CN107507840B - Display panel and display device - Google Patents

Display panel and display device Download PDF

Info

Publication number
CN107507840B
CN107507840B CN201710758807.5A CN201710758807A CN107507840B CN 107507840 B CN107507840 B CN 107507840B CN 201710758807 A CN201710758807 A CN 201710758807A CN 107507840 B CN107507840 B CN 107507840B
Authority
CN
China
Prior art keywords
film layer
partition
display panel
layer
panel according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710758807.5A
Other languages
Chinese (zh)
Other versions
CN107507840A (en
Inventor
张鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Tianma Microelectronics Co Ltd
Original Assignee
Shanghai Tianma AM OLED Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Tianma AM OLED Co Ltd filed Critical Shanghai Tianma AM OLED Co Ltd
Priority to CN201710758807.5A priority Critical patent/CN107507840B/en
Publication of CN107507840A publication Critical patent/CN107507840A/en
Application granted granted Critical
Publication of CN107507840B publication Critical patent/CN107507840B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting

Abstract

The invention discloses a display panel and a display device, which belong to the technical field of display and comprise a first film layer and a second film layer which are stacked; a step area; the second film layer partially covers the first film layer and exposes part of the upper surface of the first film layer to form a first step structure; a plurality of signal traces; in the step area, a plurality of signal wires are arranged on the surface of the first step structure; in the step area, at least two first partition parts are arranged between two adjacent signal wires, and the first partition parts are connected with the cross section of the second film layer; the lengths of the at least two first partitions are not completely the same along the extending direction of the signal trace on the upper surface of the first film layer. The method can prevent the short circuit of two adjacent signal wires caused by the residual photoresist in the process of manufacturing the display panel, and improve the yield of the display panel.

