CN105437449B - A kind of liquid-state silicon gel injection moulding process and the electronic equipment with display screen - Google Patents
A kind of liquid-state silicon gel injection moulding process and the electronic equipment with display screen Download PDFInfo
- Publication number
- CN105437449B CN105437449B CN201410415541.0A CN201410415541A CN105437449B CN 105437449 B CN105437449 B CN 105437449B CN 201410415541 A CN201410415541 A CN 201410415541A CN 105437449 B CN105437449 B CN 105437449B
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- Prior art keywords
- display screen
- silica gel
- low temperature
- glass cover
- injecting products
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides a kind of liquid-state silicon gel injection moulding process and with the electronic equipment of display screen, including：It will wait for that injecting products coat mold injection Overmolding glue；Injecting products are treated after glue curing molding and carry out low temperature liquid silica gel injection molding, and low temperature is 25 DEG C~80 DEG C.Electronic equipment with display screen, including apparatus casing and display module, display module include glass cover-plate and display screen, the display module be molded using low temperature liquid silica gel, wherein：Display screen is bonded with glass cover-plate, and the width of glass cover-plate is less than the width of display screen；The edge of display screen is fixed on apparatus casing.The width for the ratio display screen that the present invention does the width of glass cover-plate is small, and the edge of fixed display screen is gone to by apparatus casing, it is no longer necessary to print occlusion area in the both sides of glass cover-plate；By carrying out low temperature liquid silica gel injection molding to electronic equipment, can not only ensure not burn out electronic equipment in the environment of low temperature, but also ensure the adhesion strength between silica gel and electronic equipment part.
Description
Technical field
A kind of electronics the present invention relates to field of terminal technology more particularly to liquid-state silicon gel injection moulding process and with display screen is set
It is standby.
Background technology
Currently, in terminal device manufacturing process, the trial of the existing integrated injection molding to silica gel and glass.But due to
The temperature of silica gel injection molding at present is usually 180 DEG C, it is impossible to be used in is afraid of on the product of high temperature；In addition, silica gel curing rate is relatively slow (often
Rule were at 10 minutes or so), the problems such as influencing production capacity, and be particularly easy to fall off, cause assembly failure and apparent flaws.
Invention content
The embodiment of the present invention proposes a kind of liquid-state silicon gel injection moulding process and the electronic equipment with display screen, solves existing
The problem of silica gel injection molding is not used to be afraid of high-temperature product in technology.
An embodiment of the present invention provides a kind of liquid-state silicon gel injection moulding process, include the following steps：
It will wait for that injecting products coat Overmolding glue；
Wait for that injecting products carry out low temperature liquid silica gel injection molding to described after glue curing molding, low temperature is 25 DEG C~80
℃。
It has the beneficial effect that：
The technical solution that the embodiment of the present invention is provided carries out low temperature liquid silica gel injection molding by treating injecting products, can
To realize that the silica gel of the product to being afraid of high temperature is molded.In the environment of low temperature, it not only ensure that not burning out and waited for injecting products, but also ensured
Silica gel and wait for the adhesion strength between injecting products component, it is ensured that product quality and performance.
An embodiment of the present invention provides a kind of electronics with display screen made using above-mentioned liquid-state silicon gel injection moulding process to set
It is standby, including apparatus casing and display module, display module include glass cover-plate and display screen, which utilizes above-mentioned liquid
Silica gel injection moulding process is molded, wherein：
Display screen is bonded with glass cover-plate, and the width of glass cover-plate is less than the width of display screen；
The edge of display screen is fixed on apparatus casing.
It has the beneficial effect that：
The width of the technical solution that the embodiment of the present invention is provided, the ratio display screen that the width of glass cover-plate is done is small, leads to
The edge that apparatus casing removes fixed display screen is crossed, has been abandoned in the prior art in such a way that glass cover-plate removes fixed display screen,
To no longer need to print occlusion area in the both sides of glass cover-plate so that the display area of equipment is outer peripheral to equipment both sides
Distance narrows.
