CN107430963B - 利用锚固件中的mim的dvc - Google Patents

利用锚固件中的mim的dvc Download PDF

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Publication number
CN107430963B
CN107430963B CN201680014343.0A CN201680014343A CN107430963B CN 107430963 B CN107430963 B CN 107430963B CN 201680014343 A CN201680014343 A CN 201680014343A CN 107430963 B CN107430963 B CN 107430963B
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CN
China
Prior art keywords
electrode
dvc
mems
conductive layer
ohmic contact
Prior art date
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Active
Application number
CN201680014343.0A
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English (en)
Chinese (zh)
Other versions
CN107430963A (zh
Inventor
罗伯托·彼得勒斯·范·卡普恩
罗伯特·加迪
理查德·L·奈普
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Qorvo US Inc
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Cavendish Kinetics Ltd
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Publication of CN107430963A publication Critical patent/CN107430963A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/01—Switches
    • B81B2201/012—Switches characterised by the shape
    • B81B2201/016—Switches characterised by the shape having a bridge fixed on two ends and connected to one or more dimples
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0052—Special contact materials used for MEMS
    • H01H2001/0057—Special contact materials used for MEMS the contact materials containing refractory materials, e.g. tungsten
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0084—Switches making use of microelectromechanical systems [MEMS] with perpendicular movement of the movable contact relative to the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN201680014343.0A 2015-02-05 2016-01-28 利用锚固件中的mim的dvc Active CN107430963B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562112217P 2015-02-05 2015-02-05
US62/112,217 2015-02-05
PCT/US2016/015360 WO2016126517A1 (en) 2015-02-05 2016-01-28 Dvc utilizing mims in the anchor

Publications (2)

Publication Number Publication Date
CN107430963A CN107430963A (zh) 2017-12-01
CN107430963B true CN107430963B (zh) 2019-12-13

Family

ID=55315786

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680014343.0A Active CN107430963B (zh) 2015-02-05 2016-01-28 利用锚固件中的mim的dvc

Country Status (6)

Country Link
US (1) US10163566B2 (enExample)
EP (1) EP3254294B1 (enExample)
JP (1) JP7021947B2 (enExample)
KR (1) KR102554425B1 (enExample)
CN (1) CN107430963B (enExample)
WO (1) WO2016126517A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018063814A1 (en) * 2016-09-29 2018-04-05 Cavendish Kinetics, Inc Mems rf-switch with near-zero impact landing
US11746002B2 (en) * 2019-06-22 2023-09-05 Qorvo Us, Inc. Stable landing above RF conductor in MEMS device
US11705298B2 (en) 2019-06-22 2023-07-18 Qorvo Us, Inc. Flexible MEMS device having hinged sections
US11667516B2 (en) * 2019-06-26 2023-06-06 Qorvo Us, Inc. MEMS device having uniform contacts

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1601685A (zh) * 2004-09-27 2005-03-30 东南大学 射频微电子机械单刀双掷膜开关及其制造方法
CN1922755A (zh) * 2004-07-29 2007-02-28 日立视听媒体股份有限公司 电容式mems元件及其制造方法、高频装置
CN102295263A (zh) * 2010-06-25 2011-12-28 国际商业机器公司 平面腔体微机电系统及相关结构、制造和设计结构的方法
CN103843090A (zh) * 2011-09-02 2014-06-04 卡文迪什动力有限公司 Rf mems隔离，串联和并联dvc和小型mems
CN104037027A (zh) * 2014-06-26 2014-09-10 电子科技大学 一种mems电容开关
CN105556635A (zh) * 2013-08-01 2016-05-04 卡文迪什动力有限公司 利用mems电阻开关和mim电容器的dvc

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6657525B1 (en) * 2002-05-31 2003-12-02 Northrop Grumman Corporation Microelectromechanical RF switch
US7265647B2 (en) 2004-03-12 2007-09-04 The Regents Of The University Of California High isolation tunable MEMS capacitive switch
US20070115082A1 (en) * 2005-10-03 2007-05-24 Analog Devices, Inc. MEMS Switch Contact System
WO2010054244A2 (en) * 2008-11-07 2010-05-14 Cavendish Kinetics, Inc. Method of using a plurality of smaller mems devices to replace a larger mems device
JP2010135614A (ja) * 2008-12-05 2010-06-17 Fujitsu Ltd 可変容量素子
JP5304398B2 (ja) * 2009-04-06 2013-10-02 富士通株式会社 可変容量素子
JP5208867B2 (ja) * 2009-06-25 2013-06-12 株式会社東芝 Ｍｅｍｓデバイス及びその製造方法
US8797127B2 (en) * 2010-11-22 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS switch with reduced dielectric charging effect
WO2014038086A1 (ja) * 2012-09-10 2014-03-13 富士通株式会社 可変容量回路及びインピーダンス整合回路
JP6434491B2 (ja) * 2013-04-04 2018-12-05 キャベンディッシュ・キネティックス・インコーポレイテッドＣａｖｅｎｄｉｓｈ Ｋｉｎｅｔｉｃｓ， Ｉｎｃ． 高い線形性を有するｍｅｍｓ可変デジタルキャパシタデザイン
JP2015001459A (ja) * 2013-06-17 2015-01-05 セイコーエプソン株式会社 機能素子、電子機器、および移動体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1922755A (zh) * 2004-07-29 2007-02-28 日立视听媒体股份有限公司 电容式mems元件及其制造方法、高频装置
CN1601685A (zh) * 2004-09-27 2005-03-30 东南大学 射频微电子机械单刀双掷膜开关及其制造方法
CN102295263A (zh) * 2010-06-25 2011-12-28 国际商业机器公司 平面腔体微机电系统及相关结构、制造和设计结构的方法
CN103843090A (zh) * 2011-09-02 2014-06-04 卡文迪什动力有限公司 Rf mems隔离，串联和并联dvc和小型mems
CN105556635A (zh) * 2013-08-01 2016-05-04 卡文迪什动力有限公司 利用mems电阻开关和mim电容器的dvc
CN104037027A (zh) * 2014-06-26 2014-09-10 电子科技大学 一种mems电容开关

Also Published As

Publication number Publication date
EP3254294B1 (en) 2023-05-24
WO2016126517A1 (en) 2016-08-11
JP2018509757A (ja) 2018-04-05
JP7021947B2 (ja) 2022-02-17
KR102554425B1 (ko) 2023-07-11
US10163566B2 (en) 2018-12-25
US20180033553A1 (en) 2018-02-01
KR20170106489A (ko) 2017-09-20
CN107430963A (zh) 2017-12-01
EP3254294A1 (en) 2017-12-13

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Effective date of registration: 20220330

Address after: North Carolina

Patentee after: QORVO US, Inc.

Address before: California, USA

Patentee before: CAVENDISH KINETICS, Inc.