CN104788961A - LED encapsulating material - Google Patents
LED encapsulating material Download PDFInfo
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- CN104788961A CN104788961A CN201510256062.3A CN201510256062A CN104788961A CN 104788961 A CN104788961 A CN 104788961A CN 201510256062 A CN201510256062 A CN 201510256062A CN 104788961 A CN104788961 A CN 104788961A
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Abstract
The invention relates to an LED encapsulating material. The LED encapsulating material is composed of the following components in parts by mass: 15-19 parts of phenyl vinyl silicon resin, 6-12 parts of methyl phenyl vinyl polysiloxane, 4-8 parts of methyl vinyl silicon oil, 18-22 parts of phenyl silicon resin, 8-10 parts of methyl phenyl chlorosilane, and 3-5 parts of aluminium acetylacetonate. The material of a light emitting diode is optimized so that the refractive index, the hardness and the bonding strength of the light emitting diode are obviously increased. The refractive index of the LED encapsulating material prepared by the method is 1.64-1.68, the shore hardness is 64A-70A and the bonding strength is 6.6-7.2 MPa.
Description
Technical field
The present invention relates to a kind of LED encapsulation material, belong to LED technology field.
Background technology
LED is new generation of green environmentfriendly products, is widely used in automobile, illumination, electronics backlight, the fields such as traffic lights.In order to protect IC, prevent the undesirable element of outside atmosphere from causing damage to chip, extend the work-ing life of LED, its chip is encapsulated.At present, the traditional material for LED is epoxy resin, and cheap application is wide, and resin itself has the excellent feature such as electrical insulating property, stopping property, dielectric properties, cohesiveness, makes it encapsulate market at home and account for sizable ratio.But there is humidity resistance due to itself and weathering resistance is poor, and the problem such as matter is crisp, fatiguability, toughness are low and heat dispersion is poor, easily xanthochromia is there is under ultraviolet lighting and hot conditions, and not easy heat radiation, these problems all cause reduce the work-ing life of LED component.
Summary of the invention
The object of the present invention is to provide a kind of LED encapsulation material, to encapsulate for LED better, improve the result of use of LED.
To achieve these goals, technical scheme of the present invention is as follows.
A kind of LED encapsulation material, is made up of the component of following mass fraction: phenyl vinyl polysiloxane is 15 ~ 19 parts, methyl phenyl vinyl polysiloxane 6 ~ 12 parts, methyl vinyl silicon oil are 4 ~ 8 parts, phenyl polysiloxane is 18 ~ 22 parts, dichloromethyl phenylsilane is 8 ~ 10 parts, aluminium acetylacetonate is 3 ~ 5 parts.
The preparation method of above-mentioned packaged material is following steps:
(1) phenyl vinyl polysiloxane of above-mentioned mass fraction, methyl phenyl vinyl polysiloxane, dichloromethyl phenylsilane, aluminium acetylacetonate is got, dissolve after phenyl vinyl polysiloxane, methyl phenyl vinyl polysiloxane, dichloromethyl phenylsilane, aluminium acetylacetonate four kinds of composition heating, be stirred to after dissolving and mix;
(2) add methyl vinyl silicon oil, the phenyl polysiloxane of above-mentioned mass fraction again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 140 DEG C ~ 150 DEG C, is cooled to room temperature, prepares LED encapsulation material after solidification.
In said components material, phenyl vinyl polysiloxane is the methyl phenyl vinyl polysiloxane containing vinyl, under normal temperature, outward appearance is clear viscous shape liquid, mainly for the manufacture of high-power height refraction LED organic silicon packaging glue, the embedding of photoelectricity, electronics and microelectronic industry, sealing, bonding and coating, high printing opacity, high rigidity eyeglass and user other purposes independently developed, film hardness after this product solidification is large, specific refractory power is high, light transmission is good, have stronger solvent resistant water tolerance and resistance to ablating radiation, simultaneously resistance to elevated temperatures is good, not the advantage such as thickening.Made product have that ageing resistance is strong, anti-ultraviolet property is good and life-time service without the excellent specific property of xanthochromia.
This beneficial effect of the invention is: the present invention, by being optimized the material of light emitting diode, improves the specific refractory power of photodiode, hardness and cohesive strength significantly.The specific refractory power of the LED encapsulation material that method of the present invention prepares is 1.64 to 1.68, and shore hardness is 64A to 70A, and cohesive strength is 6.6MPa to 7.2MPa.
Embodiment
Below in conjunction with embodiment, the specific embodiment of the present invention is described, better to understand the present invention.
embodiment 1
LED encapsulation material in the present embodiment, is made up of the component of following mass fraction: phenyl vinyl polysiloxane is 15 parts, methyl phenyl vinyl polysiloxane 6 parts, methyl vinyl silicon oil are 4 parts, phenyl polysiloxane is 18 parts, dichloromethyl phenylsilane is 8 parts, aluminium acetylacetonate is 3 parts.
