CN111445788A - Display panel and manufacturing method thereof - Google Patents
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- CN111445788A CN111445788A CN202010341463.XA CN202010341463A CN111445788A CN 111445788 A CN111445788 A CN 111445788A CN 202010341463 A CN202010341463 A CN 202010341463A CN 111445788 A CN111445788 A CN 111445788A
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
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- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Abstract
The application discloses a display panel and a manufacturing method thereof. The display panel comprises an array substrate, an organic film layer and a plurality of first protruding parts positioned on the periphery of the organic film layer; the first protruding part and the organic film layer are arranged on the same layer, and the first protruding part is used for reducing non-organic film layer residue on the edge of the organic film layer. This application has alleviateed the light resistance at organic rete edge and has exposed to the sun problem weakly through setting up first bulge in the periphery of organic rete, reduces conducting material's residue, has solved conducting material and has even incomplete, the technical problem of short circuit.
Description
Technical Field
The present disclosure relates to display technologies, and particularly to a display panel and a manufacturing method thereof.
Background
With the improvement of the technology level, the quality requirements of people on the display panel are higher and higher.
In the prior art, in the manufacturing process of a display panel, because there are many film layers and the hole digging or signal interleaving is complicated, edge slopes with large section difference and large gradient are left on the film layers, and during subsequent conductive material coating and patterning, the photoresist at the edge slopes with large section difference and large gradient is exposed seriously, which results in photoresist residue, thereby leading to the technical problem of continuous residue and short circuit of the conductive material.
Therefore, a display panel and a method for fabricating the same are needed to solve the above-mentioned problems.
Disclosure of Invention
The application provides a display panel and a manufacturing method thereof, and aims to solve the technical problems that in the prior art, in the manufacturing process of the display panel, due to the fact that a plurality of film layers are arranged and holes are dug or signals are staggered and complicated, edge slopes with large section difference and large gradient are reserved on the film layers, and when subsequent conductive material coating and patterning processing are carried out, light resistance at the edge slopes with large section difference and large gradient is exposed seriously, so that light resistance residues are caused, and therefore the conductive material is continuous and residual and short-circuited during etching.
In order to solve the above problems, the technical solution provided by the present application is as follows:
a display panel comprises an array substrate, an organic film layer and a plurality of first protruding parts located on the periphery of the organic film layer;
the first protruding part and the organic film layer are arranged on the same layer, and the first protruding part is used for reducing non-organic film layer residue on the edge of the organic film layer.
In the display panel of this application, first bulge is in organic rete periphery interval sets up, first bulge is close to the thickness of organic rete one side with the thickness of organic rete is the same.
In the display panel of the present application, the first protruding portion includes at least a first sub-protruding portion and a second sub-protruding portion, the first sub-protruding portion contacts with the second sub-protruding portion, and the first sub-protruding portion contacts with the periphery of the organic film layer;
the thickness of the first sub-protrusion is the same as that of the organic film layer, and the thickness of the first sub-protrusion is greater than that of the second sub-protrusion.
In the display panel of the present application, the thickness of the first protrusion gradually decreases in a direction away from the organic film layer.
In the display panel of the present application, the slope of the first protrusion is 30 ° to 70 °.
In the display panel of the present application, an orthogonal projection of the first protrusion on the array substrate has any one of a circular shape, a trapezoidal shape, and a triangular shape.
In the display panel of the present application, the first protrusion is continuously disposed at the periphery of the organic film layer;
the first bulge at least comprises a first slope body and a second slope body, the first slope body is overlapped on the edge of the organic film layer, and the second slope body is overlapped on the first slope body;
the slope of the first slope body is smaller than that of the edge of the organic film layer, and the slope of the second slope body is smaller than that of the first slope body.
In the display panel of the present application, the slope of the second slope body is less than 30 °.
In the display panel of the present application, the organic film layer is one of a color resist layer and a planarization layer.
