CN107430345B

CN107430345B - Exposure data generation method, the manufacturing method of layer stereo structure, exposure data generating means, the manufacture system of computer readable storage medium and layer stereo structure

Info

Publication number: CN107430345B
Application number: CN201580078204.XA
Authority: CN
Inventors: 藤泽泰充; 古谷祥雄
Original assignee: Screen Holdings Co Ltd
Current assignee: Screen Holdings Co Ltd
Priority date: 2015-03-30
Filing date: 2015-11-25
Publication date: 2019-04-12
Anticipated expiration: 2035-11-25
Also published as: TWI596445B; TW201640231A; JP2016188926A; CN107430345A; KR20170108149A; WO2016157611A1; JP6427452B2

Abstract

The present invention relates to the manufacture of layer stereo structure, the technology that can be adjusted separately the depth of each recess portion in male and fomale(M&F) and be able to suppress the change in shape of male and fomale(M&F) caused by the positional shift of exposure position is provided.In the present invention, develop by the formation for repeating resist layer in each layer with the resist layer stack generated and the exposure for carrying out selectivity to the resist layer, to manufacture layer stereo structure.Therefore, according to each exposing patterns for each resist layer, the depth of each recess portion in male and fomale(M&F) can be adjusted separately.In addition, in the present invention, the exposure area of exposure data is made of convex region, concave region and concave surface peripheral region.Therefore, even if in the case where two layers of offset, also can inhibit to generate unexpected step difference in the male and fomale(M&F) of layer stereo structure when being exposed certain two resist layer.

Description

Exposure data generation method, the manufacturing method of layer stereo structure, exposure data generate The manufacture system of device, computer readable storage medium and layer stereo structure

Technical field

The present invention relates to manufacture the technology of layer stereo structure by being exposed according to exposure data.

Background technique

In the past, it is known that selectively exposing the development passed through in development removing resist layer stack after the resist of stacking can Molten region manufactures the technology for the layer stereo structure for having male and fomale(M&F) in side.

As the manufacturing method of the layer stereo structure in side with male and fomale(M&F), for example, as it is known that following technology: against corrosion After the interarea part of the side of oxidant layer stack forms the overlay film against corrosion for etching resistant liquid, wet corrosion is carried out to the position of no overlay film It carves.However, when so forming male and fomale(M&F) by wet etching, it is difficult to adjust separately the depth of each recess portion in male and fomale(M&F).

In technology described in Patent Document 1, after being laminated with the different resist layer of multilayer resist ingredient, by multi beam The different exposure light of wavelength is irradiated in resist layer stack, selectively exposes resist layer stack.Then, pass through development The solvable region of development in resist layer stack is removed, layer stereo structure is manufactured.In the art, it can manufacture and adjust respectively The layer stereo structure of the depth of each recess portion in whole male and fomale(M&F).

Existing technical literature

Patent document

Patent document 1: Japanese Unexamined Patent Publication 2012-208350 bulletin.

Summary of the invention

Problems to be solved by the invention

However, as described in Patent Document 1, when the ingredient difference of resist in layers, needing to be arranged multiple for applying The apparatus for coating of the different resist of each ingredient of cloth.In addition, as described in Patent Document 1, when to each resist layer irradiation multi beam wave When growing different exposure lights, need to be arranged multiple for irradiating the exposure devices of the different exposure light of each wavelength.Therefore, from Manufacture the easiness of the manufacture processing of layer stereo structure, from the perspective of manufacturing cost, not preferably.

In addition, for resist layer, the case where exposure position does not generate positional shift completely, is seldom, usually slightly generates position Set offset.In this case, in technology described in Patent Document 1, positional shift when exposing each resist layer leads to institute The layer stereo structure of manufacture has and desired variform male and fomale(M&F).Therefore, when exposing each resist layer, even if In the case where generating above-mentioned positional shift, also demand can manufacture the skill of the layer stereo structure with desired male and fomale(M&F) Art.

The present invention proposes in view of the above problems, is related to the manufacture of layer stereo structure, its purpose is to provide can It adjusts separately the depth of each recess portion in male and fomale(M&F) and is able to suppress the shape of male and fomale(M&F) caused by the positional shift of exposure position The technology of shape variation.

Solve the technological means of project

The exposure data generation method of the 1st aspect of the present invention manufactures multilayer being developed to resist layer stack Before stereochemical structure, multiple exposure datas are generated, the resist layer stack is to the shape for repeating resist layer in each layer At and to the resist layer exposure and the laminated body that generates, which is characterized in that have: segmentation pattern generation process, base In the design data for the layer stereo structure for indicating to have male and fomale(M&F) in side, generating is indicated in depth direction by described each Multiple segmentation patterns of each pattern when layer is by the layer stereo segmentation of structures；And data generation process, for described more A segmentation pattern will include the convex region on convex surface in the side, in the side include concave region and the position of concave surface Concave surface peripheral region around the concave region is set as exposure area, and generates multiple exposure datas.

The exposure data generation method of the 2nd aspect of the present invention, the exposure data as described in the 1st aspect of the present invention are raw At method, which is characterized in that the data generation process is to execute the following process handled: the first processing, for the multiple Divide pattern, the domain of the existence of the layer stereo structure is set as exposure area, the non-of layer stereo structure is deposited It is set as non-exposed areas in region；Second processing, by the layer in described first treated each exposure area in the side Also the region for setting exposure area is changed to non-exposed areas, so that the convex region and the concave region are set as exposing Light region；And third processing, the institute around the concave region will be located in each non-exposed areas after the second processing It states concave surface peripheral region and is changed to exposure area, thus by around the convex region, the concave region and the concave surface Region is set as exposure area, generates the multiple exposure data.

The exposure data generation method of the 3rd aspect of the present invention, as described in the 1st aspect of the present invention or second method Exposure data generation method, which is characterized in that learn in advance exposure position when exposure device is exposed resist layer from Benchmark exposure position deviate in the case where offset upper limit value, and using the upper limit value as registration accuracy, around the concave surface The width in region is 2 times to 3 times of length of the registration accuracy.

The exposure data generation method of the 4th aspect of the present invention, such as the 1st aspect of the present invention appointing into Third Way Exposure data generation method described in one, which is characterized in that the male and fomale(M&F) has multiple recess portions, width in the multiple recess portion It spends relatively wide recess portion and is formed relatively shallow, the relatively narrow recess portion of width forms relatively deep in the multiple recess portion.

The manufacturing method of the 5th aspect of the present invention, to the formation for repeating resist layer in each layer and to described anti- The resist layer stack losing the exposure of oxidant layer and generating is developed, to manufacture the layer stereo knot for having male and fomale(M&F) in side Structure, which is characterized in that as the process repeated according to the sequence from the other side to the side to each layer, there is following work Sequence: painting process is coated with resist to form resist layer；Prebake process heats the resist layer, and exposes Light process is described more based on being generated by exposure data generation method described in any one of first method to fourth way In a exposure data with this layer of corresponding exposure data, expose the resist layer.As for by each layer Execute the painting process, the prebake process and the exposure process and the work that executes of the resist layer stack that generates Sequence, with the following process: developing procedure removes the against corrosion of the position not being exposed in the exposure process by developer solution Agent obtains the layer stereo structure, and bakes process firmly, heats to the layer stereo structure.

The manufacturing method of the 6th aspect of the present invention, the manufacturing method as described in the 5th aspect of the present invention, feature exist In, as the process repeated according to the sequence from the other side to the side to each layer, in addition to the painting process, Other than the prebake process and the exposure process, also there is the rear baking heated to the resist layer being exposed Roast process；As for by each layer execute the painting process, the prebake process, the exposure process and The process that the rear resist layer stack for baking process and generating executes, has the developing procedure and the hard baking work Sequence.

The manufacturing method of the 7th aspect of the present invention, the manufacturer as described in the 5th aspect of the present invention or the 6th mode Method, which is characterized in that as the process carried out after the hard baking process, have to described in the layer stereo structure The surface manufacturing procedure that the surface of side is processed.

The manufacturing method of the 8th aspect of the present invention, as described in any one of 5th aspect of the present invention to the 7th mode Manufacturing method, which is characterized in that in the painting process, the ingredient of the resist of coating is identical in each layer.

The manufacturing method of the 9th aspect of the present invention, as described in any one of 5th aspect of the present invention to eighth mode Manufacturing method, which is characterized in that the exposure process is by being shone while scan exposure is used up the resist layer Exposure light is penetrated continuously to carry out the direct description process of partial exposure.

The exposure data generating means of the 10th aspect of the present invention manufacture multilayer being developed to resist layer stack Generate multiple exposure datas before stereochemical structure, the resist layer stack be each layer repeat the formation of resist layer with And the laminated body generated to the exposure of the resist layer, which is characterized in that have: segmentation tern generation unit is based on table Show the design data for the layer stereo structure that there is male and fomale(M&F) in side, generation is indicated will by each layer in depth direction Multiple segmentation patterns of each pattern when the layer stereo segmentation of structures；And data generating unit, for the multiple point Cut pattern, by include in the side convex surface convex region, the side include concave surface concave region and be located at institute The concave surface peripheral region stated around concave region is set as exposure area, and generates multiple exposure datas.

The exposure data generating means of the 11st aspect of the present invention, the exposure data as described in the 10th aspect of the present invention Generating means, which is characterized in that the data generating unit includes the first processing, will be described for the multiple segmentation pattern The domain of the existence of layer stereo structure is set as exposure area, and the non-domain of the existence of the layer stereo structure is set as non-exposure Light region；Layer in described first treated each exposure area in the side is also set exposure area by second processing Region is changed to non-exposed areas, so that the convex region and the concave region are set as exposure area；And third Processing is changed to the concave surface peripheral region around the concave region is located in each non-exposed areas after second processing The convex region, the concave region and the concave surface peripheral region are set as exposure area by exposure area, thus raw At the multiple exposure data.

The exposure data generating means of the 12nd aspect of the present invention, such as the 10th aspect of the present invention or the 11st mode institute The exposure data generating means stated, which is characterized in that learn exposure position when exposure device is exposed resist layer in advance The upper limit value from the offset in the case where the offset of benchmark exposure position is set, and using the upper limit value as registration accuracy, the concave surface The width of peripheral region is 2 to 3 times of the length of the registration accuracy.

The exposure data generating means of the 13rd aspect of the present invention, if the 10th aspect of the present invention is into the 12nd mode Described in any item exposure data generating means, which is characterized in that the male and fomale(M&F) have multiple recess portions, the multiple recess portion The relatively wide recess portion of middle width forms relatively shallow, and the relatively narrow recess portion of width forms relatively deep in the multiple recess portion.

The exposure data of the 14th aspect of the present invention generates program installation in a computer, by CPU in memory by It executes, so that the computer be made to play the 10th aspect of the present invention to the exposure data described in any one of the 13rd mode The function of generating means.

The manufacture system of the 15th aspect of the present invention, to repeating the formation of resist layer in each layer and to described The exposure of resist layer and the resist layer stack generated is developed, come manufacture side have male and fomale(M&F) layer stereo knot Structure, which is characterized in that have: exposure data described in any one of 10th aspect of the present invention to the 13rd mode generates dress It sets；Apparatus for coating is coated with resist and forms resist layer；Heating device heats the resist layer；Exposure dress It sets, the resist layer is exposed；And developing apparatus, the portion not exposed by the exposure device is removed by developer solution The resist of position.

The manufacture system of the 16th aspect of the present invention, the manufacture system as described in the 15th aspect of the present invention are special Sign is, the surface processing device that there is the surface to the side of the layer stereo structure to be processed.

The manufacture system of the 17th aspect of the present invention, the system as described in the 15th aspect of the present invention or the 16th mode Make system, which is characterized in that the ingredient of the resist of the apparatus for coating coating is identical in each layer.

The manufacture system of the 18th aspect of the present invention, such as any of the 15th aspect of the present invention into the 17th mode Manufacture system described in, which is characterized in that the exposure device is by irradiating while scanning to the resist layer Exposure light continuously carries out the direct drawing apparatus of partial exposure.

Invention effect

In the present invention, by being selected to the formation for repeating resist layer in each layer and to the resist layer The exposure of property and the resist layer stack generated are developed, to manufacture layer stereo structure.It therefore, can be according to each resist Each exposing patterns of layer, adjust separately the depth of each recess portion in male and fomale(M&F).

In addition, in the present invention, the exposure area of exposure data is by convex region, concave region and concave surface peripheral region It constitutes.Therefore, even if be exposed in the case where two layers of offset to certain two layers of resist layer, can also inhibit in layer stereo The male and fomale(M&F) of structure generates unexpected step difference.

Detailed description of the invention

Fig. 1 is to indicate that exposure data generates the flow chart of the process of processing and manufacture processing.

Fig. 2 is the perspective view of an example for the layer stereo structure for indicating the process according to Fig. 1 and manufacturing.

Fig. 3 is the block diagram for indicating the electrical structure of exposure data generating means.

Fig. 4 is the figure for indicating first treated segmentation pattern.

Fig. 5 is the figure for indicating first treated segmentation pattern.

Fig. 6 is the figure for indicating first treated segmentation pattern.

Fig. 7 is the figure for indicating first treated segmentation pattern.

Fig. 8 is the figure from treated each segmentation pattern of the Section A-A of Fig. 2 view first.

Fig. 9 is the figure of the segmentation pattern after indicating second processing.

Figure 10 is the figure of the segmentation pattern after indicating second processing.

Figure 11 is the figure of the segmentation pattern after indicating second processing.

Figure 12 is the figure of the segmentation pattern after indicating second processing.

Figure 13 is the figure of each segmentation pattern after regarding second processing from the Section A-A of Fig. 2.

Figure 14 is the figure for indicating third treated segmentation pattern.

Figure 15 is the figure for indicating third treated segmentation pattern.

Figure 16 is the figure for indicating third treated segmentation pattern.

Figure 17 is the figure for indicating third treated segmentation pattern.

Figure 18 is the figure from the Section A-A view third of Fig. 2 treated each segmentation pattern.

Figure 19 is the figure from the manufacturing process of the Section A-A view layer stereo structure of Fig. 2.

Figure 20 is the figure from the manufacturing process of the Section A-A view layer stereo structure of Fig. 2.

Figure 21 is the figure from the manufacturing process of the Section A-A view layer stereo structure of Fig. 2.

Figure 22 is the figure from the manufacturing process of the Section A-A view layer stereo structure of Fig. 2.

Figure 23 is the figure from the manufacturing process of the Section A-A view layer stereo structure of Fig. 2.

Figure 24 is the figure from the manufacturing process of the Section A-A view layer stereo structure of Fig. 2.

Figure 25 is in the case where exposure position generates offset, from the multiple-layer stand of the Section A-A view comparative example of Fig. 2 The figure of the manufacturing process of body structure.

Figure 26 is in the case where exposure position generates offset, from the multiple-layer stand of the Section A-A view comparative example of Fig. 2 The figure of the manufacturing process of body structure.

Figure 27 is in the case where exposure position generates offset, from the multiple-layer stand of the Section A-A view comparative example of Fig. 2 The figure of the manufacturing process of body structure.

Figure 28 is in the case where exposure position generates offset, from the multiple-layer stand of the Section A-A view comparative example of Fig. 2 The figure of the manufacturing process of body structure.

Figure 29 is in the case where exposure position generates offset, from the multiple-layer stand of the Section A-A view comparative example of Fig. 2 The figure of the manufacturing process of body structure.

Figure 30 is in the case where exposure position generates offset, from the more of the Section A-A view present embodiment of Fig. 2 The figure of the manufacturing process of layer stereochemical structure.

Figure 31 is in the case where exposure position generates offset, from the more of the Section A-A view present embodiment of Fig. 2 The figure of the manufacturing process of layer stereochemical structure.

Figure 32 is in the case where exposure position generates offset, from the more of the Section A-A view present embodiment of Fig. 2 The figure of the manufacturing process of layer stereochemical structure.

Figure 33 is in the case where exposure position generates offset, from the more of the Section A-A view present embodiment of Fig. 2 The figure of the manufacturing process of layer stereochemical structure.

Figure 34 is in the case where exposure position generates offset, from the more of the Section A-A view present embodiment of Fig. 2 The figure of the manufacturing process of layer stereochemical structure.

Figure 35 is in the case where exposure position generates offset, from the more of the Section A-A view present embodiment of Fig. 2 The figure of the manufacturing process of layer stereochemical structure.

Specific embodiment

In the following, embodiments of the present invention will be described based on the drawings.In the accompanying drawings to the portion of structure and function having the same Minute mark infuses identical appended drawing reference and omits repeated explanation.In addition, each attached drawing is schematically shown.It should be noted that In a part of attached drawing, for specific direction relationship, appropriate mark is using Z axis as the axis of vertical direction and using X/Y plane as horizontal plane XYZ orthogonal axis.In the following description, in the case where being only denoted as up and down, the side upper finger+Z, the lower side finger-Z.

1 embodiment > of <

The configuration example > of 1.1 layer stereo structure 100 of <

Fig. 1 is to indicate that the exposure data for generating multiple exposure datas generates the system of processing and manufacture layer stereo structure 100 Make the flow chart of the process of processing.Step S1, S2 in Fig. 1 indicates that exposure data generates each process of processing, the step in Fig. 1 S3~S10 indicates each process of manufacture processing.

Fig. 2 is the perspective view of an example for the layer stereo structure 100 for indicating the process according to Fig. 1 and manufacturing.Such as Fig. 2 institute Show, the layer stereo structure 100 of present embodiment is that the interarea in the side+Z of substrate 50 is laminated with 4 layers of resist layer 51~54 Structure has male and fomale(M&F) 110 in its side+Z.It is arranged in X/Y plane view in X direction with Y-direction in male and fomale(M&F) 110 as length First recess portion 111 of the rectangular shape on side, in X/Y plane view using Y-direction as the second recess portion 112 of the L-shaped of long side and The third recess portion 113 of circular shape in XY vertical view.

In the following, each layer is ranked up and is named, successively it is known as first layer~4th to the layer of the side+Z from the layer of the side-Z Layer.In addition, in the following, the face (the 4th layer of upper surface) of top side in male and fomale(M&F) 110 is known as convex surface 110a, by male and fomale(M&F) 110 The middle part than convex surface 110a recess is known as concave surface 110b.In addition, the first recess portion 111 is the recess portion with three layer depths.That is, the The concave surface 110b of one recess portion 111 is located at the boundary of first layer and the second layer.In addition, the second recess portion 112 is that have two layer depths Recess portion.That is, the concave surface 110b of the second recess portion 112 is located at the boundary of the second layer and third layer.In addition, third recess portion 113 is that have The recess portion of one layer depth.That is, the concave surface 110b of third recess portion 113 is located at the boundary of third layer Yu the 4th layer.

1.2 exposure data of < generates processing >

In the following, the exposure data generation processing that explanation is carried out before the manufacture processing of layer stereo structure 100.

Fig. 3 is the block diagram for indicating to execute the electrical structure for the exposure data generating means 7 that exposure data generates processing.Such as figure Shown in 3, exposure data generating means 7 for example by via bus 75 by CPU (Central Processing Unit, central processing Device) 71, ROM (Read Only Memory, read-only memory) 72, RAM (deposit by Random Access Memory, arbitrary access Reservoir) 73, the common computer that is connected to each other such as storage device 74 constitutes.ROM72 storage program area etc., RAM73 are to supply CPU71 carries out operating area when defined processing.Storage device 74 is non-volatile by flash memory or hard disk device etc. Storage device is constituted.

In addition, in exposure data generating means 7, input unit 76, display unit 77, communication unit 78 and reading part 79 are also and always Line 75 connects.Input unit 76 is made of various switches, touch screen etc., receives the various inputs from operator.Display unit 77 by Liquid crystal display device, lamp etc. are constituted, and various information are shown under the control of CPU71.Communication unit 78 has via wired or wireless And the data communication function carried out.Reading part 79 is read in the computer readable recording medium being inserted into, for example, CD, DVD or The data stored in USB storage.

Program P (exposure data generation program) is mounted in exposure data generating means 7, and in RAM73 (memory) It is executed by CPU71, executes step S1 as the segmentation tern generation unit of the function part of exposure data generating means 7 as a result, made Data generating unit for the function part of exposure data generating means 7 executes step S2.It executes at exposure data generation as a result, Reason.

Program P can be by being wirelessly read into exposure data generating means 7.It is computer-readable alternatively, it is also possible to pass through Mode makes reading unit 79 read the recording medium RM for being used for logging program P, so that program P, which is read into exposure data, generates dress Set 7.

In exposure data generation processing, firstly, being generated based on the design data for indicating layer stereo structure 100 Multiple segmentation patterns (step S1: segmentation pattern generation process), multiple segmentation pattern is indicated will be more by each layer in depth direction Each pattern when layer stereochemical structure 100 is divided.Herein, since layer stereo structure 100 is the stereochemical structure constituted by 4 layers, because This generates 4 segmentation patterns in step sl.

In exposure data generation processing, next, carrying out the first processing to third processing to 4 segmentation patterns, 4 are generated A exposure data (step S2: data generation process).

In data generation process, firstly, carrying out the first processing.Specifically, in segmentation pattern generation process 4 obtained segmentation patterns, are set as exposure area 90 for the domain of the existence of layer stereo structure 100, by layer stereo structure 100 non-domain of the existence is set as non-exposed areas 91.Fig. 4~Fig. 7 is to indicate first according to the sequence of first layer~four layer Treated 4 segmentation pattern 11~14 figure.

As shown in Fig. 2, in first layer 111~third of not formed first recess portion recess portion 113 of layer stereo structure 100.It changes Yan Zhi, the whole region of first layer are the domain of the existence of layer stereo structure 100.Therefore, in segmentation pattern 11, by first layer Whole region be set as exposure area 90.

In addition, not formed second is recessed as shown in Fig. 2, the second layer in layer stereo structure 100 forms the first recess portion 111 Portion 112 and third recess portion 113.In other words, the region that the first recess portion 111 is formed in the whole region of the second layer is layer stereo knot The non-domain of the existence of structure 100, remaining area is the domain of the existence of layer stereo structure 100 in the whole region of the second layer.Therefore, In segmentation pattern 12, the above-mentioned non-domain of the existence in the whole region of the second layer is set as non-exposed areas 91, by second Above-mentioned domain of the existence in the whole region of layer is set as exposure area 90.

In addition, as shown in Fig. 2, the third layer in layer stereo structure 100 forms the first recess portion 111 and the second recess portion 112, Not formed third recess portion 113.In other words, the first recess portion 111 and the second recess portion 112 are formed in the whole region of third layer Region is the non-domain of the existence of layer stereo structure 100, and remaining area is layer stereo structure 100 in the whole region of third layer Domain of the existence.Therefore, in segmentation pattern 13, the above-mentioned non-domain of the existence in the whole region of third layer is set as non-exposure Above-mentioned domain of the existence in the whole region of third layer is set as exposure area 90 by light region 91.

In addition, as shown in Fig. 2, layer stereo structure 100 the 4th layer of first 111~third of recess portion recess portion 113 of formation. In other words, the region for first 111~third of recess portion recess portion 113 being formed in the 4th layer of whole region is layer stereo structure 100 non-domain of the existence, remaining area is the domain of the existence of layer stereo structure 100 in the 4th layer of whole region.Therefore, exist Divide in pattern 14, the above-mentioned non-domain of the existence in the 4th layer of whole region is set as non-exposed areas 91, by the 4th layer Whole region in above-mentioned domain of the existence be set as exposure area 90.Fig. 8 be from coming from the Section A-A of Fig. 2 this at first The figure of the segmentation pattern 11~14 at the time point after reason.

In data generation process, next, carrying out second processing.Specifically, first treated each exposure area The region that layer (layer of the side+Z) is set to exposure area 90 on it in 90 is changed to non-exposed areas 91.Fig. 9~Figure 12 It is the figure that 4 segmentation patterns 21~24 after second processing are indicated according to the sequence of first layer~four layer.In the following, in each segmentation In pattern, the region for including convex surface 110a in the side+Z is known as convex region 90a, the region for including concave surface 110b in the side+Z is claimed For concave region 90b.

By the second processing carried out to first layer, divides in the exposure area 90 of pattern 11 and dividing pattern 12~14 Also the region for setting exposure area 90 is changed to non-exposed areas 91, and segmentation pattern 11 is changed to segmentation pattern 21.According to For Fig. 2 and Fig. 9 it is found that the exposure area 90 in segmentation pattern 21 is concave region 90b, concave region 90b includes the in the side+Z The concave surface 110b of one recess portion 111.

In addition, dividing in the exposure area 90 of pattern 12 by the second processing carried out to the second layer and dividing pattern 13,14 regions for also setting exposure area 90 are changed to non-exposed areas 91, and segmentation pattern 12 is changed to segmentation pattern 22. According to fig. 2 with Figure 10 it is found that the exposure area 90 in segmentation pattern 22 is concave region 90b, concave region 90b is wrapped in the side+Z Include the concave surface 110b of the second recess portion 112.

In addition, dividing in the exposure area 90 of pattern 13 by the second processing carried out to third layer and dividing pattern 14 regions for also setting exposure area 90 are changed to non-exposed areas 91, and segmentation pattern 13 is changed to segmentation pattern 23.Root According to Fig. 2 and Figure 11 it is found that the exposure area 90 in segmentation pattern 23 is concave region 90b, concave region 90b includes in the side+Z The concave surface 110b's of third recess portion 113.

In addition, due in layer stereo structure 100 the 4th layer be top layer, even if to the 4th layer carry out second Processing, will not change exposure area 90 and non-exposed areas 91.Therefore, segmentation pattern 24 is same as segmentation pattern 14 Pattern.According to fig. 2 with Figure 12 it is found that the exposure area 90 in segmentation pattern 24 is convex region 90a, convex region 90a exists The side+Z includes convex surface 110a.

As described above, in the segmentation pattern 21~24 after second processing, by convex region 90a and concave surface Region 90b is set as exposure area 90.Figure 13 is the segmentation at the time point from the Section A-A of Fig. 2 after above-mentioned second processing The figure of pattern 21~24.

In data generation process, next, carrying out third processing.Specifically, each non-exposed area after second processing The region being located at around concave region 90b in domain 91 is changed to exposure area 90.Figure 14~Figure 17 be according to first layer~ 4th layer of sequence indicates third treated the figure of 4 segmentation patterns 31~34.In the following, concave surface will be located in each segmentation pattern Region around 110b is known as concave surface peripheral region 90c.

By the third processing carried out to first layer, divides and be located at concave region 90b in the non-exposed areas 91 of pattern 21 Around concave surface peripheral region 90c be changed to exposure area 90, segmentation pattern 21 is changed to segmentation pattern 31.According to Figure 14 is it is found that peripheral region 90c in concave surface is the rectangular ring region using Y-direction as long side.

In addition, being handled by the third carried out to the second layer, divides and be located at concave regions in the non-exposed areas 91 of pattern 22 Concave surface peripheral region 90c around the 90b of domain is changed to exposure area 90, and segmentation pattern 22 is changed to segmentation pattern 32. As can be seen from FIG. 15, peripheral region 90c in concave surface is the L word annular section using Y-direction as long side.

In addition, being handled by the third carried out to third layer, divides and be located at concave regions in the non-exposed areas 91 of pattern 23 Concave surface peripheral region 90c around the 90b of domain is changed to exposure area 90, and segmentation pattern 23 is changed to segmentation pattern 33. As can be seen from FIG. 16, peripheral region 90c in concave surface is circular region.

In addition, the segmentation pattern 24 due to the 4th layer does not have concave region 90b, even if carrying out the to the 4th layer Three processing, will not change exposure area 90 and non-exposed areas 91.Therefore, segmentation pattern 34 is and segmentation pattern 14,24 Same pattern.

As described above, third treated segmentation pattern 31~34 in, by convex region 90a, concave regions Domain 90b and concave surface peripheral region 90c are set as exposure area 90.Figure 18 is the above-mentioned third of Section A-A view from Fig. 2 The figure of the segmentation pattern 31~34 at treated time point.

So, the data of the 4 segmentation patterns 31~34 generated in the first processing~third processing become to multilayer Stereochemical structure 100 carries out 4 exposure datas that exposure device is supplied to when manufacture processing.

In the present embodiment, the registration accuracy of exposure device is known in advance before carrying out third processing, around concave surface The width W40 of region 90c is set as 2 times of the length of registration accuracy.Herein, registration accuracy, which refers to, is exposed resist layer When exposure position from benchmark exposure position deviate when offset upper limit value, be and Japanese Unexamined Patent Publication 2009-224523 bulletin In overlapping accuracy, the identical concept of registration accuracy in Japanese Unexamined Patent Publication 2014-103343 bulletin.So, in aftermentioned < The effect of the width W40 of setting concave surface peripheral region 90c is described in detail in positional shift > in 1.4 exposure process.

The manufacture of 1.3 layer stereo structure 100 of < handles >

The manufacture system for manufacturing layer stereo structure 100 is following system: to the shape for repeating resist layer in each layer At and to the resist layer exposure and the resist layer stack that generates is developed, there is male and fomale(M&F) in the side+Z to manufacture 110 layer stereo structure 100.

The manufacture system includes exposure data generating means 7；Apparatus for coating is coated with resist and forms resist layer； Heating device heats resist layer；Exposure device exposes resist layer；Developing apparatus is removed by developer solution The resist at the position for going exposure device not expose；And surface processing device, carry out surface processing.Manufacture system both may be used It, can also be by configuring above-mentioned each device with straight column mode come structure to be constituted by configuring above-mentioned each device in a manner of group At.

Figure 19~Figure 24 is the figure from the manufacturing process of the Section A-A view layer stereo structure 100 of Fig. 2.In the following, The manufacture processing of layer stereo structure 100 when illustrating from the Section A-A view of Fig. 2.

In manufacture processing, firstly, negative resist is coated on the master of the side (side+Z) of substrate 50 by apparatus for coating Face forms the resist layer 51 (step S3: painting process) of first layer on substrate 50.It should be noted that the resist pair The exposure light used in exposure device has permeability.

Next, heating device heats resist layer 51, make the solvent in resist layer 51 evaporate (step S4: Prebake process).

Next, exposure device is based on first layer in 4 exposure datas for generating processing generation by above-mentioned exposure data Exposure data, (step S5: exposure process) is exposed to resist layer 51.Segmentation pattern 31 is equivalent in resist layer 51 The position of exposure area 90 be exposed, become the insoluble region 92 of development.In addition, being equivalent to segmentation pattern 31 in resist layer 51 The position of non-exposed areas 91 be not exposed, the state in the solvable region 93 that keeps developing.Exposure device is for example by directly retouching Device composition is drawn, which uses up by irradiationing exposure while scan exposure is used up to resist layer come continuous Ground carries out partial exposure.In this case, it executes in step s 5 and directly describes process, do not need to prepare and each exposure data Corresponding mask, therefore preferably.

Next, heating device heats resist layer 51, make the solvent of resist layer 51 evaporate (step S6: after Bake process).Figure 19 is the figure for indicating the manufacturing process of layer stereo structure 100 at the time point.

When executing step S3~S6 to resist layer 51, determine with the presence or absence of not formed resist layer (step S7).Herein, since as not formed resist layer, there are resist layers 52~54, therefore in step S7 branch For "Yes".

Next, the resist layer 52 to the second layer on substrate 50 executes step S3~S6.As a result, resist layer The position that the exposure area 90 of segmentation pattern 32 is equivalent in 52 is exposed, and becomes the insoluble region 92 of development.As described above, this reality Applying resist used in mode has permeability to exposure light.Therefore, for the against corrosion of the lower layer as resist layer 52 For oxidant layer 51, the position for being equivalent to the exposure area 90 of segmentation pattern 32 is exposed, and becomes the insoluble region 92 of development.In addition, The position that the non-exposed areas 91 of segmentation pattern 32 is equivalent in resist layer 52 is not exposed, and keeps solvable region 93 of developing State.Then, resist layer 52 is heated, evaporates the solvent in resist layer 52.Figure 20 is to indicate the time point Layer stereo structure 100 manufacturing process figure.

When executing step S3~S6 to resist layer 52, determine with the presence or absence of not formed resist layer (step S7).Herein, since as not formed resist layer, there are resist layers 53,54, therefore in step S7 branch For "Yes".

Resist layer 53 and the 4th layer of resist layer 54 to the third layer on substrate 50 similarly execute step S3 ~S6.Figure 21 is the manufacturing process for indicating to execute resist layer 53 the layer stereo structure 100 at the time point of step S3~S6 Figure.Figure 22 is the manufacturing process for indicating to execute resist layer 54 the layer stereo structure 100 at the time point of step S3~S6 Figure.

So, according to the sequence from the side-Z to the side+Z, step S3~S6 is executed to each layer, to generate resist layer Stack 57.Then, (step S7) is determined to the presence or absence of not formed resist layer.Herein, due to whole against corrosion Oxidant layer 51~54 has been formed, therefore branches into "No" in step S7.

Developing apparatus is the resist that solvable region 93 of developing in resist layer stack 57 is removed by developer solution, is obtained more Layer stereochemical structure 100 (step S8: developing procedure).Layer stereo structure 100 is obtained at the time point, by manufacture is handled Continue step S9, S10, to improve the intensity of layer stereo structure 100.

Next, heating device heats layer stereo structure 100, make solvent in layer stereo structure 100, It is attached to the developer solution evaporation (step S9: baking process firmly) of layer stereo structure 100.Figure 23 is the multilayer for indicating the time point The figure of the manufacturing process of stereochemical structure 100.It should be noted that in Fig. 2, diagram becomes complicated in order to prevent, depict into The layer stereo structure 100 at the time point before the surface manufacturing procedure of row next step is (that is, layer stereo corresponding with Figure 23 Structure 100).

Next, surface processing device processes the surface of the side+Z of layer stereo structure 100, covered with protective film 55 Cover the surface (step S10: surface manufacturing procedure).As protective film 55, the film such as plated film or diamond-film-like is formed.Figure 24 be the figure by the layer stereo structure 100 of step S1~S10 manufacture.

As described above, in the manufacturing method of present embodiment, repeat resist layer in each layer The resist layer stack 57 for being formed and carrying out the exposure of selectivity to the resist layer and generating is developed, to manufacture multilayer Stereochemical structure 100.Therefore, each recess portion in male and fomale(M&F) 110 can be adjusted separately according to each exposing patterns to each resist layer Depth.

Layer stereo structure 100 is used as the intaglio plate in such as printing treatment.It is recessed layer stereo structure 100 to be used as In the case where version, the relatively wide recess portion of width forms relatively shallow in preferably multiple recess portions, and width is opposite in the multiple recess portion Narrow recess portion forms relatively deep.Whens being filled into the ink of each recess portion as a result, and being transferred in transfer roll etc., it is able to suppress each recess portion In ink transfer ratio deviation.Herein, the width of recess portion refers to short from the top view from upper surface when above-mentioned recess portion The width in direction.As shown in Fig. 2, the third of relatively wide width W30 is recessed in the layer stereo structure 100 of present embodiment Portion 113 forms relatively shallow, and the second recess portion 112 of intermediate width W20 is intermediate depth, and the first of relatively narrow width W10 is recessed Portion 111 forms relatively deep.Therefore, from the above point of view, it is suppressed that deviation when transfer, thus it is preferred that.

In addition, as the layer stereo structure 100 of present embodiment, if the resist layer 51 of first layer is entire Face is insoluble region 92 of developing, then the adaptation between substrate 50 and resist layer 51~54 improves, thus it is preferred that.

In addition, as in the present embodiment, the identical mode of the ingredient for the resist that apparatus for coating is coated in layers In, the different mode of the ingredient of resist in layers from the technology recorded such as Japanese Unexamined Patent Publication 2012-208350 bulletin It compares, the manufacture processing of layer stereo structure 100 becomes easy, and can also inhibit manufacturing cost.

In addition, as in the present embodiment, side of the exposure device to the exposure light of resist layer irradiation Same Wavelength In formula, with the technology recorded such as Japanese Unexamined Patent Publication 2012-208350 bulletin each resist layer is irradiated according to resist Ingredient is different and the mode for the exposure light that wavelength is different is compared, and the manufacture processing of layer stereo structure 100 becomes easy, and also can Inhibit manufacturing cost.

Positional shift > in 1.4 exposure process of <

In the manufacture processing > of above-mentioned 1.3 layer stereo structure 100 of <, illustrate in resist layer without positional shift Ideal exposure position (benchmark exposure position) the case where being exposed process.However, in the case where executing exposure process, In the face XY, exposure position is usually deviated in the range of registration accuracy.

It is assumed below that the case where generating positional shift in exposure process, at the manufacture that illustrates present embodiment and comparative example The difference of reason.Here, it is assumed that following situations: in the resist layer 51 of benchmark exposure position exposure first layer, being exposed from benchmark Position offset by registration accuracy to -X direction in the case where expose the second layer resist layer 52, from benchmark exposure position to+ X-direction exposes the resist layer 53 of third layer in the case where offseting by registration accuracy, inclined from benchmark exposure position to -X direction The 4th layer of resist layer 54 is exposed in the case where having moved registration accuracy.

Based on above-mentioned it is assumed that explanation is handled by comparing the manufacture of example come the case where manufacturing layer stereo structure 100A.? In the comparative example, using the data of segmentation pattern 11~14 shown in Fig. 8 as exposure data, exposure process is executed.Figure 25~figure 29 be the figure from the manufacturing process of the Section A-A view layer stereo structure 100A of Fig. 2.

Firstly, the resist layer 51A to the first layer on substrate 50 executes step S3~S6.As a result, resist layer The position that the exposure area 90 of segmentation pattern 11 is equivalent in 51A is exposed, and becomes the insoluble region 92 of development.Then, to against corrosion Oxidant layer 51A is heated, and the solvent in resist layer 51A is evaporated.Figure 25 is the layer stereo structure for indicating the time point The figure of the manufacturing process of 100A.

When executing step S3~S6 to resist layer 51A, determine with the presence or absence of not formed resist layer (step S7).Herein, since as not formed resist layer, there are resist layer 52A~54A, therefore at step S7 points Branch is "Yes".

Step S3~S6 is similarly executed to resist layer 52A~54A of the second layer on substrate 50~four layer.It needs It is noted that in each step S5, as described above, in the feelings for offseting by registration accuracy from benchmark exposure position to ± X-direction Exposure process is executed under condition.Figure 26 is the layer stereo structure for indicating to execute resist layer 52A the time point of step S3~S6 The figure of 100 manufacturing process.Figure 27 is the layer stereo knot for indicating to execute resist layer 53A the time point of step S3~S6 The figure of the manufacturing process of structure 100.Figure 28 is the layer stereo knot for indicating to execute resist layer 54A the time point of step S3~S6 The figure of the manufacturing process of structure 100.

So, step S3~S6 is executed to each layer according to the sequence from the side-Z to the side+Z, to generate resist stacking Body 57A (Figure 28).Then, (step S7) is determined to the presence or absence of not formed resist layer.Herein, due to whole Resist layer 51A~54A has been formed, therefore branches into "No" in step S7.

Developing apparatus removes the resist in solvable region 93 of developing in resist layer stack 57A by developer solution, obtains more Layer stereochemical structure 100A (step S8: developing procedure).Next, heating device heats layer stereo structure 100A, make Solvent in layer stereo structure 100, developer solution evaporation (the step S9: baking work firmly for being attached to layer stereo structure 100A Sequence).Figure 29 is the figure for indicating the manufacturing process of layer stereo structure 100A at the time point.

The layer stereo structure 100A so manufactured is in male and fomale(M&F) 110A by the first recess portion 111A~third recess portion 113A structure At.However, in the shape of male and fomale(M&F) 110A and layer stereo structure 100 when executing ideal exposure process without positional shift Male and fomale(M&F) 110 shape it is different.This is because the positional shift of exposure position leads to the development in resist layer stack 57A The shape and the shape of male and fomale(M&F) 110 in solvable region 93 be not corresponding.So, in the manufacturing method of comparative example, in exposure position In the case where setting generation offset, the layer stereo structure with desired male and fomale(M&F) 110 cannot be manufactured.

Next, based on above-mentioned it is assumed that explanation manufactures layer stereo structure by the manufacture processing of present embodiment The case where 100B.In the following, executing exposure process using the data for dividing pattern 31~34 shown in Figure 18 as exposure data.Figure 30~Figure 35 is the figure from the manufacturing process of the Section A-A view layer stereo structure 100B of Fig. 2.

Firstly, the resist layer 51B to the first layer on substrate 50 executes step S3~S6.As a result, resist layer The position that the exposure area 90 of segmentation pattern 31 is equivalent in 51B is exposed, and becomes the insoluble region 92 of development.In addition, resist The position that the non-exposed areas 91 of segmentation pattern 31 is equivalent in layer 51B is not exposed, and keeps the shape in the solvable region 93 of development State.Then, resist layer 51B is heated, evaporates the solvent in resist layer 51B.Figure 30 indicates the time point The figure of the manufacturing process of layer stereo structure 100B.

After executing step S3~S6 to resist layer 51B, (step is determined to whether there is not formed resist layer Rapid S7).Herein, since as not formed resist layer, there are resist layer 52B~54B, therefore in step S7 branch For "Yes".

Step S3~S6 is similarly executed to resist layer 52B~54B of the second layer on substrate 50~four layer. It should be noted that in each step S5, as described above, offseting by registration accuracy from benchmark exposure position to ± X-direction In the case of, execute exposure process.Figure 31 is the layer stereo knot for indicating to execute resist layer 52B the time point of step S3~S6 The figure of the manufacturing process of structure 100B.Figure 32 indicates the layer stereo knot that the time point of step S3~S6 is executed to resist layer 53B The figure of the manufacturing process of structure 100B.Figure 33 is the layer stereo for indicating to execute resist layer 54B the time point of step S3~S6 The figure of the manufacturing process of structure 100B.

So, step S3~S6 is executed to each layer according to the sequence from the side-Z to the side+Z, to generate resist stacking Body 57B (Figure 33).Then, (step S7) is determined to the presence or absence of not formed resist layer.Herein, due to whole Resist layer 51B~54B has been formed, therefore branches into "No" in step S7.

Developing apparatus removes the resist in solvable region 93 of developing in resist layer stack 57B by developer solution, obtains more Layer stereochemical structure 100B (step S8: developing procedure).Next, heating device heats layer stereo structure 100B, make Solvent in layer stereo structure 100B, developer solution evaporation (the step S9: baking work firmly for being attached to layer stereo structure 100B Sequence).Figure 34 is the figure for indicating the manufacturing process of layer stereo structure 100B at the time point.

However the position of the male and fomale(M&F) 110B of the layer stereo structure 100B manufactured, with the 4th as top layer Positional shift occurs for the exposure position of layer, and deviates from ideal position (position of male and fomale(M&F) 110).But according to fig. 23 and figure 34 it is found that the shape of the male and fomale(M&F) 110B of layer stereo structure 100B is consistent with the shape of ideal male and fomale(M&F) 110.

In the present embodiment, since the exposure area of exposure data 90 does not include except convex region 90a, concave region Other regions other than 90b and concave surface peripheral region 90c, therefore even if to two layers of resist in the case where certain two layers offset When layer is exposed, it can also inhibit to generate unexpected step difference.For example, in a comparative example, since exposure area 90 includes Above-mentioned other regions, therefore deviated relative to the resist layer 53A of third layer to -X direction in the 4th layer of resist layer 54A In the case where when being exposed, the second recess portion 112A produces unexpected step difference (Figure 27~Figure 29).However, in this embodiment party In formula, since exposure area 90 is only made of convex region 90a, concave region 90b and concave surface peripheral region 90c, inhibit The quantity of exposure area.It thereby inhibits in the insoluble region 92 of the development area insoluble with the development formed on upper layer that lower layer is formed Unexpected step difference is generated between domain 92.In particular, as in the present embodiment, if the width of concave surface peripheral region 90c Degree W40 is 2 times of length of registration accuracy, though then in the case where deviating maximum limit in the opposite direction certain two layers to this two (that is, even if being exposed in the case where deviating registration accuracy in the opposite direction to two layers when layer resist layer is exposed When), it can also prevent the shape of each recess portion from changing.Therefore, in the manufacturing method of present embodiment, it is suppressed that because of exposure position The change in shape of male and fomale(M&F) 110 caused by positional shift.

Finally, surface processing device processes the surface of the side+Z of layer stereo structure 100B, covered with protective film 55B Cover the surface (step S10: surface manufacturing procedure).As protective film 55B, the film such as plated film or diamond-film-like is formed. Figure 35 is the figure indicated through step S1~S10 layer stereo structure 100B manufactured.

2 variation > of <

Embodiments of the present invention are explained above, the present invention is able to carry out within the scope of its spirit except above-mentioned Various changes other than situation.

In the above-described embodiment, for easy understanding, (the figure of layer stereo structure 100 for being simple to manufacture shape is illustrated 2) mode, but layer stereo structure of various shapes can be manufactured through the invention.In addition, in the above-described embodiment, saying The layer of each resist layer is illustrated with a thickness of fixed situation, but the thickness degree of each resist layer can also be not fixed.

In addition, in the above-described embodiment, illustrating that the width W40 of concave surface peripheral region 90c is 2 times of registration accuracy Situation, but not limited to this.But as described above, if it is considered that offset is gone forward side by side round about this two layers of upper layer and lower layer When the case where row exposure, then the width of preferred concave surface peripheral region is the 2 times or more of registration accuracy.In addition, as noted previously, as Exposure area, which is set to width, will lead to the unexpected step difference of layer stereo structure generation of manufacture, it is therefore preferable that concave surface The width of peripheral region is 3 times or less of registration accuracy.

In addition, in the above-described embodiment, illustrating what the layer stereo structure 100 of manufacture was made of 4 layers of resist layer Situation, but not limited to this.The layer stereo structure 100 of manufacture can be both made of 3 layers of resist layer below, can also be with It is made of 5 layers or more of resist layer.But it if can be obtained from the case where each resist layer exposure position deviates To from the viewpoint of the layer stereo structure with desired male and fomale(M&F), in the case where more than the numbers of plies such as 4 layers or more of situations, The present invention is particularly effective for.

In addition, in the above-described embodiment, illustrating to generate multiple impressions by carrying out the first processing to third processing According to mode, but not limited to this.The mode of multiple exposure datas is generated even by other processing sequences, as long as upper The exposure area set in exposure data is stated to be made of convex region, concave region and concave surface peripheral region, can obtain with it is upper State the same effect of embodiment.

In addition, in the above-described embodiment, illustrate to be carried out afterwards being exposed process (step S5) to each resist layer The mode of process (step S6) is baked afterwards.In general, there is the resist for promoting to be heated in rear baking process (step S6) The cross-linking reaction of layer, and improve the effect of the resist layer and the adaptation of its upper and lower.However, according to resist layer The condition of material, the thickness for being formed by resist layer etc. can fill baking process (step S6) after not implementing sometimes Ground is divided to ensure the adaptation between each layer.Therefore, in this case, process (step S6) is baked after also can be omitted.

The exposure data generation method, manufacturing method, exposure data that this concludes the description of embodiment and its variation generate Device, exposure data generate program and manufacture system, but these are the examples of preferred embodiment in the present invention, and unlimited Determine the range that the present invention is implemented.The present invention can freely combine each embodiment, is right in the range of foregoing invention The arbitrary structures component of each embodiment carries out deforming or omitting in various embodiments arbitrary structural elements.

