CN107511549A - A kind of compound cold bench and its manufacture method - Google Patents
A kind of compound cold bench and its manufacture method Download PDFInfo
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- CN107511549A CN107511549A CN201710786396.0A CN201710786396A CN107511549A CN 107511549 A CN107511549 A CN 107511549A CN 201710786396 A CN201710786396 A CN 201710786396A CN 107511549 A CN107511549 A CN 107511549A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V13/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices covered by groups G01V1/00 – G01V11/00
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Abstract
The invention discloses a kind of compound cold bench and its manufacture method, method to include：Cold bench outer shroud blank is combined with cold bench inner core blank by brazing mode, obtains compound cold bench blank；Wherein, cold bench outer shroud blank uses the first predetermined material, and cold bench inner core blank uses the second predetermined material, and the first predetermined material is different from the second predetermined material；Compound cold bench blank is handled by predetermined method for fine finishing according to pre-set dimension, to obtain structure as the compound cold bench that is made up of cold bench outer shroud and cold bench inner core.The compound cold bench manufactured using the above method, using two kinds of different materials, both the requirement to match with low heat conductivity cold finger material can have been met, meet the requirement to match with the thermal coefficient of expansion of detector chip again, so as to ensure that detector chip is in low stress environment, and it is simple in construction, convenient manufacture, solve problem of the prior art.
Description
Technical field
The present invention relates to infrared detector field, more particularly to a kind of compound cold bench and its manufacture method.
Background technology
Infrared detector has a wide range of applications in fields such as early warning detection, intelligence reconnaissance, precision strike, astronomical observations.
Generally, infrared detector chip is packaged using Dewar, for detector chip provide vacuum, low temperature building ring
Border.
In Dewar, Dewar cold finger is made up of cold finger and cold bench, and its effect is to provide support for detector chip, and will be cold
Amount passes to detector chip.Wherein, cold finger is in order to reduce conductive heat leakage, the general TC4 titanium alloy poor from heat conductivility
Material.Cold bench is typically chosen the material that heat conduction is good, thermal coefficient of expansion is low to preferably transmit cold.But sometimes for system
Convenient consideration is made, for ease of cold bench and the laser welding of cold finger, cold bench can also use the TC4 titanium alloy material consistent with cold finger
Material.It is cold under cryogenic because the thermal coefficient of expansion of TC4 titanium alloy materials is larger when cold bench uses TC4 titanium alloy materials
Thermal mismatching phenomenon occurs with detector chip in platform, causes detector chip bearing larger thermal stress, influences chip performance.
If the cold bench selection material that heat conduction is good, thermal coefficient of expansion is low, cold bench and the material that cold finger uses are inconsistent, can only use pricker
The cold bench of different materials is attached by Welding with cold finger, and manufacturing process is more complicated.
The content of the invention
The invention provides a kind of compound cold bench and its manufacture method, to solve the following problem of prior art：Cold bench
It can only be made up of a kind of material, it is impossible to both met the requirement with the cold finger match materials of low heat conductivity, met and detector core again
The requirement that the thermal coefficient of expansion of piece matches.
In order to solve the above technical problems, on the one hand, the present invention provides a kind of manufacture method of compound cold bench, including：Will be cold
Platform outer shroud blank is combined with cold bench inner core blank by brazing mode, obtains compound cold bench blank；Wherein, the cold bench outer shroud hair
Base uses the first predetermined material, and the cold bench inner core blank uses the second predetermined material, first predetermined material and described the
Two predetermined materials are different；The compound cold bench blank is handled by predetermined method for fine finishing according to pre-set dimension, to obtain structure
For the compound cold bench being made up of cold bench outer shroud and cold bench inner core.
Optionally, the predetermined method for fine finishing is turnery processing.
Optionally, first predetermined material is TA2 commercial titaniums, and second predetermined material is that indium cuts down alloy or can cut down conjunction
Gold.
Optionally, first predetermined material is TC4 titanium alloys, and second predetermined material is that indium cuts down alloy or can cut down conjunction
Gold.
On the other hand, the present invention also provides a kind of compound cold bench, is manufactured according to the manufacture method of above-mentioned compound cold bench
Obtain, including：Cold bench outer shroud and cold bench inner core, the cold bench outer shroud wrap up the cold bench inner core, the cold bench outer shroud with it is described
Cold bench inner core connects；Wherein, the cold bench outer shroud uses the first predetermined material, and the cold bench inner core uses the second predetermined material,
First predetermined material is different from second predetermined material.