Description

Display panel and display device
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
The display panel provided by the prior art includes a plurality of stacked film layers and a plurality of signal lines.
Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic diagram of a partial planar structure of a display panel provided in the prior art, and fig. 2 is a schematic diagram of a cross-sectional structure along line XX' in fig. 1. In the display panel provided by the prior art, the display panel includes a substrate 01, a first film layer 02 and a second film layer 03 which are sequentially disposed. The substrate base plate 01, the first film layer 02 and the second film layer 03 form a step structure similar to a step shape. The signal line 04 extends from the surface of the second film 03 to the substrate base plate 01 through the step structure, and the signal line 04 is used for transmitting an electrical signal in the display panel.
In the process of manufacturing the display panel provided in the related art, after the substrate 01, the first film layer 02, and the second film layer 03 are manufactured, the signal lines 04 need to be manufactured. The specific process of manufacturing the signal line 04 includes: firstly, forming a signal line material layer on the surface of a structure formed by stacking a substrate base plate 01, a first film layer 02 and a second film layer 03, then coating a layer of photoresist on the surface of the signal line material layer, and patterning the photoresist by using a mask plate to enable the photoresist to form a required pattern; and then, after wet etching or dry etching is adopted, part of the signal line material layer covered by the photoresist is reserved, and part of the signal line material layer not covered by the photoresist is removed.
However, in the step structure, both the region a and the region B are inner corners of the step structure, and the photoresist is usually easily remained at the positions of the region a and the region B, and the photoresist at the two positions cannot be completely removed in the process of patterning the photoresist by using the mask. The remaining photoresist between two adjacent signal lines 04, in the region a or the region B, is usually a long stripe in the shape of a straight line segment. The remaining photoresist may prevent the removal of a portion of the signal line material layer at the positions of the region a and the region B, which may cause a short circuit between two adjacent signal lines 04, and reduce the yield of the display panel.
Disclosure of Invention
In view of the foregoing, the present invention provides a display panel and a display device.
The present invention provides a display panel, comprising: the first film layer and the second film layer are stacked; the surface of one side of the first film layer, which is close to the second film layer, is the upper surface of the first film layer, and the surface of one side of the second film layer, which is far away from the first film layer, is the upper surface of the second film layer; a step area; the second film layer partially covers the first film layer and exposes part of the upper surface of the first film layer to form a first step structure; the surface of the first step structure comprises a part of the upper surface of the second film layer, a part of the section of the second film layer and a part of the upper surface of the first film layer; the cross section of the second film layer is connected with the upper surface of the second film layer and the upper surface of the first film layer; a plurality of signal traces; in the step area, a plurality of signal wires are arranged on the surface of the first step structure; in the step area, at least two first partition parts are arranged between two adjacent signal wires, and the first partition parts are connected with the cross section of the second film layer; the lengths of the at least two first partitions are not completely the same along the extending direction of the signal trace on the upper surface of the first film layer.
In some alternative embodiments, the first partition is the same material as the second film layer; the first partition part and the second film layer are integrally formed in the same manufacturing process.
In some optional embodiments, a third film layer is further included; the third film layer is arranged on the upper surface of the second film layer; the surface of one side of the third film layer, which is far away from the second film layer, is the upper surface of the third film layer; in the step area, the third film layer partially covers the second film layer and exposes part of the upper surface of the second film layer to form a second step structure; the surface of the second step structure comprises a part of the upper surface of the third film layer, the section of the third film layer and a part of the upper surface of the first film layer; the cross section of the third film layer is connected with the upper surface of the third film layer and the upper surface of the second film layer; in the step area, a plurality of signal wires are arranged on the surface of the second step structure; at least two second partition parts are arranged between every two adjacent signal wires and connected with the cross section of the third film layer; the lengths of the at least two second partitions are not completely the same along the extending direction of the signal trace on the upper surface of the second film layer.
In some alternative embodiments, the second partition is the same material as the third film layer; the second partition part and the third film layer are integrally formed in the same manufacturing process.
In some alternative embodiments, the at least one second partition includes an elongated second partition that extends from the upper surface of the second film layer to a cross-section of the second film layer and the upper surface of the first film layer.
In some alternative embodiments, the length of the elongated second partitions on the upper surface of the first film layer along the extending direction of the signal traces on the upper surface of the first film layer is 15-20 μm.
In some optional embodiments, in the extending direction of the signal trace on the upper surface of the second film layer, the length of the second partitions on the upper surface of the second film layer is 5-10 μm except for the lengthened second partitions in at least one of the second partitions.
In some optional embodiments, at least one second elongated partition and at least two first partitions are included between two adjacent signal traces; the lengthened second partition part is arranged between two adjacent first partition parts.
In some optional embodiments, along the extending direction of the signal trace on the upper surface of the first film layer, the length of the lengthened second partition on the upper surface of the first film layer is a, and the length of the first partition adjacent to the lengthened second partition is b, wherein b-a is greater than or equal to 5 μm.
In some optional embodiments, between two adjacent signal traces, the first partitions and the second partitions are alternately arranged.
In some alternative embodiments, the distance between two adjacent signal traces, between the adjacent first partition and the adjacent second partition, is d1, and d1 ≧ 2.5 μm.
In some alternative embodiments, the first film layer is a flexible substrate layer; the second membrane layer comprises at least one inorganic layer; the third membrane layer includes at least one inorganic layer.
In some optional embodiments, the length of the first partition on the upper surface of the first film layer along the extending direction of the signal trace on the upper surface of the first film layer is 5-10 μm.
In some alternative embodiments, the display panel includes a display area and a peripheral non-display area; the step area is arranged in the non-display area; the plurality of signal wires extend from the display area to the step area.
