WO2017197866A1 - Led and manufacturing method therefor, and electronic device using the led - Google Patents
Led and manufacturing method therefor, and electronic device using the led Download PDFInfo
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- WO2017197866A1 WO2017197866A1 PCT/CN2016/107841 CN2016107841W WO2017197866A1 WO 2017197866 A1 WO2017197866 A1 WO 2017197866A1 CN 2016107841 W CN2016107841 W CN 2016107841W WO 2017197866 A1 WO2017197866 A1 WO 2017197866A1
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- led
- emitting diode
- light emitting
- filler
- electronic device
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 33
- 238000002347 injection Methods 0.000 claims description 28
- 239000007924 injection Substances 0.000 claims description 28
- 239000003292 glue Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 13
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000001746 injection moulding Methods 0.000 abstract description 10
- 238000013461 design Methods 0.000 description 12
- 238000012806 monitoring device Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
Definitions
- the present invention relates to the field of illuminating device technologies, and in particular, to an LED and a method of manufacturing the same, and an electronic device using the same.
- the LED manufacturer causes the size of the gate to be prevented from protruding beyond the gate, leaving a gate in the middle portion of the LED and recessing the gate.
- the recessed portion of the gate results in a poor strength in this region and is prone to breakage.
- the thickness requirements of various components inside the mobile phone are further improved.
- the appearance size of the light emitting diode (LED) is getting thinner and thinner, the intensity of the LED is significantly reduced.
- the general LED size on mobile phones is 3.2*1.8*0.4mm.
- the length of the LED of 2in1 technology is extended from 3.2mm to 3.8mm. The length of a single LED package becomes longer, which is equivalent to the support span becoming larger and the overall strength is reduced.
- the latest technology 2in1LED, as well as the thinner 0.3mm thick LED further weakens.
- Embodiments of the present invention provide an LED, a method of manufacturing the same, and an electronic device using the same, which provide a higher intensity LED by adding a filler to a gate of the LED.
- An LED a method of manufacturing the same, and an electronic device using the same according to embodiments of the present invention. Pass The filler is filled on the gate of the LED body to increase the strength of the LED. The LED should be protected from damage caused by low strength.
- a specific embodiment of the present invention provides a method of fabricating a light emitting diode, the method comprising determining a light emitting diode body, the determined light emitting diode body comprising an injection gate, the injection gate being a recessed notch.
- the obtained light emitting diode body is fixed.
- the surface of the light emitting diode body is not protruded.
- fixing the obtained LED body specifically includes upwardly molding the injection gate of the LED body.
- the setting of the filling is facilitated by setting the injection gate upward.
- the fixing of the LED body to be obtained specifically includes fixing the LED body by a clamp.
- the fixture is used to make the fixing of the LED more stable.
- the filling of the injection gate of the fixed LED body comprises: injecting glue into the injection gate through the dispensing needle to form a filling.
- the dispensing of the filler is more accurate by the dispensing needle, which reduces the exit of the unqualified product.
- the glue injected into the injection gate is a UV shadowless glue. Thereby increasing the strength of the LED.
- the glue injected into the injection gate is a thermoset glue. Thereby increasing the strength of the LED.
- the glue injected into the injection gate is AB glue. Thereby increasing the strength of the LED.
- a specific embodiment of the present invention provides a light emitting diode including a light emitting diode body and a filler.
- the LED body includes an injection gate, the injection gate The gap is a depression.
- the filler is disposed in the recessed recess of the injection gate and the filler does not exceed the dimensions of the LED body.
- the filler is a UV shadowless glue. Thereby increasing the strength of the LED.
- the filler is a thermoset glue. Thereby increasing the strength of the LED.
- the filler is an AB glue. Thereby increasing the strength of the LED.
- a specific embodiment of the present invention provides an electronic device including a screen, and a plurality of light emitting diodes according to any one of claims 8-11 are disposed under the screen.
- the electronic device is a cell phone.
- the light-emitting diode according to any one of claims 8-11 is disposed in the mobile phone, thereby improving the intensity of the light-emitting diode in the mobile phone and reducing the risk of LED breakage of the mobile phone.
- the electronic device is a tablet.
- the tablet computer is provided with a plurality of light emitting diodes according to any one of claims 8-11, thereby improving the intensity of the light emitting diodes in the tablet computer and reducing the risk of LED breakage of the tablet computer.