Optionally, the cold bench outer shroud is torus, and the cold bench inner core is cylinder, the geometric center of the torus
Overlapped with the geometric center of the cylinder.
Optionally, first predetermined material is TA2 commercial titaniums, and second predetermined material is that indium cuts down alloy.
Optionally, first predetermined material is TA2 commercial titaniums, and second predetermined material is kovar alloy.
Optionally, first predetermined material is TC4 titanium alloys, and second predetermined material is that indium cuts down alloy.
Optionally, first predetermined material is TC4 titanium alloys, and second predetermined material is kovar alloy.
Compound cold bench and its manufacture method provided by the invention, by using in the cold bench outer shroud blank of different materials and cold bench
Core blank is combined by brazing mode, obtains compound cold bench blank, then the cold bench blank is finished to obtain composite cold
Platform.The compound cold bench manufactured using the above method, using two kinds of different materials, can both meet the cold finger material with low heat conductivity
Expect the requirement matched, meet the requirement to match with detector chip thermal coefficient of expansion again, ensure that detector chip is in low and answered
Power state, and simple in construction, convenient manufacture.Solves the following problem of prior art：Cold bench can only be made up of a kind of material,
The requirement with the cold finger match materials of low heat conductivity can not both be met, meet to match with the thermal coefficient of expansion of detector chip again
Requirement.
Brief description of the drawings
Fig. 1 is the flow chart of the manufacture method of compound cold bench in the embodiment of the present invention；
Fig. 2 is the schematic top plan view of compound cold bench blank in example of the embodiment of the present invention 1；
Fig. 3 is the sectional view of the line A-A along Fig. 2 in example of the embodiment of the present invention 1；
Fig. 4 is the schematic top plan view of compound cold bench in example of the embodiment of the present invention 1；
Fig. 5 is the sectional view of the line B-B along Fig. 4 in example of the embodiment of the present invention 1.
Embodiment
In order to solve the following problem of prior art：Cold bench can only be made up of a kind of material, it is impossible to while meet to lead with low
The cold finger match materials of heating rate and two requirements of matched coefficients of thermal expansion with detector chip.
The embodiments of the invention provide a kind of manufacture method of compound cold bench, this method flow chart is as shown in figure 1, including step
Rapid S102 to S104：
S102, cold bench outer shroud blank is combined with cold bench inner core blank by brazing mode, obtains compound cold bench blank.
Wherein, cold bench outer shroud blank uses the first predetermined material, and cold bench inner core blank uses the second predetermined material, and first is pre-
It is different from the second predetermined material to determine material；
S104, compound cold bench blank is handled by predetermined method for fine finishing according to pre-set dimension, to obtain structure as by cold
The compound cold bench of platform outer shroud and cold bench inner core composition.
In the present embodiment, the material that cold bench outer shroud and cold bench inner core use all is alloy material, for convenience of manufacturing, is used
Method for fine finishing be turnery processing.
In the fabrication process, in order that cold bench outer shroud and the structure Joining Technology outside cold bench are simple, and then convenient manufacture,
Meanwhile and can is to ensure the matched coefficients of thermal expansion of cold bench inner core and detector chip, and then ensure that chip is in low stress
State, so, during realization, the first predetermined material that cold bench outer shroud uses can be TA2 commercial titaniums, and cold bench inner core is adopted
Second predetermined material can be that indium cuts down alloy or kovar alloy.For the first predetermined material, TA2 commercial titaniums are a kind of choosing
Select, the material with it with similar characteristics can also be used, for example, the first predetermined material is arranged into TC4 titanium alloys.
The compound cold bench manufacture method that the present embodiment provides, is divided into cold bench outer shroud and cold bench inner core two by the compound cold bench of finished product
Part, and two parts use different materials, in the fabrication process, are attached above-mentioned two-part blank by soldering processes
Compound cold bench blank is made, then compound cold bench blank is finished by turnery processing mode, and then obtains answering for finished product
Close cold bench.Above-mentioned compound cold bench is combined into by two kinds of different materials, therefore, expands the model of cold bench material selection
Enclose, manufacturing process and the technique manufacture cold bench for using maturation, be easy to industrialized production.
