CN107414666B - 工件的板厚计测用窗结构 - Google Patents

工件的板厚计测用窗结构 Download PDF

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Publication number
CN107414666B
CN107414666B CN201710352370.5A CN201710352370A CN107414666B CN 107414666 B CN107414666 B CN 107414666B CN 201710352370 A CN201710352370 A CN 201710352370A CN 107414666 B CN107414666 B CN 107414666B
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CN
China
Prior art keywords
plate
window
workpiece
cylindrical portion
measuring
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CN201710352370.5A
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English (en)
Chinese (zh)
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CN107414666A (zh
Inventor
小池喜雄
井上裕介
吉原秀明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
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SpeedFam Co Ltd
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Publication of CN107414666A publication Critical patent/CN107414666A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201710352370.5A 2016-05-24 2017-05-18 工件的板厚计测用窗结构 Active CN107414666B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016103410A JP6602725B2 (ja) 2016-05-24 2016-05-24 ワークの板厚計測用窓構造
JP2016-103410 2016-05-24

Publications (2)

Publication Number Publication Date
CN107414666A CN107414666A (zh) 2017-12-01
CN107414666B true CN107414666B (zh) 2020-12-08

Family

ID=60425135

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710352370.5A Active CN107414666B (zh) 2016-05-24 2017-05-18 工件的板厚计测用窗结构

Country Status (4)

Country Link
JP (1) JP6602725B2 (enExample)
KR (1) KR102318327B1 (enExample)
CN (1) CN107414666B (enExample)
TW (1) TWI707742B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7034785B2 (ja) * 2018-03-20 2022-03-14 株式会社東京精密 研磨装置
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
JP7466964B1 (ja) 2023-07-03 2024-04-15 株式会社多聞 基板厚測定装置及び基板厚測定方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10160420A (ja) * 1996-12-03 1998-06-19 Tokyo Seimitsu Co Ltd ウェーハの厚さ及び厚さ変化量測定装置
JPH10199951A (ja) * 1997-01-14 1998-07-31 Tokyo Seimitsu Co Ltd ウェーハの研磨面位置測定装置
TW372483U (en) * 1998-04-13 1999-10-21 Taiwan Semiconductor Mfg Light penetrative grinding system
EP1176630B1 (en) * 1999-03-31 2007-06-27 Nikon Corporation Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
JP2002170800A (ja) * 2000-12-01 2002-06-14 Nikon Corp 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
US20030114076A1 (en) * 2001-12-14 2003-06-19 Hui-Chun Chang Apparatus for chemical mechanical polishing
US6991514B1 (en) * 2003-02-21 2006-01-31 Verity Instruments, Inc. Optical closed-loop control system for a CMP apparatus and method of manufacture thereof
JP4202841B2 (ja) * 2003-06-30 2008-12-24 株式会社Ｓｕｍｃｏ 表面研磨装置
KR100716935B1 (ko) * 2005-11-25 2007-05-14 두산디앤디 주식회사 반도체 웨이퍼의 화학기계적 연마장치용 로딩디바이스
KR100889084B1 (ko) * 2007-07-06 2009-03-17 두산메카텍 주식회사 반도체 웨이퍼 표면연마공정을 위한 연마 종말점 검출 장치
CN102089121B (zh) * 2008-07-31 2015-04-08 信越半导体股份有限公司 芯片的研磨方法及双面研磨装置
JP5917994B2 (ja) * 2012-04-23 2016-05-18 スピードファム株式会社 研磨装置の計測用窓構造
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置
JP6229737B2 (ja) * 2014-01-10 2017-11-15 株式会社Sumco ワークの厚さ測定装置、測定方法、及びワークの研磨装置
JP6230921B2 (ja) * 2014-01-16 2017-11-15 株式会社ディスコ 研磨装置

Also Published As

Publication number Publication date
CN107414666A (zh) 2017-12-01
KR102318327B1 (ko) 2021-10-28
JP2017209744A (ja) 2017-11-30
TWI707742B (zh) 2020-10-21
TW201741072A (zh) 2017-12-01
JP6602725B2 (ja) 2019-11-06
KR20170132667A (ko) 2017-12-04

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Applicant before: Speedfam C., Ltd.

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