- the electronic device is a computer.
- the computer is provided with a plurality of light-emitting diodes according to any one of claims 8-11, thereby improving the intensity of the light-emitting diodes in the computer and reducing the risk of LED breakage of the computer.
- FIG. 1 is a schematic diagram of a display structure of an electronic device according to an embodiment of the present disclosure
- FIG. 4 is a schematic view of processing according to a specific embodiment of the present invention.
- FIG. 5 is a filled LED according to an embodiment of the present invention.
- FIG. 1 is a schematic diagram of a display structure of an electronic device according to an embodiment of the present invention.
- an electronic device 101 includes a liquid crystal display (LCD) and a light-emitting diode (LED) 105.
- the LED 105 is disposed under the LCD 103 and passes through the LED 105.
- a light source is provided for the LCD 103.
- the LED is disposed on one side under the LCD, and other portions under the LCD are further provided with a light guide plate 104, through which the light emitted by the LED 105 is uniformly transmitted to the entire LCD 103.
- the protective cover glass 102 is also disposed on the LCD 103 to protect the LCD 103 from force.
- the LED body 202 is an LED body according to an embodiment of the present invention. As shown in FIG. 2, the LED body 202 further includes a gate 201 for injection molding, and the gate 201 has a recessed structure. In order to avoid that the size of the gate 201 of the LED during the injection molding process is larger than the size of the LED body 202, it is inconvenient to install the LED.
- FIG. 3 is a schematic diagram of an LED injection molding method according to an embodiment of the present invention. The method is used to provide a higher intensity LED. As shown in FIG. 3, the method includes:
- S301 determines a light emitting diode body, the determined light emitting diode body includes an injection gate, and the injection gate is a recessed notch.
- the size of the gate portion is set to a recessed structure to prevent the gate from having the remaining glue so that the size of the gate is larger than the size of the entire LED.
- FIG. 4 is a schematic view of a process according to an embodiment of the present invention.
- the LED body 202 is placed in a dedicated jig 401, and the gate 201 is placed upward.
- the example shown in FIG. 4 is only an example of the present invention and is not intended to limit the present invention.
- Ben The jig of the embodiment of the invention may be in various forms as long as the LED body 202 can be fixed, that is, the jig described in the specific embodiment of the present invention.
- the illustrated LED body 202 is disposed in a top open clamp 401, which is a top open rectangular frame that is slightly larger in size than the LED body 202.
- the gate shown can also be secured in any orientation by the clamp 401.
- S303 is filled with the injection gate of the fixed LED body, so that the recessed recess on the LED is provided with the filling by the filling manner, and after the filling fills the recess of the recess, the filling The object does not protrude from the surface of the light emitting diode body.
- the dispensing needle 402 corresponds to the gate 201 by moving the LED body 202 provided with the clamp 401 below the dispensing needle 402.
- the LED body 202 is dispensed by the dispensing needle 402, so that the recessed portion of the gate 201 is filled, and the strength of the LED body 202 is improved. And the filler of the LED body after the filler is filled does not protrude from the surface of the LED body
- dispensing of the gate 201 by the dispensing needle 402 is only an example of a specific embodiment of the present invention, and any other method may be employed for filling the gate.
- the filler to be cast by the dispensing needle 402 may be any one of various types of electronic device filling objects such as UV shadowless glue, thermosetting glue, and AB glue.
- the dispensing needle 402 also needs to be irradiated with UV light to fill the filler to cure the filler.
- a monitoring device is also disposed on one side of the dispensing tip 402.
- the monitoring device is configured to determine whether the filled LED product is qualified.
- the monitoring device is a camera monitoring device that photographs the LEDs after completing the filling of one of the LEDs. The results of the photographed after filling were compared with the results of photographing before filling.
- the outline size of the photograph of the filled LED is the same as the outline of the outline of the photo of the LED before filling, the filled LED is a qualified product.
- filled LED The contour of the photo is larger than the outline size of the photo of the LED before filling, and the filled LED is a defective product.
- FIG. 5 is a filled LED according to an embodiment of the present invention.
- an LED product 501 includes an LED body 202 and a filler 502.
- the LED body 202 is provided with a filler 502 on the gate.
- the outline size of the LED product 501 after the filler is added 502 is not greater than the outline size of the LED body 202 before the filler 502 is added.
