A CN106957511 A CN 106957511A CN 201610014906 A CN201610014906 A CN 201610014906A CN 106957511 A CN106957511 A CN 106957511A
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- led light
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- 239000000463 material Substances 0.000 title claims abstract description 82
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 32
- 239000003822 epoxy resin Substances 0.000 claims abstract description 30
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 17
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 13
- 238000005538 encapsulation Methods 0.000 claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 23
- 239000004593 Epoxy Substances 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 15
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- -1 phenol aldehyde Chemical class 0.000 claims description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 3
- 229920000877 Melamine resin Polymers 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 230000010410 reperfusion Effects 0.000 claims description 3
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 claims description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 125000001424 substituent group Chemical group 0.000 claims description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims 3
- 150000002924 oxiranes Chemical group 0.000 claims 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 2
- ZMWJQGOYIBHQJG-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-ol Chemical compound CCO[Si](C)(OCC)CCCO ZMWJQGOYIBHQJG-UHFFFAOYSA-N 0.000 claims 1
- LMVLVUPTDRWATB-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-ol Chemical compound CO[Si](C)(OC)CCCO LMVLVUPTDRWATB-UHFFFAOYSA-N 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 239000004844 aliphatic epoxy resin Substances 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000002170 ethers Chemical class 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 7
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- 150000004645 aluminates Chemical class 0.000 description 2
- SOGIFFQYRAXTDR-UHFFFAOYSA-N diethoxy(methyl)silane Chemical class CCO[SiH](C)OCC SOGIFFQYRAXTDR-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000010412 perfusion Effects 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34922—Melamine; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Polymers & Plastics (AREA)
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of LED light source thin plate encapsulating material, the material includes following components：(a) there is the epoxy resin of epoxide functional groups；(b) acid anhydrides of the weight relative to (a) 90% 110%；(c) silicone compounds of the weight relative to (a) 0.1% 10%.The present invention passes through rational formula, overcome the technical problem that epoxy resin encapsulating material fragility is big, impact resistance is poor and organosilicon encapsulating material price is high, and the LED thin plates encapsulating material of the present invention can successfully reach brightness and be all higher than 150lm/W, light decay is respectively less than 30%, hence it is evident that higher than the existing LED encapsulation material of in the market.
Description
Technical field
The present invention relates to LED encapsulation material technical field, more particularly to a kind of LED light source thin plate encapsulating material, particularly
Refer to a kind of in the encapsulating material of high brightness low light attenuation can be reached after hardening process.
Background technology
LED (light emitting diode) encapsulates the encapsulation for referring to luminescence chip, has relatively big difference compared to integrated antenna package.LED
Encapsulation be not only required to protect wick, but also will being capable of printing opacity.So LED encapsulation has special want to encapsulating material
Ask.
Conventional LED encapsulation at present mainly has the high material of the transparencies such as epoxy resin, polyurethane, organosilicon.Wherein gather
Urethane casting glue surface is excessively soft, easy to foaming, and solidification is insufficient, is only used for the embedding of ordinary appliances element.At present using most
Epoxy resin fragility is big, impact resistance is poor, temperature in use is usually no more than 150 DEG C.Organosilicon material has preferably resistance to
Hot property and UV resistant performance, at the same it is good with the compatibility of chip, it is current optimal encapsulating material, but its price is high
It is expensive, it is general only encapsulation to be required to apply in harsh high-power LED encapsulation, while also there is brightness in existing encapsulating material
The serious defect of low, light decay, with the raising of great power LED luminous efficiency, it gradually expands in the application of photo field, right
The demand of LED encapsulation material is consequently increased, therefore with greater need for a kind of cheap, high brightness low light attenuation package material of exploitation
Material.
The content of the invention
It is an object of the invention to provide a kind of LED light source thin plate encapsulating material.
The present invention is adopted the following technical scheme that：
The LED light source thin plate encapsulating material of the present invention includes following components：
(a) there is the epoxy resin of epoxide functional groups；
(b) acid anhydrides of the weight 90%-110% relative to (a)；
(c) silicone compounds of the weight 0.1%-10% relative to (a).
The described epoxy resin with epoxide functional groups is bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenolic aldehyde
Type epoxy resin, tetrabromobisphenol epoxy resin and rubber modified epoxy resin, cycloaliphatic epoxy resin, aliphatic epoxy tree
Fat or its common mixture.
Described acid anhydrides is methyl tetrahydro phthalic anhydride, methyl hexahydrophthalic anhydride or its common mixture.Methyl six is preferred in acid anhydrides
Hydracid acid anhydride (MHHPA).When content deficiency or excessive parts by weight, the problem of having Tg too low, xanthochromia and not good reliability.