Description of the drawings
Specific embodiments of the present invention are described below with reference to accompanying drawings, wherein：
Fig. 1 shows the flow diagram that liquid-state silicon gel injection moulding process is implemented in the embodiment of the present invention；
Fig. 2 shows liquid-state silicon gel injection moldings in the embodiment of the present invention to make implementation schematic diagram；
Fig. 3 shows that liquid-state silicon gel injection molding makes another schematic diagram implemented in the embodiment of the present invention；
Fig. 4 shows that liquid-state silicon gel injection molding makes another schematic diagram implemented in the embodiment of the present invention；
Fig. 5 shows the structural schematic diagram of the cross section of the electronic equipment with display screen in the embodiment of the present invention；
Fig. 6 shows the enlarged structure schematic diagram of electronic equipment cross section in the embodiment of the present invention；
Fig. 7 shows that electronic equipment makes implementation schematic diagram in the embodiment of the present invention；
Fig. 8 shows that electronic equipment makes another schematic diagram implemented in the embodiment of the present invention；
Fig. 9 shows that electronic equipment makes another schematic diagram implemented in the embodiment of the present invention；
Figure 10 shows in the embodiment of the present invention that electronic equipment completes schematic diagram.
Specific implementation mode
In order to make technical scheme of the present invention and advantage be more clearly understood, below in conjunction with attached drawing to the exemplary of the present invention
Embodiment is described in more detail, it is clear that and the described embodiments are merely a part of the embodiments of the present invention, rather than
The exhaustion of all embodiments.And in the absence of conflict, the feature in the embodiment and embodiment in this explanation can be mutual
It is combined.
Inventor notices during invention：
By taking the display module (LCM, Liquid Crystal Display Module) of liquid crystal display as an example, existing LCM
In the case of energy bearing temperature and guarantee product quality, ordinary temperature is 80 degrees Celsius；And touch screen (TP, Touch Panel)
At present also too high temperature cannot be born because there is circuit in the inside.But silica gel injection temperature is generally 180 used at present
℃.Therefore, it is badly in need of a kind of lower silica gel injection molding manner of temperature.
Against the above deficiency, the embodiment of the present invention proposes a kind of liquid-state silicon gel injection moulding process, is illustrated below.
Fig. 1 shows the flow diagram that liquid-state silicon gel injection moulding process in the embodiment of the present invention is implemented, as shown, can be with
Include the following steps：
Step 101 will wait for that injecting products coat Overmolding glue；
Step 102 treats injecting products progress low temperature liquid silica gel injection molding, the temperature of low temperature after glue curing molding
Degree is 25 DEG C~80 DEG C.
Liquid-state silicon gel (LSR, Liquid Silicone Rubber) is a kind of flexible thermal of nontoxic, heat-resisting, high restoration
Thermoset material.Liquid-state silicon gel injection moulding process is generally：The work of LSR feeders is by component A and B component with accurate 1: 1 ratio
It is sufficiently mixed, and because part formulations are colored designs, it is possible to be furnished with color pump group and color metering section.A+B components add
Enter plasticizing system after adding agent, color etc. to be sufficiently mixed.This plasticized screw has the function of homogenizing, mixing simultaneously, passes through spiral shell
Mixture is injected into mold heat by bar, and for the embodiment of the present invention at 25 DEG C~80 DEG C of mould temperature, silica gel is cured reaction.It can be with
Using horizontal liquid silica gel formation system, vertical liquid-state silicon gel shaping machine set, the invention is not limited in this regard can also be used.
And it is directed to the product with circuit or category of glass, such as the mobile terminal etc. with glass cover-plate, by taking touch screen as an example,
When carrying out glue molding to the LCM modules being bonded entirely using room temperature silica gel press moulding mode, have the disadvantages that：
1) without elasticity, the characteristic of protective glass product and screen is lost；
2) hardening time is too long, about 12~24 hours or so, does not allow on normal production line；
3) molding precision is inadequate, has an impact to appearance after assembling, while can not also reach the purpose of protection screen.
Therefore, the embodiment of the present invention can also be implemented with the following method.
In implementation, low temperature can be 70 DEG C~80 DEG C.
In implementation, the thickness of silica gel can be 0.3mm~0.4mm after progress low temperature liquid silica gel injection molding.
The embodiment of the present invention can also use following method to carry out in order to enable silica gel is combined more preferable with injecting products are waited for
Implement.
In implementation, which can be that active active glue is played at 70 DEG C~80 DEG C.
It is disconnected can to activate glass when injecting products are glass material by using active glue for the embodiment of the present invention
Face, to improve adhesive property.
