CN107438349B - Natural heat dissipation device utilizing chimney effect - Google Patents
Natural heat dissipation device utilizing chimney effect Download PDFInfo
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- CN107438349B CN107438349B CN201710552076.9A CN201710552076A CN107438349B CN 107438349 B CN107438349 B CN 107438349B CN 201710552076 A CN201710552076 A CN 201710552076A CN 107438349 B CN107438349 B CN 107438349B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A natural heat dissipation device utilizing chimney effect is composed of a base plate, a heat dissipation fin group arranged on the base plate, a cover plate arranged at the top end of the heat dissipation fin group and a rear shell; the radiating fin group adopts a stepped structure; the cover plate is arranged at the top end of the radiating fin group, the lower edge of the cover plate is flush with the stepped corners of the radiating fin group, and the cover plate, the base plate and the two fins on the outermost side of the radiating fin group vertically extend upwards to form a cylinder on the original basis, so that a chimney structure is formed. The heat generated by the electronic device during working is transferred to the aluminum flat plate through the heat pipe, the aluminum flat plate is attached to the base plate of the radiator, and finally the heat is dissipated to the environment through the radiating fin group and the cover plate. The self-suction effect generated by the chimney effect is utilized to increase the air flow velocity in the air flow channel, enhance the air convection effect on the surface of the fin and improve the heat dissipation efficiency, thereby achieving the purposes of prolonging the service life of electronic devices and improving the reliability of equipment.
Description
Technical Field
The invention belongs to the technical field of heat dissipation, and particularly relates to a natural heat dissipation device utilizing a chimney effect, which is suitable for equipment needing enhanced heat dissipation in various industries such as solar energy application, metallurgy, air conditioning, electronic communication and the like.
Background
The existing heat dissipation technology mainly comprises natural convection heat dissipation, forced air cooling heat dissipation, liquid cooling, heat pipes, microchannel cooling, thermoelectric cooling and the like. The natural convection heat dissipation is the most classical and convenient method, has the advantages of no need of energy supply, reliable and stable performance, high safety, no noise, low manufacturing cost and the like, and achieves the purpose of heat dissipation by utilizing gaps of all components in equipment and heat conduction, heat convection and heat radiation of a shell. The method is suitable for low-power consumption electronic devices which have low requirements on temperature control and low heat flux density and generate heat, and can also be used in occasions where external power sources such as a fan and the like are inconvenient to install due to narrow space or outdoor placement. Because of these problems, in some places with severe requirements, natural heat dissipation is the most suitable heat dissipation method.
For a natural heat dissipation module, the heat dissipation process from a heat source (heat generating element) inside the module to the external environment is analyzed. Therefore, the heat dissipation thermal resistance of the module shell side is far greater than the thermal contact resistance and the thermal links such as heat conduction and convection inside the module. The heat dissipation of the shell side includes natural convection heat dissipation and radiation heat dissipation, and particularly, the natural convection heat resistance therein is extremely high, which is a key point for restricting the improvement of the heat dissipation capability of the module. With the increasing power consumption level of the natural heat dissipation module, how to sufficiently reduce the thermal resistance of the shell side of the natural heat dissipation module and enhance the heat dissipation capacity of the module is a necessary requirement for reducing the temperature level of the module and also a precondition for ensuring the normal and stable operation of the natural heat dissipation module. Considering the limitation of the surface condition and the temperature level of the module, the strengthening and optimizing space of the radiation heat exchange is limited, so the strengthening heat transfer of the natural heat dissipation module mainly strengthens the natural convection heat dissipation capability of the shell side of the module, and thus, a great amount of experiments and numerical simulation researches are carried out by many scholars at home and abroad. The fin structure applied to the natural convection heat dissipation module at present mainly comprises a flat plate fin, a discontinuous fin, a spore fin, a trapezoidal fin, a cylindrical fin, a honeycomb-structure fin and a hole-opening fin. The plate fin is most commonly used in