CN107429991A - Appearance inspection device and appearance inspection method - Google Patents
Appearance inspection device and appearance inspection method Download PDFInfo
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- CN107429991A CN107429991A CN201580078072.0A CN201580078072A CN107429991A CN 107429991 A CN107429991 A CN 107429991A CN 201580078072 A CN201580078072 A CN 201580078072A CN 107429991 A CN107429991 A CN 107429991A
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- measurement region
- substrate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
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Abstract
Inclined camera (31b)~(31e) obliquely configures relative to the normal direction (vertical Z) on the surface (10a) of substrate (10), suitable for catch be present on the surface (10a) of substrate (10) solder (91), (92) side (Fig. 7).And, based on measurement region R (I) obtained from the measurement region R (I) set as inclined camera (31b)~(31e) shootings to substrate (10), measurement region R (I) 3D shape Dt (I) is measured.Therefore, in the case that even measurement region R (I) is set in a manner of comprising the solder (91) being present on substrate (10), the side (91a) of (92), (92a), solder (91), the side (91a) of (92), the 3D shape Dt (I) of (92a) can be also measured exactly.
Description
Technical field
The present invention relates to a kind of appearance inspection device and appearance inspection method of the outward appearance for checking substrate.
Background technology
Equipment for examining vision described in patent document 1 possesses the first camera for being right against check object thing and irradiation grid
The grid pattern irradiation portion of pattern, the sample deformed based on the grid pattern being radiated at by first camera shooting on check object thing
The result of son, determine the height of check object thing.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Application Publication 2014-510276 publications
The content of the invention
The invention problem to be solved
This technology for example can be used in checking the outward appearance for the substrate that element is provided with by solder.But above-mentioned
One camera face check object thing.Therefore, when checking substrate, it not necessarily can exactly measure sometimes and be present in base
The 3D shape of the side of object (solder or element etc.) on plate.By the way, in patent document 1, provided with configuration
Second camera around first camera.But the second camera can only confirm floating or being not inserted into for element, be not enough to disappear
Except the problem.
The invention in view of above-mentioned problem and complete, its object is to provide one kind and can measure exactly to be present on substrate
Object side 3D shape technology.
For solving the technical scheme of problem
To achieve these goals, appearance inspection device of the invention possesses：Board holder, substrate is kept；
Projector, to the substrate irradiation light for being held in board holder；Inclined camera, relative to the substrate for being held in board holder
Normal to a surface direction obliquely configures；And control unit, based on from projector to the measurement region irradiation light set to substrate simultaneously
The shooting image as obtained from inclined camera shoots measurement region, is measured to the 3D shape of measurement region.
To achieve these goals, appearance inspection method of the invention possesses following process：Measurement area is set to substrate
Domain；To measurement region irradiation light and based on the shooting of the inclined camera by obliquely being configured relative to the normal to a surface direction of substrate
Region is surveyed, obtains shooting image；And the 3D shape of measurement region is measured based on shooting image.
The present invention (appearance inspection device and appearance inspection method) the possessed inclined camera so formed is relative to base
The normal to a surface direction of plate is obliquely configured, and compared with above-mentioned straight-on camera, the surface of substrate is present in suitable for catching
On object side.Moreover, based on as inclined camera shooting to substrate set measurement region obtained from shooting image,
The 3D shape of measurement region is measured.Therefore, even measurement region is to include the side for the object being present on substrate
In the case that the mode in face is set, the 3D shape of the side of object can be also measured exactly.
Invention effect
The present invention can measure the 3D shape of the side for the object being present on substrate exactly.
Brief description of the drawings
Fig. 1 is the stereogram of one for schematically showing the appearance inspection device possessed inspection head of the present invention.
Fig. 2 is the top view of one of the inspection head for schematically showing Fig. 1.
Fig. 3 is the block diagram of the schematically appearance inspection device of the example present invention.
The flow chart of one of the image taking that Fig. 4 has been expressed as inspecting substrate and performed.
Fig. 5 is the top view for the direction for schematically illustrating measurement region.
The flow chart of one of the image procossing that Fig. 6 has been expressed as inspecting substrate and performed.
Fig. 7 is the figure for schematically illustrating advantage possessed by inclined camera.
Fig. 8 is the figure for schematically illustrating another advantage possessed by inclined camera.
Fig. 9 is the figure for schematically showing the situation checked the substrate for being mixed with different types of element.
Embodiment
Fig. 1 is the stereogram of one for schematically showing the appearance inspection device possessed inspection head of the present invention.Fig. 2
It is the top view of one of the inspection head for schematically showing Fig. 1.In two figures and following figure, appropriately represent mutually orthogonal
Horizontal direction X, horizontal direction Y and vertical Z.The surface 10a for the substrate 10 that the inspection first 3 keeps level is set to inspection pair
As irradiating the light of (projection) predetermined pattern to the surface 10a of the substrate 10 in examination scope F3 and shooting.
As shown in both figures, check that first 3 have：The centrally located straight-on camera in the top view from vertical Z
31a；And centered on straight-on camera 31a optical axis Aa in concentric circles arranged at equal intervals 4 inclined camera 31b~31e.
In addition, in two figures, mutually different reference 31a~31e is marked to 5 cameras, below, is not differentiating between each camera
In the case of suitably use general reference 31.As camera 31a~31e, such as CCD (Charge can be used
Coupled Device：Charge coupled cell) camera.5 camera 31a~31e are with the inspection model on the surface 10a with substrate 10
Enclose the opposite modes of F3 to configure, examination scope F3 can be accommodated in each visual field.In other words, 5 camera 31a~31e
The visual field mutually repeats in the examination scope F3 on the surface 10a of substrate 10.
Straight-on camera 31a is configured in a manner of its optical axis Aa is parallel with vertical Z, from top face examination scope F3.
Therefore, the surface 10a angulations of straight-on camera 31a optical axis Aa and substrate 10 are 90 degree.Straight-on camera 31a has telecentricity
Camera lens, the surface 10a of the substrate 10 in examination scope F3 is shot via the telecentric lens.
Inclined camera 31b~31e by respective optical axis Ab~Ae relative to vertical Z it is inclined in a manner of configure, from oblique
Top and examination scope F3 are opposite.Inclined camera 31b~31e optical axis Ab~Ae and the surface 10a angulations of substrate 10
(elevation angle) is equal to each other, and turns into the acute angle less than 90 degree.On the other hand, in the top view from vertical Z, 4 are inclined
Monoclinic phase machine 31b~31e every 90 degree of optical axis Ab~Ae is different.That is, in Fig. 2 top view, if with reference axis X (horizontal directions
X angle (azimuth)) is defined counterclockwise for start line, then inclined camera 31b optical axis Ab angle turns into 45 degree, inclines
Monoclinic phase machine 31c optical axis Ac angle turns into 135 degree, and inclined camera 31d optical axis Ad angle turns into 225 degree, inclined camera
31e optical axis Ae angle turns into 315 degree.
Moreover, check first 3 have centered on straight-on camera 31a optical axis Aa in concentric circles arranged at equal intervals 4
Platform projector 32b~32e (projecting apparatus).In addition, in two figures, 4 projectors are marked mutually different reference 32b~
32e, below, in the case where not differentiating between each projector, suitably using general reference 32.Projector 32b~32e's
Light intensity distributions are irradiated in examination scope F3 by each projector in the light (pattern light) of the striped design of sinusoidal wave shape change.
The striped of composition pattern light is in the top view from vertical Z parallel to respective with 4 inclined camera 31b~32e
Optical axis Ab~Ae is with the direction of 45 degree of intersections.