- an electronic device 101 as shown in FIG. 1, which employs an LED product 501 as shown in FIG.
- the electronic device 101 can be any one or more of a mobile phone, a tablet, or a computer.
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Abstract
Description
本申请要求于2016年05月19日提交中国专利局，申请号为201610340758.9、发明名称为“一种LED及其制造方法以及采用该LED的电子设备”的中国专利申请，其全部内容通过引用结合在本申请中。This application claims to be filed on May 19, 2016, the Chinese Patent Application No. 201610340758.9, entitled "An LED and its manufacturing method, and an electronic device using the LED", the entire contents of which are incorporated by reference. In this application.
本发明涉及发光设备技术领域，尤其涉及一种LED及其制造方法以及采用该LED的电子设备。The present invention relates to the field of illuminating device technologies, and in particular, to an LED and a method of manufacturing the same, and an electronic device using the same.
现有技术中，LED注塑封装过程中，LED生产厂家为防止浇口突出本体而导致尺寸超标，会在LED中间部分的留下浇口，并使浇口凹进去一部分。但是，浇口凹进去的部分导致了这个区域强度差，容易断裂。In the prior art, in the LED injection molding process, the LED manufacturer causes the size of the gate to be prevented from protruding beyond the gate, leaving a gate in the middle portion of the LED and recessing the gate. However, the recessed portion of the gate results in a poor strength in this region and is prone to breakage.
手机厚度薄型化后，对手机内部各个元器件的厚度要求也进一步提高。在发光二极管(LED，Light Emitting Diode)外观尺寸越来越来越薄后，LED的强度会显著降低。目前手机上通用LED尺寸为3.2*1.8*0.4mm。而2in1技术的LED，其长度从3.2mm加长到3.8mm，单颗LED封装长度变长，相当于支撑跨距变大，整体强度降低。最新技术2in1LED，以及更薄型的0.3mm厚度LED，强度进一步减弱。After the thickness of the mobile phone is thinned, the thickness requirements of various components inside the mobile phone are further improved. After the appearance size of the light emitting diode (LED) is getting thinner and thinner, the intensity of the LED is significantly reduced. At present, the general LED size on mobile phones is 3.2*1.8*0.4mm. The length of the LED of 2in1 technology is extended from 3.2mm to 3.8mm. The length of a single LED package becomes longer, which is equivalent to the support span becoming larger and the overall strength is reduced. The latest technology 2in1LED, as well as the thinner 0.3mm thick LED, further weakens.
由于浇口的凹陷和LED越来越薄，满足不了高端手机可靠性需要，甚至在组装时就出现LED裂，导致手机黑屏。故LED在浇注口的凹陷和薄型化的双重原因下，发生断裂的风险越来越大。Due to the depression of the gate and the thinning of the LED, the reliability of the high-end mobile phone cannot be met, and even the LED crack occurs during assembly, resulting in a black screen of the mobile phone. Therefore, under the dual reasons of the depression and thinning of the gate, the risk of breakage is increasing.
发明内容Summary of the invention
本发明实施例提供了一种LED及其制造方法以及采用该LED的电子设备，通过在LED的浇注口添加填充物，从而提供一种强度更高的LED。Embodiments of the present invention provide an LED, a method of manufacturing the same, and an electronic device using the same, which provide a higher intensity LED by adding a filler to a gate of the LED.
本发明实施例的一种LED及其制造方法以及采用该LED的电子设备。通 过在LED本体的浇口上填充填充物，从而增加LED的强度。避免了LED应为强度低而引起的损坏。An LED, a method of manufacturing the same, and an electronic device using the same according to embodiments of the present invention. Pass The filler is filled on the gate of the LED body to increase the strength of the LED. The LED should be protected from damage caused by low strength.
一方面，本发明具体实施例提供一种发光二极管制造方法，所述方法包括确定发光二极管本体，所述确定的发光二极管本体包括注塑浇口，所述注塑浇口为凹陷的缺口。将获取的所述发光二极管本体固定。对固定后的发光二极管本体的注塑浇口进行填充，以使所述发光二极管上凹陷的缺口通过所述填充的方式设置填充物，所述填充物填充所述凹陷的缺口后，所述填充物不突出所述发光二极管本体的表面。通过在所述发光二极管的凹陷的缺口上设置填充物，从而提高发光二极管的强度，降低LED断裂的风险。In one aspect, a specific embodiment of the present invention provides a method of fabricating a light emitting diode, the method comprising determining a light emitting diode body, the determined light emitting diode body comprising an injection gate, the injection gate being a recessed notch. The obtained light emitting diode body is fixed. Filling the injection gate of the fixed LED body so that the recessed recess on the LED is provided with the filling by the filling manner, and after filling the gap of the recess, the filler The surface of the light emitting diode body is not protruded. By providing a filler on the recessed indentation of the light emitting diode, the strength of the light emitting diode is increased, and the risk of LED breakage is reduced.