It, can be by waiting for that injecting products carry out ultraviolet light (UV, Ultraviolet to what is applied glue in implementation
Rays) light irradiates solidified glue.
Due to being coated with active glue on waiting for injecting products, when temperature reaches 70 DEG C~80 DEG C or so, the work can be excited
Property glue activity, ensure to wait for bonding force between injecting products and silica gel, ensure the quality and performance that wait for injecting products.
In implementation, wait for that injecting products can be with circuit glass product, the product with display screen, band circuit plastic cement products etc.
Deng, wherein band circuit plastic cement products can be further oolemma circuit plastic cement products.
In force, since the said goods are more commonly used, mainstream, it is easy to it will be appreciated by those skilled in the art that so here only
It is illustrated by taking the said goods as an example；But the embodiment of the present invention provided wait for that injecting products can also be other kinds of
Product, such as polyethylene terephthalate (PET, polyethylene terephthalate) product etc., the said goods
It is only used for how introduction those skilled in the art specifically implement the present invention, but is not intended to be only limitted to the said goods.
In implementation, wait for that injecting products may include the display module being bonded by display screen and glass cover-plate.
In implementation, it can be to treat injecting products by mold to treat injecting products and carry out the injection molding of low temperature liquid silica gel
Display module carries out low temperature liquid silica gel injection molding.
In implementation, it can be to treat injecting products by mold to treat injecting products and carry out the injection molding of low temperature liquid silica gel
Display module carries out low temperature liquid silica gel injection molding with the apparatus casing for waiting for injecting products.
In general, in industrial production to be molded, be blow molded, squeeze out, die casting or the methods of forging forming, smelting, punching press obtain
The various moulds and tool of required product, referred to as mold.In brief, mold is the tool for formed article, this work
Tool is made of various parts, and different molds is made of different parts.
In implementation, the precision after the injection molding of low temperature liquid silica gel can be less than or equal to 0.1mm.
The low temperature liquid silica gel of the embodiment of the present invention exactly uses low temperature moulding, thickness 0.3-0.4mm, after the completion of molding
The fitting tolerance of screen and glass cover-plate is just absorbed, ensures surface uniform gap after finishing assembly, meets normal production
It is required that.Therefore, the technical solution that the embodiment of the present invention is provided can be used for that there are the requirements such as narrow frame, Rimless or waterproof
Terminal device, screen protection waterproof precision can be improved, to realize to a very small extent solve shatter-resistant protection problem.
Below for including the mobile phone for the display module being bonded by display screen and glass cover-plate, liquid-state silicon gel is noted
Modeling makes the process implemented and illustrates.
1) 70 DEG C of active glues are coated in one figure of the outer edge of display module, as shown in Figure 2；
2) pass through 7 seconds UV light irradiation after, glue curing, then can place 7 days (or referred to as 168 hours) with
Interior, glue performance can be activated by being molded in 7 days (or referred to as 168 hours), as shown in Figure 3；
3) silica gel injection molding is carried out below 70-80 DEG C of environment Celsius, ensures product quality and performance, as shown in Figure 4.
After mold injection, ensureing that the circuit of screen and touch screen is not affected by temperature, while also ensureing 30 degree firmly
The elastic property of silica gel is spent, because with the presence of the activity of glue, binding force between silica gel and screen is also enough powerful, will not
It falls off.
An embodiment of the present invention provides a kind of low temperature (70 DEG C -80 DEG C) silica gel and with circuit glass plate, silica gel and screen etc.
The combination of glass electronic component, technical solution through the invention can reach 80 DEG C of condition moldings, can be applied to
On the products such as band circuit and display screen, curing rate only has 5 minutes, and production capacity doubles.Because in display screen and glass cover
Edges of boards edge is coated with active glue, when temperature reaches 70 DEG C~80 DEG C or so, can excite its activity, ensure category of glass product and silicon
Bonding force between glue.Both it ensure that and do not burnt out screen and TP cablings, while having in turn ensured between silica gel and glass cover-plate, TP
Adhesion strength, it is ensured that product quality and performance.
Based on same inventive concept, made using above-mentioned liquid-state silicon gel injection moulding process an embodiment of the present invention provides a kind of
Electronic equipment with display screen, is illustrated below.