Described silicone compounds are 3- glycydoxies triethoxysilane, 3- (oxygen of 2,3- epoxies third)
Propyl trimethoxy silicane, 3- glycydoxy methyldiethoxysilanes, 3- [oxygen of (2,3)-epoxy third] propyl group
Methyl dimethoxysilane, 2- (3,4- 7-oxa-bicyclo[4.1.0) ethyl trimethoxy silane, silicone alkoxy oligomer,
Wherein silicone substituents include methyl, ethyl, Ammonia, epoxy or polymethyl methacrylate.
Also contain accelerator in described material, the accelerator is to contain phosphorous, brominated type, nitrogenous type accelerator or blending
Thing；The addition of accelerator is the 0.01%-10% of weight epoxy.
Also contain fluorescent material in described material, the fluorescent material is that YAG fluorescent powder, TAG fluorescent material, aluminate are glimmering
Luminescent material, silicate fluorescent material, nitride and nitrogen oxide fluorescent material, nitrogen oxide fluorescent material；Fluorescent material
Addition is the 0.01%-30% of weight epoxy.
Also contain feature powder in described material, the feature powder is silicones, melamine, acryl material
Material, silica, aluminum oxide, aluminium hydroxide, boron nitride or its blend；The addition of feature powder is weight epoxy
0.01%-5%.
The processing mode of described material includes molding and reperfusion mode.
As one of preferred technical scheme, LED light source thin plate encapsulating material of the invention is made up of following component：
(a) bisphenol A type epoxy resin；
(b) the methyl hexahydro acid anhydrides of the weight 100% relative to (a)；
(c) the phosphorus system accelerator of the weight 2% relative to (a)；
(d) YAG fluorescent powder of the weight 20% relative to (a)；
(e) silicones of the weight 1% relative to (a).
As the two of preferred technical scheme, LED light source thin plate encapsulating material of the invention is made up of following component：
(a) bisphenol A type epoxy resin；
(b) the methyl hexahydro acid anhydrides of the weight 100% relative to (a)；
(c) the epoxy radicals silcone alkoxy oligomer of the weight 2% relative to (a)；
(d) the phosphorus system accelerator of the weight 2% relative to (a)；
(e) YAG fluorescent powder of the weight 20% relative to (a)；
(f) silicones of the weight 1% relative to (a).
The positive effect of the present invention is as follows：
The present invention overcomes that epoxy resin encapsulating material fragility is big, impact resistance is poor and organic by rational formula
The high technical problem of silicium encapsulating material price, and the LED thin plates encapsulating material of the present invention can successfully reach brightness and be all higher than
150lm/W, light decay is respectively less than 30%, hence it is evident that higher than the existing LED encapsulation material of in the market.
Embodiment
Below, the present invention is further described：
Embodiment 1
The LED light source thin plate encapsulating material of the present invention is made up of following component：
(a) cycloaliphatic epoxy resin；
(b) methyl hexahydrophthalic anhydride of the weight 100% relative to (a)；
(c) the 3- glycydoxy methyldiethoxysilanes of the weight 5% relative to (a).
The processing mode of described material is molding.
Embodiment 2
The LED light source thin plate encapsulating material of the present invention is made up of following component：
(a) tetrabromobisphenol epoxy resin；
(b) methyl hexahydrophthalic anhydride of the weight 110% relative to (a)；
(c) 3- (oxygen of 2,3- epoxies third) propyl trimethoxy silicane of the weight 0.1% relative to (a)；
(d) the nitrogenous type accelerator of the weight 10% relative to (a)；
(e) aluminate fluorescent powder of the weight 0.01% relative to (a)；
(f) melamine of the weight 5% relative to (a).
The processing mode of described material is perfusion.
Embodiment 3
The LED light source thin plate encapsulating material of the present invention is made up of following component：
(a) bisphenol f type epoxy resin；
(b) methyl tetrahydro phthalic anhydride of the weight 90% relative to (a)；
(c) the 3- glycydoxy triethoxysilanes of the weight 10% relative to (a)；
(d) the brominated type accelerator of the weight 0.01% relative to (a)；
(e) the TAG fluorescent material of the weight 30% relative to (a)；
(f) aluminum oxide of the weight 0.01% relative to (a).
The processing mode of described material is molding.
Embodiment 4
The LED light source thin plate encapsulating material of the present invention is made up of following component：
(a) bisphenol A type epoxy resin；
(b) the methyl hexahydro acid anhydrides of the weight 100% relative to (a)；
(c) the phosphorus system accelerator of the weight 2% relative to (a)；
(d) YAG fluorescent powder of the weight 20% relative to (a)；
(e) silicones of the weight 1% relative to (a).
The processing mode of described material is perfusion.
Embodiment 5
The LED light source thin plate encapsulating material of the present invention is made up of following component：
(a) bisphenol A type epoxy resin；
(b) the methyl hexahydro acid anhydrides of the weight 100% relative to (a)；
(c) the epoxy radicals silcone alkoxy oligomer of the weight 2% relative to (a)；
(d) the phosphorus system accelerator of the weight 2% relative to (a)；
(e) YAG fluorescent powder of the weight 20% relative to (a)；
(f) silicones of the weight 1% relative to (a).
The processing mode of described material is molding.
Comparative example 1
Using bisphenol A type epoxy resin and alicyclic race's epoxy resin sclerous reaction institute is carried out with MHHPA anhydride hardeners
Obtained finished product (model WG-5211A/B, Taiwan Jing He Co., Ltds are for selling).
Comparative example 2
Finished product (the model SK- obtained by sclerous reaction is carried out using bisphenol A type epoxy resin and MHHPA anhydride hardeners
5518A/B, Taiwan Jing He Co., Ltds are for selling).
LED encapsulation material constituent light decay is assessed
Respectively by comparative example 1 to 2 and embodiment 1-5 encapsulating material compositions be mixed and stirred for it is uniform after, to be molded or
Luminous thin plate is made in reperfusion mode, thereafter, by foregoing thin plate, carries out normal temperature 15mA@1000hrs and lights, is tested using LED luminance
Machine test brightness and record light decay data (LED-BNTW-12-XY, Hong Gang limited company), test result is shown in table 1 below
In.
Table 1
Table 2
| Light decay percentage | |
| Comparative example 1 | - 47.01% |
| Comparative example 2 | - 68.52% |
| Embodiment 1 | - 23.78% |
| Embodiment 2 | - 10.35% |
| Embodiment 3 | - 6.42% |
| Embodiment 4 | - 0.99% |
| Embodiment 5 | - 1.69% |
Knowable to upper table 1,2, relative to comparative example 1 and comparative example 2, LED package of light source material composites of the invention
Really it after overmolding, can reach high brightness and light decay test is smaller than 30%, therefore with can use for a long time and will not
Cause to light the serious advantage of rear light decay.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understand and these embodiments can be carried out without departing from the principles and spirit of the present invention a variety of changes, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of LED light source thin plate encapsulating material, it is characterised in that：Described material includes following components：
(a) there is the epoxy resin of epoxide functional groups；
(b) acid anhydrides of the weight 90%-110% relative to (a)；
(c) silicone compounds of the weight 0.1%-10% relative to (a).
2. LED light source thin plate encapsulating material as claimed in claim 1, it is characterised in that：It is described that there are epoxide functional groups
Epoxy resin be bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenol aldehyde type epoxy resin, tetrabromobisphenol epoxy resin, with
And rubber modified epoxy resin, cycloaliphatic epoxy resin, aliphatic epoxy resin or its common mixture.
3. LED light source thin plate encapsulating material as claimed in claim 1, it is characterised in that：Described acid anhydrides is methyl tetrahydrochysene benzene
Acid anhydride, methyl hexahydrophthalic anhydride or its common mixture.
4. LED light source thin plate encapsulating material as claimed in claim 1, it is characterised in that：Described silicone compounds are 3-
Glycydoxy triethoxysilane, 3- (2,3- the third oxygen of epoxy) propyl trimethoxy silicane, 3- glycidol ethers
Epoxide hydroxypropyl methyl diethoxy silane, 3- [oxygen of (2,3)-epoxy third] hydroxypropyl methyl dimethoxysilane, 2- (3,4- epoxide rings
Hexane) ethyl trimethoxy silane, silicone alkoxy oligomer, wherein silicone substituents include methyl, second
Base, Ammonia, epoxy or polymethyl methacrylate.
5. LED light source thin plate encapsulating material as claimed in claim 1, it is characterised in that：Also containing promotion in described material
Agent, the accelerator is to contain phosphorous, brominated type, nitrogenous type accelerator or blend；The addition of accelerator is weight epoxy
0.01%-10%.
6. LED light source thin plate encapsulating material as claimed in claim 1, it is characterised in that：Also contain fluorescence in described material
Material, the fluorescent material be YAG fluorescent powder, TAG fluorescent material, thioaluminate phosphor material, silicate fluorescent material, nitride with
And nitrogen oxide fluorescent material, nitrogen oxide fluorescent material；The addition of fluorescent material is the 0.01%- of weight epoxy
30%.
