CN107370969A - 成像装置 - Google Patents
成像装置 Download PDFInfo
- Publication number
- CN107370969A CN107370969A CN201610310694.8A CN201610310694A CN107370969A CN 107370969 A CN107370969 A CN 107370969A CN 201610310694 A CN201610310694 A CN 201610310694A CN 107370969 A CN107370969 A CN 107370969A
- Authority
- CN
- China
- Prior art keywords
- pixel
- signal
- capacitor
- reset
- output
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 11
- 239000003990 capacitor Substances 0.000 claims description 40
- 125000006850 spacer group Chemical group 0.000 claims description 17
- 238000010586 diagram Methods 0.000 description 20
- 238000009792 diffusion process Methods 0.000 description 8
- 238000005070 sampling Methods 0.000 description 4
- 230000002596 correlated effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 101100205847 Mus musculus Srst gene Proteins 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/616—Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610310694.8A CN107370969B (zh) | 2016-05-11 | 2016-05-11 | 成像装置 |
US15/335,650 US10304888B2 (en) | 2016-05-11 | 2016-10-27 | Imaging apparatus comprising 3D stacked global shutter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610310694.8A CN107370969B (zh) | 2016-05-11 | 2016-05-11 | 成像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107370969A true CN107370969A (zh) | 2017-11-21 |
CN107370969B CN107370969B (zh) | 2020-10-02 |
Family
ID=57996232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610310694.8A Active CN107370969B (zh) | 2016-05-11 | 2016-05-11 | 成像装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10304888B2 (zh) |
CN (1) | CN107370969B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108270982A (zh) * | 2017-12-19 | 2018-07-10 | 思特威电子科技(开曼)有限公司 | 像素单元及其成像方法和成像装置 |
CN114125208A (zh) * | 2020-08-25 | 2022-03-01 | 原相科技股份有限公司 | 图像传感装置与设置于像素单元内的处理电路 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106791463B (zh) * | 2016-11-30 | 2019-08-20 | 上海集成电路研发中心有限公司 | 一种全局快门cmos像素单元及图像采集方法 |
TW202118281A (zh) * | 2019-09-11 | 2021-05-01 | 日商半導體能源研究所股份有限公司 | 攝像裝置及電子裝置 |
WO2021185190A1 (en) * | 2020-03-17 | 2021-09-23 | Shenzhen Rgbic Microelectronics Technology Co., Ltd | Pixel circuit, image sensor, and image pickup device and method for using the same |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1717940A (zh) * | 2002-11-28 | 2006-01-04 | 索尼株式会社 | 固态成像装置及其信号读取方法 |
CN101287062A (zh) * | 2007-04-11 | 2008-10-15 | 佳能株式会社 | 光电转换设备和图像捕获系统 |
JP2013236170A (ja) * | 2012-05-07 | 2013-11-21 | Denso Corp | 固体撮像装置および車載制御装置 |
JP2014107739A (ja) * | 2012-11-28 | 2014-06-09 | Canon Inc | 撮像装置及びその制御方法 |
CN206042182U (zh) * | 2016-05-11 | 2017-03-22 | 江苏思特威电子科技有限公司 | 成像装置 |
CN107333074A (zh) * | 2016-04-29 | 2017-11-07 | 江苏思特威电子科技有限公司 | 成像装置及其成像方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2487943A (en) * | 2011-02-09 | 2012-08-15 | St Microelectronics Res & Dev | A CMOS pixel sensor with local analogue storage in each pixel circuit for capturing frames in quick succession |
JP2015119154A (ja) * | 2013-12-20 | 2015-06-25 | ソニー株式会社 | 固体撮像素子、固体撮像素子の製造方法、及び電子機器 |
US9654712B2 (en) * | 2015-10-07 | 2017-05-16 | Semiconductor Components Industries, Llc | Pixels with a global shutter and high dynamic range |
-
2016
- 2016-05-11 CN CN201610310694.8A patent/CN107370969B/zh active Active
- 2016-10-27 US US15/335,650 patent/US10304888B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1717940A (zh) * | 2002-11-28 | 2006-01-04 | 索尼株式会社 | 固态成像装置及其信号读取方法 |
CN101287062A (zh) * | 2007-04-11 | 2008-10-15 | 佳能株式会社 | 光电转换设备和图像捕获系统 |