Based on the manufacture method of above-mentioned compound cold bench, the present embodiment additionally provides a kind of compound cold bench, and the compound cold bench is
Manufacture what is obtained by above-mentioned compound cold bench manufacture method, the compound cold bench specifically includes：Cold bench outer shroud and cold bench inner core, cold bench
Outer shroud wraps up cold bench inner core, and cold bench outer shroud is connected with cold bench inner core；Wherein, cold bench outer shroud uses the first predetermined material, in cold bench
Core uses the second predetermined material, and the first predetermined material is different from the second predetermined material.
Compound cold bench is attached with the panel detector structure outside it for convenience, and facilitates cold bench outer shroud and cold bench inner core
Connection, in specific implementation, cold bench outer shroud can be arranged to torus, cold bench inner core is arranged to cylinder, and torus
Geometric center overlapped with the geometric center of cylinder.
In specific implementation, to make cold bench outer shroud use the low thermal conductivity material to match with cold finger, while cold bench inner core
With the matched coefficients of thermal expansion of detector chip, so as to ensure the low stress of chip, the first predetermined material that cold bench outer shroud uses
Can be TA2 commercial titaniums, the second predetermined material that cold bench inner core uses can cut down alloy for indium.
In order to realize following purpose：Cold bench outer shroud uses the low thermal conductivity material to match with cold finger, while cold bench inner core
With the matched coefficients of thermal expansion of detector chip, so as to ensure that chip is in low-stress state.The first of cold bench outer shroud use is pre-
It can be TA2 commercial titaniums to determine material, and the second predetermined material that cold bench inner core uses can cut down alloy for indium.For the first predetermined material
Material, a kind of above-mentioned simply example, in specific design, the first predetermined material can also be TC4 titanium alloys；For the second predetermined material
Material, above-mentioned is also only a kind of example, and in specific design, the second predetermined material can also be kovar alloy.
By the present embodiment during realization, the material of cold bench outer shroud and cold bench inner core can be replaced, entered
And expand cold bench material selection scope, and can also meet to match with low heat conductivity cold finger material simultaneously and with detection
Two requirements that the thermal coefficient of expansion of the chip of device matches；Further, compound cold bench structure letter provided in an embodiment of the present invention
Single, manufacturing process is ripe, is easy to industrial production.
Below by way of example and accompanying drawing, the present embodiment is specifically described.
Example 1
The compound cold bench of this example includes cold bench outer shroud and cold bench inner core two parts, therefore, during fabrication, by cold bench outer shroud
Blank is combined with cold bench inner core blank by brazing mode.The schematic top plan view of compound cold bench blank is as shown in Fig. 2 compound
Cold bench blank is as shown in Figure 3 along the sectional view of line A-A., can be because when cold bench outer shroud blank 101 combines with cold bench inner core blank 102
There is tolerance in blank, cause gap be present between two parts.In view of the situation, just should by circular solder inserted into gap it
In, solder and blank are heated.In order to realize the purpose of soldering, the fusing point of general solder is less than the metal material that blank uses
The fusing point of material, after being heated to solder fusing, the solder of fusing is automatically complete by gap filling caused by tolerance, by shaping, just
Compound cold bench blank is obtained.
Further, obtained compound cold bench blank is finished, because the material of cold bench is metal material, finishing
When can use precision machine tool carry out turnery processing, according to the size being actually needed, cold bench blank is processed, just obtained
The cold bench being made up of cold bench outer shroud 201 and cold bench inner core 202.The schematic top plan view of compound cold bench is as shown in figure 4, compound cold bench edge
The sectional view of line B-B is as shown in Figure 5.