Projector 32b~32e has LED (Light Emitting Diode respectively：Light emitting diode) etc. light source and to
Examination scope F3 reflects the digital micromirror device of the light from light source.Moreover, by adjusting digital micromirror device
The angle of each micro-reflector, can be by the pattern light irradiation of phase 4 types different from each other in examination scope F3.That is, examine
First 3 are looked into by making the phase place change from the pattern light of projector 32b~32e irradiations while being carried out by camera 31a~31e
Shooting, the 3D shape in examination scope F3 can be measured by phase shift method.
4 projector 32b~32e by respective optical axis Bb~Be relative to vertical Z it is inclined in a manner of configure, from oblique
Top and examination scope F3 are opposite, and the examination scope F3 on the surface 10a of substrate 10 can be accommodated in the irradiation model of each light
In enclosing.In other words, examination scope of the range of exposures of 4 projector 32b~32e pattern light on the surface 10a of substrate 10
Mutually repeated in F3.
Projector 32b~32e optical axis Bb~Be and substrate 10 surface 10a angulations (elevation angle) are equal to each other,
As the acute angle less than 90 degree.On the other hand, in the top view from vertical Z, 4 projector 32b~32e light
Every 90 degree of axle Bb~Be is different.That is, if with reference axis X (horizontal direction X) it is start line to side counterclockwise in Fig. 2 top view
To angle (azimuth) is defined, then projector 32b optical axis Bb angle turns into 0 degree, projector 32c optical axis Bc angle into
For 90 degree, projector 32d optical axis Bd angle turns into 180 degree, and projector 32e optical axis Be angle turns into 270 degree.This
Sample, projector 32b~32e is configured between inclined camera 31b~32e adjacent in a circumferential direction.
Fig. 3 is the block diagram of the schematically appearance inspection device of the example present invention.The appearance inspection device 1 is filled by controlling
Put 100 control conveyer belts 2, check first 3 and drive mechanism 4, by obtaining the measurement region set to substrate 10 (printed base plate)
3D shape, check substrate 10 outward appearance.
Conveyer belt 2 is along predetermined transport path conveying substrate 10.Specifically, conveyer belt 2 send the substrate 10 before inspection
Enter to the inspection position in appearance inspection device 1, the level of substrate 10 is maintained at and checks position.Thus, flat substrate 10
Surface 10a it is horizontal keep, the surface 10a of substrate 10 normal direction is consistent with vertical Z.In addition, finishing to inspection
During the inspection for the substrate 10 looked into position, the substrate 10 after inspection is output to outside appearance inspection device 1 by conveyer belt 2.
Check that first 3 is opposite from vertical Z upside relative to the surface 10a of the substrate 10 kept by conveyer belt 2.As above
State like that, check the examination scope F3 irradiation patterns light on the first 3 surface 10a from projector 32b~32e to substrate 10, and lead to
Cross camera 31a~31e shooting examination scopes F3.The supporting of drive mechanism 4 check first 3 and by motor to horizontal direction X, Y and
Vertical Z drivings check first 3.By the driving of the drive mechanism 4, the first 3 surface 10a that can will be set in substrate 10 are checked
On measurement region be accommodated in examination scope F3.
Control device 100 has by CPU (Central Processing Unit：Central processing unit) and memory composition
Master control part 110, master control part 110 performs inspection by the control in each portion of centralised arrangement.In addition, control device 100 has
There is the user interface 200 being made up of input-output equipment such as display, keyboard and mouses, user can be via user interface 200
To the input instruction of control device 100, or confirm the inspection result of control device 100.Moreover, control device 100 has control
Projector 32b~32e irradiation control unit 120, control camera 31a~31e shooting control part 130, control drive mechanism 4
The storage part 150 of drive control part 140, data storage etc. and the image processing part 160 for performing image procossing.
Moreover, control device 100 performs using the shooting action for checking first 3 shooting measurement region and to passing through shooting action
The shooting image of acquisition implements the image procossing of calculation process, and substrate 10 is checked.Next, example measurement is in substrate 10
Surface 10a on install electronic component solder shape and the whether good feelings of shape that result checks solder are measured based on it
Condition, it is specifically described.
The flow chart of one of the image taking that Fig. 4 has been expressed as inspecting substrate and performed.Fig. 4 flow chart is according to master
The control of control unit 110 performs.In step S101, master control part 110 based on the component data De for being stored in storage part 150,
Determine measurement region R (I) (Fig. 5).That is, component data De represents position and the shape of the element on the surface 10a of substrate 10.Cause
This, master control part 110 obtains the position of the solder of installation elements on the surface 10a of substrate 10 according to component data De, with bag
Mode containing the solder sets measurement region.In addition, multiple element is mounted with the surface 10a of substrate 10, provided with multiple welderings
The installation position (weld pad) of material.Correspondingly, multiple measurement region R (I) are also set with.
Next, reset to zero using for identifying as the measurement region R (I) of the object of shooting action identiflication number I
(step S102), identiflication number I is set to add " 1 " (step S103).Moreover, if identiflication number I is below maximum Imax (steps
It is "No" in S104), then the position of inspection first 3 is adjusted by drive mechanism 4 by drive control part 140, makes inspection first 3 and I
Individual measurement region R (I) is opposite.Here, maximum Imax is the measurement region R (I) determined in step S101 number.Thus,
I-th measurement region R (I) is included in the examination scope F3 for checking first 3.In step s 106, master control part 110 judges I
The direction of individual measurement region R (I).
Fig. 5 is the top view for the direction for schematically illustrating measurement region.In the figure, by taking rectangular dies element 8 as an example
Enumerated, representing the configuration of chip component 8 configuration pattern 1 parallel with horizontal direction X direction E and horizontal direction X respectively just
The configuration pattern 2 of friendship and from horizontal direction the configuration pattern 3 of 45 degree of X inclinations.Here, the configuration direction E of chip component 8 be from
The length direction of chip component 8 in the top view of vertical Z observations, in the example of fig. 5, is located at the two of chip component 8
The terminal 81,82 at end is consistent on the direction of arrangement.As shown in figure 5, the first side E1 of the configuration direction E in chip component 8, leads to
The pad 11 that terminal 81 is installed on the surface 10a for being located at substrate 10 by solder 91 is crossed, in the configuration direction E of chip component 8
Second side E2 (the first side E1 opposite side), pass through the installation end of solder 92 on the weld pad 12 on the surface 10a located at substrate 10
Son 82.
Moreover, in Fig. 4 step S106, master control part 110 will set the oblique of measurement region R (I) solder 91,92
The direction (in other words, the direction of the normal on the inclined-plane) in face is judged as measurement region R (I) direction.Specifically, really
The terminal 81,82 for recognizing attachment as the solder 91,92 of measurement region R (I) setting object is located at the first side on chip component 8
E1 and the second side E2 which end.If moreover, confirm, positioned at the first side E1 end, to be determined as measurement region R (I) direction
Direction E the first side E1 is configured, if confirming positioned at the second side E2 end, is determined as measurement region R (I) towards configuration side
To E the second side E2.
Such as represented with Fig. 5 concrete example, then " configuration pattern 1 " example in, be determined as measurement region R (I) towards with
Configuration direction E parallel horizontal direction X the first side E1." in the example of configuration pattern 2 ", it is being determined as measurement region R (I) court
To the configuration direction E orthogonal with horizontal direction X the first side E1.Or " in the example of configuration pattern 3 ", it is being judged to measuring
Region R (I) has tilted 45 degree of configuration direction E the first side E1 towards X from horizontal direction.
In step s 107, master control part 110 is based on the result of determination of measurement region R (I) direction, from projector 32b
The projector 32 of the shooting for measurement region R (I) is selected in~32e.Specifically, selection meets from measurement region R (I)
The projector 32 of one lateral measurement region R (I) irradiation patterns light this irradiation condition of institute's direction.
Therefore, in the case where measurement region R (I) is towards configuration direction E the first side E1, select from the first side E1 to meter
Survey the projector 32 of region R (I) irradiation patterns light.Here, in the side view from the direction orthogonal with configuration direction E
(in other words, configuration direction E on), from measurement region R (I) the first side E1 to the whole of measurement region R (I) irradiation patterns light
Projector 32 corresponds to from the first side E1 to the projector 32 of measurement region R (I) irradiation patterns light.
Such as represented with Fig. 5 concrete example, then " in the example of configuration pattern 1 ", in the configuration side parallel with horizontal direction X
To on E, 1 projector 32d (Fig. 2) of the first side E1 irradiation lights of measurement region R (I) out of examination scope F3 is selected.
" in the example of configuration pattern 2 ", on the configuration direction E orthogonal with horizontal direction X, select the measurement area out of examination scope F3
1 projector 32c of domain R (I) the first side E1 irradiation lights.Or " in the example of configuration pattern 3 ", in X from horizontal direction
Tilt on 45 degree of configuration direction E, select 2 of the first side E1 irradiation lights of the measurement region R (I) out of examination scope F3 to throw
Shadow machine 32c, 32d.In addition, here, example measurement region R (I) towards configuration direction E the first side E1 situation are said
Bright, measurement region R (I) direction configurations direction E the second side E2 situation is similarly.
Next, the identiflication number P of the projector 32 selected in identification step S107 is reset into zero (step S108), make
Identiflication number P adds " 1 " (step S109).Moreover, if identiflication number P is below maximum Pmax (being "No" in step S110),
Perform the step of obtaining to carry out measuring required shooting image to measurement region R (I) 3D shape by phase shift method
S111~S114.Here, maximum Pmax is the number of the projector 32 selected in step S107.
That is, be stored with storage part 150 the pattern light for representing above-mentioned 4 types pattern data Dp (S) (S=1,
2、3、4).Moreover, irradiation control unit 120 based on the pattern data Dp (S) read from storage part 150 to projector 32 by being carried out
Control, measurement region R that can be from projector 32 by the pattern light irradiation represented by pattern data Dp (S) in examination scope F3
(I) in.
Therefore, the identiflication number S of identification icon light is reset into zero (step S111), identiflication number S is added " 1 " (step
S112).Moreover, if identiflication number S is maximum Smax (=4) (being "No" in step S113) below, make 5 camera 31a
Measurement region R (I) in~31e shooting examination scopes F3, obtains the respective shooting image (steps of 5 camera 31a~31e
S114).In addition, only lighting P this 1 projectors 32 and extinguishing the state of other projectors 32, make 5 camera 31a~31e
Expose simultaneously (that is, make 5 camera 31a~31e time for exposure identical), to perform measurement region R (I) shooting.Moreover, weight
Step S112~S114 is performed again until identiflication number S exceedes maximum Smax (being "Yes" in step S113).Thus, while making
Identiflication number S adds " 1 " and changes the phase for the pattern light for being irradiated to measurement region R (I), while obtaining 5 camera 31a~31e
Measurement region R (I) shooting image (step S114).
So, obtain the irradiation light of projector 32 from identiflication number P and shoot measurement region R respectively with camera 31a~31e
(I) 4 are 1 group of shooting image obtained from.Therefore, the projector 32 of irradiation light is carried out when master control part 110 is by shooting
The identiflication number C that the identiflication number P of identification and camera 31a~31e to being shot are identified is associated, and will measure area
Domain R (I) shooting image Ds (I, P, C) is stored in storage part 150.
Moreover, step S109~S114 is repeated until identiflication number P (is in step S110 more than maximum Pmax
"Yes").Thereby, it is possible to measurement region R (I) shooting image Ds is obtained using the whole projectors 32 selected in step S107
(I、P、C).Step S103~S114 is repeated until identiflication number I exceedes maximum Imax (being "Yes" in step S104).
Thereby, it is possible to obtain shooting image Ds (I, P, C) to the whole measurement region R (I) determined in step S101.So, terminating
During Fig. 4 shooting action, the image procossing for implementing calculation process to the shooting image obtained by shooting action is performed.
The flow chart of one of the image procossing that Fig. 6 has been expressed as inspecting substrate and performed.According to master control part 110
Control performs Fig. 6 flow chart.First, using the identiflication number of the measurement region R (I) for identifying the object as image procossing
I resets to zero (step S201), identiflication number I is added " 1 " (step S202).If moreover, identiflication number I be maximum Imax with
Under (being "No" in step S203), then using Fig. 5, use the method in above-mentioned step S106, master control part 110 judges I
The direction (step S204) of individual measurement region R (I).
In step S205, master control part 110 is based on the result of determination of measurement region R (I) direction, and selection uses measurement
In region R (I) shooting image Ds (I, P, C) by which inclined camera 31b~31e shooting shooting image Ds (I, P,
C).Specifically, selection meets to shoot the measurement region R (I) this shooting condition from the side of measurement region R (I) institute direction
Inclined camera 31 shooting image Ds (I, P, C).
Therefore, in the case where measurement region R (I) is towards configuration direction E the first side E1, select to shoot from the first side E1
The shooting image Ds (I, P, C) of measurement region R (I) inclined camera 31.Here, seen from the direction orthogonal with configuration direction E
In the side view examined (in other words, on configuration direction E), shoot measurement region R's (I) from measurement region R (I) the first side E1
Whole inclined cameras 31 correspond to the inclined camera 31 from the first side E1 shooting measurement region R (I).
Such as represented with Fig. 5 concrete example, then " in the example of configuration pattern 1 ", in the configuration side parallel with horizontal direction X
To on E, 2 inclined cameras 31c, 31d selecting the first side E1 of the measurement region R (I) out of examination scope F3 to be shot
Each captured shooting image Ds (I, P, C)." in the example of configuration pattern 2 ", in the configuration side orthogonal with horizontal direction X
To on E, 2 inclined cameras 31b, 31c selecting the first side E1 of the measurement region R (I) out of examination scope F3 to be shot
Each captured shooting image Ds (I, P, C).Or " in the example of configuration pattern 3 ", 45 are being tilted in X from horizontal direction
On the configuration direction E of degree, 1 inclination phase selecting the first side E1 of the measurement region R (I) out of examination scope F3 to be shot
Machine 31c.In addition, here, example measurement region R (I) towards configuration direction E the first side E1 situation are illustrated, measure
Region R (I) direction configurations direction E the second side E2 situation is similarly.
In step S206, image processing part 160 uses the inclined camera 31 and straight-on camera 31 selected in step S205
Each camera shooting image Ds (I, P, C), calculate measurement region R (I) 3D shape Dt (I).Specifically, such as such as
It is lower such, obtain 3D shape Dt (I).
First, the measurement region R (I) of selected inclined camera 31 shooting image Ds (I, P, C) is converted into face
The coordinate system of camera 31.Moreover, corresponding each pixel calculate the inclined camera 31 after Coordinate Conversion shooting image Ds (I, P,
C the average value of pixel value) and the shooting image Ds (I, P, C) of straight-on camera 31 pixel value.In addition, for being used during shooting
The mutually the same shooting image Ds (I, P, C) of phase of pattern light of projector 32 perform the calculating of average value.Accordingly, for
The pattern light of phase 4 types different from each other, can obtain with average pixel value average shooting image Ds (I, P,
C).Therefore, image processing part 160 calculates measurement region R using phase shift method according to these shooting image Ds (I, P, C) that are averaged
(I) 3D shape Dt (I).
In step S207, image processing part 160 judges measurement region R (I) based on the 3D shape Dt (I) calculated
Solder 91,92 shape it is whether good.Moreover, step S202~S207 is repeated, until identiflication number I exceedes maximum
Imax (being "Yes" in step S203).Thus, on the whole measurement region R (I) determined in step S101,3D shape is obtained
Dt (I), perform whether good judgement.
As described above, present embodiment possessed inclined camera 31b~31e relative to substrate 10 surface
10a normal direction (vertical Z) obliquely configures, suitable for catch be present on the surface 10a of substrate 10 solder 91,
92 side (Fig. 7).Here, Fig. 7 is the figure for schematically illustrating advantage possessed by inclined camera.That is, with from substrate 10
The arrow V1 that surface 10a normal direction (vertical Z) catches the side 91a of solder 91 is compared, from relative to substrate 10
Side (in other words, side 91a normal direction institute direction of the surface 10a normal direction to the side 91a institutes direction of solder 91
Side) inclined direction catches side 91a arrow V2 can more catch the side 91a of solder 91 exactly from front.Moreover,
In the present embodiment, based on obtained from the measurement region R (I) set as inclined camera 31b~31e shootings to substrate 10
Measurement region R (I), measurement region R (I) 3D shape Dt (I) is measured.Therefore, even if measurement region R (I) is with bag
In the case that the mode of side 91a, 92a containing the solder 91,92 being present on substrate 10 are set, weldering can be also measured exactly
Side 91a, 92a of material 91,92 3D shape Dt (I).
In addition, this inclined camera 31b~31e also has, suitable for suppressing the surface 10a of substrate 10 mirage phantom, this is another
Advantage.Fig. 8 is the figure for schematically illustrating another advantage possessed by inclined camera.As shown in Fig. 8 " having mirage phantom " one column,
In the case of the arrow V1 for the side 91a for catching solder 91 from the surface 10a of substrate 10 normal direction (vertical Z), by
The light of the surface 10a reflections of substrate 10 is reflected and incides camera 31 again by the side 91a of solder 91.Therefore, substrate 10 is anti-
The face 10b of penetrating may produce mirage phantom in the side 91a of solder 91 shooting image.On the other hand, such as Fig. 8 " no mirage phantom " one
It is inclined in the side of the normal direction from the surface 10a relative to substrate 10 to the side 91a institutes direction of solder 91 shown in column
In the case that direction catches side 91a arrow V2, it can suppress to produce such mirage phantom.
Moreover, it is provided with multiple inclined camera 31b~31e.Therefore, it is possible to pass through inclined camera 31b~31e from multiple directions
Shoot measurement region R (I), side 91a, 92a of the solder 91,92 being present in measuring exactly on the surface 10a of substrate 10
3D shape Dt (I) it is favourable.
In addition, the multiple inclined camera 31b of set direction based on inclined camera 31b~31e shooting measurement region R (I)~
The shooting image of the measurement of the 3D shape Dt (I) for measurement region R (I) in the respective shooting image Ds (I, P, C) of 31e
Ds (I, P, C) (step S204, S205).Thereby, it is possible to shoot meter using from the suitable shooting direction in multiple shooting direction
Shooting image Ds (I, P, C) obtained from surveying region R (I) measures to measurement region R (I) 3D shape Dt (I).Cause
This, side 91a, 92a of the solder 91,92 being present in measuring exactly on the surface 10a of substrate 10 3D shape Dt (I)
Favorably.
Specifically, as shown in step S204, S205 described above, obtain and represent to install by solder 91,92
The position of chip component 8 on the surface 10a of substrate 10 and the component data De of profile, and set according to component data De
The shooting condition required in shooting measurement region R (I) inclined camera 31b~31e shooting direction.Moreover, will be from satisfaction
The shooting image Ds (I, P, C) of the direction shooting measurement region R (I) of shooting condition inclined camera 31 is used for measurement region R
(I) 3D shape Dt (I) measurement.In the structure shown here, it can use and be clapped from the shooting direction selected based on component data De
Shooting image Ds (I, P, C) obtained from taking the photograph measurement region R (I) measures to measurement region R (I) 3D shape Dt (I).
Therefore, side 91a, 92a of the solder 91,92 being present in measuring exactly on the surface 10a of substrate 10 3D shape Dt
(I) it is favourable.
Particularly, in the present embodiment, to side 91a, 92a setting measurement region R (I) of solder 91,92.Moreover,
Based on the position that solder 91,92 and the chip component 8 by the solder 91,92 installation on the substrate 10 are judged according to component data De
The result obtained by relation is put, sets shooting condition.In the structure shown here, it can use and solder is based on from from multiple shooting direction
91st, shooting image Ds obtained from the 92 shooting direction shooting measurement region R (I) selected with the position relationship of chip component 8 (I,
P, C) measurement region R (I) 3D shape Dt (I) is measured.Therefore, the surface of substrate 10 is present in measuring exactly
Side 91a, 92a of solder 91,92 on 10a 3D shape Dt (I) are favourable.
Specifically, the solder 91 (solder 92) of the setting object as measurement region R (I) is judged based on component data De
Which of chip component 8 accompanying terminal 81 (terminal 82) be on the configuration direction E parallel with the surface 10a of substrate 10
The end (step S204) of side.It is determined as chip component 8 of the terminal 81 (terminal 82) on configuration direction E moreover, working as
During the first side E1 (the second side E2) end, the first side E1 (the second side E2) from measurement region R (I) configuration direction E is set
Shoot measurement region R (I) this shooting condition.Thereby, it is possible to measure terminal 81 (terminal 82) peace of chip component 8 exactly
The 3D shape Dt (I) of side 91a (side 91b) loaded on the solder 91 (solder 92) on substrate 10.
But can exist in step S205 judgement and meet to shoot the measurement area according to measurement region R (I) direction
2 inclined cameras 31 of shooting condition during domain R (I).That is, exist in terms of being clipped on the direction V orthogonal with configuration direction E
In the case of 2 inclined cameras 31 that survey region R (I) mode configures, 2 inclined cameras 31 meet shooting condition.Such as with
Above-mentioned Fig. 5 concrete example represents, then " in the example of configuration pattern 1 ", 2 inclined cameras 31c, 31d meet shooting condition,
" configuration pattern 2 " example in, 2 inclined cameras 31b, 31c meet shooting condition.In this case, measurement region R (I)
3D shape Dt (I) can use the respective shooting image Ds (I, P, C) of 2 inclined cameras 31 to the three of measurement region R (I)
Dimension shape Dt (I) is measured.
That is, the respective shooting image Ds (I, P, C) of 2 inclined cameras 31 is converted to the coordinate system of straight-on camera 31.And
And corresponding each pixel calculates shooting image Ds (I, P, C) after the Coordinate Conversion of an inclined camera 31, other cameras 31
The average value of the shooting image Ds (I, P, C) of shooting image Ds (I, P, C) and straight-on camera 31 after Coordinate Conversion pixel value.
The shooting image Ds (I, P, C) that the phase of the pattern light of projector 32 when now, to for shooting is mutually the same is performed averagely
The calculating of value.Being averaged with average pixel value can be obtained accordingly, for the pattern light of phase 4 types different from each other
Shooting image Ds (I, P, C).Therefore, it is possible to which using phase shift method, measurement is calculated according to these shooting image Ds (I, P, C) that are averaged
Region R (I) 3D shape Dt (I).
Moreover, making the 31 respective time for exposure of this 2 inclined cameras mutually repeat, shooting is performed.Thereby, it is possible to shorten 2
Time required for the shooting of platform inclined camera 31, it can effectively carry out 3D shape Dt (I) measurement.
By the way, in inclined camera 31, incident may be projected from projector 32 and by substrate 10 surface 10a just
The light of reflection.Such normal reflection light turns into the reason for halation in the shooting image Ds (I, P, C) of inclined camera 31.Therefore,
Can also by the respective shooting image Ds (I, P, C) of 2 inclined cameras 31 it is complementary be used for measurement region R (I) three-dimensional shaped
Shape Dt (I) calculating.That is, the pixel value example of the part of halation is caused in the shooting image Ds (I, P, C) of an inclined camera 31
Such as handled as null value (null) rather than above-mentioned average calculating operation.Moreover, being directed to the part, incline using only other
The shooting image Ds (I, P, C) of monoclinic phase machine 31 pixel value.Thus, to suppressing the influence of halation and measuring exactly to be present in base
Side 91a, 92a of solder 91,92 on the surface 10a of plate 10 3D shape Dt (I) are favourable.
In addition, normal direction (vertical of the projector 32 relative to the surface 10a for the substrate 10 for being held in conveyer belt 2
Z) obliquely configure.In the structure shown here, the inclined projector 32 of normal direction of the surface 10a relative to substrate 10, energy are passed through
Reach side 91a, 92a irradiation patterns light to being present in the solder 91,92 on the surface 10a of substrate 10.Therefore, to counting exactly
The 3D shape Dt (I) for surveying side 91a, the 92a for the solder 91,92 being present on the surface 10a of substrate 10 is favourable.
Moreover, it is provided with multiple projector 32b~32e.Come from therefore, it is possible to be irradiated from multiple directions to measurement region R (I)
The pattern light for the projector 32b~32e being arranged obliquely, the solder 91 being present in measuring exactly on the surface 10a of substrate 10,
92 side 91a, 92a 3D shape Dt (I) are favourable.
In addition, based on projector 32 to the direction of illumination of measurement region R (I) irradiation patterns light from multiple projector 32b~
The projector 32 (step S106, S107) of the shooting for measurement region R (I) is selected in 32e.Thereby, it is possible to use from multiple
Suitable direction of illumination irradiation patterns light in direction of illumination and shooting image Ds obtained from shooting measurement region R (I) (I, P,
C) measurement region R (I) 3D shape Dt (I) is measured.Therefore, the surface of substrate 10 is present in measuring exactly
Side 91a, 92a of solder 91,92 on 10a 3D shape Dt (I) are favourable.
Specifically, as shown in above-mentioned step S106, S107, obtain and represent to be arranged on substrate 10 by solder 91,92
Surface 10a on the position of chip component 8 and the component data De of profile, and be set according to component data De to measurement
The irradiation condition required on the direction of illumination of the pattern light of the projector 32 of region R (I) irradiation patterns light.Moreover, make from satisfaction
The bright light of projector 32 from the direction of the irradiation condition to measurement region R (I) irradiation patterns light and shoot measurement region R (I).At this
In structure, it can be obtained from the direction of illumination irradiation patterns light selected based on component data De and using shooting measurement region R (I)
To shooting image Ds (I, P, C) measurement region R (I) 3D shape Dt (I) is measured.Therefore, to measuring exactly
Side 91a, 92a of the solder 91,92 being present on the surface 10a of substrate 10 3D shape Dt (I) are favourable.
Particularly, in the present embodiment, to side 91a, 92a setting measurement region R (I) of solder 91,92.Moreover,
Based on the position that solder 91,92 and the chip component 8 by the solder 91,92 installation on the substrate 10 are judged according to component data De
The result obtained by relation is put, sets irradiation condition.In the structure shown here, can use from multiple direction of illuminations based on solder
91st, the 92 direction of illumination irradiation lights selected with the position relationship of chip component 8 and shooting obtained from measurement region R (I) is shot
Image Ds (I, P, C) measures to measurement region R (I) 3D shape Dt (I).Therefore, it is present in base to measuring exactly
Side 91a, 92a of solder 91,92 on the surface 10a of plate 10 3D shape Dt (I) are favourable.
Specifically, the solder 91 (solder 92) of the setting object as measurement region R (I) is judged based on component data De
Which of chip component 8 accompanying terminal 81 (terminal 82) be on the configuration direction E parallel with the surface 10a of substrate 10
The end (step S106) of side.It is judged as chip component 8 of the terminal 81 (terminal 82) on configuration direction E moreover, working as
During the first side E1 (the second side E2) end, the first side E1 (the second side E2) from measurement region R (I) configuration direction E is set
To this irradiation condition of measurement region R (I) irradiation patterns light.Thereby, it is possible to measure the terminal 81 of chip component 8 exactly
The side 91a (side 91b) of the solder 91 (solder 92) of (terminal 82) installation on the substrate 10 3D shape Dt (I).
But in step S107 judgement, can exist and meet according to measurement region R (I) direction to the measurement area
2 projectors 32 of irradiation condition during domain R (I) irradiation patterns light.That is, exist with the direction V orthogonal with configuration direction E
On clip 2 projectors 32 that measurement region R (I) mode configures in the case of, 2 projectors 32 meet irradiation condition.
As shown in above-mentioned Fig. 5 concrete example, " configuration pattern 3 " example in, 2 projectors 32c, 32d meet irradiation condition.At this
In the case of, measurement region R (I) 3D shape Dt (I) can make 2 projectors 32 bright light and the bat that photographs in order
Image Ds (I, P, C) is taken the photograph to measure measurement region R (I) 3D shape Dt (I).
That is, corresponding each pixel, which calculates, sends as an envoy to the bright light of a projector 32 and the shooting image Ds (I, P, C) that photographs and makes
Other bright lights of projector 32 and the average value of shooting image Ds (I, P, C) pixel value photographed.In addition, during to for shooting
The mutually the same shooting image Ds (I, P, C) of phase of pattern light of projector 32 perform the calculating of average value.So, for
The pattern light of phase 4 types different from each other can obtain the average shooting image Ds (I, P, C) with average pixel value.
Therefore, it is possible to using phase shift method, calculate measurement region R (I) 3D shape according to these shooting image Ds (I, P, C) that are averaged
Dt(I)。
In addition, the structure can also apply to suppress the influence of above-mentioned halation.That is, a projector 32 shooting is being used
Cause the pixel value of the part of halation such as being handled as null value rather than above-mentioned in shooting image Ds (I, P, C)
Average calculating operation.Moreover, for the part, using only the pixel of the shooting image Ds (I, P, C) using the shooting of other projectors 32
Value.Thus, to suppressing the influence of halation and measuring the side for the solder 91,92 being present on the surface 10a of substrate 10 exactly
91a, 92a 3D shape Dt (I) are favourable.
In addition, 4 inclined camera 31b~31e centered on the surface 10a of substrate 10 normal with 90 degree of spaced circumferential
Arrange shape.In addition, the pattern light that is made up of following striped of the measurement region R (I) of projector 32 irradiations, the striped is from substrate 10
Surface 10a normal direction (vertical Z) observation top view in parallel to respective with 4 inclined camera 31b~31e
Optical axis Ab~Ae is with the direction of 45 degree of intersections.Moreover, based on to measurement region R (I) irradiation patterns light and making 4 from projector 32
Inclined camera 31b~31e time for exposure mutually repeats and shoots measurement region R (I) result, using phase shift method to measuring area
Domain R (I) 3D shape Dt (I) is measured.Thereby, it is possible to the measurement for the 3D shape Dt (I) for realizing measurement region R (I)
The shortening of time required for required shooting image Ds (I, P, C) shooting, it can effectively carry out 3D shape Dt's (I)
Measurement.
In addition, straight-on camera 31a and inclined camera 31b~31e is provided with, and it is right using each shooting image Ds (I, P, C)
Measurement region R (I) 3D shape Dt (I) is measured.Thereby, it is possible to carry out the measurement of higher precision.
So, in the present embodiment, appearance inspection device 1 is equivalent to one of " appearance inspection device " of the present invention,
Conveyer belt 2 is equivalent to one of " board holder " of the present invention, and projector 32b~32e is each equivalent to the " projection of the present invention
One of machine ", for inclined camera 31b~31e each equivalent to one of " inclined camera " of the invention, straight-on camera 31a is suitable
In one of " straight-on camera " of the present invention, control device 100 is equivalent to one of " control unit " of the present invention, measurement region R
(I) equivalent to one of " measurement region " of the invention, component data De is equivalent to one of " component data " of the present invention, core
Piece element 8 is equivalent to one of " element " or " chip component " of the present invention, " terminal " of the terminal 81,82 equivalent to the present invention
One, solder 91,92 is equivalent to one of " solder " of the present invention, " specific directions " of the configuration direction E equivalent to the present invention
One.
Additionally, this invention is not limited to above-mentioned embodiment, without departing from its purport, it becomes possible to which above-mentioned embodiment is applied
Add various changes.For example, measurement region R (I) three-dimensional shaped is calculated according to measurement region R (I) shooting image Ds (I, P, C)
Shape Dt (I) specific method is not limited to above-mentioned example, can rightly use existing method.
In addition, in the case of 2 inclined cameras 31 for meeting shooting condition in step S205 judgement being present, this is used
The shooting image Ds (I, P, C) of 2 inclined cameras, 31 liang of sides has calculated measurement region R (I) 3D shape Dt (I).But
The shooting image Ds (I, P, C) of 1 inclined camera 31 selected from 2 inclined cameras 31 can also be used to calculate measurement region
R (I) 3D shape Dt (I).
In addition, in the case of existing in step S107 judgement and meeting 2 projectors 32 of irradiation condition, using making this
2 projectors 32 bright light and the shooting image Ds (I, P, C) that photographs respectively, have calculated measurement region R (I) 3D shape
Dt(I).But it is also possible to photographed using 1 bright light of projector 32 for making to select from 2 projectors 32 Ds (I, P,
C), measurement region R (I) 3D shape Dt (I) is calculated.
In addition, the situation of the appearance inspection device 1 to the present invention to be applied to possess straight-on camera 31a is illustrated.
But the present invention can also be applied in the appearance inspection device 1 to not possessing straight-on camera 31a.
In addition, in the shooting of pattern in step S114, no matter how measurement region R (I) direction can make entirely
Portion's inclined camera 31b~31e bright lights.But for measurement region R (I) 3D shape Dt (I) calculating be only to measurement
Region R (I) meets the shooting image Ds (I, P, C) of predetermined position relationship, the i.e. inclined camera 31 of shooting condition.Therefore, base
The result of determination of the direction of measurement region R (I) in step S106, it is determined that meeting the inclined camera 31 of shooting condition, in step
In rapid S114, only the inclined camera 31 so determined can also be used to shoot.
Alternatively, it is also possible to be configured in examination scope F3 comprising multiple measurement region R (I) and measure each measurement region R
(I) 3D shape Dt (I).Shooting condition also is obtained to each measurement region R (I) in the structure shown here, using meeting the shooting bar
The shooting image Ds (I, P, C) of the inclined camera 31 of part calculates the 3D shape Dt (I) of each measurement region R (I).
Moreover, in the structure shown here, the time for exposure of the inclined camera 31 of more than 2 can also be made mutually to repeat and make this 2
Inclined camera 31 more than platform performs shooting.In this case, the shooting image Ds from the inclined camera of more than 2 31 is passed through
The shooting image Ds (I, P, C), Neng Goutong of the calculating of the 3D shape Dt (I) for measurement region R (I) are selected in (I, P, C)
Cross appropriate shooting image Ds (I, P, C) and calculate 3D shape Dt (I).Furthermore, it is also possible to realize the three of measurement region R (I)
The shortening of time needed for the shooting of shooting image Ds (I, P, C) required for dimension shape Dt (I) calculating, can effectively enter
Row 3D shape Dt (I) measurement.
3D shape Dt (I) alternatively, it is also possible to be configured to measure is held in storage part 150 as point group data.
Implement to change the 3D shape Dt's (I) for showing out measurement region R (I) on the picture of user interface 200 thereby, it is possible to one side
The image procossing of people as sight, while performing the inspection of substrate 10 by user.
In addition, illustrate the feelings of the inspection for the solder 91,92 for applying the present invention to make chip component 8 be engaged with substrate 10
Condition.But it is also possible to apply the present invention to by with the different types of element (such as lead elements and production method thereof) of chip component 8 and substrate 10
The inspection of the solder 91,92 of connection.
Furthermore, it is understood that it is preferred that apply the present invention to the inspection of the substrate 10 to being mixed with diversified element.Fig. 9
It is the figure for schematically showing the situation checked the substrate for being mixed with different types of element.In the example of figure 9, exist
In top view from vertical Z, element 8A is blocked by element 8B.Therefore, can not only be checked by straight-on camera 31a
To element 8A installment state.On the other hand, in the structure shown in above-mentioned embodiment, by using in Fig. 9 from dot-dash
The capturing element 8A of inclined camera 31 that the direction that line arrow represents is shot, also check that element 8A installment state.
In addition, in above-mentioned, mainly the situation of the shape to checking solder is illustrated.But the object of inspection is not
It is limited to solder, the various objects being present on the surface 10a of substrate 10 can also turn into the object checked.
More than, as being illustrated example specific embodiment, it can also for example form as follows in the present invention
Appearance inspection device：At least 2 inclined cameras are in the top view from the normal to a surface direction from substrate towards mutual not phase
Same direction and the respective visual field mutually repeats in the examination scope on the surface of substrate, and control unit regards multiple inclined cameras
Setting measurement region in the examination scope that open country repeats.The structure can be carried out from multiple directions by inclined camera to measurement region
Shooting, it is favourable to measuring the 3D shape of side for the object being present on the surface of substrate exactly.
Alternatively, it is also possible to form appearance inspection device as follows：Control unit is based on inclined camera shooting measurement area
The shooting of the measurement of the 3D shape for measurement region in the respective shooting image of the multiple inclined cameras of set direction in domain
Image.Thereby, it is possible to use shooting figure obtained from shooting measurement region from the suitable shooting direction in multiple shooting direction
As being measured to the 3D shape of measurement region.Therefore, to measuring the side of the object being present on the surface of substrate exactly
The 3D shape in face is favourable.
Specifically, appearance inspection device can also be formed as follows：Control unit, which obtains, to be represented to pacify by solder
The position of element on a surface of a substrate and the component data of profile are filled, shooting measurement region is set according to the component data
Inclined camera shooting direction on desired shooting condition, the inclination of measurement region will be shot from the direction for meeting shooting condition
The shooting image of camera is used for the measurement of the 3D shape of measurement region.In the structure shown here, can use from multiple shooting direction
In position based on element and profile selection shooting direction shooting measurement region obtained from shooting image to measurement region
3D shape measured.Therefore, to the 3D shape for the side for measuring the object being present on the surface of substrate exactly
Favorably.
Alternatively, it is also possible to form appearance inspection device as follows：Control unit measures area to the surface set of solder
Domain, based on the result obtained by the position relationship for judging solder and the element on substrate according to component data, setting shooting
Condition.In the structure shown here, can use from the shooting based on the selection of the position relationship of solder and element in multiple shooting direction
Shooting image obtained from direction shooting measurement region measures to the 3D shape of measurement region.Therefore, to counting exactly
The 3D shape for surveying the side for the solder being present on the surface of substrate is favourable.
Specifically, such as appearance inspection device can also be formed as follows：Included in element with terminal
In the case of chip component, control unit ought be judged as according to component data as accompanying by the solder of the setting object of measurement region
Terminal the first side for being located at chip component on the specific direction parallel with the surface of substrate end when, set from measurement area
This shooting condition of the first side shooting measurement region in domain.Thereby, it is possible to measure the terminal of chip component being arranged on exactly
The 3D shape of the side of solder on substrate.
Alternatively, it is also possible to form appearance inspection device as follows：At least 2 inclined cameras are with the table with substrate
The mode that measurement region is clipped on parallel and orthogonal with the specific direction direction in face configures and shoots measurement region, and control unit will be full
The shooting image of sufficient shooting condition is used for the measurement of the 3D shape of measurement region.In the structure shown here, 2 inclination phases can be based on
Shooting image measures to the 3D shape of measurement region obtained from machine shoots measurement region from different directions.Its result
It is the 3D shape of measurement region to be measured using the shooting image of 2 inclined cameras complementaryly.It is specific next
Say, such as even if a part for the shooting image of an inclined camera causes halation, the shooting of another inclined camera can also be passed through
Image is supplemented this part.Therefore, to the three-dimensional for the side for measuring the object being present on the surface of substrate exactly
Shape is favourable.
Alternatively, it is also possible to form appearance inspection device as follows：Control unit makes with parallel with the surface of substrate
And at least 2 inclined camera respective time for exposure that the mode that measurement region is clipped on the direction orthogonal with specific direction configures
Mutually repeat and perform shooting.Thereby, it is possible to shorten the time needed for the shooting of 2 inclined cameras, three can be effectively carried out
Tie up the measurement of shape.
Alternatively, it is also possible to form appearance inspection device as follows：Control unit sets multiple measurement regions, makes multiple
The time for exposure of at least 2 inclined cameras in inclined camera mutually repeats and performs shooting, for each of multiple measurement regions
Measurement region, the 3D shape for measurement region is selected from the shooting image for making the inclined camera of time for exposure mutually repeatedly
Measurement shooting image.The bat of required shooting image in measurement thereby, it is possible to realize the 3D shape of measurement region
The shortening of required time is taken the photograph, can effectively carry out the measurement of 3D shape.
Alternatively, it is also possible to form appearance inspection device as follows：Projector is relative to being held in board holder
The normal to a surface direction of substrate obliquely configure.In the structure shown here, by inclining relative to the normal to a surface direction of substrate
Oblique projector, can be to the side irradiation light for the object being present on the surface of substrate.Therefore, it is present in measuring exactly
The 3D shape of the side of object on the surface of substrate is favourable.
Alternatively, it is also possible to form appearance inspection device as follows, possess multiple projectors, the plurality of projector exists
Range of exposures in top view from the normal to a surface direction of substrate towards mutually different direction and respective light exists
Mutually repeated on the surface of substrate.In the structure shown here, can be irradiated from multiple directions to measurement region from the throwing being arranged obliquely
The light of shadow machine, it is favourable to measuring the 3D shape of side for the object being present on the surface of substrate exactly.
Alternatively, it is also possible to form appearance inspection device as follows：Based on projector to measurement region irradiation light
Direction of illumination, the projector of the shooting for measurement region is selected from multiple projectors.Thereby, it is possible to use from multiple irradiations
The three-dimensional shaped of suitable direction of illumination irradiation light in direction and shooting image obtained from shooting measurement region to measurement region
Shape is measured.Therefore, the 3D shape of the side to measuring the object being present on the surface of substrate exactly is favourable.
Specifically, appearance inspection device can also be formed as follows：Control unit, which obtains, to be represented to pacify by solder
The position of element on a surface of a substrate and the component data of profile are filled, is set in measurement region and shone according to the component data
Desired irradiation condition is penetrated on the direction of illumination of the light of the projector of light, makes to shine to measurement region from the direction for meeting irradiation condition
Penetrate projector's bright light of light and inclined camera is shot measurement region.In the structure shown here, can use from multiple irradiations
The direction of illumination irradiation light of position based on element and profile selection in direction simultaneously shoots shooting figure obtained from measurement region
As being measured to the 3D shape of measurement region.Therefore, to measuring the side of the object being present on the surface of substrate exactly
The 3D shape in face is favourable.
Alternatively, it is also possible to form appearance inspection device as follows：Control unit measures area to the surface set of solder
Domain, based on the result obtained by the position relationship according to the element that component data judges solder and is installed on substrate, setting irradiation bar
Part.In the structure shown here, can use from the irradiation side based on the selection of the position relationship of solder and element in multiple direction of illuminations
To irradiation light and shooting image obtained from shooting measurement region measures to the 3D shape of measurement region.Therefore, it is aligned
The 3D shape for really measuring the side for the solder being present on the surface of substrate is favourable.
Specifically, such as appearance inspection device can also be formed as follows：Included in element with terminal
In the case of chip component, control unit ought be judged as according to component data as accompanying by the solder of the setting object of measurement region
Terminal the first side for being located at chip component on the specific direction parallel with the surface of substrate end when, set from measurement area
First lateral measurement region irradiation light this irradiation condition in domain.The structure to measuring the terminal installation of chip component exactly
The 3D shape of the side of solder on substrate is favourable.
Alternatively, it is also possible to form appearance inspection device as follows：At least 2 projectors are with the surface with substrate
The mode that measurement region is clipped on parallel and orthogonal with specific direction direction configures, and control unit makes at least 2 projectors by suitable
Sequence bright light and shoot measurement region.In the structure shown here, can be based on making 2 projectors of irradiation light from different directions in order
The bright light and shooting image photographed measures to the 3D shape of measurement region.As a result, it can use complementaryly
The shooting image for making projector's bright light and photographing and the shooting image for making another projector's bright light and photographing, to measuring area
The 3D shape in domain is measured.Specifically, even if making a part for shooting image during projector's bright light cause halation,
Also shooting image when can be by making other projector's bright lights is supplemented the part.Therefore, deposited to measuring exactly
It is that the 3D shape of the side of the object on the surface of substrate is favourable.
Alternatively, it is also possible to form appearance inspection device as follows：Multiple inclined cameras are included with the surface of substrate
Normal centered at least 4 inclined cameras for being arranged with 90 degree of spaced circumferential shape, projector irradiated by such as to measurement region
The light for the pattern that lower striped is formed, the striped in the top view from the normal to a surface direction from substrate parallel to 4
With the directions of 45 degree of intersections, control unit is based on from projector to measurement region irradiation light and makes 4 the respective optical axis of inclined camera
The time for exposure of inclined camera is mutually repeated and shoots the result of measurement region, and the 3D shape of measurement region is measured.
The contracting of time in measurement thereby, it is possible to realize the 3D shape of measurement region needed for the shooting of required shooting image
It is short, it can effectively carry out the measurement of 3D shape.
Alternatively, it is also possible to form appearance inspection device as follows：Straight-on camera is also equipped with, the straight-on camera direction
The normal to a surface direction of substrate and with the visual field repeated on a surface of a substrate with the visuals field of multiple inclined cameras, control unit
Based on shooting image and passing through from projector to measurement region irradiation light and as obtained from straight-on camera shoots measurement region
Shooting image obtained from inclined camera shooting measurement region, is measured to the 3D shape of measurement region.So, by making
The 3D shape of measurement region is measured with the shooting image of straight-on camera and each camera of inclined camera, can be carried out more
High-precision measurement.
At this time it is also possible to appearance inspection device is formed as follows：Control unit by inclined camera by based on will be clapped
The shooting image taken the photograph is converted to the shooting image taken by the image and straight-on camera of the coordinate system of straight-on camera to determine
The height of measurement region in each pixel, the 3D shape of measurement region is measured.
Alternatively, it is also possible to form appearance inspection device as follows：Control unit is by the three of the measurement region measured
Dimension shape is kept as point group data.Thereby, it is possible to the sight for the 3D shape for implementing to change measurement region is so arbitrary
Image procossing is simultaneously checked.
Moreover, can also suitably it be changed for camera 31 and 32 respective number of projector and configuration.