Above-mentioned encapsulation preparation method is following steps:
(1) phenyl vinyl polysiloxane of above-mentioned mass fraction, methyl phenyl vinyl polysiloxane, dichloromethyl phenylsilane, aluminium acetylacetonate is got, dissolve after phenyl vinyl polysiloxane, methyl phenyl vinyl polysiloxane, dichloromethyl phenylsilane, aluminium acetylacetonate four kinds of composition heating, be stirred to after dissolving and mix;
(2) add methyl vinyl silicon oil, the phenyl polysiloxane of above-mentioned mass fraction again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 140 DEG C DEG C, is cooled to room temperature after solidification, prepares LED encapsulation material.
The specific refractory power of the LED encapsulation material that method of the present invention prepares is 1.64, and shore hardness is 64A, and cohesive strength is 6.6MPa.
embodiment 2
LED encapsulation material in the present embodiment, is made up of the component of following mass fraction: phenyl vinyl polysiloxane is 17 parts, methyl phenyl vinyl polysiloxane 9 parts, methyl vinyl silicon oil are 6 parts, phenyl polysiloxane is 20 parts, dichloromethyl phenylsilane is 9 parts, aluminium acetylacetonate is 4 parts.
Above-mentioned encapsulation preparation method is following steps:
(1) phenyl vinyl polysiloxane of above-mentioned mass fraction, methyl phenyl vinyl polysiloxane, dichloromethyl phenylsilane, aluminium acetylacetonate is got, dissolve after phenyl vinyl polysiloxane, methyl phenyl vinyl polysiloxane, dichloromethyl phenylsilane, aluminium acetylacetonate four kinds of composition heating, be stirred to after dissolving and mix;
(2) add methyl vinyl silicon oil, the phenyl polysiloxane of above-mentioned mass fraction again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 145 DEG C, is cooled to room temperature after solidification, prepares LED encapsulation material.
The specific refractory power of the LED encapsulation material that method of the present invention prepares is 1.68, and shore hardness is 70A, and cohesive strength is 7.2MPa.
embodiment 3
LED encapsulation material in the present embodiment, is made up of the component of following mass fraction: phenyl vinyl polysiloxane is 19 parts, methyl phenyl vinyl polysiloxane 12 parts, methyl vinyl silicon oil are 8 parts, phenyl polysiloxane is 22 parts, dichloromethyl phenylsilane is 10 parts, aluminium acetylacetonate is 5 parts.
Above-mentioned encapsulation preparation method is following steps:
(1) phenyl vinyl polysiloxane of above-mentioned mass fraction, methyl phenyl vinyl polysiloxane, dichloromethyl phenylsilane, aluminium acetylacetonate is got, dissolve after phenyl vinyl polysiloxane, methyl phenyl vinyl polysiloxane, dichloromethyl phenylsilane, aluminium acetylacetonate four kinds of composition heating, be stirred to after dissolving and mix;
(2) add methyl vinyl silicon oil, the phenyl polysiloxane of above-mentioned mass fraction again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 150 DEG C, is cooled to room temperature after solidification, prepares LED encapsulation material.
The specific refractory power of the LED encapsulation material that method of the present invention prepares is 1.66, and shore hardness is 68A, and cohesive strength is 6.9MPa.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (2)
1. a LED encapsulation material, is characterized in that: be made up of the component of following mass fraction: phenyl vinyl polysiloxane is 15 ~ 19 parts, methyl phenyl vinyl polysiloxane 6 ~ 12 parts, methyl vinyl silicon oil are 4 ~ 8 parts, phenyl polysiloxane is 18 ~ 22 parts, dichloromethyl phenylsilane is 8 ~ 10 parts, aluminium acetylacetonate is 3 ~ 5 parts.