A manufacturing method of a display panel comprises the following steps:
forming an organic film on the array substrate;
patterning the organic film to form an organic film layer and a first protrusion part located at the periphery of the organic film layer;
the first protruding part and the organic film layer are arranged on the same layer, and the first protruding part is used for reducing non-organic film layer residue on the edge of the organic film layer.
Has the advantages that: this application has alleviateed the light resistance at organic rete edge and has exposed to the sun problem weakly through setting up first bulge in the periphery of organic rete, reduces conducting material's residue, has solved conducting material and has even incomplete, the technical problem of short circuit.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
FIG. 1 is a schematic top view of a first structure of a display panel according to the present application;
FIG. 2 is a schematic structural diagram of a first structure of a display panel according to the present application;
FIG. 3 is a schematic structural diagram of a second structure of a display panel according to the present application;
FIG. 4 is a schematic top view illustrating a third structure of a display panel according to the present application;
FIG. 5 is a schematic structural diagram of a third structure of a display panel according to the present application;
FIG. 6 is a schematic structural diagram of a fourth structure of a display panel according to the present application;
fig. 7 is a flowchart illustrating steps of a method for manufacturing a display panel according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
In the prior art, in the manufacturing process of a display panel, because there are many film layers and the hole digging or signal interleaving is complicated, edge slopes with large section difference and large gradient are left on the film layers, and during subsequent conductive material coating and patterning, the photoresist at the edge slopes with large section difference and large gradient is exposed seriously, which results in photoresist residue, thereby leading to the technical problem of continuous residue and short circuit of the conductive material.
Referring to fig. 1 to 6, the present application discloses a display panel 100, wherein the display panel 100 includes an array substrate 200, an organic film 300, and a plurality of first protrusions 400 located at the periphery of the organic film 300;
the first protrusion 400 and the organic film 300 are disposed in the same layer, and the first protrusion 400 is used to reduce the residue of the non-organic film 300 at the edge of the organic film 300.
This application has alleviateed the light resistance at organic rete edge and has exposed to the sun problem weakly through setting up first bulge in the periphery of organic rete, reduces conducting material's residue, has solved conducting material and has even incomplete, the technical problem of short circuit.
The technical solution of the present application will now be described with reference to specific embodiments.
Referring to fig. 1 to 6, the display panel 100 includes an array substrate 200, an organic film 300, and a plurality of first protrusions 400 located at the periphery of the organic film 300. The first protrusion 400 and the organic film 300 are disposed in the same layer, and the first protrusion 400 is used to reduce the residue of the non-organic film 300 at the edge of the organic film 300.
In this embodiment, through the arrangement of the first protruding portion 400, in the manufacturing process of the display panel 100, the conductive material 450 is disposed on the organic film layer 300, and when the conductive material 450 is subjected to patterning, a photoresist layer is coated on the conductive material 450, because of the arrangement of the first protruding portion 400, the photoresist layer is fully exposed in an exposure process, so that the conductive material 450 is etched in a subsequent etching process, specifically, referring to fig. 1 and 4, the technical problem of residue and short circuit of the conductive material 450 is solved.
In this embodiment, the first protrusions 400 are spaced apart from each other at the periphery of the organic film 300, and the thickness of the first protrusions 400 near the organic film 300 is the same as the thickness of the organic film 300, please refer to fig. 1 specifically. The first protrusion 400 may be the same as the material of the organic film layer 300. The first protrusion 400 can be formed in the same patterning process as the organic film 300, so as to reduce the mask process, and the orthographic projection of the first protrusion and the edge of the organic film 300 on the array substrate 200 is changed from a straight line in the prior art to an irregular curve, so that the photoresist layer is isolated during the patterning process of the conductive material 450, and the conductive material 450 is isolated. The technical problems of residue connection and short circuit of the conductive material 450 are solved while the process is simplified.