actual production, and has the advantages of convenience in processing, low manufacturing cost, convenience in large-scale production and the like. For the vertical flat plate fin, the airflow channel is from top to bottom, and when the airflow reaches the top end of the channel, the airflow is fully heated, so that the temperature is higher, the heat exchange temperature difference between the fluid and the base plate of the radiator is reduced, and the heat dissipation capacity of the radiator is correspondingly deteriorated. In addition, from the viewpoint of the field synergy principle (namely, the essence of the enhancement of the convection heat transfer is that the included angle between the velocity vector of the flow field and the temperature gradient is reduced, and when the included angle between the velocity vector of the flow field and the temperature gradient is equal to 90 °, the convection heat transfer quantity is equal to zero), the included angle between the partial airflow velocity field on the vertical flat plate fin and the temperature gradient is close to 90 °, and the synergy is extremely poor, so that the natural convection heat dissipation effect is poor, and the reliability of the device operation is reduced. Compared with the common fins, the heat exchange performance of the discontinuous fins can be improved by about 5 to 18 percent; the average Knoop number of the cell type fin can be improved by about 68 percent; the heat exchange coefficient of the stepped fin can be improved by about 38 percent, and the flow resistance is reduced. Compared with an unhardened substrate, the heat exchange coefficient of the cylindrical fins in different distribution modes is about 1.5-2 times of that of the cylindrical fins; the knoop number of the aluminum honeycomb fins (left) is 4 times that of the light panels.
The size and arrangement of the building or the section bar often form a self-ventilation phenomenon, namely a chimney effect. The chimney effect is based on the difference of the density inside the flow channel to generate the effect of internal and external pressure difference, the flowing condition of the fluid is determined by combining the self buoyancy effect of the fluid, and the two effects are offset due to the different positions of the heat sources. For example, high-rise buildings, internal staircases, elevators, air-conditioning ventilation runners and the like have strong longitudinal air flow, and the user can feel cool even without an air-conditioning facility. The chimney effect exists in high-rise buildings, and can be achieved as long as the structural design is reasonable, so that the chimney effect acts on a small-sized heat dissipation device for natural convection heat dissipation, the heat transfer coefficient of a heat radiator can be greatly improved, and the heat dissipation performance is improved.
Disclosure of Invention
Aiming at the technical problems that the upper airflow temperature of the vertical flat plate fin is high, the flow velocity is low and the whole field cooperativity is poor, so that the convection heat transfer effect is deteriorated, the natural heat dissipation device utilizing the chimney effect is provided, the temperature of a heating element in heat dissipation equipment under the natural heat dissipation condition can be effectively reduced, and the purposes of prolonging the service life and improving the reliability of the equipment are achieved.
In order to achieve the purpose, the invention adopts the technical scheme that: the heat dissipation structure comprises a substrate, a heat dissipation fin group and a cover plate which are arranged on the substrate and used for dissipating heat of the substrate to the environment, and a rear shell arranged at the lower end of the substrate, wherein the heat dissipation fin group adopts a stepped structure; the cover plate is arranged at the top end of the radiating fin group, the lower edge of the cover plate is flush with the stepped corner of the radiating fin group, and the cover plate, the base plate and two fins on the outermost side of the radiating fin group vertically extend upwards to form a cylinder to form a chimney structure.
The height of the chimney and the length h/L of the substrate are 0.1-0.45.
The length L of the fins of the upper part and the lower part of the stepped structure radiating fin group1/L2=0.5~2。
The height H of the upper part and the lower part of the fins of the stepped structure radiating fin group1/H2=0.55~1.8。
The back shell is an aluminum flat plate.
The heat generated by the electronic device during working is transferred to the aluminum flat plate rear shell through the heat pipe, the aluminum flat plate rear shell is attached to the radiator base plate, and finally the heat is dissipated to the environment through the radiating fin group and the cover plate. The self-suction effect generated by the chimney effect is utilized to increase the air flow velocity in the airflow channel, enhance the air convection effect on the surface of the fin and improve the heat dissipation efficiency.