The explanation of appended drawing reference

7 exposure data generating means

11~14,21~24,31~34 segmentation patterns

50 substrates

51~54,51A~54A, 51B~54B resist layer

55,55A, 55B protective film

57,57A, 57B resist layer stack

90 exposure areas

The convex region 90a

90b concave region

The concave surface 90c peripheral region

91 non-exposed areas

The insoluble region of 92 developments

The 93 solvable regions of development

100,100A, 100B layer stereo structure

110,110A, 110B male and fomale(M&F)

111, the first recess portion of 111A

112, the second recess portion of 112A

113,113A third recess portion

S1~S10 step

Claims

1. a kind of exposure data generation method, developed to resist layer stack come before manufacturing layer stereo structure, it is raw At multiple exposure datas, the resist layer stack is to the formation for repeating resist layer in each layer and to described against corrosion The exposure of oxidant layer and the laminated body generated, which is characterized in that have:

Divide pattern generation process, it is raw based on the design data for the layer stereo structure for indicating that there is male and fomale(M&F) in side Multiple segmentation patterns of each pattern of each layer by the layer stereo segmentation of structures when are pressed in depth direction at expression；And

Data generation process will include the convex region on convex surface in the side, described one for the multiple segmentation pattern Side includes that the concave region of concave surface and the concave surface peripheral region around the concave region are set as exposure area, and Generate multiple exposure datas.

2. exposure data generation method as described in claim 1, which is characterized in that

The data generation process is to execute the following process handled:

First processing, for the multiple segmentation pattern, is set as exposure area for the domain of the existence of the layer stereo structure, The non-domain of the existence of the layer stereo structure is set as non-exposed areas；

Layer in described first treated each exposure area in the side is also set the region of exposure area by second processing It is changed to non-exposed areas, so that the convex region and the concave region are set as exposure area；And

Third processing, the concave surface week being located at around the concave region in each non-exposed areas after the second processing It encloses region and is changed to exposure area, so that the convex region, the concave region and the concave surface peripheral region be set For exposure area, the multiple exposure data is generated.

3. exposure data generation method as claimed in claim 1 or 2, which is characterized in that

Learn exposure position when exposure device is exposed resist layer in the case where the offset of benchmark exposure position in advance Offset upper limit value, and using the upper limit value as registration accuracy,

The width of the concave surface peripheral region is 2 times to 3 times of length of the registration accuracy.

4. exposure data generation method as described in claim 1, which is characterized in that

The male and fomale(M&F) has multiple recess portions, and the relatively wide recess portion of width forms relatively shallow in the multiple recess portion, described more The relatively narrow recess portion of width forms relatively deep in a recess portion.

5. a kind of manufacturing method of layer stereo structure, to the formation for repeating resist layer in each layer and to described against corrosion The exposure of oxidant layer and the resist layer stack generated is developed, come manufacture side have male and fomale(M&F) layer stereo structure, It is characterized in that,

It is with the following process as the process repeated according to the sequence from the other side to the side to each layer:

Painting process is coated with resist and forms resist layer,

Prebake process heats the resist layer, and

Exposure process is described more based on being generated by exposure data generation method according to any one of claims 1 to 4 In a exposure data with this layer of corresponding exposure data, expose the resist layer；

It is given birth to as and executing the painting process, the prebake process and the exposure process to each layer At resist layer stack execute process, it is with the following process:

Developing procedure is removed the resist at the position not being exposed in the exposure process by developer solution, obtained described more Layer stereochemical structure, and

It is hard to bake process, the layer stereo structure is heated.

6. manufacturing method as claimed in claim 5, which is characterized in that

As the process repeated according to the sequence from the other side to the side to each layer, in addition to the coating work Other than sequence, the prebake process and the exposure process, also has and the resist layer being exposed is heated After bake process,

As for by executing the painting process, the prebake process, the exposure process and institute to each layer Process is baked after stating and the process that executes of the resist layer stack that generates, there is the developing procedure and the hard baking process.

7. such as manufacturing method described in claim 5 or 6, which is characterized in that

As on the hard surface for baking the process carried out after process, having to the side of the layer stereo structure The surface manufacturing procedure processed.

8. manufacturing method as claimed in claim 5, which is characterized in that

In the painting process, the ingredient of the resist of coating is identical in each layer.

9. manufacturing method as claimed in claim 5, which is characterized in that

The exposure process is to be used up by irradiationing exposure while scan exposure is used up to the resist layer come continuously Carry out the direct description process of partial exposure.

10. a kind of exposure data generating means, the previous existence of layer stereo structure is manufactured being developed to resist layer stack At multiple exposure datas, the resist layer stack is in each layer to repeat the formation of resist layer and to the resist The exposure of layer and the laminated body that generates, which is characterized in that have:

Divide tern generation unit, it is raw based on the design data for the layer stereo structure for indicating that there is male and fomale(M&F) in side Multiple segmentation patterns of each pattern of each layer by the layer stereo segmentation of structures when are pressed in depth direction at expression；And

Data generating unit will include the convex region on convex surface in the side, described one for the multiple segmentation pattern Side includes that the concave region of concave surface and the concave surface peripheral region around the concave region are set as exposure area, and Generate multiple exposure datas.

11. exposure data generating means as claimed in claim 10, which is characterized in that

The data generating unit includes

Third processing will be located at the concave surface peripheral region around the concave region in each non-exposed areas after second processing Domain is changed to exposure area, and the convex region, the concave region and the concave surface peripheral region are set as exposure region Domain, to generate the multiple exposure data.

12. exposure data generating means as described in claim 10 or 11, which is characterized in that

The width of the concave surface peripheral region is 2 to 3 times of the length of the registration accuracy.

13. exposure data generating means as claimed in claim 10, which is characterized in that

14. a kind of computer readable storage medium is stored thereon with exposure data and generates program, which is characterized in that the exposure Exposure data generation side of the data generator described in any one of processor perform claim requirement 1~5 of the computer The step of method.

15. a kind of manufacture system of layer stereo structure, to the formation for repeating resist layer in each layer and to described anti- The resist layer stack losing the exposure of oxidant layer and generating is developed, to manufacture the layer stereo knot for having male and fomale(M&F) in side Structure, which is characterized in that have:

Exposure data generating means described in any one of claim 10~13；

Apparatus for coating is coated with resist and forms resist layer；

Heating device heats the resist layer；

Exposure device is exposed the resist layer；And

Developing apparatus removes the resist at the position not exposed by the exposure device by developer solution.

16. manufacture system as claimed in claim 15, which is characterized in that

The surface processing device that surface with the side to the layer stereo structure is processed.

17. the manufacture system as described in claim 15 or 16, which is characterized in that the resist of apparatus for coating coating at Divide identical in each layer.

18. manufacture system as claimed in claim 15, which is characterized in that

The exposure device is continuously to carry out part by irradiationing exposure on one side scan while to the resist layer to use up The direct drawing apparatus of exposure.