CN107674642A - A kind of high folding packaging plastics of the reliable LED of cohesive - Google Patents

A kind of high folding packaging plastics of the reliable LED of cohesive Download PDF

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Publication number
CN107674642A
CN107674642A CN201711112792.1A CN201711112792A CN107674642A CN 107674642 A CN107674642 A CN 107674642A CN 201711112792 A CN201711112792 A CN 201711112792A CN 107674642 A CN107674642 A CN 107674642A
Authority
CN
China
Prior art keywords
cohesive
high folding
reliable led
folding packaging
packaging plastics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711112792.1A
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Chinese (zh)
Inventor
蔡秀
潘斌俊
庞有群
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongshan Dingli Electronics Material Co Ltd
Original Assignee
Zhongshan Dingli Electronics Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhongshan Dingli Electronics Material Co Ltd filed Critical Zhongshan Dingli Electronics Material Co Ltd
Priority to CN201711112792.1A priority Critical patent/CN107674642A/en
Publication of CN107674642A publication Critical patent/CN107674642A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • C08L2203/206Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The present invention provides a kind of high folding packaging plastics of the reliable LED of cohesive, is made up of the material of following mass percentage content:Phenyl vinyl MT resins (ethylene contents for 3% 9%) 45~80%, phenyl-vinyl silicon oil 10~30%, platinum group catalyst 0.02~0.04%, tackifier 0.5~2%, benzene cross-linking agent 5~25%, inhibitor 0.1~0.5%.The beneficial effects of the present invention are have excellent adhesive property and cold-resistant thermal shock resistance properties, sulfidation-resistance energy, resistance to elevated temperatures, and cost is relatively low.

Description

A kind of high folding packaging plastics of the reliable LED of cohesive
Technical field
The present invention relates to a kind of high folding packaging plastics of the reliable LED of cohesive.
Background technology
LED light source turns into the most important light source of lighting field because it possesses the advantages that energy-efficient, green.Encapsulation A ring essential as LED light source, the more and more higher also required its material property, such as require that closed material has and absorb Light, do not scatter, have good cohesive with various base materials such as element, lead frame, substrate and frameworks.Hydrosilylation reactions are consolidated The cured silicone combination of change is used as the photosemiconductor components such as photoelectrical coupler, light emitting diode, solid state image sensor most Conventional packaging protection material, cost is relatively low, but it has cementability deficiency.
The content of the invention
To solve the above problems the invention provides a kind of high folding packaging plastics of the reliable LED of cohesive, there is excellent glue Performance is connect, and cost is relatively low.
Technical scheme provided by the present invention is:A kind of high folding packaging plastics of the reliable LED of cohesive, by following quality percentage Material than content is made:
The beneficial effects of the present invention are resistance to excellent adhesive property and cold-resistant thermal shock resistance properties, sulfidation-resistance energy High-temperature behavior, and cost is relatively low.
Embodiment
Embodiment 1:
The phenyl vinyl MT resins of above-mentioned percentage by weight are weighed, phenyl-vinyl silicon oil, in reaction vessel, are stirred Uniformly, platinum group catalyst and tackifier are added, is stirred, benzene cross-linking agent is then added, inhibitor, stirs, very Empty deaeration, obtain the high folding encapsulation glue compositions of the reliable LED of cohesive.
Embodiment 2:
The phenyl vinyl MT resins of above-mentioned percentage by weight are weighed, phenyl-vinyl silicon oil, in reaction vessel, are stirred Uniformly, platinum group catalyst and tackifier are added, is stirred, benzene cross-linking agent is then added, inhibitor, stirs, very Empty deaeration, obtain the high folding encapsulation glue compositions of the reliable LED of cohesive.
Embodiment 3:
The phenyl vinyl MT resins of above-mentioned percentage by weight are weighed, phenyl-vinyl silicon oil, in reaction vessel, are stirred Uniformly, platinum group catalyst and tackifier are added, is stirred, benzene cross-linking agent is then added, inhibitor, stirs, very Empty deaeration, obtain the high folding encapsulation glue compositions of the reliable LED of cohesive.
Respectively by embodiment 1, embodiment 2, the composition of embodiment 3 does contrast test with two commercially available material, 5 groups LED encapsulates glue composition dispensing or tank glue on component to be packaged, carries out light transmittance, high temperature resistant, red ink, cohesive etc. The test of aspect, as a result as shown in table 1.
The high folding encapsulation glue composition test results of the reliable LED of the cohesive of table 1
The present invention is explained in detail above in conjunction with embodiment, but the present invention is not limited to above-described embodiment.In ability , can also be on the basis of each composition effect basis mechanism is well understood that in the those of ordinary skill's possessed knowledge of domain Do not depart from the premise of present inventive concept that various changes can be made, come under protection scope of the present invention.

Claims (1)

1. a kind of high folding packaging plastics of the reliable LED of cohesive, are made up of the material of following mass percentage content:
CN201711112792.1A 2017-11-10 2017-11-10 A kind of high folding packaging plastics of the reliable LED of cohesive Pending CN107674642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711112792.1A CN107674642A (en) 2017-11-10 2017-11-10 A kind of high folding packaging plastics of the reliable LED of cohesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711112792.1A CN107674642A (en) 2017-11-10 2017-11-10 A kind of high folding packaging plastics of the reliable LED of cohesive

Publications (1)

Publication Number Publication Date
CN107674642A true CN107674642A (en) 2018-02-09

Family

ID=61145245

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711112792.1A Pending CN107674642A (en) 2017-11-10 2017-11-10 A kind of high folding packaging plastics of the reliable LED of cohesive

Country Status (1)

Country Link
CN (1) CN107674642A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104194716A (en) * 2014-08-19 2014-12-10 烟台德邦先进硅材料有限公司 Low-light-attenuation organic silicon crystal solidification adhesive for high-power COB (chip on board) packaging
CN104788961A (en) * 2015-05-20 2015-07-22 龚灿锋 LED encapsulating material
EP3153517A1 (en) * 2014-06-04 2017-04-12 Dow Corning Toray Co., Ltd. Organosiloxane, curable silicone composition, and semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3153517A1 (en) * 2014-06-04 2017-04-12 Dow Corning Toray Co., Ltd. Organosiloxane, curable silicone composition, and semiconductor device
CN104194716A (en) * 2014-08-19 2014-12-10 烟台德邦先进硅材料有限公司 Low-light-attenuation organic silicon crystal solidification adhesive for high-power COB (chip on board) packaging
CN104788961A (en) * 2015-05-20 2015-07-22 龚灿锋 LED encapsulating material

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Application publication date: 20180209

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