Compared with the prior art, the natural heat dissipation device utilizing the chimney effect has the following advantages:
1) and the natural convection heat dissipation is enhanced based on the self-suction effect of the chimney effect. The base plate, the two fins on the outermost side of the radiating fin group and the cover plate are vertically and upwardly extended on the basis of the original length of the base plate to form a cylinder, namely a chimney structure. According to the self-suction effect generated by the chimney effect, the air flow velocity in the air flow channel can be increased, and meanwhile, the whole field cooperativity between the fluid velocity field and the temperature field is also obviously improved, so that the defects that the fluid temperature of the upper part of the vertical flat plate fin which is frequently used in the production practice is higher, the heat exchange temperature difference is smaller, the flow velocity is lower, and the included angle between the fluid velocity field and the temperature gradient is close to 90 degrees, namely, the heat convection effect is deteriorated, the temperature is increased and the like caused by the factors such as poor cooperativity and the like are overcome.
2) The air intake mode is changed. The heights of the upper and lower fins of the stepped structure radiating fin group are different, and the air inlet mode can be changed by the constructed steps. The air inlet mode of simultaneously introducing air from the lower part and the side surface can not only reduce the average temperature of the lower part of the substrate, but also introduce more fresh cold air into the air flow channel at the upper part, increase the heat exchange temperature difference and further strengthen the heat dissipation.
3) The invention has simple structure. On the basis of the traditional vertical flat plate heat dissipation structure, only a simple structure of a chimney is extended from the upper space; the vertical plate fin effectively keeps the advantages of small flow resistance, convenient processing, low manufacturing cost and the like.
4) When the power of an electronic device is 100W and the external environment temperature is 35 ℃, the fin type radiator widely applied in the industry at present can reduce 3 ℃ on the basis of the traditional vertical flat plate radiator, and the average temperature of the substrate in the invention can be reduced from 66.38 ℃ of the traditional vertical flat plate fin type radiator to 61.64 ℃ of the novel heat radiating device, and is reduced by about 4.7 ℃.
Drawings
The invention is further illustrated by the following embodiments described in connection with the figures.
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an exploded view of the present invention.
Fig. 3 is a front view of the present invention.
FIG. 4 is a comparison graph of the temperature measuring point of the structure of the invention and the temperature of the temperature measuring point of the traditional vertical plate fin radiator.
In the figure, the radiator comprises a radiator base plate 1, a radiator fin group 2, a radiator fin group 3, a cover plate 4, a rear shell 5 and a chimney.
Detailed Description
Referring to fig. 1 to 3, the heat dissipating device of the present invention comprises a base plate 1 and a fin group 2 disposed on the base plate 1, and a cover plate 3, a rear case 4 made of an aluminum flat plate disposed at a lower end of the base plate 1; the radiating fin group 2 adopts a stepped structure; the cover plate 3 is arranged at the top end of the radiating fin group 2, the lower edge of the cover plate is flush with the stepped corner of the fin group 2, and the cover plate 3, the base plate 1 and two fins on the outermost side of the radiating fin 2 vertically extend upwards to form a cylinder to form a chimney 5 structure on the original basis. Wherein the height of the chimney 5 and the length h/L of the substrate 1 are 0.1-0.45; fin length L of upper and lower parts of stepped structure radiating fin group 21/L20.5-2; height H of upper and lower fins of stepped structure radiating fin group 21/H2=0.55~1.8。
The heat generated by the electronic device during working is transferred to the aluminum flat plate through the heat pipe, the aluminum flat plate is attached to the base plate 1 of the radiator, and finally the heat is dissipated to the environment through the radiating fin group 2 and the cover plate 3. The self-suction effect generated by the chimney effect is utilized to increase the air flow velocity in the airflow channel, enhance the air convection effect on the surface of the fin and improve the heat dissipation efficiency.