Fig. 5 shows that the structural schematic diagram of the cross section of electronic equipment of the embodiment of the present invention with display screen, Fig. 6 are shown
The enlarged diagram of the cross section, as shown, may include：Apparatus casing 1 and display module, display module include glass cover
Plate (also referred to as glass panel) 201 and display screen 202, display module are molded using above-mentioned low temperature liquid silica gel, wherein：
Display screen 202 is bonded with glass cover-plate 201, and the width of glass cover-plate 201 is less than the width of display screen 202；
The edge of display screen 202 is fixed on apparatus casing 1.
In implementation, it may further include：Be bonded with display screen display screen fixing bracket (or referred to as backboard fix branch
Frame) 3, display module is fixed on display screen fixing bracket 3.
The so-called display screen fixing bracket of the embodiment of the present invention can be one piece of stainless steel plate, and thickness can be 0.5 millimeter
Etc..
It is to be easy to people in the art since which is more commonly used, mainstream to use the modes such as stainless steel plate in force
Member's use/understanding, so here by taking stainless steel plate as an example；But use other modes also possible in theory, as long as
It can realize that the purpose of fixed display screen, stainless steel plate are only used for how introduction those skilled in the art specifically implement this hair
It is bright, but be not intended to be only capable of to use stainless steel plate, can be needed in conjunction with practice in implementation process determine corresponding material and
Thickness etc..
In implementation, display screen can be light emitting diode (LED, Light Emitting Diode) display screen, liquid crystal
Display screen (LCD, Liquid Crystal Display) or organic electric exciting light-emitting diode (OLED, Organic Light-
Emitting Diode) etc..
By taking LCM display screens as an example, ratio liquid crystal display LCD display modules that the embodiment of the present invention makees glass cover-plate
(LCM, LCD Module) is small, fixes the edge of display screen by apparatus casing in this way, without passing through glass cover using conventional
Plate removes fixed display screen.Due to being gone in the mode of fixed display screen with glass cover-plate in the prior art, display screen and glass cover-plate
The side at least tolerance of 1mm, and glass cover-plate has the tolerance of 1.2mm to apparatus casing.Therefore, implemented using the present invention
This mode that example is provided, unilateral side can save the width of 2.2mm, and equipment may dispense with the width of 4.4mm on the whole, no
The printing in the both sides of glass cover-plate is needed to block (black or white) region again so that outside the display area of equipment to equipment both sides
The distance at edge narrows.Thus, it is possible to allow the on-screen display (osd) area bigger of electronic equipment, or the electronics of more large screen can be allowed
Equipment is narrower, and grip feeling is more preferable.
The embodiment of the present invention uses Rimless technology, and frame referred herein refers in the prior art the two of glass cover-plate
The occlusion area of side printing, all display areas in glass cover-plate region in the embodiment of the present invention.In terms of the front of equipment, left and right
Both sides are that frame does not have very narrow borders in other words.The embodiment of the present invention can be hidden the circuit of display screen by silica gel
Gear, either by the upper surface of line routing device (in terms of front) of display screen or below extraction, block electronics without frame
The left and right sides of equipment, and then achieve the purpose that Rimless or narrow frame.
Since electronic equipment provided in an embodiment of the present invention uses above-mentioned liquid-state silicon gel injection moulding process, pass through low temperature liquid
Silica gel forming technique protects display screen, realizes shatter-resistant, the purpose of antistatic, waterproof.Low temperature liquid used in the embodiment of the present invention
Silica gel be exactly using low temperature moulding and generation silica gel thickness 0.3mm~0.4mm (namely more than or equal to 0.3mm, be less than or equal to
0.4mm), the fitting tolerance of screen and glass cover-plate is just absorbed after the completion of molding, precision can guarantee within 0.1mm.
Guarantee shows uniform gap after finishing assembly, meets normal production requirement.
In implementation, electronic equipment can be the equipment such as mobile phone, tablet computer or electronic watch.
By taking mobile phone as an example, mobile phone glass cover board, display screen or the glass cover being bonded entirely may be implemented in the embodiment of the present invention
Plate and display screen, the combination with silica gel.So that glass cover-plate and display screen circuit are within the temperature range of can bear
It is molded, and is absorbed into the assembling tolerance of display screen and glass cover-plate, assembly clearance is accomplished into minimum, it is real in 0.4mm
Now protection screen antidetonation test.
