CN107403856A - A kind of LED and its manufacture method and the electronic equipment using the LED - Google Patents
A kind of LED and its manufacture method and the electronic equipment using the LED Download PDFInfo
- Publication number
- CN107403856A CN107403856A CN201610340758.9A CN201610340758A CN107403856A CN 107403856 A CN107403856 A CN 107403856A CN 201610340758 A CN201610340758 A CN 201610340758A CN 107403856 A CN107403856 A CN 107403856A
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- CN
- China
- Prior art keywords
- light
- led
- filler
- emitting diodes
- tube body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
A kind of electronic equipment the embodiment of the invention discloses LED and its manufacture method and using the LED.Wherein, a kind of light emitting diode, including light-emitting diodes tube body and filler.The light-emitting diodes tube body includes injection molding sprue, and the injection molding sprue is the breach of depression.The filler is arranged in the breach of the depression of the injection molding sprue, and makes the filler without departing from the size of light-emitting diodes tube body.A kind of LED and its manufacture method of the embodiment of the present invention and the electronic equipment using the LED.By filling filler on the cast gate of LED body, so as to increase LED intensity.Avoid LED and should be damage caused by low intensity.
Description
Technical field
The present invention relates to luminaire technical field, more particularly to a kind of LED and its manufacture method and adopt
With the electronic equipment of the LED.
Background technology
In the prior art, during LED injection molding packagings, LED manufacturers for prevent cast gate protrude body and
Cause size exceeded, can in the led between part leave cast gate, and cast gate is fallen in a part.But
It is that it is poor that the part that cast gate is fallen in result in this field strength, is easily broken off.
After the slimming of mobile phone thickness, the thickness requirement of each component of interior of mobile phone is also further improved.
Light emitting diode (LED, Light Emitting Diode) apparent size increasingly come it is thinner after, LED
Intensity can significantly reduce.Universal LED size is 3.2*1.8*0.4mm on mobile phone at present.And 2in1 skills
The LED of art, its length are lengthened to 3.8mm from 3.2mm, and single LEDs package length is elongated, equivalent to branch
Support span and become big, bulk strength reduces.State-of-the-art technology 2in1LED, and more slim 0.3mm thickness
LED, intensity further weaken.
Due to the depression and LED more and more thinners of cast gate, it can not meet high-end handsets reliability needs, even
LED is occurred as soon as in assembling to split, and causes mobile phone blank screen.Therefore depressions and slimming of the LED at sprue gate
Under dual reason, the risk being broken is increasing.
The content of the invention
A kind of electronics the embodiments of the invention provide LED and its manufacture method and using the LED
Equipment, by adding filler at LED sprue gate, so as to provide a kind of intensity higher LED.
A kind of LED and its manufacture method of the embodiment of the present invention and the electronic equipment using the LED.
By filling filler on the cast gate of LED body, so as to increase LED intensity.Avoiding LED should
For damage caused by low intensity.
On the one hand, the specific embodiment of the invention provides a kind of method for manufacturing light-emitting, and methods described includes
Light-emitting diodes tube body is determined, the light-emitting diodes tube body of the determination includes injection molding sprue, the injection
Cast gate is the breach of depression.The light-emitting diodes tube body of acquisition is fixed.To luminous two after fixation
The injection molding sprue of pole pipe body is filled so that the breach being recessed on the light emitting diode pass through it is described
After the mode of filling sets filler, the filler to fill the breach of the depression, the filler is not
The surface of the prominent light-emitting diodes tube body.By being set on the breach of the depression of the light emitting diode
Filler is put, so as to improve the intensity of light emitting diode, reduces the risk of LED fractures.
In a possible design, the light-emitting diodes tube body of acquisition is fixed and specifically includes and will light
The injection molding sprue of diode body is upward.By the way that injection molding sprue is set up, consequently facilitating filler
Set.
In a possible design, the light-emitting diodes tube body by acquisition is fixed and specifically included,
The light-emitting diodes tube body is fixed by fixture.By fixture, make the fixation of light emitting diode more
Stabilization.