The following is an embodiment of the present invention, including a base plate 1 and a fin group 2 provided on the base plate 1, and a cover plate 3, a rear case 4 made of an aluminum flat plate provided at the lower end of the base plate 1; the radiating fin group 2 adopts a stepped structure; the cover plate 3 is arranged at the top end of the radiating fin group 2, the lower edge of the cover plate is flush with the stepped corner of the fin group 2, and the cover plate 3, the base plate 1 and two fins on the outermost side of the radiating fin 2 vertically extend upwards to form a cylinder to form a chimney 5 structure on the original basis. Wherein, the length L of the substrate 1 is 435mm, the width of the substrate is 210mm, and the thickness of the substrate is 3 mm; the radiating fin group 2 with the ladder structure has the length of the fin of 355mm, the thickness of 1.8mm, the interval of 11.2mm and the height H of the upper part155mm, lower height H280 mm; the cover plate 3 is positioned at the top end of the radiating fin group 2, the lower edge of the cover plate is flush with the corner of the step, the width of the cover plate is 209.8mm, and the cover plate covers all fins of the upper radiating fin group; on the basis, two fins on the outermost side of the radiating fin group 2 vertically extend upwards for 80mm to form a cylinder body, namely a chimney 5 structure, with the base plate 1 and the cover plate 3, namely, the length of two fins on the outermost side of the radiating fin group 2 is 435mm, and the length of the rest fins is 355 mm. The 5 20W heat sources are uniformly arranged on the back side of the substrate, and the 5 temperature measuring points are respectively positioned in the centers of the 5 heat sources. According to the structural parameters of the embodiment, the heat exchange and flow characteristics of the traditional vertical flat plate fin radiator and the structure of the embodiment of the invention are respectively subjected to numerical calculation, and meanwhile, the temperature distribution on the substrates of the two structures is subjected to comparative analysis. The comparison result of the temperature distribution of the 5 heat source central temperature measuring points of the example structure of the invention and the traditional vertical flat plate fin radiator is shown in figure 4. As can be seen from FIG. 4, compared with the conventional vertical plate fin radiator, the average temperature of the substrate can be reduced by about 4.7 ℃ by adopting the structure of the invention, and the natural heat dissipation capability is obviously enhanced.
Claims (4)
1. A natural heat dissipating device using a chimney effect is characterized in that: comprising a substrate (1) andthe heat dissipation structure comprises a radiating fin group (2) and a cover plate (3) which are arranged on a substrate (1) and used for dissipating heat of the substrate (1) to the environment, and a rear shell (4) arranged at the lower end of the substrate (1), wherein the radiating fin group (2) adopts a stepped structure; the cover plate (3) is arranged at the top end of the radiating fin group (2), the lower edge of the cover plate is flush with the stepped corner of the radiating fin group (2), the cover plate (3), the base plate (1) and two fins at the outermost side of the radiating fin group (2) vertically extend upwards to form a cylinder to form a chimney (5) structure, and the height H of the upper and lower fins of the radiating fin group (2) with the stepped structure is equal to that of the upper and lower fins of the radiating fin group (2)1/H2And 0.6875, air is simultaneously fed into the lower part and the side surface of the natural heat dissipation device.
2. The natural heat dissipating apparatus using a chimney effect according to claim 1, wherein: the height of the chimney (5) and the length h/L of the substrate (1) are 0.1-0.45.
3. The natural heat dissipating apparatus using a chimney effect according to claim 1, wherein: the length L of the upper part and the lower part of the stepped structure radiating fin group (2) is equal to that of the upper part and the lower part of the fins1/L2=0.5~2。
4. The natural heat dissipating apparatus using a chimney effect according to claim 1, wherein: the rear shell (4) is an aluminum flat plate.
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Families Citing this family (3)
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CN109724774A (en) * | 2019-02-27 | 2019-05-07 | 吉林大学 | The general board-like finned flow Mobile Test Set of one kind and test method |
CN110461136A (en) * | 2019-09-02 | 2019-11-15 | 珠海格力电器股份有限公司 | Electrical apparatus box heat radiation structure, electrical apparatus box structure and air conditioning equipment |
CN112739156A (en) * | 2020-12-09 | 2021-04-30 | 阳光电源股份有限公司 | Heat dissipation module, radiator and power equipment |
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CN205610156U (en) * | 2016-04-28 | 2016-09-28 | 广东南华西电气有限公司 | Dense -type bus duct |
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CN102436295A (en) * | 2010-09-29 | 2012-05-02 | 研祥智能科技股份有限公司 | Heat tube heat radiator |
CN202603135U (en) * | 2012-05-29 | 2012-12-12 | 旭丽电子(广州)有限公司 | Closed type radiating fin structure |
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