In this embodiment, the first protrusion 400 at least includes a first sub-protrusion 410 and a second sub-protrusion 420, the first sub-protrusion 410 contacts the second sub-protrusion 420, and the first sub-protrusion 410 contacts the periphery of the organic film 300, as shown in fig. 3. The thickness of the first sub-protrusion 410 is the same as that of the organic film layer 300, and the thickness of the first sub-protrusion 410 is greater than that of the second sub-protrusion 420. The first protrusion 400 is provided in a step shape, so that the photoresist layer is more sufficiently isolated during the patterning process of the conductive material 450, thereby better isolating the conductive material 450. The technical problems of residue connection and short circuit of the conductive material 450 are better solved.
In this embodiment, the first sub-protrusion 410 and the second sub-protrusion 420 are used as steps, and the number of the steps is not limited, and may be two, three, or even more, which is described herein.
In this embodiment, the thickness of the first protrusion 400 gradually decreases in a direction away from the organic film layer 300, please refer to fig. 2 specifically. The first protrusion 400 is set to be slope-shaped, so as to further reduce the slope change of the first protrusion 400, so that the photoresist layer is isolated more sufficiently during the patterning process of the conductive material 450, and the conductive material 450 is isolated better. The technical problems of residue connection and short circuit of the conductive material 450 are better solved.
In this embodiment, the slope of the first protrusion 400 is 30 ° to 70 °. On the one hand, too steep a slope, the effect is substantially absent, thus wasting patterning accuracy, rather than being paid for. On the other hand, an excessively gentle slope may cause an excessively large orthographic projection area of the first protrusion 400 on the array substrate 200, encroach on an available area of the display panel 100, and waste resources. When the slope of first bulge 400 is 30 ~ 70, can have the conducting material 450 pattern processing in-process concurrently, the light blockage layer is kept apart more fully to make conducting material 450 keep apart better, practice thrift the patterning precision simultaneously, reduce the wasting of resources.
In this embodiment, the shape of the orthographic projection of the first protrusion 400 on the array substrate 200 is any one of a circle, a trapezoid, and a triangle. When the shape of the orthographic projection of the first protrusion 400 on the array substrate 200 is a circle, the feature that the area of the circle is the largest when the circumferences are equal increases the exposure probability of the photoresist layer during the patterning process of the conductive material 450, and the conductive material 450 is isolated. When the orthographic projection of the first protrusion 400 on the array substrate 200 is triangular, the stability and edge effect of the triangle are utilized to increase the exposure probability of the photoresist layer and reduce the coverage of the photoresist layer in the patterning process of the conductive material 450, so that the conductive material 450 is better isolated, and the technical problems of residue and short circuit of the conductive material 450 are solved. When the shape of the orthographic projection of the first protrusion 400 on the array substrate 200 is a trapezoid, the effect is between a circle and a triangle. The shape of the orthographic projection of the first protrusion 400 on the array substrate 200 is not limited in any way.
In this embodiment, the first protrusion 400 is continuously disposed on the periphery of the organic film 300. The first protrusion 400 at least includes a first slope 430 and a second slope 440, the first slope 430 is overlapped on the edge of the organic film 300, and the second slope 440 is overlapped on the first slope 430, as shown in fig. 4 to 6. The first slope 430 has a slope smaller than the slope of the edge of the organic film 300, and the second slope 440 has a slope smaller than the slope of the first slope 430. By the effect of the multistage gentle slope, the photoresist layer can be better exposed after being coated in the patterning process of the electric material, so that the photoresist layer is more fully isolated, and the conductive material 450 is better isolated. The technical problems of residue connection and short circuit of the conductive material 450 are better solved.
In this embodiment, the first slope body 430 and the second slope body 440 are taken as multi-level gentle slopes, and the number of the multi-level gentle slopes is not limited, and may be two, three, or even more, which is described herein.
In this embodiment, the first protrusions 400 including the first slope 430 and the second slope 440 are disposed at intervals. By combining the multistage gentle slope with the convex arrangement, in the electric material patterning process to the maximum extent, after the photoresist layer is coated, the photoresist layer is fully exposed, so that the photoresist layer is more fully isolated, and the conductive material 450 is better isolated. The technical problems of residue connection and short circuit of the conductive material 450 are better solved.