Description of reference numerals
1 ... appearance inspection device
10 ... substrates
2 ... conveyer belts (board holder)
31a ... straight-on cameras
31b~31e ... inclined cameras
32b~32e ... projectors
8 ... chip components
81st, 82 ... terminals
91st, 92 ... solders
100 ... control devices (control unit)
R (I) ... measurement regions
De ... component datas
E ... configures direction (specific direction)
The sides of E1 ... first
The sides of E2 ... second
Direction orthogonal with configuration direction V ...
F3 ... examination scopes
Z ... verticals (normal direction of substrate)
Ds (I, P, C) ... shooting images
Claims (21)
1. a kind of appearance inspection device, possesses：
Board holder, substrate is kept；
Projector, to the substrate irradiation light for being held in the board holder；
Inclined camera, obliquely configured relative to the normal to a surface direction for the substrate for being held in the board holder；
And
Control unit, based on to the measurement region irradiation light set to the substrate and passing through the inclined camera from the projector
Shooting image obtained from shooting the measurement region, the 3D shape of the measurement region is measured.
2. appearance inspection device according to claim 1, wherein,
At least 2 inclined cameras are in the top view from the normal to a surface direction from the substrate towards different
Direction and the respective visual field mutually repeated in the examination scope on the surface of the substrate,
The control unit sets the measurement region in the examination scope that the visual field of multiple inclined cameras repeats.
3. appearance inspection device according to claim 2, wherein,
The control unit shoots the direction of the measurement region based on the inclined camera, selects multiple inclined cameras each
The shooting image in the 3D shape for the measurement region measurement the shooting image.
4. appearance inspection device according to claim 3, wherein,
The control unit obtains the position of element for representing to be arranged on by solder on the surface of the substrate and the element of profile
Data, the shooting required in the shooting direction for the inclined camera for shooting the measurement region is set according to the component data
Condition, the shooting image that the inclined camera of the measurement region is shot from the direction for meeting the shooting condition is used
In the measurement of the 3D shape of the measurement region.
5. appearance inspection device according to claim 4, wherein,
The control unit is to measurement region described in the surface set of the solder, based on judging the weldering according to the component data
Expect and be installed on the substrate the element position relationship obtained by result, set the shooting condition.
6. appearance inspection device according to claim 5, wherein,
The element includes the chip component with terminal,
The control unit is when the solder institute for being judged as the setting object as the measurement region according to the component data
The terminal of attachment is located at the end of the first side of the chip component on the specific direction parallel with the surface of the substrate
During portion, set from the first side of the measurement region and shoot described this described shooting condition of measurement region.
7. appearance inspection device according to claim 6, wherein,
At least 2 inclined cameras on direction parallel with the surface of the substrate and orthogonal with the specific direction to press from both sides
The mode for the measurement region configures and shoots the measurement region,
The control unit will meet the shooting image of the shooting condition based on the 3D shape of the measurement region
Survey.
8. appearance inspection device according to claim 7, wherein,
The control unit makes described to be clipped on direction parallel with the surface of the substrate and orthogonal with the specific direction
At least 2 inclined camera respective time for exposure that the mode of measurement region configures mutually repeat and perform shooting.
9. the appearance inspection device according to any one of claim 3~8, wherein,
The control unit sets multiple measurement regions, makes at least 2 inclined camera exposures in multiple inclined cameras
Time mutually repeats and performs shooting, for each measurement region of multiple measurement regions, is mutually repeated from the time for exposure is made
The inclined camera the shooting image in select 3D shape for the measurement region measurement the shooting
Image.
10. according to appearance inspection device according to any one of claims 1 to 9, wherein,
The projector obliquely configures relative to the normal to a surface direction for the substrate for being held in the board holder.
11. appearance inspection device according to claim 10, wherein,
Possess multiple projectors, top view of multiple projectors from the normal to a surface direction from the substrate
It is middle mutually to be repeated on the surface of the substrate towards the range of exposures of mutually different direction and respective light.
12. appearance inspection device according to claim 11, wherein,
Direction of illumination based on from the projector to the measurement region irradiation light, select to be used for institute from multiple projectors
State the projector of the shooting of measurement region.
13. appearance inspection device according to claim 12, wherein,
The control unit obtains the position of element for representing to be arranged on by solder on the surface of the substrate and the element of profile
Data, require on the direction of illumination for the light that the projector to the measurement region irradiation light is set according to the component data
Irradiation condition, make from meeting the direction of the irradiation condition to projector's bright light of the measurement region irradiation light and make
The inclined camera shoots the measurement region.
14. appearance inspection device according to claim 13, wherein,
The control unit is to measurement region described in the surface set of the solder, based on judging the weldering according to the component data
Expect and be installed on the substrate the element position relationship obtained by result, set the irradiation condition.
15. appearance inspection device according to claim 14, wherein,
The element includes the chip component with terminal,
The control unit is when the solder institute for being judged as the setting object as the measurement region according to the component data
The terminal of attachment is located at the end of the first side of the chip component on the specific direction parallel with the surface of the substrate
During portion, the first lateral measurement region irradiation light this described irradiation condition from the measurement region is set.
16. appearance inspection device according to claim 15, wherein,
At least 2 projectors on direction parallel with the surface of the substrate and orthogonal with the specific direction to clip
The mode of the measurement region configures,
The control unit make at least 2 projectors in order bright light and shoot the measurement region.
17. appearance inspection device according to claim 2, wherein,
Multiple inclined cameras are included and arranged centered on the normal to a surface of the substrate with 90 degree of spaced circumferential shape
At least 4 inclined cameras,
The light of pattern that the projector is made up of to measurement region irradiation following striped, the striped is from the substrate
Normal to a surface direction observation top view in parallel to 4 respective optical axises of inclined camera with 45 degree of sides intersected
To,
The control unit is based on from the projector to the measurement region irradiation light and when making the exposure of 4 inclined cameras
Between mutually repeat and shoot the result of the measurement region, the 3D shape of the measurement region is measured.
18. the appearance inspection device according to any one of claim 1~17, wherein,
Straight-on camera is also equipped with, the straight-on camera has in the substrate towards the normal to a surface direction of the substrate
Surface on the visual field that is repeated with the visuals field of multiple inclined cameras,
The control unit is based on shooting the meter from the projector to the measurement region irradiation light and by the straight-on camera
Shooting image obtained from surveying region and the shooting image as obtained from the inclined camera shoots the measurement region,
The 3D shape of the measurement region is measured.
19. appearance inspection device according to claim 18, wherein,
The control unit by the shooting image photographed by the inclined camera by based on being converted to the straight-on camera
Coordinate system image and the straight-on camera taken by the shooting image determine the measurement area in each pixel
The height in domain, the 3D shape of the measurement region is measured.
20. the appearance inspection device according to any one of claim 1~19, wherein,
The control unit keeps the 3D shape of the measurement region measured as point group data.
21. a kind of appearance inspection method, possesses following process：
Measurement region is set to substrate；
To the measurement region irradiation light and the inclination that is obliquely configured by the normal to a surface direction relative to the substrate
Camera shoots the measurement region, obtains shooting image；And
The 3D shape of the measurement region is measured based on the shooting image.
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| PCT/JP2015/061423 WO2016166807A1 (en) | 2015-04-14 | 2015-04-14 | Appearance inspection apparatus and appearance inspection method |
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| CN107429991B CN107429991B (en) | 2021-09-07 |
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| JP (1) | JP6322335B2 (en) |
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Also Published As
| Publication number | Publication date |
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| WO2016166807A1 (en) | 2016-10-20 |
| CN107429991B (en) | 2021-09-07 |
| JP6322335B2 (en) | 2018-05-09 |
| JPWO2016166807A1 (en) | 2017-10-12 |
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