CN104893311A - LED packaging material - Google Patents
LED packaging material Download PDFInfo
- Publication number
- CN104893311A CN104893311A CN201510375064.4A CN201510375064A CN104893311A CN 104893311 A CN104893311 A CN 104893311A CN 201510375064 A CN201510375064 A CN 201510375064A CN 104893311 A CN104893311 A CN 104893311A
- Authority
- CN
- China
- Prior art keywords
- parts
- dichloromethyl phenylsilane
- sulfydryl
- mass fraction
- phenyl vinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to LED packaging material, comprising, by weight, 15 to 19 parts of methylphenyldichlorosilane, 6 to 12 parts of methyl high-phenyl vinyl silicone resin, 4 to 8 parts of bisphenol-A epoxy resin, 18 to 22 parts of diethylaminopropylamine, 8 to 10 parts of methylphenyldichlorosilane, and 3 to 5 parts of mercaptan-containing silsesquioxane compound. The materials of the LED are optimized, thus refractive index, hardness and bonding strength of the LED are evidently improved. The LED packaging material produced by such a method has the refractive index from 1.64 to 1.69, shore hardness from 64A to 72A and bonding strength 6.6MPa to 7.4MPa.
Description
Technical field
The present invention relates to a kind of LED encapsulation material, belong to LED technology field.
Background technology
LED is new generation of green environmentfriendly products, is widely used in automobile, illumination, electronics backlight, the fields such as traffic lights.In order to protect IC, prevent the undesirable element of outside atmosphere from causing damage to chip, extend the work-ing life of LED, its chip is encapsulated.At present, the traditional material for LED is epoxy resin, and cheap application is wide, and resin itself has the excellent feature such as electrical insulating property, stopping property, dielectric properties, cohesiveness, makes it encapsulate market at home and account for sizable ratio.But there is humidity resistance due to itself and weathering resistance is poor, and the problem such as matter is crisp, fatiguability, toughness are low and heat dispersion is poor, easily xanthochromia is there is under ultraviolet lighting and hot conditions, and not easy heat radiation, these problems all cause reduce the work-ing life of LED component.
Summary of the invention
The object of the present invention is to provide a kind of LED encapsulation material, to encapsulate for LED better, improve the result of use of LED.
To achieve these goals, technical scheme of the present invention is as follows.
A kind of LED encapsulation material, is made up of the component of following mass fraction: dichloromethyl phenylsilane is 15 ~ 19 parts, methyl height phenyl vinyl polysiloxane 6 ~ 12 parts, bisphenol A type epoxy resin are 4 ~ 8 parts, diethylaminopropylamine is 18 ~ 22 parts, dichloromethyl phenylsilane is 8 ~ 10 parts, be 3 ~ 5 parts containing the silesquioxane compound of sulfydryl.
The preparation method of above-mentioned packaged material is following steps:
(1) dichloromethyl phenylsilane of above-mentioned mass fraction, methyl height phenyl vinyl polysiloxane, dichloromethyl phenylsilane, silesquioxane compound containing sulfydryl is got, by dichloromethyl phenylsilane, methyl height phenyl vinyl polysiloxane, dichloromethyl phenylsilane, dissolve containing after silesquioxane compound four kinds of composition heating of sulfydryl, be stirred to after dissolving and mix;
(2) add bisphenol A type epoxy resin, the diethylaminopropylamine of above-mentioned mass fraction again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 140 DEG C ~ 150 DEG C, is cooled to room temperature, prepares LED encapsulation material after solidification.
This beneficial effect of the invention is: the present invention, by being optimized the material of light emitting diode, improves the specific refractory power of photodiode, hardness and cohesive strength significantly.The specific refractory power of the LED encapsulation material that method of the present invention prepares is 1.64 to 1.69, and shore hardness is 64A to 72A, and cohesive strength is 6.6MPa to 7.4MPa.
Embodiment
Below in conjunction with embodiment, the specific embodiment of the present invention is described, better to understand the present invention.
Embodiment 1
LED encapsulation material in the present embodiment, is made up of the component of following mass fraction: dichloromethyl phenylsilane is 15 parts, methyl height phenyl vinyl polysiloxane 6 parts, bisphenol A type epoxy resin are 4 parts, diethylaminopropylamine is 18 parts, dichloromethyl phenylsilane is 8 parts, be 3 parts containing the silesquioxane compound of sulfydryl.
