CN107936368A - A kind of preparation method of composite conducting encapsulating material - Google Patents
A kind of preparation method of composite conducting encapsulating material Download PDFInfo
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- CN107936368A CN107936368A CN201711199711.6A CN201711199711A CN107936368A CN 107936368 A CN107936368 A CN 107936368A CN 201711199711 A CN201711199711 A CN 201711199711A CN 107936368 A CN107936368 A CN 107936368A
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- carbon
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- chemical blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0837—Bismuth
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a kind of preparation method of composite conducting encapsulating material, the carbide percent by volume in the conductive packaging material accounts for higher, and products obtained therefrom electric conductivity is excellent, flexible, plasticity is strong, and has good dispersiveness, compatibility and heat resistance.
Description
Technical field
The present invention relates to electronic device manufacturing field, and in particular to a kind of preparation method of composite conducting encapsulating material.
Background technology
With the fast development of microelectronics integrated technology and package technique, the volume of electronic device is less and less.Electronics device
In part process, it is often necessary to encapsulated using suitable mode.
Since electronic package material has important influence to the reliability and service life of electronic device, electronic seal in recent years
The research of package material is of increased attention.Electronic package material is to be used to carry electronic component and its mutually interconnect
Line, plays the basis material of mechanical support, sealed environment protection, signal special delivery etc..
Conductive filler component in polymer base conductive composite material is generally carbon black, carbon black, metal and its compound
Fiber, particulate and nano particle, they are scattered in using polymer as in the material of matrix as filler, common polymeric matrix
Including polyolefin, resinous matter etc..This polymer base conductive composite material had both had the electrology characteristic of conductive component, at the same time
Have the characteristics that polymeric material is stretchable, deformable, flexible and plasticity is good again, therefore, the two to be implemented in combination with advantage mutual
Mend, extend its application range in respective field.
No matter conducting polymer materials are formed into conducting wire or film, its optional position conductive characteristic is identical in theory, material
It is all conductive that material is overall.If electric conductor is exposed in atmosphere, easily disturbed by external environment, it is final to influence actual make
Use effect.For this bare conductor, it usually needs additionally one layer of megohmite insulant of parcel is packaged outside it, is so handled
Afterwards, interference is not only avoid, and is easily installed and transports.
The content of the invention
The present invention provides a kind of preparation method of composite conducting encapsulating material, the carbide body in the conductive packaging material
Product percentage accounts for higher, and products obtained therefrom electric conductivity is excellent, flexible, plasticity is strong, and with good dispersiveness, compatibility
And heat resistance.
To achieve these goals, the present invention provides a kind of preparation method of composite conducting encapsulating material, this method bag
Include following steps：
（1）Prepare complex carbon material powder
Carbon black pre-processes, and sodium fluoride is mixed in nano carbon black powder, and adds metallic catalyst, mixes, in inert gas shielding
Under sodium fluoride is fixed in 600-650 DEG C of heating, heating time control on nano carbon black powder surface in 10-15min；
Carbon nano-fiber pre-processes, and the Nano carbon fibers Wesy concentrated sulfuric acid is carried out with potassium permanganate to mix acid oxidase, violent through ultrasound
After stirring, the carbon nano-fiber of carboxylated is obtained, adds surface conditioning agent, heats 10-15min at 150-200 DEG C,
Nitrogen and helium it is mixed gas protected under at 400-450 DEG C heat 30-45min, the carbon nano-fiber material pre-processed；
The carbon nano-fiber of the carbon black of pretreatment and pretreatment is placed in container, is dissolved with 150-250 parts of isopropanols, with strength
Mixer is blended, and then carries out ultrasonic disperse, supersonic frequency 25-30kHz, time 1-2h, shape with ultrasonic wave separating apparatus again
Into the nano-sized carbon conductive fiber material solution of homogeneous；
Obtained nano-sized carbon conductive fiber material solution and chemical blend thing are subjected to chemical blend, the chemical blend thing is poly-
Vinyl chloride, the mass fraction of the chemical blend thing account for the 25-30% of original solution, compound carbon materials are prepared with method of electrostatic spinning
Material, ball mill grinding obtain complex carbon material powder；
（2）According to following parts by weight dispensing:
Above-mentioned 11-13 parts of complex carbon material powder
2-5 parts of ethyl orthosilicate
6-9 parts of prodan
1-1.5 parts of polyglycolic acid
20-24 parts of polypropylene
0.5-1 parts of bismuth
2-4 parts of containing hydrogen silicone oil crosslinking agent；
（3）Mixed in proportion by said components, heating stirring carries out mixture to being uniformly mixed in vacuum degasing machine
Deaeration, inclined heated plate 5-7h；
Feed the mixture into mould and cured again, solidification temperature is 240 DEG C -250 DEG C, cures postcooling to room temperature, prepares
Obtain composite conducting encapsulating material.