The production method that liquid-state silicon gel injection molding is carried out to electronic equipment an embodiment of the present invention provides two kinds：
One, by glass cover-plate 201 and display screen 202, this whole (namely display module) is molded into using liquid-state silicon gel
Type carries out liquid-state silicon gel injection molding around display module；
And for common silica gel etc. or glass cover-plate then may be used between glass cover-plate 201 and display screen 202
201 be exactly coherent, the invention is not limited in this regard when usually being provided by producer with display screen 202
Two, the embodiment of the present invention can also by glass cover-plate 201 and display screen 202 this whole (namely display module) with
Apparatus casing 1 is fixed using liquid-state silicon gel forming technique.
Certainly, in implementation, both the above mode can also be combined, that is, by glass cover-plate 201 and display screen
After 202 this whole surrounding's liquid-state silicon gel molding, display module and apparatus casing 1 are further subjected to secondary liquid silica gel again
Molding.
Below for carrying out liquid-state silicon gel molding to display module, make and implement explanation.
1) display screen 202 has been bonded by jig and mold glass cover-plate 201 display module carry out liquid-state silicon gel at
Type, as shown in Figure 7；
2) display module for completing molding is packed into from the back side of apparatus casing 1, as shown in figure 8, being laid flat, installing；
3) display screen fixing bracket 3 is packed into from the back side of apparatus casing 1, as shown in figure 9, display module to be compacted and glue
Patch fixes；
4) as shown in Figure 10 from the design sketch in terms of equipment front after completing.
Although preferred embodiments of the present invention have been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the scope of the invention.
Claims (8)
1. a kind of liquid-state silicon gel injection moulding process, which is characterized in that include the following steps：
It will wait for that injecting products coat mold injection Overmolding glue；The glue is active in 70 DEG C~80 DEG C performances
Active glue；
After the glue curing molding after to it is described wait for injecting products carry out low temperature liquid silica gel injection molding, the low temperature be 70 DEG C~
80℃；The thickness of the silica gel is 0.3mm~0.4mm；Precision after the injection molding of low temperature liquid silica gel is less than or equal to 0.1mm.
2. the method as described in claim 1, which is characterized in that wait for that injecting products curing molding is to pass through ultraviolet (UV) to described
Illumination injection water carrys out curing molding.
3. method as claimed in claim 1 or 2, which is characterized in that described to wait for that injecting products are band circuit glass product, with aobvious
The product of display screen or with circuit plastic cement products.
4. method as claimed in claim 1 or 2, which is characterized in that described to wait for that injecting products include by display screen and glass cover
The display module that plate is bonded.
5. method as claimed in claim 4, which is characterized in that wait for that injecting products carry out low temperature liquid silica gel injection molding tool to described
Body is to carry out low temperature liquid silica gel injection molding to the display module for waiting for injecting products.
6. method as claimed in claim 4, which is characterized in that wait for that injecting products carry out low temperature liquid silica gel injection molding tool to described
Body is to carry out low temperature liquid silica gel note to the display module for waiting for injecting products and the apparatus casing for waiting for injecting products
Modeling.
7. a kind of utilizing the electronic equipment with display screen made such as any the method for claim 1 to 6, which is characterized in that
Including apparatus casing and display module, the display module includes glass cover-plate and display screen, and the display module is using such as
Any the method for claim 1 to 6 is molded, wherein：
The display screen is bonded with glass cover-plate, and the width of the glass cover-plate is less than the width of the display screen；
The edge of the display screen is fixed on the apparatus casing.