In some alternative embodiments, the display panel includes a plurality of organic light emitting diodes.
The invention also provides a display device which comprises the display panel provided by the invention.
Compared with the prior art, the display panel and the display device provided by the invention at least realize the following beneficial effects:
in the display panel and the display device provided by the invention, the display panel comprises the first film layer and the second film layer which are stacked. The display panel further includes a stepped region including a first stepped structure. The second film layer partially covers the first film layer and exposes part of the upper surface of the first film layer to form a first step structure. A plurality of signal routing lines are arranged on the surface of the first step structure. At least two first partition parts are arranged between two adjacent signal wires; the first partition part is connected with the section of the second film layer. The partition part is arranged on the section of the second film layer, so that the short circuit of two adjacent signal wires caused by residual photoresist can be prevented in the process of manufacturing the display panel; in addition, the lengths of the at least two second partition parts are not completely the same, so that the short circuit of two adjacent signal wires caused by photoresist residue can be further prevented, and the yield of the display panel is improved.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic view of a partial plan structure of a display panel provided in the prior art;
FIG. 2 is a schematic cross-sectional view taken along line XX' in FIG. 1;
fig. 3 is a schematic view of a partial plan structure of a display panel according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view taken along line YY' in FIG. 3;
FIG. 5 is a schematic cross-sectional view taken along line ZZ' in FIG. 3;
FIG. 6 is a schematic diagram of a partial plan view of another display panel according to an embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view taken along line MM' of FIG. 6;
FIG. 8 is a schematic diagram of a partial plan view of a display panel according to another embodiment of the present invention;
FIG. 9 is a schematic cross-sectional view taken along line NN' of FIG. 8;
fig. 10 is a schematic plan view illustrating a display panel according to another embodiment of the present invention;
fig. 11 is a schematic diagram of a display device according to an embodiment of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Referring to fig. 3, fig. 4 and fig. 5 in combination, fig. 3 is a schematic partial plan view of a display panel according to an embodiment of the present invention, fig. 4 is a schematic cross-sectional view taken along a line YY 'in fig. 3, and fig. 5 is a schematic cross-sectional view taken along a line ZZ' in fig. 3.
An embodiment of the present invention provides a display panel, including: a first membrane layer 10 and a second membrane layer 20 arranged in a stacked manner; the surface of one side of the first film layer 10 close to the second film layer 20 is a first film layer upper surface 11, and the surface of one side of the second film layer 20 away from the first film layer 10 is a second film layer upper surface 21; a step area ST; the second film 20 partially covers the first film 10 and exposes a portion of the first film upper surface 11 to form a first step structure T1; the surface of the first step structure T1 includes a portion of the second film layer upper surface 21, a portion of the second film layer cross-section 22, a portion of the first film layer upper surface 11; wherein the second film section 22 connects the second film top surface 21 and the first film top surface 11; a plurality of signal traces 40; in the step area ST, a plurality of signal traces 40 are disposed on the surface of the first step structure T1; in the step area ST, at least two first partitions 51 are included between two adjacent signal traces 40, and the first partitions 51 are connected with the cross section 22 of the second film layer; along the extending direction of the signal trace 40 on the first film layer upper surface 11, the lengths L51 of at least two first partitions 51 are different from the lengths of other first partitions.
In the display panel provided by the embodiment, the display panel has a function of displaying image information; the display panel may include a display area including a plurality of pixels and a non-display area including signal traces, electronic components, and the like. The display panel includes a first film layer 10 and a second film layer 20 stacked, the first film layer 10 and the second film layer 20 may be disposed in a display region, or may be disposed in a non-display region, or may extend from the display region to the non-display region, and the position of the first film layer 10 and the second film layer 20 is not particularly limited in the embodiment of the present invention.
Fig. 3, 4 and 5 provide a display panel including a step region ST including a first step structure T1. it is understood that the specific location of the step region ST is determined by the locations of the first and second film layers 10 and 20; when the first and second film layers 10 and 20 extend from the display region to the non-display region, the step region ST may be disposed in the display region, the non-display region, or the step region ST may extend from the display region to the non-display region.
The display panel provided by this embodiment further includes a plurality of signal traces 40, and the signal traces 40 are used for transmitting electrical signals. In fig. 3, only 3 signal traces 40 are illustrated as an example, and it is understood that the number of signal traces 40 is set according to the specific situation of the display panel. In the step area ST, a plurality of signal traces 40 are disposed on the surface of the first step structure T1. In other words, the signal line 40 extends at least through the second film layer upper surface 21, the cross-section 22 of the second film layer, and the first film layer upper surface 11.
In the display panel provided in this embodiment, at least two first partitions 51 are further disposed between two adjacent signal traces 40. Wherein the first interruptions 51 are connected to the cross-section 22 of the second film layer. The first partition 51 has a function of isolating two adjacent signal traces 40. In the process of manufacturing the display panel provided by this embodiment, after the first film layer 10 and the second film layer 20 are completed and the step region ST is formed, the signal traces 40 are manufactured. The specific process of manufacturing the signal trace 40 includes: first, a signal routing material layer is formed on the surface of the structure formed by stacking the first film layer 10 and the second film layer 20, and the signal routing material layer covers the surface of the first step structure T1. Then, coating a layer of photoresist on the surface of the signal wiring material layer, and patterning the photoresist by using a mask plate to enable the photoresist to form a pattern corresponding to the signal wiring; in the step area ST, the first partition 51 is arranged between two adjacent signal traces 40, and the first partition 51 is connected with the cross section 22 of the second film layer, so that the structure at the inner corner T11 of the first step structure T1 is damaged, and the residual photoresist between two adjacent signal traces 40 cannot form a linear-segment-shaped strip; specifically, a side surface of the first partition 51 away from the cross section 22 of the second film layer is a first partition front end surface 511, and the remaining photoresist cannot bypass the first partition 51 at the position of the first partition 51, and especially a broken and discontinuous shape is easily formed at the first partition front end surface 511, so that the remaining photoresist cannot form a continuous strip-shaped structure at the inner corner T11 of the first step structure T1 between two adjacent signal traces 40. When wet etching or dry etching is used, the part of the signal line material layer covered by the photoresist is remained, and the part of the signal line material layer not covered by the photoresist is removed.