JP2013236170A (ja) * | 2012-05-07 | 2013-11-21 | Denso Corp | 固体撮像装置および車載制御装置 |
JP2014107739A (ja) * | 2012-11-28 | 2014-06-09 | Canon Inc | 撮像装置及びその制御方法 |
CN107333074A (zh) * | 2016-04-29 | 2017-11-07 | 江苏思特威电子科技有限公司 | 成像装置及其成像方法 |
CN206042182U (zh) * | 2016-05-11 | 2017-03-22 | 江苏思特威电子科技有限公司 | 成像装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108270982A (zh) * | 2017-12-19 | 2018-07-10 | 思特威电子科技(开曼)有限公司 | 像素单元及其成像方法和成像装置 |
CN108270982B (zh) * | 2017-12-19 | 2020-09-04 | 思特威(上海)电子科技有限公司 | 像素单元及其成像方法和成像装置 |
CN114125208A (zh) * | 2020-08-25 | 2022-03-01 | 原相科技股份有限公司 | 图像传感装置与设置于像素单元内的处理电路 |
CN114125208B (zh) * | 2020-08-25 | 2024-02-06 | 原相科技股份有限公司 | 图像传感装置与设置于像素单元内的处理电路 |
Also Published As
Publication number | Publication date |
---|---|
CN107370969B (zh) | 2020-10-02 |
US10304888B2 (en) | 2019-05-28 |
US20170048469A1 (en) | 2017-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111430388B (zh) | 成像像素 | |
CN209488695U (zh) | 图像传感器像素 | |
US10531027B2 (en) | Backside illuminated global shutter pixel with active reset | |
CN206283595U (zh) | 成像像素 | |
US11375145B2 (en) | Solid-state imaging device, method for driving solid-state imaging device, and electronic apparatus | |
CN112788224B (zh) | 摄像装置 | |
US10186535B2 (en) | Image sensors with stacked photodiodes | |
CN207369180U (zh) | 全局快门成像像素和包括成像像素阵列的图像传感器 | |
CN206023945U (zh) | 图像传感器、成像像素和成像系统 | |
TWI528814B (zh) | 固態成像裝置及其驅動方法及電子系統 | |
US11343439B2 (en) | High dynamic range imaging pixels with multiple photodiodes | |
WO2009054962A1 (en) | Global shutter pixel circuit with transistor sharing for cmos image sensors | |
CN107370969B (zh) | 成像装置 | |
CN112291493B (zh) | 用于生成高动态范围图像的成像系统和方法 | |
US10834342B2 (en) | Image sensors with reduced noise | |
US8604407B2 (en) | Dual conversion gain pixel methods, systems, and apparatus | |
US10075663B2 (en) | Phase detection pixels with high speed readout | |
CN211208448U (zh) | 堆叠芯片图像传感器和固态堆叠芯片图像传感器 | |
US11671730B2 (en) | Solid-state imaging device, method for driving solid-state imaging device, and electronic apparatus | |
JP2021057891A (ja) | 調整可能な増幅器回路を有する撮像システム | |
CN107370968B (zh) | 成像装置及其成像方法 | |
WO2010090167A1 (ja) | 固体撮像装置 | |
CN206042182U (zh) | 成像装置 | |
CN112291490A (zh) | 成像系统及生成具有降低的暗电流噪声的图像信号的方法 | |
US12200371B2 (en) | Image sensor and image processing system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20181010 Address after: 200233, 11 floor, innovation building, 1009 Yishan Road, Xuhui District, Shanghai. Applicant after: Shanghai Ye Core Electronic Technology Co. Ltd. Address before: 215513 Jiangsu Suzhou Jiangsu Changshou City four Changshou City Road 11 Development Zone 301 Applicant before: JIANGSU SMARTSENS TECHNOLOGY, LTD. |
|
TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Address after: Room 612, 6th floor, No. 111 Building, Kexiang Road, China (Shanghai) Free Trade Pilot Area, Pudong New Area, Shanghai, 2001 Applicant after: STEVE (SHANGHAI) ELECTRONIC TECHNOLOGY CO., LTD Address before: 200233, 11 floor, innovation building, 1009 Yishan Road, Xuhui District, Shanghai. Applicant before: Shanghai Ye Core Electronic Technology Co. Ltd. |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Room 612, 6th floor, No. 111 Building, Kexiang Road, China (Shanghai) Free Trade Pilot Area, Pudong New Area, Shanghai, 2001 Patentee after: Starway (Shanghai) Electronic Technology Co.,Ltd. Address before: Room 612, 6th floor, No. 111 Building, Kexiang Road, China (Shanghai) Free Trade Pilot Area, Pudong New Area, Shanghai, 2001 Patentee before: Siteway (Shanghai) Electronic Technology Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |