CN107390482B - The stripping means of anticorrosive additive stripping liquid controlling and resist - Google Patents
The stripping means of anticorrosive additive stripping liquid controlling and resist Download PDFInfo
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- CN107390482B CN107390482B CN201710610215.9A CN201710610215A CN107390482B CN 107390482 B CN107390482 B CN 107390482B CN 201710610215 A CN201710610215 A CN 201710610215A CN 107390482 B CN107390482 B CN 107390482B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
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Abstract
The issue of the present invention is to provide the stripping means of a kind of anticorrosive additive stripping liquid controlling and resist, the anticorrosive additive stripping liquid controlling is the anticorrosive additive stripping liquid controlling for removing resist from the substrate for having metal wiring and/or metal oxide film, the fissility of the anticorrosive additive stripping liquid controlling is excellent, the adhesion amount again for the resist removed is few, and defoaming is also excellent.A kind of anticorrosive additive stripping liquid controlling, it is characterized in that, it contains the sulfonic acid that (A) amine, (B) organic solvent and (C) weight average molecular weight are 5000~1000000 or carboxylic acid or their salt, (C) content of ingredient is 5.0 weight % or less, content without containing (D) water, or containing (D) water and (D) ingredient is 60 weight % or less.
Description
Technical field
The present invention relates to the stripping means of anticorrosive additive stripping liquid controlling and resist.
Background technique
Semiconductor substrate etc. has the electrode structure for implementing fine wiring, and resist is used in its manufacturing process.
About thin film transistor (TFT) (TFT), it is known that the electrode knot for being composed the metal wirings such as the oxide semiconductor films such as IGZO and copper
Structure.Electrode structure for example manufactures as follows: on the oxide semiconductor films such as the metal wirings such as the copper being formed on substrate or IGZO
Be coated with resist, it is implemented exposure, development processing and form resist pattern, it is right using the resist pattern as mask
After conductive metal layer or oxide semiconductor film etc. are etched, removed with anticorrosive additive stripping liquid controlling unwanted against corrosion
Thus agent is manufactured.
Such as a kind of composition is proposed in patent document 1, it is half water-soluble removing and cleaning combination, contains spy
Quantitative aminobenzenesulfonic acid, water Combination organic solvent and water.But the composition recorded in patent document 1 is for having
There are following problems when the removing of the resist on the substrate of metal wiring and/or metal oxide film: once being stripped
Resist can be attached to again on the substrate for having metal wiring and/or metal oxide film.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2009-224782 bulletin
Summary of the invention
Problems to be solved by the invention
The purpose of the present invention is to provide a kind of anticorrosive additive stripping liquid controlling, for for by resist from having metal wiring
And/or the anticorrosive additive stripping liquid controlling of the substrate removing of metal oxide film, the fissility of the anticorrosive additive stripping liquid controlling is excellent, is removed
The adhesion amount again of resist is few, and defoaming is also excellent.
Solution for solving the problem
Present inventor has performed further investigations, as a result, it has been found that, in the anticorrosive additive stripping liquid controlling containing amine and organic solvent, make
Use specific quantity sulfonic acid or carboxylic acid below with specific weight average molecular weight or their salt as Anti-adhesion agent again, and
Specific quantity is adjusted to hereinafter, to can be obtained while with excellent fissility, institute not comprising water, or by the content of water
The adhesion amount again of the resist of removing is few, defoaming also excellent anticorrosive additive stripping liquid controlling, has thus completed the present invention.
That is, anticorrosive additive stripping liquid controlling of the invention is characterized in that, contain:
(A) amine,
(B) organic solvent and
(C) sulfonic acid or carboxylic acid or their salt that weight average molecular weight is 5000~1000000,
(C) content of ingredient be 5.0 weight % hereinafter,
Content without containing (D) water, or containing (D) water and (D) ingredient is 60 weight % or less.
In anticorrosive additive stripping liquid controlling of the invention, (C) ingredient is preferably polyaniline sulfonic acid, polystyrolsulfon acid or polyacrylic acid
Or their salt.
In anticorrosive additive stripping liquid controlling of the invention, the content of (C) ingredient is preferably 0.0025 weight of weight %~5.0 %.
In anticorrosive additive stripping liquid controlling of the invention, preferably (A) ingredient is alkanolamine, and the content of (A) ingredient is 1 weight %~40
Weight %.
Anticorrosive additive stripping liquid controlling of the invention preferably further contains (D) water, the weight ratio of (B) ingredient and (D) ingredient ((B):
It (D)) is 0.2:1~70:1.
Anticorrosive additive stripping liquid controlling of the invention is preferred for the resist that removing has copper and/or the substrate of IGZO.
The stripping means of resist of the invention is by resist from the base for having metal wiring and/or metal oxide film
The method of material removing, which is characterized in that use anticorrosive additive stripping liquid controlling of the invention.
In the stripping means of resist of the invention, preferably the material of metal wiring is copper, the material of metal oxide film
For IGZO.
The effect of invention
Anticorrosive additive stripping liquid controlling of the invention is due to containing the specific quantity sulfonic acid or carboxylic below with specific weight average molecular weight
Acid or their salt do not include water as Anti-adhesion agent again, or the content of water is adjusted to specific quantity hereinafter, because
While with excellent fissility, the adhesion amount again for the resist removed is few, and defoaming is also excellent for this.
Specific embodiment
<<anticorrosive additive stripping liquid controlling>>
Anticorrosive additive stripping liquid controlling of the invention is characterized in that, is contained:
(A) amine,
(B) organic solvent and
(C) sulfonic acid or carboxylic acid or their salt that weight average molecular weight is 5000~1000000,
(C) content of ingredient be 5.0 weight % hereinafter,
Content without containing (D) water, or containing (D) water and (D) ingredient is 60 weight % or less.The anticorrosive additive stripping liquid controlling
It is preferred for the resist that removing has copper and/or the substrate of IGZO.
<(A) amine>
As (A) amine (being hereinafter also referred to as (A) ingredient), it is not particularly limited, it can be cited for example that N- methyl ethanol
Amine, monoethanolamine, monomethyl diethanol amine, triethanolamine, monomethylamine, mono aminoethane, propylamine, butylamine, 2 ethyl hexylamine, 2- ethyl
Hexyloxy propylamine, 2- ethoxy propylamine, dimethylamine, diethylamine, di-n-propylamine, dibutyl amine, trimethylamine, triethylamine, tripropyl amine (TPA), three fourths
Amine, 3- diethyl amino propylamine, two -2 ethyl hexylamines, dibutyl amino propyl amine, tetramethylethylenediamine, tri-n-octyl amine, tertiary fourth
Amine, sec-butylamine, methylaminopropylamine, dimethylamino propylamine, methyl-imino double propylamine, 3 methoxypropyl amine, allylamine, two
Allylamine, triallylamine, isopropylamine, diisopropylamine, imino group propylamine, iminobispropylamine, ethylenediamine, diethylenetriamines,
Trien, tetren, penten, N, N- dimethylethanolamine, N, N- diethyl ethylene diamine, amino
Ehtylethanolamine, N- methyl-N, N- diethanol amine, N, N- dibutylethanolamine, N- methylethanolamine, 3- amino -1- propyl alcohol, N,
Bis- (2- ethoxy) cyclohexylamine of N- etc..Among these, from resist fissility aspect, preferably alkanolamine, more preferable N-
Methylethanolamine (MMA), monoethanolamine (MEA), monomethyl diethanol amine (MDA), triethanolamine (TEA).These (A) ingredients can
To be used alone, can also be shared two or more.
In anticorrosive additive stripping liquid controlling of the invention, the content of (A) ingredient is not particularly limited, preferably 1 weight of weight %~40
Measure %, more preferably 5 weight of weight %~25 %.If the content of (A) ingredient is less than 1 weight %, resist fissility is sometimes
It can reduce, if viscosity increases, it some times happens that the unfavorable condition in operation more than 40 weight %.
<(B) organic solvent>
As (B) organic solvent (being hereinafter also referred to as (B) ingredient), it is not particularly limited, it can be cited for example that acetone,
Unary alcohol (for example, methanol, ethyl alcohol etc.), glycols are (for example, ethylene glycol, diethylene glycol, diethylene glycol monomethyl ether, diethyl two
Alcohol list ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, propylene glycol, propylene glycol monomethyl ether, dipropylene glycol etc.), pyrrolidones
Class (for example, n-methyl-2-pyrrolidone etc.), amides are (for example, n,N-dimethylacetamide, n,N-Dimethylformamide
Deng), nitrile (for example, acetonitrile etc.), sulfoxide type (for example, dimethyl sulfoxide etc.), sulfone class (for example, sulfolane etc.), carbonic acid Asia second
Ester etc..Among these, from resist fissility aspect, it is preferably selected from and is made of glycols, sulfoxide type and amides
At least one of group, more preferable diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether.These (B) ingredients
It can be used alone, can also be shared two or more.
In anticorrosive additive stripping liquid controlling of the invention, the content of (B) ingredient is not particularly limited, from resist fissility etc.
It sets out, preferably 10 weight of weight %~95 %, more preferably 15 weight of weight %~90 %, further preferably 25 weight %
~80 weight %.
<sulfonic acid or carboxylic acid or their salt that (C) weight average molecular weight is 5000~1000000>
Anticorrosive additive stripping liquid controlling of the invention contain (C) weight average molecular weight be 5000~1000000 sulfonic acid or carboxylic acid or
Their salt (being hereinafter also referred to as (C) ingredient) is used as Anti-adhesion agent again, thus while with excellent fissility,
The adhesion amount again for the resist removed is few.
As the sulfonic acid for being used as (C) ingredient, it is not particularly limited, it can be cited for example that polyaniline sulfonic acid, polystyrene sulphur
Acid, styrene/Styrene Sulfonic Acid Copolymer, poly- { 2- (methyl) Acryloyl amino -2,2- dimethyl ethanesulfonic acid }, 2- (methyl)
Acryloyl amino -2,2- dimethyl ethanesulfonic acid/styrol copolymer, 2- (methyl) Acryloyl amino -2,2- dimethyl second
Sulfonic acid/acrylamide copolymer, 2- (methyl) Acryloyl amino -2,2- dimethyl ethanesulfonic acid/(methyl) acrylic copolymer,
2- (methyl) Acryloyl amino -2,2- dimethyl ethanesulfonic acid/(methyl) acrylic acid/acrylamide copolymer, 2- (methyl) third
Enoylamino -2,2- dimethyl ethanesulfonic acid/styrene/acrylamide copolymer, 2- (methyl) Acryloyl amino -2,2- two
Methyl ethanesulfonic acid/styrene/(methyl) acrylic copolymer, naphthalene sulfonic acid-formaldehyde condensation product, condensation compound of methyl naphthalene sulfonic acid and formaldehyde, two
Condensation compound of methyl naphthalene sulfonic acid and formaldehyde, rylnthracene sulfonin formaldehyde condensation products, melamine sulfonic formaldehyde condensation compound, anilinesulfonic acid-phenol-first
Aldehyde condensate etc..It as carboxylic acid, is not particularly limited, aliphatic carboxylic acid can be enumerated, the polymer of aromatic carboxylic acid, for example gathered
Acrylic acid, poly, acrylic acid/maleic acid etc..These sulfonic acid and carboxylic acid may be copolymer, such as can be
Acrylic acid/sulfonic acid copolymer.In addition, being not particularly limited as the cation with these sulfonic acid or carboxylic acid forming salt, Ke Yiju
Out such as alkali metal, alkaline-earth metal, organic amine.Among these, from the adhesion amount again for copper or IGZO etc. it is few in terms of go out
Hair, preferably polyaniline sulfonic acid, polystyrolsulfon acid or polyacrylic acid or their salt, it is excellent from inhibition blistering etc.
Select polyaniline sulfonic acid.These (C) ingredients can be used alone, and can also share two or more.
(C) weight average molecular weight of ingredient is not particularly limited as long as being 5000~1000000, preferably 10000~
75000.If the weight average molecular weight of (C) ingredient, less than 5000, adhesion amount will increase resist sometimes again.
In anticorrosive additive stripping liquid controlling of the invention, the content of (C) ingredient does not limit especially as long as 5.0 weight % or less
It is fixed, preferably 0.0025 weight of weight %~5.0 %, more preferably 0.025 weight of weight %~1.0 %.If (C) ingredient contains
Amount is less than 0.0025 weight %, then attachment inhibition effect is sometimes low again for resist, if more than 5.0 weight %, resist removing
Property reduces sometimes.
Anticorrosive additive stripping liquid controlling of the invention can optionally contain other compositions other than above-mentioned (A)~(C) ingredient.Make
It for other compositions, is not particularly limited, (D) water, corrosion inhibitor, pH adjusting agent, defoaming agent etc. can be enumerated.They can individually make
With can also share two or more.
<(D) water>
Anticorrosive additive stripping liquid controlling of the invention can also not contain (D) water (being hereinafter also referred to as (D) ingredient), from the liquid longevity
Life (liquid ラ イ Off) etc. is set out, and (D) ingredient is preferably further contained.
In the case where anticorrosive additive stripping liquid controlling of the invention contains (D) ingredient, content is as long as 60 weight % or less
It is not particularly limited, preferably 40 weight % or less, more preferably 30 weight % or less.If the content of (D) ingredient is more than 60 weights
% is measured, then fissility reduces sometimes.It should be noted that in the case where containing (D) ingredient, to the content of (D) ingredient
Lower limit value is not particularly limited, such as can be 0.5 weight %, or 1 weight %.
In the case where anticorrosive additive stripping liquid controlling of the invention contains (D) ingredient, the weight ratio of (B) ingredient and (D) ingredient
((B): (D)) is not particularly limited, preferably 0.2:1~70:1.If the weight ratio of (B) ingredient is less than relative to (D) ingredient 1
0.2, then resist fissility reduces sometimes, if fluid life declines sometimes relative to (D) ingredient 1 more than 70.
<corrosion inhibitor>
In the case where anticorrosive additive stripping liquid controlling of the invention contains corrosion inhibitor, content is not particularly limited, from resist
Fissility etc. sets out, preferably 0.01 weight of weight %~1.0 %.
Anticorrosive additive stripping liquid controlling of the invention using conventional method by above-mentioned (A)~(C) ingredient and optionally by being contained
Other compositions mixing and obtain.
<<stripping means of resist>>
The stripping means of resist of the invention is by resist from the base for having metal wiring and/or metal oxide film
The method of material removing, which is characterized in that use anticorrosive additive stripping liquid controlling of the invention.As using anticorrosive additive stripping liquid controlling of the invention
The method that resist is removed from the substrate for having metal wiring and/or metal oxide film, is not particularly limited, can enumerate
Such as: the substrate that will be provided with metal wiring and/or metal oxide film is impregnated into method in anticorrosive additive stripping liquid controlling of the invention；
Ultrasonic wave mode, spray mode, spray pattern, brush mode, dipping shake, one chip etc..Anticorrosive additive stripping liquid controlling of the invention
It can be used for the stripping means of eurymeric, any photoresist in minus.
The material of metal wiring is not particularly limited, it can be cited for example that copper, aluminium, titanium, molybdenum, chromium, tungsten etc..Among these,
From electric conductivity aspect, preferably copper.
The material of metal oxide film is not particularly limited, it can be cited for example that IGZO (indium gallium zinc), IGO (oxidation
Indium gallium), ITO (tin indium oxide), IZO (indium zinc oxide), GZO (gallium oxide zinc), ZTO (zinc-tin oxide), ZnO (zinc oxide), ZAO
(zinc oxide aluminum) etc..Among these, from the aspect for preventing resist from adhering to again, preferably IGZO.
Resist of the invention is used in the manufacture of the TFT with the metal wirings such as the metal oxide films such as IGZO and copper
In the case where stripper, it is preferable to use to the resist of metal oxide film, the metal wiring both sides few resist of adhesion amount again
Stripper.In this case, the removing of resist can be implemented more than twice, in the case where implementing more than twice, specifically,
By resist after the strippable substrate with metal oxide film (metal wiring), metal is formed using other Etching masks
Wiring (metal oxide film), by resist from the strippable substrate with metal oxide film and metal wiring.At this point it is possible to
Anticorrosive additive stripping liquid controlling of the invention is used in whole resist stripping process, this hair can also be used in any stripping process
Bright anticorrosive additive stripping liquid controlling.
Embodiment
Embodiment is enumerated below and illustrates the present invention, but the present invention is not limited to these embodiments.Hereinafter, as long as no
Special Statement, " part " or " % " refer respectively to " parts by weight " or " weight % ".
1. using material
Materials described below has been used in embodiment below and comparative example.
1-1. (A) ingredient
N- methylethanolamine (MMA)
Monoethanolamine (MEA)
Monomethyl diethanol amine (MDA)
Triethanolamine (TEA)
1-2. (B) ingredient
Diethylene glycol monobutyl ether (BDG)
Diethylene glycol monomethyl ether (MDG)
Diethylene glycol monoethyl ether (EDG)
1-3. (C) ingredient
Polyaniline sulfonic acid (weight average molecular weight 10000)
The formaldehyde condensation products (weight average molecular weight 30000) of melamine sulfonate
Polyacrylic acid (weight average molecular weight 10000)
Naphthalene sulfonic acid-formaldehyde condensation product MEA salt (weight average molecular weight 5600)
Polystyrolsulfon acid (weight average molecular weight 75000)
Polystyrolsulfon acid (weight average molecular weight 1000000)
Additive other than 1-4. (C) ingredient
Anilinesulfonic acid (weight average molecular weight 173)
Polyoxyethylene tridecyl ether (weight average molecular weight 420)
Ethylenediamine tetraacetic polyoxyethylene polyoxypropylene (weight average molecular weight 3500)
Alkyl (C16-18) trimethyl ammonium chloride (weight average molecular weight 348)
Alkyl benzene sulphonate and its salt (weight average molecular weight 322)
Lauryl sodium sulfate (weight average molecular weight 288)
1-5. (D) ingredient
Pure water
2. embodiment and comparative example
(embodiment 1~14, comparative example 1~11)
(A)~(D) ingredient is mixed in the way of reaching weight ratio shown in Tables 1 and 2, obtains resist removing
Liquid.For obtained anticorrosive additive stripping liquid controlling, adhesion amount, fissility, defoaming are had rated again using following methods.As a result it is shown in
Tables 1 and 2.It should be noted that not evaluating about embodiment 6,8,10,11,13,14, comparative example 9~11 for IGZO's
Adhesion amount again.In addition, not evaluating fissility about embodiment 2,4,5,7,9,10,12, Comparative Examples 1 and 2.In addition, about implementation
Example 13,14, comparative example 7~11, do not evaluate defoaming.It should be noted that the viscosity of embodiment 1 is high, workability is difficult.
[table 1]
[table 2]
3. evaluation method
(adhesion amount again)
Into anticorrosive additive stripping liquid controlling obtained in each embodiment and comparative example after the resist solid of addition 1%, use
Respectively by chip obtained by Cu and IGZO film forming on 5 inches of Si substrate, leaching in 1 minute is carried out at normal temperature and is set at (puddle)
Reason.It washed, dried later, using on laser scanning surface dirt somascope (Co., Ltd. TOPCON manufacture) measurement chip
Resist attachment quantity, evaluated according to following four-stages.
◎: less than 500
Zero: 500 more than and less than 1500
△: 1500 more than and less than 2500
×: 2500 or more
(fissility)
Photoresist is formed on the glass substrate with copper film, is etched, by obtained band resist
Substrate as evaluation object.Substrate is impregnated in the anticorrosive additive stripping liquid controlling for being adjusted to 50 DEG C, carries out impregnation in 120 seconds
Afterwards, washing and air blow drying are carried out to substrate.Substrate is observed using optical microscopy (manufacture of Keyence company), is confirmed photic
The removing situation of resist, is evaluated according to following four-stages.