2. LED encapsulation material according to claim 1, is characterized in that: the preparation method of described packaged material is following steps:
(1) phenyl vinyl polysiloxane of above-mentioned mass fraction, methyl phenyl vinyl polysiloxane, dichloromethyl phenylsilane, aluminium acetylacetonate is got, dissolve after phenyl vinyl polysiloxane, methyl phenyl vinyl polysiloxane, dichloromethyl phenylsilane, aluminium acetylacetonate four kinds of composition heating, be stirred to after dissolving and mix;
(2) add methyl vinyl silicon oil, the phenyl polysiloxane of above-mentioned mass fraction again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is about 3h;
(4) added in mould by mixture and be cured, solidification value is about 140 DEG C ~ 150 DEG C, is cooled to room temperature, prepares LED encapsulation material after solidification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510256062.3A CN104788961A (en) | 2015-05-20 | 2015-05-20 | LED encapsulating material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510256062.3A CN104788961A (en) | 2015-05-20 | 2015-05-20 | LED encapsulating material |
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| CN104788961A true CN104788961A (en) | 2015-07-22 |
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| CN201510256062.3A Pending CN104788961A (en) | 2015-05-20 | 2015-05-20 | LED encapsulating material |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105085826A (en) * | 2015-08-16 | 2015-11-25 | 朱志 | Metallic silicon powder mixed high-performance organic silicon resin-polymethyl methacrylate composite for LED packaging and preparation method thereof |
| CN106010424A (en) * | 2016-06-28 | 2016-10-12 | 华蓥市高科龙电子科技有限公司 | LED (light emitting diode) encapsulation material |
| CN106928722A (en) * | 2017-02-15 | 2017-07-07 | 中山市汇能硅胶制品有限公司 | A kind of silicone grease composition and preparation method thereof |
| CN107325370A (en) * | 2017-07-11 | 2017-11-07 | 苏州南尔材料科技有限公司 | A kind of preparation method of composite organic encapsulating material |
| CN107529539A (en) * | 2017-07-18 | 2018-01-02 | 池州市中翔光电科技有限公司 | A kind of LED lamp chip encapsulation material |
| CN107674642A (en) * | 2017-11-10 | 2018-02-09 | 中山市鼎立森电子材料有限公司 | A kind of high folding packaging plastics of the reliable LED of cohesive |
| CN107793993A (en) * | 2017-11-10 | 2018-03-13 | 中山市鼎立森电子材料有限公司 | A kind of high folding packaging plastics of the high LED of high temperature reliability |
| CN107868339A (en) * | 2017-11-30 | 2018-04-03 | 苏州南尔材料科技有限公司 | A kind of preparation method of composite organic encapsulating material |
| CN107936368A (en) * | 2017-11-26 | 2018-04-20 | 苏州南尔材料科技有限公司 | A kind of preparation method of composite conducting encapsulating material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103980714A (en) * | 2014-06-04 | 2014-08-13 | 烟台利诺电子科技有限公司 | High-refraction-index LED (Light Emitting Diode) organic silicon packaging material and preparation method thereof |
| CN104130585A (en) * | 2014-08-12 | 2014-11-05 | 铜陵国鑫光源技术开发有限公司 | High-refractive-index organic silicon material for LED encapsulation |
-
2015
- 2015-05-20 CN CN201510256062.3A patent/CN104788961A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103980714A (en) * | 2014-06-04 | 2014-08-13 | 烟台利诺电子科技有限公司 | High-refraction-index LED (Light Emitting Diode) organic silicon packaging material and preparation method thereof |
| CN104130585A (en) * | 2014-08-12 | 2014-11-05 | 铜陵国鑫光源技术开发有限公司 | High-refractive-index organic silicon material for LED encapsulation |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105085826A (en) * | 2015-08-16 | 2015-11-25 | 朱志 | Metallic silicon powder mixed high-performance organic silicon resin-polymethyl methacrylate composite for LED packaging and preparation method thereof |
| CN106010424A (en) * | 2016-06-28 | 2016-10-12 | 华蓥市高科龙电子科技有限公司 | LED (light emitting diode) encapsulation material |
| CN106928722A (en) * | 2017-02-15 | 2017-07-07 | 中山市汇能硅胶制品有限公司 | A kind of silicone grease composition and preparation method thereof |
| CN106928722B (en) * | 2017-02-15 | 2020-06-19 | 中山市汇能硅胶制品有限公司 | Silicone grease composition and preparation method thereof |
| CN107325370A (en) * | 2017-07-11 | 2017-11-07 | 苏州南尔材料科技有限公司 | A kind of preparation method of composite organic encapsulating material |
| CN107529539A (en) * | 2017-07-18 | 2018-01-02 | 池州市中翔光电科技有限公司 | A kind of LED lamp chip encapsulation material |
| CN107674642A (en) * | 2017-11-10 | 2018-02-09 | 中山市鼎立森电子材料有限公司 | A kind of high folding packaging plastics of the reliable LED of cohesive |
| CN107793993A (en) * | 2017-11-10 | 2018-03-13 | 中山市鼎立森电子材料有限公司 | A kind of high folding packaging plastics of the high LED of high temperature reliability |
| CN107936368A (en) * | 2017-11-26 | 2018-04-20 | 苏州南尔材料科技有限公司 | A kind of preparation method of composite conducting encapsulating material |
| CN107868339A (en) * | 2017-11-30 | 2018-04-03 | 苏州南尔材料科技有限公司 | A kind of preparation method of composite organic encapsulating material |
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Application publication date: 20150722 |