In a possible design, the injection molding sprue of the light-emitting diodes tube body after described pair of fixation is filled out
Fill and specifically include, injection glue is carried out to injection molding sprue by dispensing needle head, forms filler.By described
Dispensing needle head makes the injection of filler more accurate, reduces the outlet of substandard product.
In a possible design, the glue injected to injection molding sprue is UV shadowless glues.So as to improve
LED intensity.
In a possible design, the glue injected to injection molding sprue is hot-setting adhesive.So as to improve LED
Intensity.
In a possible design, the glue injected to injection molding sprue is AB glue.So as to improve LED
Intensity.
On the other hand, the specific embodiment of the invention provides a kind of light emitting diode, the light emitting diode bag
Include light-emitting diodes tube body and filler.The light-emitting diodes tube body includes injection molding sprue, the injection
Cast gate is the breach of depression.The filler is arranged in the breach of the depression of the injection molding sprue, and is made
Size of the filler without departing from light-emitting diodes tube body.Pass through the depression in the light emitting diode
Filler is set on breach, so as to improve the intensity of light emitting diode, reduces the risk of LED fractures.
In a possible design, the filler is UV shadowless glues.So as to improve LED intensity.
In a possible design, the filler is hot-setting adhesive.So as to improve LED intensity.
In a possible design, the filler is AB glue.So as to improve LED intensity.
Another further aspect, the specific embodiment of the invention provide a kind of electronic equipment, and the electronic equipment includes screen,
Multiple light emitting diodes as described in claim any one of 8-11 are provided with the screen.By there is provided
Multiple light emitting diodes as described in claim any one of 8-11, so as to improve the intensity of light emitting diode,
Reduce the risk of LED fractures.
In a possible design, the electronic equipment is mobile phone.It is provided with the mobile phone multiple as weighed
Profit requires the light emitting diode described in any one of 8-11, so as to improve the intensity of light emitting diode in mobile phone,
Reduce the risk of the LED fractures of mobile phone.
In a possible design, the electronic equipment is tablet personal computer.It is provided with the tablet personal computer
Multiple light emitting diodes as described in claim any one of 8-11, so as to improve luminous two in tablet personal computer
The intensity of pole pipe, reduce the risk of the LED fractures of tablet personal computer.
In a possible design, the electronic equipment is computer.It is provided with the computer multiple as weighed
Profit requires the light emitting diode described in any one of 8-11, so as to improve the intensity of light emitting diode in computer,
Reduce the risk of the LED fractures of computer.
Brief description of the drawings
Fig. 1 is the display structural representation of a kind of electronic equipment provided in an embodiment of the present invention；
Fig. 2 is a kind of LED body that the specific embodiment of the invention provides；
Fig. 3 is a kind of LED injection moulding process that the specific embodiment of the invention provides；
Fig. 4 is a kind of machining sketch chart that the specific embodiment of the invention provides；
Fig. 5 is the LED after a kind of filling that the specific embodiment of the invention provides.
Embodiment
Below by drawings and examples, the technical scheme of the embodiment of the present invention is done and further retouched in detail
State.
Fig. 1 is the display structural representation of a kind of electronic equipment provided in an embodiment of the present invention.Such as Fig. 1 institutes
Show, a kind of electronic equipment 101, including liquid crystal display (LCD, Liquid Crystal Di splay, 103
With light emitting diode (LED, Light-Emi tt ing Diode) 105.Shown LED 105 is arranged on LCD
103 lower section, it is that LCD 103 provides light source by LED 105.The LED is arranged on one under LCD
Side, the other parts under the LCD are also provided with light guide plate 104, by the light guide plate 104 by LED105
The light sent uniformly conducts the lower section for causing whole LCD 103.It is also provided with protecting on the LCD 103
Glass 102, to protect LCD 103 not stress.
Fig. 2 is a kind of LED body that the specific embodiment of the invention provides.As shown in Fig. 2 the LED
Also include injection molding cast gate 201 on body 202, the cast gate 201 is the structure of depression.To avoid
The size of LED cast gates 201 in injection moulding process is more than the size of LED body 202, so as to be not easy to LED
Installation.