在一个可能的设计中，将获取的所述发光二极管本体固定具体包括将发光二极管本体的注塑浇口向上。通过将注塑浇口向上设置，从而便于填充物的设置。In one possible design, fixing the obtained LED body specifically includes upwardly molding the injection gate of the LED body. The setting of the filling is facilitated by setting the injection gate upward.
在一个可能的设计中，所述将获取的所述发光二极管本体固定具体包括，通过夹具将所述发光二极管本体固定。通过夹具，使发光二极管的固定更加的稳定。In a possible design, the fixing of the LED body to be obtained specifically includes fixing the LED body by a clamp. The fixture is used to make the fixing of the LED more stable.
在一个可能的设计中，所述对固定后的发光二极管本体的注塑浇口进行填充具体包括，通过点胶针头向注塑浇口进行注射胶，形成填充物。通过所述点胶针头使填充物的注射更加准确，减少了不合格产品的出线。In a possible design, the filling of the injection gate of the fixed LED body comprises: injecting glue into the injection gate through the dispensing needle to form a filling. The dispensing of the filler is more accurate by the dispensing needle, which reduces the exit of the unqualified product.
在一个可能的设计中，所述向注塑浇口注射的胶是UV无影胶。从而提高LED的强度。In one possible design, the glue injected into the injection gate is a UV shadowless glue. Thereby increasing the strength of the LED.
在一个可能的设计中，所述向注塑浇口注射的胶是热固胶。从而提高LED的强度。In one possible design, the glue injected into the injection gate is a thermoset glue. Thereby increasing the strength of the LED.
在一个可能的设计中，所述向注塑浇口注射的胶是AB胶。从而提高LED的强度。In one possible design, the glue injected into the injection gate is AB glue. Thereby increasing the strength of the LED.
另一方面，本发明具体实施例提供了一种发光二极管，所述发光二极管包括发光二极管本体和填充物。所述发光二极管本体包括注塑浇口，所述注塑浇口 为凹陷的缺口。所述填充物设置在所述注塑浇口的凹陷的缺口中，并使所述填充物不超出发光二极管本体的尺寸。通过在所述发光二极管的凹陷的缺口上设置填充物，从而提高发光二极管的强度，降低LED断裂的风险。In another aspect, a specific embodiment of the present invention provides a light emitting diode including a light emitting diode body and a filler. The LED body includes an injection gate, the injection gate The gap is a depression. The filler is disposed in the recessed recess of the injection gate and the filler does not exceed the dimensions of the LED body. By providing a filler on the recessed indentation of the light emitting diode, the strength of the light emitting diode is increased, and the risk of LED breakage is reduced.
在一个可能的设计中，所述填充物为UV无影胶。从而提高LED的强度。In one possible design, the filler is a UV shadowless glue. Thereby increasing the strength of the LED.
在一个可能的设计中，所述填充物为热固胶。从而提高LED的强度。In one possible design, the filler is a thermoset glue. Thereby increasing the strength of the LED.
在一个可能的设计中，所述填充物为AB胶。从而提高LED的强度。In one possible design, the filler is an AB glue. Thereby increasing the strength of the LED.
再一方面，本发明具体实施例提供一种电子设备，所述电子设备包括屏幕，所述屏幕下设置了多个如权利要求8-11任一项所述的发光二极管。通过设置了多个如权利要求8-11任一项所述的发光二极管，从而提高发光二极管的强度，降低LED断裂的风险。In still another aspect, a specific embodiment of the present invention provides an electronic device including a screen, and a plurality of light emitting diodes according to any one of claims 8-11 are disposed under the screen. By providing a plurality of light-emitting diodes according to any one of claims 8-11, the strength of the light-emitting diodes is increased, and the risk of LED breakage is reduced.
在一个可能的设计中，所述电子设备为手机。所述手机中设置了多个如权利要求8-11任一项所述的发光二极管，从而提高了手机中发光二极管的强度，降低手机的LED断裂的风险。In one possible design, the electronic device is a cell phone. The light-emitting diode according to any one of claims 8-11 is disposed in the mobile phone, thereby improving the intensity of the light-emitting diode in the mobile phone and reducing the risk of LED breakage of the mobile phone.
在一个可能的设计中，所述电子设备为平板电脑。所述平板电脑中设置了多个如权利要求8-11任一项所述的发光二极管，从而提高了平板电脑中发光二极管的强度，降低平板电脑的LED断裂的风险。In one possible design, the electronic device is a tablet. The tablet computer is provided with a plurality of light emitting diodes according to any one of claims 8-11, thereby improving the intensity of the light emitting diodes in the tablet computer and reducing the risk of LED breakage of the tablet computer.
在一个可能的设计中，所述电子设备为电脑。所述电脑中设置了多个如权利要求8-11任一项所述的发光二极管，从而提高电脑中发光二极管的强度，降低电脑的LED断裂的风险。In one possible design, the electronic device is a computer. The computer is provided with a plurality of light-emitting diodes according to any one of claims 8-11, thereby improving the intensity of the light-emitting diodes in the computer and reducing the risk of LED breakage of the computer.
图1为本发明实施例提供的一种电子设备的显示结构示意图；FIG. 1 is a schematic diagram of a display structure of an electronic device according to an embodiment of the present disclosure;
图2为本发明具体实施例提供的一种LED本体；2 is an LED body according to an embodiment of the present invention;
图3为本发明具体实施例提供的一种LED注塑方法；3 is an LED injection molding method according to an embodiment of the present invention;
图4为本发明具体实施例提供的一种加工示意图； 4 is a schematic view of processing according to a specific embodiment of the present invention;
图5为本发明具体实施例提供的一种填充后的LED。FIG. 5 is a filled LED according to an embodiment of the present invention.
下面通过附图和实施例，对本发明实施例的技术方案做进一步的详细描述。The technical solutions of the embodiments of the present invention are further described in detail below through the accompanying drawings and embodiments.
图1为本发明实施例提供的一种电子设备的显示结构示意图。如图1所示，一种电子设备101，包括液晶显示器(LCD，Liquid Crystal Display,103和发光二极管(LED，Light-Emitting Diode)105。所示LED 105设置在LCD 103的下方，通过LED 105为LCD 103提供光源。所述LED设置在LCD下的一侧，所述LCD下的其它部分还设置了导光板104，通过所述导光板104将LED105发出的光均匀的传导致整个LCD 103的下方。所述LCD 103上还设置了保护玻璃102，以保护LCD 103不受力。FIG. 1 is a schematic diagram of a display structure of an electronic device according to an embodiment of the present invention. As shown in FIG. 1 , an
图2为本发明具体实施例提供的一种LED本体。如图2所示，所述LED本体202上还包括注塑用的浇口201，所述浇口201为凹陷的结构。以避免LED在注塑过程中浇口201的尺寸大于LED本体202的尺寸，从而不便于LED的安装。2 is an LED body according to an embodiment of the present invention. As shown in FIG. 2, the
图3为本发明具体实施例提供的一种LED注塑方法。所述方法用于提供一种更高强度的LED。如图3所示，所述方法包括：FIG. 3 is a schematic diagram of an LED injection molding method according to an embodiment of the present invention. The method is used to provide a higher intensity LED. As shown in FIG. 3, the method includes:
S301确定发光二极管本体，所述确定的发光二极管本体包括注塑浇口，所述注塑浇口为凹陷的缺口。S301 determines a light emitting diode body, the determined light emitting diode body includes an injection gate, and the injection gate is a recessed notch.
所述LED在注塑的过程中，存在浇口，通过所述浇口注塑，使LED封装。为了使浇口部分的尺寸不大于整个LED的尺寸，将浇口部分的尺寸设置为凹陷的结构，以避免浇口可能存在剩余的胶使浇口的尺寸大于整个LED的尺寸。During the injection molding process of the LED, there is a gate through which the LED is packaged by injection molding. In order to make the size of the gate portion not larger than the size of the entire LED, the size of the gate portion is set to a recessed structure to prevent the gate from having the remaining glue so that the size of the gate is larger than the size of the entire LED.