Above-mentioned encapsulation preparation method is following steps:
(1) dichloromethyl phenylsilane of above-mentioned mass fraction, methyl height phenyl vinyl polysiloxane, dichloromethyl phenylsilane, silesquioxane compound containing sulfydryl is got, by dichloromethyl phenylsilane, methyl height phenyl vinyl polysiloxane, dichloromethyl phenylsilane, dissolve containing after silesquioxane compound four kinds of composition heating of sulfydryl, be stirred to after dissolving and mix;
(2) add bisphenol A type epoxy resin, the diethylaminopropylamine of above-mentioned mass fraction again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 140 DEG C DEG C, is cooled to room temperature after solidification, prepares LED encapsulation material.
The specific refractory power of the LED encapsulation material that method of the present invention prepares is 1.64, and shore hardness is 64A, and cohesive strength is 6.6MPa.
Embodiment 2
LED encapsulation material in the present embodiment, is made up of the component of following mass fraction: dichloromethyl phenylsilane is 17 parts, methyl height phenyl vinyl polysiloxane 9 parts, bisphenol A type epoxy resin are 6 parts, diethylaminopropylamine is 20 parts, dichloromethyl phenylsilane is 9 parts, be 4 parts containing the silesquioxane compound of sulfydryl.
Above-mentioned encapsulation preparation method is following steps:
(1) dichloromethyl phenylsilane of above-mentioned mass fraction, methyl height phenyl vinyl polysiloxane, dichloromethyl phenylsilane, silesquioxane compound containing sulfydryl is got, by dichloromethyl phenylsilane, methyl height phenyl vinyl polysiloxane, dichloromethyl phenylsilane, dissolve containing after silesquioxane compound four kinds of composition heating of sulfydryl, be stirred to after dissolving and mix;
(2) add bisphenol A type epoxy resin, the diethylaminopropylamine of above-mentioned mass fraction again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 145 DEG C, is cooled to room temperature after solidification, prepares LED encapsulation material.
The specific refractory power of the LED encapsulation material that method of the present invention prepares is 1.69, and shore hardness is 72A, and cohesive strength is 7.4MPa.
Embodiment 3
LED encapsulation material in the present embodiment, is made up of the component of following mass fraction: dichloromethyl phenylsilane is 19 parts, methyl height phenyl vinyl polysiloxane 12 parts, bisphenol A type epoxy resin are 8 parts, diethylaminopropylamine is 22 parts, dichloromethyl phenylsilane is 10 parts, be 5 parts containing the silesquioxane compound of sulfydryl.
Above-mentioned encapsulation preparation method is following steps:
(1) dichloromethyl phenylsilane of above-mentioned mass fraction, methyl height phenyl vinyl polysiloxane, dichloromethyl phenylsilane, silesquioxane compound containing sulfydryl is got, by dichloromethyl phenylsilane, methyl height phenyl vinyl polysiloxane, dichloromethyl phenylsilane, dissolve containing after silesquioxane compound four kinds of composition heating of sulfydryl, be stirred to after dissolving and mix;
(2) add bisphenol A type epoxy resin, the diethylaminopropylamine of above-mentioned mass fraction again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 150 DEG C, is cooled to room temperature after solidification, prepares LED encapsulation material.
The specific refractory power of the LED encapsulation material that method of the present invention prepares is 1.66, and shore hardness is 68A, and cohesive strength is 6.9MPa.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (2)
1. a LED encapsulation material, is characterized in that: be made up of the component of following mass fraction: dichloromethyl phenylsilane is 15 ~ 19 parts, methyl height phenyl vinyl polysiloxane 6 ~ 12 parts, bisphenol A type epoxy resin are 4 ~ 8 parts, diethylaminopropylamine is 18 ~ 22 parts, dichloromethyl phenylsilane is 8 ~ 10 parts, be 3 ~ 5 parts containing the silesquioxane compound of sulfydryl.