In this embodiment, the slope of the second slope body 440 is less than 30 °. When the multistage gentle slope is used for fully exposing the photoresist, the slope of the last stage gentle slope is required to be less than 30 degrees, when the first protruding portion 400 comprises the first slope body 430 and the second slope body 440, the second slope body 440 is the last stage gentle slope, so that the photoresist layer can be fully exposed after being coated in the patterning processing process of the electric material, and the photoresist layer is fully isolated, so that the conductive material 450 is better isolated. The technical problems of residue connection and short circuit of the conductive material 450 are better solved.
In this embodiment, the first slope 430 has a slope of 30 ° to 70 °. On the one hand, too steep a slope, the effect is substantially absent, thus wasting patterning accuracy, rather than being paid for. On the other hand, an excessively gentle slope may cause an excessively large orthographic projection area of the first slope body 430 on the array substrate 200, encroach on an available area of the display panel 100, and waste resources. When the gradient of the first slope body 430 is 30 degrees to 70 degrees, the photoresist layer can be isolated more sufficiently in the patterning process of the conductive material 450, so that the conductive material 450 is isolated better, the patterning precision is saved, and the resource waste is reduced.
In this embodiment, the first slope 430 is overlapped at one half of the edge of the organic film layer 300, and the second slope 440 is overlapped at one half of the first slope 430, so that the overlapping manner makes full use of the length of the edge of the organic film layer 300 with a large slope and the length of the first slope 430, and reduces the "floor area" of the first protrusion 400 on the array substrate 200, and solves the technical problem of the residue and short circuit of the conductive material 450.
In this embodiment, the organic film 300 is one of a color resist layer and a planarization layer. The first protrusion 400 is applied to any one of the color resist layer and the planarization layer. The color resistance layer includes a plurality of color resistances, and the first protrusion 400 may be located at an edge of the color resistance.
This application has alleviateed the light resistance at organic rete edge and has exposed to the sun problem weakly through setting up first bulge in the periphery of organic rete, reduces conducting material's residue, has solved conducting material and has even incomplete, the technical problem of short circuit.
Referring to fig. 7, the present application further provides a manufacturing method of a display panel 100, including:
s100, forming an organic film on the array substrate 200;
s200, patterning the organic film to form an organic film layer 300 and a first protrusion 400 located at the periphery of the organic film layer 300;
the first protrusion 400 and the organic film 300 are disposed in the same layer, and the first protrusion 400 is used to reduce the residue of the non-organic film 300 at the edge of the organic film 300.
This application has alleviateed the light resistance at organic rete edge and has exposed to the sun problem weakly through setting up first bulge in the periphery of organic rete, reduces conducting material's residue, has solved conducting material and has even incomplete, the technical problem of short circuit.
The technical solution of the present application will now be described with reference to specific embodiments.
Referring to fig. 1 to 7, the method for manufacturing the display panel 100 includes:
s100, an organic film is formed on the array substrate 200.
In this embodiment, the organic film is one of a color resist layer and a planarization layer. The first protrusion 400 is applied to any one of the color resist layer and the planarization layer. The color resistance layer includes a plurality of color resistances, and the first protrusion 400 may be located at an edge of the color resistance.
S200, patterning the organic film to form an organic film layer 300 and a first protrusion 400 located at the periphery of the organic film layer 300.
In this embodiment, through the arrangement of the first protruding portion 400, in the manufacturing process of the display panel 100, the conductive material 450 is disposed on the organic film layer 300, and when the conductive material 450 is subjected to patterning, a photoresist layer is coated on the conductive material 450, because of the arrangement of the first protruding portion 400, the photoresist layer is fully exposed in an exposure process, so that the conductive material 450 is etched in a subsequent etching process, specifically, referring to fig. 1 and 4, the technical problem of residue and short circuit of the conductive material 450 is solved.