Embodiment
Embodiment one
Carbon black pre-processes, and sodium fluoride is mixed in nano carbon black powder, and adds metallic catalyst, mixes, in inert gas shielding
Under sodium fluoride is fixed in 600 DEG C of heating, heating time control on nano carbon black powder surface in 10min.
Carbon nano-fiber pre-processes, and the Nano carbon fibers Wesy concentrated sulfuric acid is carried out with potassium permanganate to mix acid oxidase, through ultrasound
After being vigorously stirred, the carbon nano-fiber of carboxylated is obtained, adds surface conditioning agent, heats 10min at 150 DEG C, in nitrogen
Gas and helium it is mixed gas protected under at 400 DEG C heat 30min, the carbon nano-fiber material pre-processed.
The carbon nano-fiber of the carbon black of pretreatment and pretreatment is placed in container, is dissolved with 150 parts of isopropanols, with strength
Mixer is blended, and then carries out ultrasonic disperse with ultrasonic wave separating apparatus again, supersonic frequency 25kHz, time 1h, form homogeneous
Nano-sized carbon conductive fiber material solution.
Obtained nano-sized carbon conductive fiber material solution and chemical blend thing are subjected to chemical blend, the chemical blend thing
For polyvinyl chloride, the mass fraction of the chemical blend thing accounts for the 25% of original solution, and compound carbon materials are prepared with method of electrostatic spinning
Material, ball mill grinding obtain complex carbon material powder.
According to following parts by weight dispensing:
Above-mentioned 11 parts of complex carbon material powder
2 parts of ethyl orthosilicate
6 parts of prodan
1 part of polyglycolic acid
20 parts of polypropylene
0.5 part of bismuth
2 parts of containing hydrogen silicone oil crosslinking agent.
Mixed in proportion by said components, heating stirring to be uniformly mixed, by mixture in vacuum degasing machine into
Row deaeration, inclined heated plate 5h；Feed the mixture into mould and cured again, solidification temperature is 240 DEG C, cures postcooling extremely
Room temperature, is prepared composite conducting encapsulating material.
Embodiment two
Carbon black pre-processes, and sodium fluoride is mixed in nano carbon black powder, and adds metallic catalyst, mixes, in inert gas shielding
Under sodium fluoride is fixed in 650 DEG C of heating, heating time control on nano carbon black powder surface in 15min.
Carbon nano-fiber pre-processes, and the Nano carbon fibers Wesy concentrated sulfuric acid is carried out with potassium permanganate to mix acid oxidase, through ultrasound
After being vigorously stirred, the carbon nano-fiber of carboxylated is obtained, adds surface conditioning agent, heats 15min at 200 DEG C, in nitrogen
Gas and helium it is mixed gas protected under at 450 DEG C heat 45min, the carbon nano-fiber material pre-processed.
The carbon nano-fiber of the carbon black of pretreatment and pretreatment is placed in container, is dissolved with 250 parts of isopropanols, with strength
Mixer is blended, and then carries out ultrasonic disperse with ultrasonic wave separating apparatus again, supersonic frequency 30kHz, time 2h, form homogeneous
Nano-sized carbon conductive fiber material solution.
Obtained nano-sized carbon conductive fiber material solution and chemical blend thing are subjected to chemical blend, the chemical blend thing
For polyvinyl chloride, the mass fraction of the chemical blend thing accounts for the 30% of original solution, and compound carbon materials are prepared with method of electrostatic spinning
Material, ball mill grinding obtain complex carbon material powder.
According to following parts by weight dispensing:
Above-mentioned 13 parts of complex carbon material powder
5 parts of ethyl orthosilicate
9 parts of prodan
1.5 parts of polyglycolic acid
24 parts of polypropylene
1 part of bismuth
4 parts of containing hydrogen silicone oil crosslinking agent.
Mixed in proportion by said components, heating stirring to be uniformly mixed, by mixture in vacuum degasing machine into
Row deaeration, inclined heated plate 7h；Feed the mixture into mould and cured again, solidification temperature is 250 DEG C, cures postcooling extremely
Room temperature, is prepared composite conducting encapsulating material.