2. LED encapsulation material according to claim 1, is characterized in that: the preparation method of described packaged material is following steps:
(1) dichloromethyl phenylsilane of above-mentioned mass fraction, methyl height phenyl vinyl polysiloxane, dichloromethyl phenylsilane, silesquioxane compound containing sulfydryl is got, by dichloromethyl phenylsilane, methyl height phenyl vinyl polysiloxane, dichloromethyl phenylsilane, dissolve containing after silesquioxane compound four kinds of composition heating of sulfydryl, be stirred to after dissolving and mix;
(2) add bisphenol A type epoxy resin, the diethylaminopropylamine of above-mentioned mass fraction again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is about 3h;
(4) added in mould by mixture and be cured, solidification value is about 140 DEG C ~ 150 DEG C, is cooled to room temperature, prepares LED encapsulation material after solidification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510375064.4A CN104893311A (en) | 2015-07-01 | 2015-07-01 | LED packaging material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510375064.4A CN104893311A (en) | 2015-07-01 | 2015-07-01 | LED packaging material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104893311A true CN104893311A (en) | 2015-09-09 |
Family
ID=54026296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510375064.4A Pending CN104893311A (en) | 2015-07-01 | 2015-07-01 | LED packaging material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104893311A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529539A (en) * | 2017-07-18 | 2018-01-02 | 池州市中翔光电科技有限公司 | A kind of LED lamp chip encapsulation material |
| CN114957923A (en) * | 2021-12-29 | 2022-08-30 | 江苏志纤复能科技有限公司 | Vinyl organic silicon toughening modified epoxy resin and preparation method thereof |
-
2015
- 2015-07-01 CN CN201510375064.4A patent/CN104893311A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529539A (en) * | 2017-07-18 | 2018-01-02 | 池州市中翔光电科技有限公司 | A kind of LED lamp chip encapsulation material |
| CN114957923A (en) * | 2021-12-29 | 2022-08-30 | 江苏志纤复能科技有限公司 | Vinyl organic silicon toughening modified epoxy resin and preparation method thereof |
| CN114957923B (en) * | 2021-12-29 | 2023-08-18 | 江苏志纤复能科技有限公司 | Vinyl organosilicon toughened and modified epoxy resin and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104788961A (en) | LED encapsulating material | |
| CN102702441B (en) | Preparation method of organic silicon-polymethyl methacrylate composite materials | |
| CN103641998B (en) | The white epoxy resin composition that LED reflector is used | |
| CN102093719A (en) | High-power light emitting diode (LED) chip packaging soft gel | |
| KR20160110553A (en) | Curable silicone composition, cured product thereof, and optical semiconductor device | |
| CN109777039B (en) | Epoxy resin composition rubber cake for chip LED packaging and preparation method and packaging process thereof | |
| Bae et al. | Sol–gel synthesized linear oligosiloxane-based hybrid material for a thermally-resistant light emitting diode (LED) encapsulant | |
| CN103951984A (en) | Solidifiable silicon resin composition and optical semiconductor device using same | |
| CN105400211A (en) | LED packaging material | |
| CN108017879A (en) | A kind of preparation of high-power LED encapsulation white epoxy moulding compound | |
| CN106751893A (en) | A kind of refractive power LED encapsulation add-on type liquid silicon rubbers high and preparation method thereof | |
| CN103608408A (en) | Curable composition | |
| EP3101052B1 (en) | Cured product | |
| CN104893311A (en) | LED packaging material | |
| JP6361319B2 (en) | Curable resin composition | |
| CN104893253A (en) | LED (light-emitting diode) packaging material | |
| TW201536838A (en) | Curable silicone resin composition | |
| KR20170032362A (en) | Curable silicone resin composition, cured object obtained therefrom, and optical semiconductor device formed using same | |
| CN105885012B (en) | A kind of preparation method of modified epoxy for LED encapsulation | |
| CN104610897A (en) | Preparation method of acrylic acid modified epoxy resin for LED packaging | |
| CN104945851A (en) | LED packaging materials | |
| JP6357896B2 (en) | Curable resin composition | |
| CN103965581A (en) | Curable resin composition and resin composition for optical semiconductor encapsulation | |
| CN101654509A (en) | Preparation method of epoxy silsesquioxane/epoxy resin hybrid material for packaging large-power LED | |
| KR101585773B1 (en) | Led encapsulant comprisng a rare earth metal oxide particles |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150909 |