In this embodiment, the organic film is patterned, the first protrusions 400 are spaced apart from the periphery of the organic film 300, and the thickness of the first protrusions 400 near the organic film 300 is the same as the thickness of the organic film 300, which is described in detail with reference to fig. 1 and 2. The first protrusion 400 may be the same as the material of the organic film layer 300. The first protrusion 400 can be formed in the same patterning process as the organic film 300, so as to reduce the mask process, and the orthographic projection of the first protrusion and the edge of the organic film 300 on the array substrate 200 is changed from a straight line in the prior art to an irregular curve, so that the photoresist layer is isolated during the patterning process of the conductive material 450, and the conductive material 450 is isolated. The technical problems of residue connection and short circuit of the conductive material 450 are solved while the process is simplified.
In this embodiment, the organic film is patterned, the first protrusion 400 includes at least a first sub-protrusion 410 and a second sub-protrusion 420, the first sub-protrusion 410 contacts the second sub-protrusion 420, and the first sub-protrusion 410 contacts the periphery of the organic film 300, as shown in fig. 3. The thickness of the first sub-protrusion 410 is the same as that of the organic film layer 300, and the thickness of the first sub-protrusion 410 is greater than that of the second sub-protrusion 420. The first protrusion 400 is provided in a step shape, so that the photoresist layer is more sufficiently isolated during the patterning process of the conductive material 450, thereby better isolating the conductive material 450. The technical problems of residue connection and short circuit of the conductive material 450 are better solved.
In this embodiment, the organic film is patterned, and the first sub-protrusion 410 and the second sub-protrusion 420 are used as steps, and the number of the steps is not limited, and may be two, three, or even more, as described herein.
In this embodiment, the organic film is patterned, and the thickness of the first protrusion 400 gradually decreases in a direction away from the organic film 300, as shown in fig. 2. The first protrusion 400 is set to be slope-shaped, so as to further reduce the slope change of the first protrusion 400, so that the photoresist layer is isolated more sufficiently during the patterning process of the conductive material 450, and the conductive material 450 is isolated better. The technical problems of residue connection and short circuit of the conductive material 450 are better solved.
In this embodiment, the organic film is patterned, and the slope of the first protrusion 400 is 30 ° to 70 °. On the one hand, too steep a slope, the effect is substantially absent, thus wasting patterning accuracy, rather than being paid for. On the other hand, an excessively gentle slope may cause an excessively large orthographic projection area of the first protrusion 400 on the array substrate 200, encroach on an available area of the display panel 100, and waste resources. When the slope of first bulge 400 is 30 ~ 70, can have the conducting material 450 pattern processing in-process concurrently, the light blockage layer is kept apart more fully to make conducting material 450 keep apart better, practice thrift the patterning precision simultaneously, reduce the wasting of resources.
In this embodiment, the organic film is patterned, and the shape of the orthogonal projection of the first protrusion 400 on the array substrate 200 is any one of circular, trapezoidal, and triangular. When the shape of the orthographic projection of the first protrusion 400 on the array substrate 200 is a circle, the feature that the area of the circle is the largest when the circumferences are equal increases the exposure probability of the photoresist layer during the patterning process of the conductive material 450, and the conductive material 450 is isolated. When the orthographic projection of the first protrusion 400 on the array substrate 200 is triangular, the stability and edge effect of the triangle are utilized to increase the exposure probability of the photoresist layer and reduce the coverage of the photoresist layer in the patterning process of the conductive material 450, so that the conductive material 450 is better isolated, and the technical problems of residue and short circuit of the conductive material 450 are solved. When the shape of the orthographic projection of the first protrusion 400 on the array substrate 200 is a trapezoid, the effect is between a circle and a triangle. The shape of the orthographic projection of the first protrusion 400 on the array substrate 200 is not limited in any way.