S302将获取的所述发光二极管本体固定。S302 fixes the obtained LED body.
图4为本发明具体实施例提供的一种加工示意图。如图4所示，将LED本体202设置在专用的夹具401中，并使浇口201向上设置。在本发明的具体实施例中，图4所示的例子仅为本发明的一种举例，不用于对本发明的限定。本
发明具体实施例所述的夹具可以是多种形式，只要能将所述LED本体202固定即为本发明具体实施例所述的夹具。在图4所示的例子中，所示LED本体202设置在顶部开口的夹具401中，所示夹具401为顶部开口的矩形框，所述矩形框的尺寸略大于LED本体202的尺寸。在本发明的具体实施例中，所示浇口也可以被所述夹具401固定在任意方向。FIG. 4 is a schematic view of a process according to an embodiment of the present invention. As shown in FIG. 4, the
S303对固定后的发光二极管本体的注塑浇口进行填充，以使所述发光二极管上凹陷的缺口通过所述填充的方式设置填充物，所述填充物填充所述凹陷的缺口后，所述填充物不突出所述发光二极管本体的表面。S303 is filled with the injection gate of the fixed LED body, so that the recessed recess on the LED is provided with the filling by the filling manner, and after the filling fills the recess of the recess, the filling The object does not protrude from the surface of the light emitting diode body.
通过将设置了夹具401的LED本体202移动到点胶针头402的下方，使所述点胶针头402与所述浇口201相对应。通过点胶针头402对LED本体202点胶，从而达到浇口201上凹陷的部分被填充，提高LED本体202的强度。并且使所述填充物填充后的LED本体的所述填充物不突出所述发光二极管本体的表面The dispensing
上述通过点胶针头402对浇口201进行点胶仅为本发明具体实施例的一种举例，对所述浇口的填充还可以采用其它任何方法。The above-mentioned dispensing of the
在本发明的具体实施例中，所示点胶针头402浇注的填充物可以是UV无影胶、热固胶、AB胶等多种可用于电子设备填充物体中的任意一种。当所述填充物为UV无影胶时，所述点胶针头402填充后还需要通过UV光进行照射，以使所述填充物固化。In a specific embodiment of the present invention, the filler to be cast by the dispensing
在一个例子中，为了确定合格的产品填充物不突出所述发光二极管本体的表面，所述点胶针头402的一侧还设置了监控设备。所述监控设备用于判断填充后的LED产品是否合格。例如，所述监控设备为照相监控设备，所述照相监控设备在完成一个LED的填充后，对LED照相。对填充后的照相的结果与填充前的照相的结果进行比较。当填充后的LED的照片的轮廓尺寸与填充前的LED的照片的轮廓的尺寸相同，则所述填充后的LED为合格的产品。当填充后的LED
的照片的轮廓尺寸大于填充前的LED的照片的轮廓尺寸，则所述填充后的LED为不合格的产品。In one example, to determine that a qualified product fill does not protrude from the surface of the LED body, a monitoring device is also disposed on one side of the dispensing
图5为本发明具体实施例提供的一种填充后的LED。如图5所示，一种LED产品501，包括LED本体202和填充物502。所述LED本体202如图2所示，所述浇口上设置了填充物502。所述加入填充物后502的LED产品501的轮廓尺寸不大于加入填充物502前的LED本体202的轮廓尺寸。FIG. 5 is a filled LED according to an embodiment of the present invention. As shown in FIG. 5, an
在本发明的具体实施例中，还提供一种如图1所示的电子设备101，所述电子设备101采用了如图5所示的LED产品501。在一个例子中，所述电子设备101可以是手机、平板电脑或电脑中的任意一种或多种。In a specific embodiment of the present invention, there is also provided an
以上所述的具体实施方式，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本发明的具体实施方式而已，并不用于限定本发明的保护范围，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。 The specific embodiments of the present invention have been described in detail with reference to the preferred embodiments of the present invention. All modifications, equivalent substitutions, improvements, etc., made within the spirit and scope of the invention are intended to be included within the scope of the invention.
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| CN201610340758.9 | 2016-05-19 | ||
| CN201610340758.9A CN107403856B (en) | 2016-05-19 | 2016-05-19 | A kind of LED and its manufacturing method and electronic equipment using the LED |
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