In order to meet the requirement to match with low heat conductivity cold finger material, the heat of the chip of cold bench and detector can be made again
Matched expansion coefficient, the material of cold bench outer shroud and cold bench inner core in compound cold bench can be selected.Cold bench outer shroud selects
Material when should ensure that compound cold bench and cold finger are attached, relatively simple technique can be used.In addition, compound cold bench conduct
The carrier of detector chip, the material of cold bench inner core selection should ensure that the thermal coefficient of expansion phase with the material of detector chip
Match somebody with somebody, so that chip is in low stress environment, and then ensure chip performance.Therefore, in specific implementation, composite cold in this example
The material that the cold bench outer shroud of platform uses is convenient to be welded with cold finger for TA2 commercial titaniums.In this example in the cold bench of compound cold bench
The material that core uses cuts down alloy for indium, and the thermal conductivity that indium cuts down alloy is higher, is 10.2W/mK, and thermal coefficient of expansion is relatively low, is 1.5
×10-6/ K so that the matched coefficients of thermal expansion of the material of cold bench inner core and detector chip, ensure that the performance of detector chip
Give full play to.
The compound cold bench formed using the cold bench outer shroud of TA2 commercial titaniums with cutting down the cold bench inner core of alloy using indium, both can be with
Meet to require with low heat conductivity cold finger material identical, the thermal coefficient of expansion phase of composite cold platform and the chip of detector can be made again
Matching, ensure that detector chip is in low stress environment, and simple in construction, convenient manufacture.Solve the as follows of prior art
Problem：Cold bench can only be made up of a kind of material, it is impossible to while meet and and detector chip identical with low heat conductivity cold finger material
The requirement of matched coefficients of thermal expansion two.
Example 2
The compound cold bench of this example includes cold bench outer shroud and cold bench inner core two parts, therefore, during fabrication, by cold bench outer shroud
Blank is combined with cold bench inner core blank by brazing mode., can be because when cold bench outer shroud blank combines with cold bench inner core blank
There is tolerance in blank, cause gap be present between two parts.In view of the situation, just should by circular solder inserted into gap it
In, solder and blank are heated.In order to realize the purpose of soldering, the fusing point of general solder is less than the metal material that blank uses
The fusing point of material, after being heated to solder fusing, the solder of fusing is automatically complete by gap filling caused by tolerance, by shaping, just
Compound cold bench blank is obtained.
Further, obtained compound cold bench blank is finished, because the material of cold bench is metal material, finishing
When can use precision machine tool carry out turnery processing, according to the size being actually needed, cold bench blank is processed, just obtained
The compound cold bench being made up of cold bench outer shroud and cold bench inner core.
In order to meet the requirement with low heat conductivity cold finger match materials, can make again cold bench and detector chip it is hot swollen
Swollen coefficient matches, and the material of cold bench outer shroud and cold bench inner core in compound cold bench can be selected.The selection of cold bench outer shroud
When material should ensure that cold bench is attached with cold finger, relatively simple technique can be used.In addition, compound cold bench is as detector
The carrier of chip, the material of cold bench inner core selection should ensure that the thermal coefficient of expansion phase of the material of cold bench and the material of detector chip
Matching, so as to ensure that chip is in low stress environment, and then ensure chip performance.Therefore, it is multiple in this example in specific implementation
The material that the cold bench outer shroud of conjunction cold bench uses is convenient to be welded with cold finger for TA2 commercial titaniums.In this example, compound cold bench
The material that cold bench inner core uses for kovar alloy, compared to the indium that cold bench inner core in example 1 uses cut down by the thermal conductivity of kovar alloy
Alloy is higher, is 20.6W/mK, and thermal coefficient of expansion is relatively low, is 6.4 × 10-6/ K so that cold bench inner core and detector chip
The thermal coefficient of expansion of material more matches, and ensure that the performance of detector chip gives full play to.
The cold bench that cold bench outer shroud using TA2 commercial titaniums forms with the cold bench inner core using kovar alloy, can both meet
The requirement to match with low heat conductivity cold finger material, the thermal coefficient of expansion phase of composite cold platform and the chip of detector can be made again
Match somebody with somebody, ensure that detector chip is in low stress environment, and simple in construction, convenient manufacture.Solve the following of prior art to ask
Topic：Cold bench can only be made up of a kind of material, it is impossible to while meet identical and with detector chip with low heat conductivity cold finger material
Two requirements of matched coefficients of thermal expansion.
Example 3
The compound cold bench of this example includes cold bench outer shroud and cold bench inner core two parts, therefore, during fabrication, by cold bench outer shroud
Blank is combined with cold bench inner core blank by brazing mode., can be because when cold bench outer shroud blank combines with cold bench inner core blank
There is tolerance in blank, cause gap be present between two parts.In view of the situation, just should by circular solder inserted into gap it
In, solder and blank are heated.In order to realize the purpose of soldering processes, the fusing point of general solder is less than the gold that blank uses
Belong to the fusing point of material, after being heated to solder fusing, the solder of fusing automatically supplements in gap caused by tolerance completely, by fixed
Type, compound cold bench blank is just obtained.