In this embodiment, step S200 includes:
s210, patterning the organic film, wherein the first protrusions 400 are continuously disposed on the periphery of the organic film layer 300. The first protrusion 400 at least includes a first slope 430 and a second slope 440, the first slope 430 is overlapped on the edge of the organic film 300, and the second slope 440 is overlapped on the first slope 430, as shown in fig. 4 to 6. The first bank 430, the second bank 440, and the organic film 300 are simultaneously formed by one patterning process. The first slope 430 has a slope smaller than the slope of the edge of the organic film 300, and the second slope 440 has a slope smaller than the slope of the first slope 430. By the effect of the multistage gentle slope, the photoresist layer can be better exposed after being coated in the patterning process of the electric material, so that the photoresist layer is more fully isolated, and the conductive material 450 is better isolated. The technical problems of residue connection and short circuit of the conductive material 450 are better solved.
In this embodiment, the first slope body 430 and the second slope body 440 are taken as multi-level gentle slopes, and the number of the multi-level gentle slopes is not limited, and may be two, three, or even more, which is described herein.
In this embodiment, the first protrusions 400 including the first slope 430 and the second slope 440 are disposed at intervals. By combining the multistage gentle slope with the convex arrangement, in the electric material patterning process to the maximum extent, after the photoresist layer is coated, the photoresist layer is fully exposed, so that the photoresist layer is more fully isolated, and the conductive material 450 is better isolated. The technical problems of residue connection and short circuit of the conductive material 450 are better solved.
In this embodiment, the slope of the second slope body 440 is less than 30 °. When the multistage gentle slope is used for fully exposing the photoresist, the slope of the last stage gentle slope is required to be less than 30 degrees, when the first protruding portion 400 comprises the first slope body 430 and the second slope body 440, the second slope body 440 is the last stage gentle slope, so that the photoresist layer can be fully exposed after being coated in the patterning processing process of the electric material, and the photoresist layer is fully isolated, so that the conductive material 450 is better isolated. The technical problems of residue connection and short circuit of the conductive material 450 are better solved.
In this embodiment, the first slope 430 has a slope of 30 ° to 70 °. On the one hand, too steep a slope, the effect is substantially absent, thus wasting patterning accuracy, rather than being paid for. On the other hand, an excessively gentle slope may cause an excessively large orthographic projection area of the first slope body 430 on the array substrate 200, encroach on an available area of the display panel 100, and waste resources. When the gradient of the first slope body 430 is 30 degrees to 70 degrees, the photoresist layer can be isolated more sufficiently in the patterning process of the conductive material 450, so that the conductive material 450 is isolated better, the patterning precision is saved, and the resource waste is reduced.
In this embodiment, the step S200 includes:
s210, patterning the organic film to form an organic film layer 300.
S220, forming a first organic film on the organic film layer 300.
And S230, forming a first slope body 430 by patterning the first organic film.
S240, forming a second organic film on the organic film layer 300.
And S250, forming a second slope body 440 by patterning the second organic film.
In this embodiment, the organic film layer 300, the first slope 430, and the second slope 440 are formed by a plurality of patterning processes, and referring to fig. 6 in particular, the forming precision is high, and the weak explosion reduction effect is good.
In this embodiment, the first slope 430 is overlapped at one half of the edge of the organic film layer 300, and the second slope 440 is overlapped at one half of the first slope 430, so that the overlapping manner makes full use of the length of the edge of the organic film layer 300 with a large slope and the length of the first slope 430, and reduces the "floor area" of the first protrusion 400 on the array substrate 200, and solves the technical problem of the residue and short circuit of the conductive material 450.
In this embodiment, the organic film 300 is one of a color resist layer and a planarization layer. The first protrusion 400 is applied to any one of the color resist layer and the planarization layer. The color resistance layer includes a plurality of color resistances, and the first protrusion 400 may be located at an edge of the color resistance.
In this embodiment, the manufacturing method of the display panel 100 further includes:
s300, forming a conductive material layer on the array substrate 200.
S400, forming a conductive layer on the conductive material layer through patterning treatment.
In this embodiment, step S400 includes:
s410, forming a photoresist layer on the conductive material layer.
And S420, exposing the photoresist layer through an exposure process.
In this embodiment, due to the arrangement of the first protruding portion 400, the photoresist layer is fully exposed in the exposure process, so that the conductive material 450 in the conductive material layer is etched in the subsequent etching process, specifically referring to fig. 1 and 4, the technical problem of the residue and short circuit of the conductive material 450 is solved.
And S430, forming a conductive layer with a preset pattern on the conductive material layer by a developing etching process.
In this embodiment, after the photoresist on the edge slope with a large step difference and a large gradient is fully exposed, the residue of the conductive material is reduced during the developing and etching process, so that the conductive material is disconnected, thereby solving the technical problems of continuous residue and short circuit of the conductive material.
This application has alleviateed the light resistance at organic rete edge and has exposed to the sun problem weakly through setting up first bulge in the periphery of organic rete, reduces conducting material's residue, has solved conducting material and has even incomplete, the technical problem of short circuit.
The application discloses a display panel and a manufacturing method thereof. The display panel comprises an array substrate, an organic film layer and a plurality of first protruding parts positioned on the periphery of the organic film layer; the first protruding part and the organic film layer are arranged on the same layer, and the first protruding part is used for reducing non-organic film layer residue on the edge of the organic film layer. This application has alleviateed the light resistance at organic rete edge and has exposed to the sun problem weakly through setting up first bulge in the periphery of organic rete, reduces conducting material's residue, has solved conducting material and has even incomplete, the technical problem of short circuit.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above embodiments of the present application are described in detail, and specific examples are applied in the present application to explain the principles and implementations of the present application, and the description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. The display panel is characterized by comprising an array substrate, an organic film layer and a plurality of first protruding parts positioned on the periphery of the organic film layer;
the first protruding part and the organic film layer are arranged on the same layer, and the first protruding part is used for reducing non-organic film layer residue on the edge of the organic film layer.
2. The display panel according to claim 1, wherein the first protruding portions are spaced apart from the periphery of the organic film layer, and a thickness of the first protruding portions adjacent to the organic film layer is the same as a thickness of the organic film layer.
3. The display panel according to claim 2, wherein the first protruding portion comprises at least a first sub-protruding portion and a second sub-protruding portion, the first sub-protruding portion contacts the second sub-protruding portion, and the first sub-protruding portion contacts a periphery of the organic film layer;
the thickness of the first sub-protrusion is the same as that of the organic film layer, and the thickness of the first sub-protrusion is greater than that of the second sub-protrusion.
4. The display panel according to claim 2, wherein the thickness of the first protrusion portion is gradually reduced in a direction away from the organic film layer.
5. The display panel according to claim 4, wherein the slope of the first convex portion is 30 ° to 70 °.
6. The display panel according to claim 2, wherein an orthographic projection of the first protrusion on the array substrate is any one of a circle, a trapezoid and a triangle.
7. The display panel according to claim 1, wherein the first protrusion is continuously provided at the periphery of the organic film layer;
the first bulge at least comprises a first slope body and a second slope body, the first slope body is overlapped on the edge of the organic film layer, and the second slope body is overlapped on the first slope body;
the slope of the first slope body is smaller than that of the edge of the organic film layer, and the slope of the second slope body is smaller than that of the first slope body.
8. The display panel of claim 7, wherein the slope of the second sloping body is less than 30 °.
9. The display panel of claim 1, wherein the organic film layer is one of a color resist layer or a planarization layer.
10. A method for manufacturing a display panel is characterized by comprising the following steps:
forming an organic film on the array substrate;
patterning the organic film to form an organic film layer and a first protrusion part located at the periphery of the organic film layer;
the first protruding part and the organic film layer are arranged on the same layer, and the first protruding part is used for reducing non-organic film layer residue on the edge of the organic film layer.
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