8. electronic equipment as claimed in claim 7, which is characterized in that further comprise：The display being bonded with the display screen
Shield fixing bracket, the display module is fixed on display screen fixing bracket.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410415541.0A CN105437449B (en) | 2014-08-21 | 2014-08-21 | A kind of liquid-state silicon gel injection moulding process and the electronic equipment with display screen |
| PCT/CN2015/086612 WO2016026398A1 (en) | 2014-08-21 | 2015-08-11 | Liquid silicone rubber injection molding method and electronic device with display screen |
| HK16110140.0A HK1221939A1 (en) | 2014-08-21 | 2016-08-25 | Injection molding method for liquid silicone and electronic device having display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410415541.0A CN105437449B (en) | 2014-08-21 | 2014-08-21 | A kind of liquid-state silicon gel injection moulding process and the electronic equipment with display screen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105437449A CN105437449A (en) | 2016-03-30 |
| CN105437449B true CN105437449B (en) | 2018-08-24 |
Family
ID=55350190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410415541.0A Active CN105437449B (en) | 2014-08-21 | 2014-08-21 | A kind of liquid-state silicon gel injection moulding process and the electronic equipment with display screen |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN105437449B (en) |
| HK (1) | HK1221939A1 (en) |
| WO (1) | WO2016026398A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106982272B (en) * | 2017-03-21 | 2020-03-13 | Oppo广东移动通信有限公司 | Assembling jig and assembling method for display screen assembly |
| CN107364065B (en) * | 2017-08-14 | 2023-11-28 | 深圳市康利邦科技有限公司 | Integrated forming processing technology of curved glass screen protective film and protective film thereof |
| CN109397614A (en) * | 2017-08-16 | 2019-03-01 | 深圳市利勇安硅橡胶制品有限公司 | A kind of waterproof case |
| CN109429457A (en) * | 2017-08-22 | 2019-03-05 | 北京小米移动软件有限公司 | Electronic equipment and its screen adhesive bonding method |
| CN107861566B (en) * | 2017-10-31 | 2022-09-13 | 维沃移动通信有限公司 | Mobile terminal |
| CN110377185B (en) * | 2019-08-08 | 2022-09-20 | 业成科技（成都）有限公司 | Method for attaching curved cover plate and display panel, display screen and electronic equipment |
| CN111290668B (en) * | 2020-01-13 | 2024-01-26 | 广西中沛光电科技有限公司 | IML injection molding integrated capacitive touch screen |
| CN112652254B (en) * | 2020-09-11 | 2022-09-20 | 和辉(深圳)液晶显示技术有限公司 | Anti-electromagnetic interference low-temperature-resistant liquid crystal display screen |
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| CN102332231A (en) * | 2011-10-26 | 2012-01-25 | 中国兵器工业集团第二一四研究所苏州研发中心 | Technology for hybrid integration of multi-chip thick film printed circuit board (PCB) and light-emitting diode (LED) flat plate display |
| CN103059322A (en) * | 2011-10-21 | 2013-04-24 | 深圳富泰宏精密工业有限公司 | Method for jointing aluminum piece and resin and complex body prepared by utilizing same |
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| JPS62207611A (en) * | 1986-03-06 | 1987-09-12 | Toray Silicone Co Ltd | Injection molding of liquid silicone rubber composition |
| CN101048448A (en) * | 2004-10-25 | 2007-10-03 | 南农股份公司 | Method of producing a silicone rubber item and the product obtainable by the method |
| CN102044535B (en) * | 2009-10-26 | 2012-08-08 | 佛山市国星光电股份有限公司 | Surface mounted device (SMD) light emitting diode (LED) device and display module thereof for outdoor display screen |
| CN102157634B (en) * | 2011-01-19 | 2012-10-24 | 木林森股份有限公司 | Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber |
| CN102364219A (en) * | 2011-07-21 | 2012-02-29 | 上海西虹桥光电科技有限公司 | Plastic-sealed light emitting diode (LED) module lamp string and production process thereof |
| CN204156912U (en) * | 2014-08-21 | 2015-02-11 | 阿里巴巴集团控股有限公司 | A kind of electronic equipment with display screen |
-
2014
- 2014-08-21 CN CN201410415541.0A patent/CN105437449B/en active Active
-
2015
- 2015-08-11 WO PCT/CN2015/086612 patent/WO2016026398A1/en active Application Filing
-
2016
- 2016-08-25 HK HK16110140.0A patent/HK1221939A1/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103059322A (en) * | 2011-10-21 | 2013-04-24 | 深圳富泰宏精密工业有限公司 | Method for jointing aluminum piece and resin and complex body prepared by utilizing same |
| CN102332231A (en) * | 2011-10-26 | 2012-01-25 | 中国兵器工业集团第二一四研究所苏州研发中心 | Technology for hybrid integration of multi-chip thick film printed circuit board (PCB) and light-emitting diode (LED) flat plate display |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1221939A1 (en) | 2017-06-16 |
| CN105437449A (en) | 2016-03-30 |
| WO2016026398A1 (en) | 2016-02-25 |
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