Further, obtained compound cold bench blank is finished, because the material of cold bench is metal material, finishing
When can use precision machine tool carry out turnery processing, according to the size being actually needed, compound cold bench blank is processed, must
To the compound cold bench being made up of cold bench outer shroud and cold bench inner core.
In order to meet the requirement to match with low heat conductivity cold finger material, the heat of the chip of cold bench and detector can be made again
Matched expansion coefficient, the material of cold bench outer shroud and cold bench inner core in compound cold bench can be selected.Cold bench outer shroud selects
Material when should ensure that compound cold bench and cold finger are attached, relatively simple technique can be used.In addition, compound cold bench conduct
The carrier of detector chip, the material of cold bench inner core selection should ensure that the heat of the material of compound cold bench and the material of detector chip
Matched expansion coefficient, so that chip is in low stress environment, and then ensure chip performance.Therefore, in specific implementation, this
The material that the cold bench outer shroud of compound cold bench uses in example is convenient to be welded with cold finger for TC4 titanium alloys.It is compound in this example
The material that the cold bench inner core of cold bench uses cuts down alloy for indium, and the thermal conductivity that indium cuts down alloy is higher, is 10.2W/mK, thermal expansion system
Number is relatively low, is 1.5 × 10-6/ K so that cold bench inner core more matches with the thermal coefficient of expansion of the material of detector chip, ensure that
The performance of detector chip gives full play to.
The compound cold bench formed using the cold bench outer shroud of TC4 titanium alloys with cutting down the cold bench inner core of alloy using indium, both can be with
Meet the requirement with low heat conductivity cold finger match materials, the thermal coefficient of expansion phase of composite cold platform and the chip of detector can be made again
Matching, ensure that detector chip is in low stress environment, and simple in construction, convenient manufacture.Solve the as follows of prior art
Problem：Cold bench can only be made up of a kind of material, it is impossible to while meet and low heat conductivity cold finger match materials and and detector chip
The requirement of matched coefficients of thermal expansion two.
Example 4
The compound cold bench of this example includes cold bench outer shroud and cold bench inner core two parts, therefore, during fabrication, by cold bench outer shroud
Blank is combined with cold bench inner core blank by brazing mode., can be because when cold bench outer shroud blank combines with cold bench inner core blank
There is tolerance in blank, cause gap be present between two parts.In view of the situation, just should by circular solder inserted into gap it
In, solder and blank are heated.In order to realize the purpose of soldering processes, the fusing point of general solder is less than the gold that blank uses
Belong to the fusing point of material, after being heated to solder fusing, the solder of fusing automatically supplements in gap caused by tolerance completely, by fixed
Type, compound cold bench blank is just obtained.
Further, obtained compound cold bench blank is finished, because the material of cold bench is metal material, finishing
When can use precision machine tool carry out turnery processing, according to the size being actually needed, compound cold bench blank is processed, must
To the compound cold bench being made up of cold bench outer shroud and cold bench inner core.
In order to meet with low heat conductivity cold finger material identical requirement, can make again cold bench and detector chip it is hot swollen
Swollen coefficient matches, and the material of cold bench outer shroud and cold bench inner core in compound cold bench can be selected.The selection of cold bench outer shroud
When material should ensure that cold bench is attached with cold finger, relatively simple technique can be used.In addition, compound cold bench is as detector
The carrier of chip, the material of cold bench inner core selection should ensure that the thermal coefficient of expansion phase of the material of cold bench and the material of detector chip
Matching, ensure that chip is in low stress environment, and then ensure chip performance.Therefore, in specific implementation, composite cold in this example
The material that the cold bench outer shroud of platform uses is convenient to be welded with cold finger for TC4 titanium alloys.In this example in the cold bench of compound cold bench
For the material that core uses for kovar alloy, the thermal conductivity of kovar alloy is higher, is 20.6W/mK, and thermal coefficient of expansion is relatively low, is 6.4
×10-6/ K so that cold bench inner core more matches with the thermal coefficient of expansion of the material of detector chip, ensure that detector chip
Performance gives full play to.