Fig. 3 is a kind of LED injection moulding process that the specific embodiment of the invention provides.Methods described is used to provide
A kind of LED of higher intensity.As shown in figure 3, methods described includes：
S301 determines light-emitting diodes tube body, and the light-emitting diodes tube body of the determination includes injection molding sprue,
The injection molding sprue is the breach of depression.
There is cast gate in the LED, be molded by the cast gate, encapsulate LED during injection.
In order that the size of gate portions is not more than whole LED size, gate portions are sized to recessed
Sunken structure, the size of cast gate is set to be more than whole LED size to avoid cast gate from there may be remaining glue.
S302 fixes the light-emitting diodes tube body of acquisition.
Fig. 4 is a kind of machining sketch chart that the specific embodiment of the invention provides.As shown in figure 4, by LED
Body 202 is arranged in special fixture 401, and sets up cast gate 201.In the tool of the present invention
In body embodiment, the example shown in Fig. 4 is only a kind of citing of the present invention, is not used in the limit to the present invention
It is fixed.Fixture described in the specific embodiment of the invention can be diversified forms, as long as can be by the LED body
202 fix the fixture as described in the specific embodiment of the invention.In the example shown in Figure 4, shown LED
Body 202 is arranged in open-topped fixture 401, and shown fixture 401 is open-topped rectangle frame,
The size of the rectangle frame is slightly larger than the size of LED body 202.In a particular embodiment of the present invention,
Shown cast gate can also be fixed in any direction by the fixture 401.
S303 is filled to the injection molding sprue of the light-emitting diodes tube body after fixation, so that described luminous two
The breach being recessed in pole pipe sets filler by way of the filling, and the filler is filled described recessed
After sunken breach, the filler does not protrude the surface of the light-emitting diodes tube body.
By by there is provided the lower section that the LED body 202 of fixture 401 is moved to dispensing needle head 402, making
The dispensing needle head 402 is corresponding with the cast gate 201.By dispensing needle head 402 to LED body 202
Dispensing, it is filled so as to reach the part being recessed on cast gate 201, improves the intensity of LED body 202.
And the filler of the LED body after the filler filling is set not protrude the light emitting diode sheet
The surface of body
It is only the one of the specific embodiment of the invention to carry out dispensing to cast gate 201 above by dispensing needle head 402
Kind citing, the filling to the cast gate can also use other any methods.
In a particular embodiment of the present invention, the filler that shown dispensing needle head 402 is poured into a mould can be UV without
Any one a variety of that can be used in electronic equipment filler body such as shadow glue, hot-setting adhesive, AB glue.When described
When filler is UV shadowless glues, the dispensing needle head 402 also needs to be irradiated by UV light after filling,
So that the filler solidification.
In one example, in order to determine that qualified product filler does not protrude the light-emitting diodes tube body
Surface, the side of the dispensing needle head 402 is also provided with monitoring device.The monitoring device is used to sentence
Whether the LED product after disconnected filling is qualified.For example, the monitoring device is photograph monitoring device, it is described
Monitoring device of taking a picture is taken a picture after LED filling is completed to LED.To the knot of the photograph after filling
Fruit is compared with the result of the photograph before filling.The overall size of the photo of LED after filling is with filling out
The size of the profile of the photo of LED before filling is identical, then the LED after the filling is qualified product.
The overall size of the photo of LED after filling is more than the overall size of the photo of the LED before filling, then
LED after the filling is underproof product.
Fig. 5 is the LED after a kind of filling that the specific embodiment of the invention provides.It is as shown in figure 5, a kind of
LED product 501, including LED body 202 and filler 502.The LED body 202 such as Fig. 2 institutes
Show, filler 502 is provided with the cast gate.502 LED product 501 after the addition filler
Overall size of the overall size no more than the LED body 202 before adding filler 502.
In a particular embodiment of the present invention, a kind of electronic equipment 101 as shown in Figure 1 is also provided, it is described
Electronic equipment 101 employs LED product 501 as shown in Figure 5.In one example, the electronics is set
Standby 101 can be any one or more in mobile phone, tablet personal computer or computer.
Above-described embodiment, the purpose of the present invention, technical scheme and beneficial effect are carried out
Be further described, should be understood that the embodiment that the foregoing is only of the invention and
, the protection domain being not intended to limit the present invention, within the spirit and principles of the invention, done
Any modification, equivalent substitution and improvements etc., should be included in the scope of the protection.
Claims (15)
1. a kind of method for manufacturing light-emitting, it is characterised in that methods described includes：
Light-emitting diodes tube body is determined, the light-emitting diodes tube body of the determination includes injection molding sprue, and the injection molding sprue is the breach of depression；
The light-emitting diodes tube body of acquisition is fixed；
The injection molding sprue of light-emitting diodes tube body after fixation is filled, filler is set in a manner of the breach for making to be recessed on the light emitting diode is by the filling, after the filler fills the breach of the depression, the filler does not protrude the surface of the light-emitting diodes tube body.
2. according to the method for claim 1, it is characterised in that the light-emitting diodes tube body by acquisition is fixed and specifically included：
The injection molding sprue of light-emitting diodes tube body is upward.
3. according to the method for claim 1, it is characterised in that the light-emitting diodes tube body by acquisition is fixed and specifically included：
The light-emitting diodes tube body is fixed by fixture.
4. according to the method for claim 1, it is characterised in that the injection molding sprue of the light-emitting diodes tube body after described pair of fixation, which is filled, to be specifically included：
Injection glue is carried out to injection molding sprue by dispensing needle head, forms filler.
5. according to the method for claim 4, it is characterised in that the glue injected to injection molding sprue is UV shadowless glues.
6. according to the method for claim 4, it is characterised in that the glue injected to injection molding sprue is hot-setting adhesive.
7. according to the method for claim 4, it is characterised in that the glue injected to injection molding sprue is AB glue.
8. a kind of light emitting diode, it is characterised in that described including light-emitting diodes tube body and filler；The light-emitting diodes tube body includes injection molding sprue, and the injection molding sprue is the breach of depression；The filler is arranged in the breach of the depression of the injection molding sprue, and makes the filler without departing from the size of light-emitting diodes tube body.
9. light emitting diode according to claim 8, it is characterised in that the filler is UV shadowless glues.
10. light emitting diode according to claim 8, it is characterised in that the filler is hot-setting adhesive.
11. light emitting diode according to claim 8, it is characterised in that the filler is AB glue.
12. a kind of electronic equipment, it is characterised in that including screen, multiple light emitting diodes as described in claim any one of 8-11 are provided with the screen.
13. electronic equipment according to claim 12, it is characterised in that the electronic equipment is mobile phone.
14. electronic equipment according to claim 12, it is characterised in that the electronic equipment is tablet personal computer.
15. electronic equipment according to claim 12, it is characterised in that the electronic equipment is computer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610340758.9A CN107403856B (en) | 2016-05-19 | 2016-05-19 | A kind of LED and its manufacturing method and electronic equipment using the LED |
| PCT/CN2016/107841 WO2017197866A1 (en) | 2016-05-19 | 2016-11-30 | Led and manufacturing method therefor, and electronic device using the led |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610340758.9A CN107403856B (en) | 2016-05-19 | 2016-05-19 | A kind of LED and its manufacturing method and electronic equipment using the LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107403856A true CN107403856A (en) | 2017-11-28 |
| CN107403856B CN107403856B (en) | 2019-10-22 |
Family
ID=60326454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610340758.9A Active CN107403856B (en) | 2016-05-19 | 2016-05-19 | A kind of LED and its manufacturing method and electronic equipment using the LED |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107403856B (en) |
| WO (1) | WO2017197866A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113359345A (en) * | 2020-03-04 | 2021-09-07 | 华为技术有限公司 | Electronic device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107403856B (en) | 2019-10-22 |
| WO2017197866A1 (en) | 2017-11-23 |
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