Further, the lengths of the first partitions 51 are not exactly the same. It can be understood that the first partition 51 functions to prevent the photoresist from remaining at the inner corner T11 to cause a short circuit between two adjacent signal lines, and although the first partition 51 is disposed, the photoresist has a certain probability to bypass the first partition 51, so that the adjacent signal lines are still short-circuited, and thus the short-circuit probability of the signal lines can be reduced by increasing the number of the first partitions 51, but the distance between two adjacent signal lines is often very small, when a plurality of first partitions 51 are disposed, the distance between adjacent first partitions 51 is very small, and if the lengths of the first partitions 51 are the same, the situation that the photoresist is connected to form a line is likely to occur at the front end surface 511 of the first partition, and therefore, the length of at least two first partitions 51 is set to be different between two adjacent signal lines 40, even if the photoresist bypasses the shorter first partition 51, it is difficult to continue to bypass the long first partition 51, the probability of short circuit of the signal trace 40 is greatly reduced, and it is not necessary to provide many first partitions 51.
By providing the first partitions 51 with different lengths and forming the zigzag structure with irregular length at the cross section 22 of the second film layer, the structure at the inner corner T11 of the first step structure T1 can be further damaged, so that between two adjacent signal traces 40, at the inner corner T11 of the first step structure T1, the residual photoresist further cannot form a continuous strip-shaped structure. Because the residual photoresist cannot form a continuous strip-shaped structure at the inner corner T11 of the first step structure T1 between two adjacent signal traces 40, the corresponding residual signal line material layer cannot be electrically connected to the two adjacent signal traces 40, thereby solving the technical problem that the two signal traces 40 are easily short-circuited in the prior art.
In the display panels shown in fig. 3, 4, and 5, only two first partitions 51 will be described as an example. In other alternative implementations, the number of the first partition parts 51 may be three or more, and the number of the first partition parts 51 is not particularly limited in this embodiment.
In the display panel provided by the embodiment of the invention, the display panel comprises a first film layer and a second film layer which are stacked. The display panel further includes a stepped region including a first stepped structure. The second film layer partially covers the first film layer and exposes part of the upper surface of the first film layer to form a first step structure. A plurality of signal routing lines are arranged on the surface of the first step structure. At least two first partition parts are arranged between two adjacent signal wires; the first partition part is connected with the section of the second film layer. The partition part is arranged on the section of the second film layer, so that the short circuit of two adjacent signal wires caused by residual photoresist can be prevented in the process of manufacturing the display panel; in addition, the lengths of the at least two second partition parts are not completely the same, so that the short circuit of two adjacent signal wires caused by photoresist residue can be further prevented, and the yield of the display panel is improved.
In some optional embodiments, on the display panel provided in any embodiment of the present invention, the first partition and the second film layer are made of the same material; the first partition part and the second film layer are integrally formed in the same manufacturing process. Specifically, referring to fig. 6 and 7, fig. 6 is a schematic partial plan view of another display panel according to an embodiment of the present invention, and fig. 7 is a schematic cross-sectional view along the MM' line in fig. 6. Fig. 6 follows the reference numerals of fig. 3. In the display panel shown in fig. 6 and 7, the first partition 51 and the second film layer 20 are formed integrally by the same manufacturing process using the same material. For example, in the process of manufacturing a display panel, after a first film layer 10 is formed, a second film layer material layer and a photoresist are sequentially formed on the surface of the first film layer 10, the photoresist is patterned by using a mask through setting a pattern of the mask, and then wet etching or dry etching is performed to obtain the first partition part 51 and the second film layer 20. In fig. 7, the relative position of the cross-section 22 of the second film layer is illustrated in dashed lines. In the display panel provided in this embodiment, the first partition 51 and the second film layer 20 are formed integrally in the same manufacturing process using the same material, which can simplify the manufacturing process of the display panel and improve the manufacturing efficiency of the display panel.
Optionally, with continued reference to fig. 6 and 7, the height H51 of the first partition 51 is the same as the height H20 of the second film layer 20. Alternatively, the number of the first partition parts 51 is plural, and fig. 6 illustrates an embodiment in which the number of the first partition parts 51 is three. Through setting up a plurality of first wall portions 51, form jagged structure in the cross-section 22 department of second rete, the structure of interior corner T11 department that can further destroy first stair structure T1 for between two adjacent signal traces 40, at the interior corner T11 department of first stair structure T1, remaining photoresist further can 'T form continuous strip structure, thereby solved prior art, two signal traces 40 take place the technical problem of short circuit easily, improve display panel's yield.
In some optional embodiments, please continue to refer to fig. 6 and fig. 7, the display panel provided in this embodiment further includes a third film layer 30; the third film layer 30 is disposed on the second film layer upper surface 21; the surface of the third film layer 30 on the side away from the second film layer 20 is a third film layer upper surface 31; in the step region ST, the third film layer 30 partially covers the second film layer 20 and exposes a portion of the second film layer upper surface 21 to form a second step structure T2; the surface of the second step structure T2 includes a portion of the third film layer upper surface 31, a portion of the third film layer cross-section 32, a portion of the first film layer upper surface 11; wherein the cross-section of the third film layer connects the third film layer upper surface and the second film layer upper surface; wherein the third film section 32 connects the third film upper surface 31 and the second film upper surface 21; in the step area ST, a plurality of signal traces 40 are disposed on the surface of the second step structure T2; at least two second partitions 52 are included between two adjacent signal traces 40, and the second partitions 52 are connected to the cross section 32 of the third film layer; the lengths L52 of the at least two second partitions 52 are not exactly the same along the extending direction of the signal traces 40 on the second film layer upper surface 21. It can be understood that the function and the working principle of the second partition portion 52 are similar to those of the first partition