The compound cold bench that cold bench outer shroud using TC4 titanium alloys forms with the cold bench inner core using kovar alloy, both can be with
Meet to require with low heat conductivity cold finger material identical, the thermal coefficient of expansion phase of composite cold platform and the chip of detector can be made again
Matching, ensure that detector chip is in low stress environment, and simple in construction, convenient manufacture.Solve the as follows of prior art
Problem：Cold bench can only be made up of a kind of material, it is impossible to while meet and and detector chip identical with low heat conductivity cold finger material
The requirement of matched coefficients of thermal expansion two.
Compound cold bench and its manufacture method provided in an embodiment of the present invention, by using different materials cold bench outer shroud blank with
Cold bench inner core blank is combined by brazing mode, obtains cold bench blank, then cold bench blank is finished to obtain composite cold
Platform.The compound cold bench manufactured using the above method, using two kinds of different materials, can both meet and low heat conductivity cold finger material
Identical requirement, can make the thermal coefficient of expansion of the chip of cold bench and detector match again, ensure that detector chip is in low
Ambient stress, and simple in construction, convenient manufacture.Solves the following problem of prior art：Cold bench can only be by a kind of material structure
Into, it is impossible to while meet two requirements of matched coefficients of thermal expansion identical with low heat conductivity cold finger material and with detector chip.
Although being example purpose, the preferred embodiments of the present invention are had been disclosed for, those skilled in the art will recognize
Various improvement, increase and substitution are also possible, and therefore, the scope of the present invention should be not limited to above-described embodiment.
Claims (10)
- A kind of 1. manufacture method of compound cold bench, it is characterised in that including：Cold bench outer shroud blank is combined with cold bench inner core blank by brazing mode, obtains compound cold bench blank；Wherein, it is described cold Platform outer shroud blank uses the first predetermined material, and the cold bench inner core blank uses the second predetermined material, first predetermined material It is different from second predetermined material；The compound cold bench blank is handled by predetermined method for fine finishing according to pre-set dimension, to obtain structure as by cold bench outer shroud With the compound cold bench of cold bench inner core composition.
- 2. manufacture method as claimed in claim 1, it is characterised in that the predetermined method for fine finishing is turnery processing.
- 3. manufacture method as claimed in claim 1, it is characterised in thatFirst predetermined material is TA2 commercial titaniums, and second predetermined material is that indium cuts down alloy or kovar alloy.
- 4. manufacture method as claimed in claim 1, it is characterised in thatFirst predetermined material is TC4 titanium alloys, and second predetermined material is that indium cuts down alloy or kovar alloy.
- 5. a kind of compound cold bench, manufacture to obtain by the manufacture method of the compound cold bench any one of Claims 1-4, It is characterised in that it includes：Cold bench outer shroud and cold bench inner core, the cold bench outer shroud wrap up the cold bench inner core, the cold bench outer shroud with the cold bench Core connects；Wherein, the cold bench outer shroud uses the first predetermined material, and the cold bench inner core uses the second predetermined material, and described One predetermined material is different from second predetermined material.
- 6. compound cold bench as claimed in claim 5, it is characterised in thatThe cold bench outer shroud is torus, and the cold bench inner core is cylinder, the geometric center of the torus and the cylinder The geometric center of body overlaps.
- 7. the compound cold bench as described in claim 5 or 6, it is characterised in thatFirst predetermined material is TA2 commercial titaniums, and second predetermined material is that indium cuts down alloy.
- 8. the compound cold bench as described in claim 5 or 6, it is characterised in thatFirst predetermined material is TA2 commercial titaniums, and second predetermined material is kovar alloy.
- 9. the compound cold bench as described in claim 5 or 6, it is characterised in thatFirst predetermined material is TC4 titanium alloys, and second predetermined material is that indium cuts down alloy.
- 10. the compound cold bench as described in claim 5 or 6, it is characterised in thatFirst predetermined material is TC4 titanium alloys, and second predetermined material is kovar alloy.
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| CN108672865A (en) * | 2018-04-16 | 2018-10-19 | 中国电子科技集团公司第十研究所 | A kind of silk screen method for welding |
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Application publication date: 20171226 |