7. LED light source thin plate encapsulating material as claimed in claim 1, it is characterised in that：Also containing functional in described material
Property powder, the feature powder is silicones, melamine, acryl material, silica, aluminum oxide, aluminium hydroxide, nitrogen
Change boron or its blend；The addition of feature powder is the 0.01%-5% of weight epoxy.
8. LED light source thin plate encapsulating material as claimed in claim 1, it is characterised in that：The processing mode bag of described material
Include molding and reperfusion mode.
9. LED light source thin plate encapsulating material as claimed in claim 1, it is characterised in that：Described LED light source thin plate package material
Material is made up of following component：
(a) bisphenol A type epoxy resin；
(b) the methyl hexahydro acid anhydrides of the weight 100% relative to (a)；
(c) the phosphorus system accelerator of the weight 2% relative to (a)；
(d) YAG fluorescent powder of the weight 20% relative to (a)；
(e) silicones of the weight 1% relative to (a).
10. LED light source thin plate encapsulating material as claimed in claim 1, it is characterised in that：Described LED light source thin plate encapsulation
Material is made up of following component：
(a) bisphenol A type epoxy resin；
(b) the methyl hexahydro acid anhydrides of the weight 100% relative to (a)；
(c) the epoxy radicals silcone alkoxy oligomer of the weight 2% relative to (a)；
(d) the phosphorus system accelerator of the weight 2% relative to (a)；
(e) YAG fluorescent powder of the weight 20% relative to (a)；
(f) silicones of the weight 1% relative to (a).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610014906.8A CN106957511A (en) | 2016-01-11 | 2016-01-11 | A kind of LED light source thin plate encapsulating material |
| TW105128133A TWI647276B (en) | 2016-01-11 | 2016-08-31 | LED light source sheet packaging material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610014906.8A CN106957511A (en) | 2016-01-11 | 2016-01-11 | A kind of LED light source thin plate encapsulating material |
Publications (1)
| Publication Number | Publication Date |
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| CN106957511A true CN106957511A (en) | 2017-07-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610014906.8A Pending CN106957511A (en) | 2016-01-11 | 2016-01-11 | A kind of LED light source thin plate encapsulating material |
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| Country | Link |
|---|---|
| CN (1) | CN106957511A (en) |
| TW (1) | TWI647276B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109608825A (en) * | 2018-11-30 | 2019-04-12 | 中国航空工业集团公司基础技术研究院 | A kind of sacrificial layer Ultraluminescence epoxy resin carbon fiber prepreg |
| CN114015393A (en) * | 2021-11-25 | 2022-02-08 | 盐城东山精密制造有限公司 | Promote gas tightness glue structure |
| CN114087547A (en) * | 2021-11-24 | 2022-02-25 | 盐城东山精密制造有限公司 | Process for realizing high-efficiency wide angle of lamp bead |
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| CN101851388A (en) * | 2009-03-31 | 2010-10-06 | 日立化成工业株式会社 | Electronic component-use liquid resin composition and electronic part apparatus |
| CN102775736A (en) * | 2012-08-16 | 2012-11-14 | 上纬（上海）精细化工有限公司 | LED (Light-Emitting Diode) package material and composite used in same |
| CN102964776A (en) * | 2012-10-25 | 2013-03-13 | 上纬（上海）精细化工有限公司 | Packaging resin composition |
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| TWI422638B (en) * | 2009-08-25 | 2014-01-11 | Everlight Chem Ind Corp | Silicone containing encapsulant |
| CN101880515A (en) * | 2010-06-28 | 2010-11-10 | 深圳市库泰克电子材料技术有限公司 | High-reliability and low-viscosity underfill |
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| CN101851388A (en) * | 2009-03-31 | 2010-10-06 | 日立化成工业株式会社 | Electronic component-use liquid resin composition and electronic part apparatus |
| CN102775736A (en) * | 2012-08-16 | 2012-11-14 | 上纬（上海）精细化工有限公司 | LED (Light-Emitting Diode) package material and composite used in same |
| CN102964776A (en) * | 2012-10-25 | 2013-03-13 | 上纬（上海）精细化工有限公司 | Packaging resin composition |
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| CN109608825A (en) * | 2018-11-30 | 2019-04-12 | 中国航空工业集团公司基础技术研究院 | A kind of sacrificial layer Ultraluminescence epoxy resin carbon fiber prepreg |
| CN114087547A (en) * | 2021-11-24 | 2022-02-25 | 盐城东山精密制造有限公司 | Process for realizing high-efficiency wide angle of lamp bead |
| CN114015393A (en) * | 2021-11-25 | 2022-02-08 | 盐城东山精密制造有限公司 | Promote gas tightness glue structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201725237A (en) | 2017-07-16 |
| TWI647276B (en) | 2019-01-11 |
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