Claims (1)
1. a kind of preparation method of composite conducting encapsulating material, this method comprises the following steps：
（1）Prepare complex carbon material powder
Carbon black pre-processes, and sodium fluoride is mixed in nano carbon black powder, and adds metallic catalyst, mixes, in inert gas shielding
Under sodium fluoride is fixed in 600-650 DEG C of heating, heating time control on nano carbon black powder surface in 10-15min；
Carbon nano-fiber pre-processes, and the Nano carbon fibers Wesy concentrated sulfuric acid is carried out with potassium permanganate to mix acid oxidase, violent through ultrasound
After stirring, the carbon nano-fiber of carboxylated is obtained, adds surface conditioning agent, heats 10-15min at 150-200 DEG C,
Nitrogen and helium it is mixed gas protected under at 400-450 DEG C heat 30-45min, the carbon nano-fiber material pre-processed；
The carbon nano-fiber of the carbon black of pretreatment and pretreatment is placed in container, is dissolved with 150-250 parts of isopropanols, with strength
Mixer is blended, and then carries out ultrasonic disperse, supersonic frequency 25-30kHz, time 1-2h, shape with ultrasonic wave separating apparatus again
Into the nano-sized carbon conductive fiber material solution of homogeneous；
Obtained nano-sized carbon conductive fiber material solution and chemical blend thing are subjected to chemical blend, the chemical blend thing is poly-
Vinyl chloride, the mass fraction of the chemical blend thing account for the 25-30% of original solution, compound carbon materials are prepared with method of electrostatic spinning
Material, ball mill grinding obtain complex carbon material powder；
（2）According to following parts by weight dispensing:
Above-mentioned 11-13 parts of complex carbon material powder
2-5 parts of ethyl orthosilicate
6-9 parts of prodan
1-1.5 parts of polyglycolic acid
20-24 parts of polypropylene
0.5-1 parts of bismuth
2-4 parts of containing hydrogen silicone oil crosslinking agent；
（3）Mixed in proportion by said components, heating stirring carries out mixture to being uniformly mixed in vacuum degasing machine
Deaeration, inclined heated plate 5-7h；
Feed the mixture into mould and cured again, solidification temperature is 240 DEG C -250 DEG C, cures postcooling to room temperature, prepares
Obtain composite conducting encapsulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711199711.6A CN107936368A (en) | 2017-11-26 | 2017-11-26 | A kind of preparation method of composite conducting encapsulating material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711199711.6A CN107936368A (en) | 2017-11-26 | 2017-11-26 | A kind of preparation method of composite conducting encapsulating material |
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| Publication Number | Publication Date |
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| CN107936368A true CN107936368A (en) | 2018-04-20 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104292755A (en) * | 2014-10-16 | 2015-01-21 | 苏州思莱特电子科技有限公司 | High-molecule LED (Light-Emitting Diode) packaging material and preparation method thereof |
| CN104788961A (en) * | 2015-05-20 | 2015-07-22 | 龚灿锋 | LED encapsulating material |
| CN105177745A (en) * | 2015-08-31 | 2015-12-23 | 贵州省纤维检验局 | Novel electromagnetic shielding nanocarbon conductive fibrous material and preparation method thereof |
| CN105542693A (en) * | 2016-03-15 | 2016-05-04 | 重庆信德电子有限公司 | Packaging material for LED filament |
| CN106751346A (en) * | 2016-11-24 | 2017-05-31 | 陕西聚洁瀚化工有限公司 | The synthetic method of fluorochemical monomer modified organosilicon encapsulating material |
-
2017
- 2017-11-26 CN CN201711199711.6A patent/CN107936368A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104292755A (en) * | 2014-10-16 | 2015-01-21 | 苏州思莱特电子科技有限公司 | High-molecule LED (Light-Emitting Diode) packaging material and preparation method thereof |
| CN104788961A (en) * | 2015-05-20 | 2015-07-22 | 龚灿锋 | LED encapsulating material |
| CN105177745A (en) * | 2015-08-31 | 2015-12-23 | 贵州省纤维检验局 | Novel electromagnetic shielding nanocarbon conductive fibrous material and preparation method thereof |
| CN105542693A (en) * | 2016-03-15 | 2016-05-04 | 重庆信德电子有限公司 | Packaging material for LED filament |
| CN106751346A (en) * | 2016-11-24 | 2017-05-31 | 陕西聚洁瀚化工有限公司 | The synthetic method of fluorochemical monomer modified organosilicon encapsulating material |
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Application publication date: 20180420 |