portion 51, and the second partition portion 52 destroys the structure at the inner corner T21 of the second stepped structure T2, so that between two adjacent signal traces 40, at the inner corner T21 of the second stepped structure T2, the residual photoresist cannot form a continuous strip-shaped structure, thereby solving the technical problem that the two signal traces 40 are easily short-circuited in the prior art and improving the yield of the display panel. In the display panel provided by this embodiment, by providing at least two second partitions 52, a zigzag structure is formed at the cross section 32 of the third film layer, the structure at the inner corner T21 of the second step structure T2 can be further damaged, so that two adjacent signal traces 40 are connected to each other, at the inner corner T21 of the second step structure T2, the remaining photoresist further cannot form a continuous strip structure, thereby solving the technical problem that two signal traces 40 are easily short-circuited in the prior art, and improving the yield of the display panel. Alternatively, the number of the second partitions 52 is plural, and fig. 6 illustrates an embodiment in which the number of the second partitions 52 is three.
In some optional embodiments, on the display panel provided in any embodiment of the present invention, the second partition and the third film layer are made of the same material; the second partition part and the third film layer are integrally formed in the same manufacturing process. With continued reference to fig. 6 and 7, the second partition 52 and the third film 30 are integrally formed by the same material and in the same manufacturing process. For example, in the process of manufacturing the display panel, after the first film layer 10 and the second film layer 20 are formed, a third film layer material layer and a photoresist are sequentially formed on the surface of the second film layer 20, the photoresist is patterned by using a mask by setting a pattern of the mask, and then wet etching or dry etching is performed to obtain the second partition portion 52 and the third film layer 30. In fig. 7, the relative position of the cross-section 32 of the third film layer is illustrated in dashed lines. In the display panel provided in this embodiment, the second partition portion 52 and the third film layer 30 are integrally formed in the same manufacturing process using the same material, which can simplify the manufacturing process of the display panel and improve the manufacturing efficiency of the display panel. Optionally, with continued reference to fig. 6 and 7, the height H52 of the second partition 52 is the same as the height H30 of the third film 30.
In some optional embodiments, please refer to fig. 8 and 9, fig. 8 is a schematic partial plan view of a display panel according to another embodiment of the present invention, and fig. 9 is a schematic cross-sectional view along the NN' line in fig. 8. In the display panel shown in fig. 8 and 9, the at least one second partition 52 includes an elongated second partition 521, and the elongated second partition 521 extends from the second film layer upper surface 21 to the cross section 22 of the second film layer and the first film layer upper surface 11. In fig. 9, the relative position of the cross-section 32 of the third film layer is illustrated in dashed lines. In the display panel provided in the present embodiment, the elongated second blocking portion 521 is provided, and the elongated second blocking portion 521 extends through the second film layer upper surface 21, the cross section 22 of the second film layer, and the first film layer upper surface 11 in sequence, so that the structure at the inner corner T11 of the first stepped structure T1 and the structure at the inner corner T21 of the second stepped structure T2 are simultaneously destroyed; moreover, since the lengthened second partition portion 521 extends to the upper surface 11 of the first film layer, at the inner corner T11 of the first stepped structure T1, when the first partition portion 51 does not effectively partition the adjacent two signal traces 40, the lengthened second partition portion 521 can further destroy the continuous structure of the residual photoresist at the cross section 22 of the second film layer, so that the residual photoresist further cannot form a continuous strip-shaped structure, thereby solving the technical problem that the two signal traces 40 are easily short-circuited in the prior art, and improving the yield of the display panel. Optionally, with continued reference to fig. 8 and fig. 9, two adjacent signal traces 40 include at least one second elongated partition 521 and at least two first partitions 51 therebetween; the elongated second partition 521 is disposed between two adjacent first partitions 51. Optionally, with continued reference to fig. 8 and fig. 9, along the extending direction of the signal trace 40 on the first film layer upper surface 11, the length L521 of the lengthened second partition 521 on the first film layer upper surface 11 is 15-20 μm. Optionally, along the extending direction of the signal trace 40 on the first film layer upper surface 11, the length L521 of the lengthened second partition 521 on the first film layer upper surface 11 is a, and the length L52 of the first partition 51 adjacent to the lengthened second partition 521 is b, where b-a is greater than or equal to 5 μm. Next, the adjacent first partition 51 and the elongated second partition 521 will be described as an example. The surface of the first partition 51 away from the cross section 22 of the second film layer is a first partition front end surface 511, and the surface of the elongated second partition 521 away from the cross section 22 of the second film layer is an elongated second partition front end surface 5211. If the difference between the lengths of the extended second partition 521 and the adjacent first partition 51 is too small, the photoresist is easily connected at the first partition front end surface 511 and the extended second partition front end surface 5211, and a continuous pattern is formed around the first partition 51 and the extended second partition 521, which cannot be effectively broken. By setting the length difference between the lengthened second partition 521 and the adjacent first partition 51, the continuous structure of the residual photoresist at the section 22 of the second film layer can be effectively destroyed, and the reliability of the display panel is improved. Optionally, the thickness of the third film layer 30 is smaller than that of the second film layer 20, and at this time, the photoresist is more likely to remain at the inner corner T11 of the first step structure T1 relative to the inner corner T21 of the second step structure T2, so that the two adjacent signal traces 40 can be effectively prevented from being shorted by the arrangement of the lengthened second partition 521.
Optionally, with continued reference to fig. 8 and fig. 9, between two adjacent signal traces 40, the first partitions 51 and the second partitions 52 are alternately disposed. Specifically, since the first partition parts 51 and the second partition parts 52 are respectively disposed on different film layers, the first partition parts 51 and the second partition parts 52 are alternately disposed, that is, along the extending direction y of the signal trace 40 on the upper surface 31 of the third film layer, the straight line on which the first partition parts 51 are disposed and the straight line on which the second partition parts 52 are disposed are alternately disposed. Optionally, the distance between two adjacent signal traces 40 and between the adjacent first partition 51 and the adjacent second partition 52 is d1, and d1 is greater than or equal to 2.5 μm. The present embodiment provides a display panel in which the minimum distance between adjacent first and second partitions 51 and 52 is 2.5 μm. Next, the adjacent first partition 51 and the elongated second partition 521 will be described as an example. The surface of the first partition 51 away from the cross section 22 of the second film layer is a first partition front end surface 511, and the surface of the elongated second partition 521 away from the cross section 22 of the second film layer is an elongated second partition front end surface 5211. If the distance between the adjacent first partition 51 and the second partition 521 is too small, the photoresist is easily connected at the first partition front end surface 511 and the second partition front end surface 5211, and a continuous pattern is formed around the first partition 51 and the second partition 521, which cannot be effectively broken. By setting the minimum distance between the adjacent first and second partitions 51 and 52 to be 2.5 μm, the continuous structure of the photoresist can be effectively broken at the positions of the adjacent first and second partitions 51 and 52.
Optionally, on the basis of the display panel provided in any embodiment of the present invention, along the extending direction of the signal trace 40 on the first film layer upper surface 11, the length L51 of the first partition 51 on the first film layer upper surface 11 is 5 to 10 μm. Optionally, in the extending direction of the signal trace 40 on the second film layer upper surface 21, in at least one of the second partitions 52, except for the lengthened second partition 521, the length L52 of the remaining second partitions 52 on the second film layer upper surface 21 is 5-10 μm. When the length of the first partition 51 or the second partition 52 is less than 5 μm, the photoresist may not be effectively broken, and a continuous pattern may be formed around the first partition 51 or the second partition 52. The length L51 of the first partition 51 and the length L52 of the second partition 52 should not exceed 10 μm so as not to occupy too much area of the display panel. By setting the length L51 of the first partition part 51 and the length L52 of the second partition part 52 within the range of 5-10 μm, the structure at the inner corner T11 of the first step structure T1 and the structure at the inner corner T21 of the second step structure T2 can be effectively destroyed, so that the residual photoresist cannot form a continuous strip structure, the technical problem that the two signal traces 40 are easy to short-circuit in the prior art is solved, and the yield of the display panel is improved.
It is understood that the present invention is only exemplary herein of the length and relative position relationship of the first partition 51 and the second partition 52. The lengths and relative positional relationships of the first partition 51 and the second partition 52 may be set according to the specific implementation such as the size of the panel and the size of the step structure.
In some optional embodiments, please refer to fig. 10, fig. 10 is a schematic plan view illustrating a display panel according to another embodiment of the present invention. On the basis of the display panel provided by any embodiment of the invention, the display panel comprises a display area AA and a peripheral non-display area BB; the step area ST is arranged in the non-display area BB; the plurality of signal traces 40 extend from the display area AA to the step area ST. In the display panel provided in this embodiment, in order to make the non-display area BB thinner, a portion of the film structure in the non-display area BB is removed, so that a step area ST is formed in the non-display area BB.
In some alternative embodiments, on the basis of the display panel provided in any embodiment of the present invention, the first film layer is a flexible substrate layer, for example, the material of the first film layer may be a resin material, such as polyimide, and other film layer structures of the display panel are sequentially formed on the flexible substrate layer, so that the display panel is flexible and bendable. The second film layer includes at least one inorganic layer, for example, the second film layer may include a plurality of inorganic layers stacked and disposed, the material of the inorganic layers may include silicon nitride or silicon oxide, and the plurality of inorganic layers may serve as insulation or planarization in the display panel. The third membrane layer includes at least one inorganic layer, for example, the third membrane layer may include a plurality of inorganic layers stacked and the material of the inorganic layers may include silicon nitride or silicon oxide. Alternatively, when the step region ST is disposed in the non-display region BB, in order to make the non-display region BB of the display panel more easily bent, a portion of the inorganic layer in the step region ST is generally removed, thereby forming the step region ST.
In some optional embodiments, on the basis of the display panel provided in any embodiment of the present invention, the display panel includes a plurality of Organic Light-Emitting diodes (OLEDs). Optionally, the plurality of organic light emitting diodes are all disposed in the display area of the display panel. The display panel provided by the embodiment is an organic light emitting diode display panel, and has the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, high response speed and the like.
The invention also provides a display device comprising the display panel provided by any one of the above embodiments of the invention. Referring to fig. 11, fig. 11 is a schematic view of a display device according to an embodiment of the invention. Fig. 11 provides a display device 100 including a display panel 200 according to any of the above embodiments of the present invention. The embodiment of fig. 11 is only an example of a mobile phone, and the display device 100 is described, it is understood that the display device provided in the embodiment of the present invention may be other display devices with a display function, such as a computer, a television, and a vehicle-mounted display device, and the present invention is not limited thereto. The display device provided in the embodiment of the present invention has the beneficial effects of the display panel provided in the embodiment of the present invention, and specific reference may be made to the specific description of the display panel in each of the above embodiments, which is not repeated herein.
As can be seen from the foregoing embodiments, the display panel and the display device provided in the foregoing embodiments of the present invention at least achieve the following advantages:
in the display panel and the display device provided by the invention, the display panel comprises a first film layer, a second film layer and a third film layer which are stacked. The display panel further comprises a step area, the step area comprises a step structure, and the step structure comprises a first step structure and a second step structure. The second film layer partially covers the first film layer and exposes a part of the upper surface of the first film layer to form a first step structure, and the third film layer partially covers the second film layer and exposes a part of the upper surface of the second film layer to form a second step structure. A plurality of signal routing lines are arranged on the surface of the step structure. The two adjacent signal routing wires comprise at least one first partition part and at least one second partition part; the first partition part is connected with the cross section of the second film layer, and the second partition part is connected with the cross section of the third film layer. The partition parts are respectively arranged on the cross section of the second film layer and the cross section of the third film layer, so that the situation that two adjacent signal wires are short-circuited due to photoresist residue in the process of manufacturing the display panel can be prevented, and the yield of the display panel is improved.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (14)

1. A display panel, comprising:
the membrane comprises a first membrane layer, a second membrane layer and a third membrane layer which are arranged in a stacked mode; the surface of one side, close to the second film layer, of the first film layer is the upper surface of the first film layer, and the surface of one side, away from the first film layer, of the second film layer is the upper surface of the second film layer; the third film layer is arranged on the upper surface of the second film layer; the surface of one side of the third film layer, which is far away from the second film layer, is the upper surface of the third film layer;
a step area; the second film layer partially covers the first film layer and exposes part of the upper surface of the first film layer to form a first step structure; the surface of the first step structure comprises a part of the upper surface of the second film layer, a part of the cross section of the second film layer and a part of the upper surface of the first film layer; wherein the cross-section of the second film layer connects the second film layer upper surface and the first film layer upper surface;
the second membrane layer comprises at least one inorganic layer; a plurality of signal traces; in the step area, the plurality of signal wires are arranged on the surface of the first step structure; in the step area, at least two first partition parts are arranged between two adjacent signal wires, and the first partition parts are connected with the cross section of the second film layer; the lengths of the at least two first partitions are not completely the same along the extending direction of the signal routing on the upper surface of the first film layer; at least two second partition parts are arranged between every two adjacent signal wires, and the second partition parts are connected with the cross section of the third film layer; the lengths of the at least two second partitions are not completely the same along the extending direction of the signal trace on the upper surface of the second film layer;
wherein at least one of the second partitions comprises an elongated second partition extending from the upper surface of the second film layer to a cross-section of the second film layer and to the upper surface of the first film layer; at least one lengthened second partition part and at least two first partition parts are arranged between every two adjacent signal routing lines; the lengthened second partition part is arranged between two adjacent first partition parts.
2. The display panel according to claim 1,
the first partition part and the second film layer are made of the same material; the first partition part and the second film layer are integrally formed in the same manufacturing process.
3. The display panel according to claim 1,
in the step area, the third film layer partially covers the second film layer and exposes part of the upper surface of the second film layer to form a second step structure; the surface of the second step structure comprises a part of the upper surface of the third film layer, a part of the cross section of the third film layer and a part of the upper surface of the second film layer; wherein the cross-section of the third film layer connects the third film layer upper surface and the second film layer upper surface;
in the step area, the plurality of signal traces are arranged on the surface of the second step structure.
4. The display panel according to claim 3,
the second partition part and the third film layer are made of the same material; the second partition part and the third film layer are integrally formed in the same manufacturing process.
5. The display panel according to claim 1,
the length of the lengthened second partition part on the upper surface of the first film layer is 15-20 μm along the extending direction of the signal trace on the upper surface of the first film layer.
6. The display panel according to claim 1,
in the extending direction of the signal trace on the upper surface of the second film layer, the length of the rest of the second partition parts on the upper surface of the second film layer, except the lengthened second partition part, is 5-10 μm.
7. The display panel according to claim 1,
along the extending direction of the signal routing wire on the upper surface of the first film layer, the length of the lengthened second partition part on the upper surface of the first film layer is a, the length of the first partition part adjacent to the lengthened second partition part is b, and b-a is larger than or equal to 5 microns.
8. The display panel according to claim 3,
between two adjacent signal routing lines, the first partition parts and the second partition parts are alternately arranged.
9. The display panel according to claim 8,
and between two adjacent signal wires, the distance between the first partition part and the second partition part which are adjacent is d1, and d1 is more than or equal to 2.5 mu m.
10. The display panel according to claim 3,
the first film layer is a flexible substrate layer;
the third membrane layer includes at least one inorganic layer.
11. The display panel according to claim 1,
the length of the first partition on the upper surface of the first film layer is 5-10 μm along the extending direction of the signal trace on the upper surface of the first film layer.
12. The display panel according to claim 1,
the display panel comprises a display area and a peripheral non-display area; the step area is arranged in the non-display area;
the plurality of signal wires extend from the display area to the step area.
13. The display panel according to claim 1,
the display panel includes a plurality of organic light emitting diodes.
14. A display device characterized by comprising the display panel according to any one of claims 1 to 13.
CN201710758807.5A 2017-08-29 2017-08-29 Display panel and display device Active CN107507840B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710758807.5A CN107507840B (en) 2017-08-29 2017-08-29 Display panel and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710758807.5A CN107507840B (en) 2017-08-29 2017-08-29 Display panel and display device

Publications (2)

Publication Number Publication Date
CN107507840A CN107507840A (en) 2017-12-22
CN107507840B true CN107507840B (en) 2020-10-16

Family

ID=60694273

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710758807.5A Active CN107507840B (en) 2017-08-29 2017-08-29 Display panel and display device

Country Status (1)

Country Link
CN (1) CN107507840B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108878676A (en) * 2018-05-31 2018-11-23 武汉华星光电半导体显示技术有限公司 A kind of AMOLED thin-film packing structure and its manufacturing method
CN111180468A (en) * 2020-01-06 2020-05-19 昆山国显光电有限公司 Display panel, display device and preparation method of display panel
CN111445788A (en) * 2020-04-27 2020-07-24 Tcl华星光电技术有限公司 Display panel and manufacturing method thereof
CN112599701B (en) * 2020-12-14 2022-05-17 合肥维信诺科技有限公司 Display substrate
WO2023184374A1 (en) * 2022-03-31 2023-10-05 京东方科技集团股份有限公司 Display panel, array substrate, and manufacturing method therefor
CN115528046A (en) * 2022-08-16 2022-12-27 京东方科技集团股份有限公司 Display substrate, display device and preparation method of display substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181449A (en) * 1987-01-23 1988-07-26 Matsushita Electronics Corp Semiconductor device
CN104332485A (en) * 2014-09-24 2015-02-04 苹果公司 Silicon and semiconductor oxide thin film transistor display device
CN104952882A (en) * 2015-03-26 2015-09-30 友达光电股份有限公司 Active element array substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003172946A (en) * 2001-09-28 2003-06-20 Fujitsu Display Technologies Corp Substrate for liquid crystal display device and liquid crystal display device using the substrate
US9904130B2 (en) * 2014-05-22 2018-02-27 Sharp Kabushiki Kaisha Connecting wire

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181449A (en) * 1987-01-23 1988-07-26 Matsushita Electronics Corp Semiconductor device
CN104332485A (en) * 2014-09-24 2015-02-04 苹果公司 Silicon and semiconductor oxide thin film transistor display device
CN104952882A (en) * 2015-03-26 2015-09-30 友达光电股份有限公司 Active element array substrate

Also Published As

Publication number Publication date
CN107507840A (en) 2017-12-22

Similar Documents

Publication Publication Date Title
CN107507840B (en) Display panel and display device
CN108878444B (en) Display panel and display device
KR102339300B1 (en) Flexible touch screen panel and flexible touch screen display device
CN107068715B (en) Organic light-emitting display panel, organic light-emitting display device and preparation method of organic light-emitting display panel
US9287342B2 (en) Flexible organic light emitting display and method of manufacturing the same
CN106252380B (en) Flexible display panel and device
CN106129081B (en) Display device
CN109004012B (en) Display panel and display device thereof
CN106775039B (en) Embedded touch screen, manufacturing method thereof and display device
US9735184B2 (en) Forming method for structure of crossing datalines and scanning lines in display device
US9285939B2 (en) Touch panel
KR20180098451A (en) Display device
US10186648B2 (en) Display device
CN111128969B (en) Display panel and display device
CN113410414B (en) Stretchable array substrate, manufacturing method thereof, display panel and display device
US11216098B2 (en) OLED display panel and method for manufacturing same, and display apparatus
KR102619978B1 (en) Flexible display device
CN113206139A (en) Display panel, manufacturing method thereof and display device
TW201842690A (en) OLED, display, and mobile communication device
CN110658951B (en) Touch substrate, manufacturing method thereof and touch display device
US11372499B2 (en) Touch display panel and touch display device
US11893178B2 (en) Display panel, display device and method for fabricating the display panel
US11307689B2 (en) Display panel, and array substrate and manufacturing thereof
KR20180001206A (en) Light emitting diode chip and display device using the same and method for manufacturing thereof
US20200185376A1 (en) Array substrate and display panel

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20211022

Address after: No.8, liufangyuanheng Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430074

Patentee after: WUHAN TIANMA MICRO-ELECTRONICS Co.,Ltd.

Patentee after: Wuhan Tianma Microelectronics Co.,Ltd. Shanghai Branch

Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 201201

Patentee before: SHANGHAI TIANMA AM-OLED Co.,Ltd.

TR01 Transfer of patent right