◎: it is stripped completely
Zero: remaining removing microly
△: most removing remains
×: it can not remove completely
(defoaming)
Anticorrosive additive stripping liquid controlling 30ml obtained in each embodiment and comparative example is fitted into the colorimetric cylinder of 100ml, is set to
TS formula vibrator vibrates 2 minutes.Oscillation measures bubble height (mm) after stopping after 1 minute, measured and tied according to following benchmark evaluations
Fruit.It should be noted that bubble height is that, essentially without the generation of bubble, will not produce to the operating of device in 5mm situation below
It is raw to influence；More than 5mm but although bubble can be generated slightly, but not to be generated to the operating of device real in 15mm situation below
The influence of matter.But more than 15mm, a possibility that being had an impact because of the generation of bubble to the operating of device
Greatly.
◎: 0mm
Zero: more than 0mm but being 5mm or less
△: more than 5mm but being 15mm or less
×: more than 15mm
Claims (6)
1. a kind of anticorrosive additive stripping liquid controlling, which is characterized in that it contains:
(A) amine,
(B) organic solvent and
(C) polyaniline sulfonic acid or its salt that weight average molecular weight is 5000~1000000,
The content of the polyaniline sulfonic acid or its salt be 5.0 weight % hereinafter,
The anticorrosive additive stripping liquid controlling further contains (D) water, the content of the water be 60 weight % hereinafter,
The amine is alkanolamine, and the content of the alkanolamine is 1 weight of weight %~40 %.
2. anticorrosive additive stripping liquid controlling as described in claim 1, wherein the content of the polyaniline sulfonic acid or its salt is 0.0025 weight
Measure the weight of %~5.0 %.
3. anticorrosive additive stripping liquid controlling as claimed in claim 1 or 2, wherein the weight ratio of the organic solvent and the water is
0.2:1~70:1.
4. anticorrosive additive stripping liquid controlling as claimed in claim 1 or 2, is used to remove and has the against corrosion of copper and/or the substrate of IGZO
Agent.
5. a kind of stripping means of resist, for by resist from the substrate for having metal wiring and/or metal oxide film
The method of removing, which is characterized in that use anticorrosive additive stripping liquid controlling described in any one of Claims 1 to 44.
6. the stripping means of resist as claimed in claim 5, wherein the material of metal wiring is copper, metal oxide film
Material be IGZO.
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| JP2016226997 | 2016-11-22 | ||
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| JP2017-111724 | 2017-06-06 | ||
| JP2017111724A JP6249260B1 (en) | 2016-11-22 | 2017-06-06 | Resist stripping solution and resist stripping method |
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| CN107390482B true CN107390482B (en) | 2019-07-09 |
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| JPWO2019111479A1 (en) * | 2017-12-07 | 2020-12-10 | 株式会社Ｊｃｕ | Resist stripper |
| WO2021035673A1 (en) * | 2019-08-30 | 2021-03-04 | Dow Global Technologies Llc | Photoresist stripping composition |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1394357A (en) * | 2000-09-01 | 2003-01-29 | 株式会社德山 | Cleaning solution for removing residue |
| CN105339816A (en) * | 2013-06-28 | 2016-02-17 | 日东电工株式会社 | Polarizing film with adhesive layer, laminate, and image display device |
| CN105358649A (en) * | 2013-06-28 | 2016-02-24 | 日东电工株式会社 | Acrylic adhesive composition, manufacturing method of adhesive layer, polarizing film with adhesive layer, and crosslinking acceleration method of acrylic adhesive composition |
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| US6024895A (en) * | 1995-08-11 | 2000-02-15 | Mitsubishi Rayon Co., Ltd. | Cross-linkable, electrically conductive composition, electric conductor and process for forming the same |
| JP4153718B2 (en) * | 2002-04-23 | 2008-09-24 | 株式会社日本触媒 | Resist stripper |
| JP2012032757A (en) * | 2010-07-06 | 2012-02-16 | Tosoh Corp | Resist stripping agent and stripping method using the same |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1394357A (en) * | 2000-09-01 | 2003-01-29 | 株式会社德山 | Cleaning solution for removing residue |
| CN105339816A (en) * | 2013-06-28 | 2016-02-17 | 日东电工株式会社 | Polarizing film with adhesive layer, laminate, and image display device |
| CN105358649A (en) * | 2013-06-28 | 2016-02-24 | 日东电工株式会社 | Acrylic adhesive composition, manufacturing method of adhesive layer, polarizing film with adhesive layer, and crosslinking acceleration method of acrylic adhesive composition |
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