CN107359102A - 多柱装置和多柱式带电粒子束曝光装置 - Google Patents
多柱装置和多柱式带电粒子束曝光装置 Download PDFInfo
- Publication number
- CN107359102A CN107359102A CN201710159377.5A CN201710159377A CN107359102A CN 107359102 A CN107359102 A CN 107359102A CN 201710159377 A CN201710159377 A CN 201710159377A CN 107359102 A CN107359102 A CN 107359102A
- Authority
- CN
- China
- Prior art keywords
- post
- winding
- lens
- column devices
- coil portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
- H01J37/3007—Electron or ion-optical systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/24—Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for
- H01J37/241—High voltage power supply or regulation circuits
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
- G03F1/78—Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/043—Beam blanking
- H01J2237/0435—Multi-aperture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/045—Diaphragms
- H01J2237/0451—Diaphragms with fixed aperture
- H01J2237/0453—Diaphragms with fixed aperture multiple apertures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/10—Lenses
- H01J2237/14—Lenses magnetic
- H01J2237/1405—Constructional details
- H01J2237/141—Coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/15—Means for deflecting or directing discharge
- H01J2237/1504—Associated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/15—Means for deflecting or directing discharge
- H01J2237/152—Magnetic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/15—Means for deflecting or directing discharge
- H01J2237/152—Magnetic means
- H01J2237/1526—For X-Y scanning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20278—Motorised movement
- H01J2237/20285—Motorised movement computer-controlled
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3175—Lithography
- H01J2237/31774—Multi-beam
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Electron Beam Exposure (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-093801 | 2016-05-09 | ||
JP2016093801A JP2017204499A (ja) | 2016-05-09 | 2016-05-09 | マルチカラム荷電粒子ビーム露光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107359102A true CN107359102A (zh) | 2017-11-17 |
Family
ID=58454850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710159377.5A Pending CN107359102A (zh) | 2016-05-09 | 2017-03-17 | 多柱装置和多柱式带电粒子束曝光装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10083813B2 (zh) |
EP (1) | EP3258478B1 (zh) |
JP (1) | JP2017204499A (zh) |
KR (1) | KR102350429B1 (zh) |
CN (1) | CN107359102A (zh) |
TW (1) | TWI718274B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018189817A1 (ja) | 2017-04-11 | 2018-10-18 | 株式会社アドバンテスト | 露光装置 |
US10824077B2 (en) * | 2017-04-11 | 2020-11-03 | Advantest Corporation | Exposure device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0562200B1 (en) * | 1992-03-27 | 1996-08-14 | THOMSON TUBES & DISPLAYS S.A. | Permanent magnet focus unit with integral astigmatism corrector |
TW344839B (en) * | 1996-08-08 | 1998-11-11 | Toshiba Co Ltd | Cathode ray tube |
WO2001075950A1 (fr) * | 2000-04-04 | 2001-10-11 | Advantest Corporation | Appareil d'exposition multifaisceau comprenant une lentille electronique multiaxe, procede de fabrication de ladite lentille, et procede de fabrication d'un dispositif a semi-conducteur |
JP4301724B2 (ja) * | 2000-12-06 | 2009-07-22 | 株式会社アドバンテスト | 電子ビーム露光装置及び電子レンズ |
EP1956631B1 (en) * | 2002-12-17 | 2012-06-20 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Lens system for a plurality of charged particle beams |
EP1457827A1 (en) * | 2003-03-11 | 2004-09-15 | ASML Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby |
JP2005251440A (ja) | 2004-03-02 | 2005-09-15 | Ebara Corp | 電子線装置及び該装置を用いたデバイス製造方法 |
US7425703B2 (en) | 2004-02-20 | 2008-09-16 | Ebara Corporation | Electron beam apparatus, a device manufacturing method using the same apparatus, a pattern evaluation method, a device manufacturing method using the same method, and a resist pattern or processed wafer evaluation method |
JP4676209B2 (ja) * | 2005-01-26 | 2011-04-27 | 株式会社日立ハイテクノロジーズ | 電子レンズ及びこれを用いた荷電粒子線装置 |
WO2009157054A1 (ja) * | 2008-06-24 | 2009-12-30 | 株式会社アドバンテスト | マルチコラム電子ビーム露光装置及び磁場発生装置 |
JP4893975B2 (ja) * | 2009-08-25 | 2012-03-07 | サンケン電気株式会社 | コイル装置 |
JP2013016744A (ja) | 2011-07-06 | 2013-01-24 | Canon Inc | 描画装置及びデバイスの製造方法 |
EP2779205B1 (en) | 2013-03-15 | 2017-10-18 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | High throughput scan deflector and method of manufacturing thereof |
JP6215061B2 (ja) | 2014-01-14 | 2017-10-18 | 株式会社アドバンテスト | 電子ビーム露光装置 |
-
2016
- 2016-05-09 JP JP2016093801A patent/JP2017204499A/ja active Pending
-
2017
- 2017-03-17 KR KR1020170033548A patent/KR102350429B1/ko active IP Right Grant
- 2017-03-17 US US15/461,829 patent/US10083813B2/en active Active
- 2017-03-17 CN CN201710159377.5A patent/CN107359102A/zh active Pending
- 2017-03-17 TW TW106108886A patent/TWI718274B/zh active
- 2017-03-20 EP EP17161755.8A patent/EP3258478B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10083813B2 (en) | 2018-09-25 |
EP3258478A1 (en) | 2017-12-20 |
EP3258478B1 (en) | 2019-04-24 |
KR20170126393A (ko) | 2017-11-17 |
JP2017204499A (ja) | 2017-11-16 |
TW201805989A (zh) | 2018-02-16 |
KR102350429B1 (ko) | 2022-01-11 |
TWI718274B (zh) | 2021-02-11 |
US20170323760A1 (en) | 2017-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180129 Address after: American California Applicant after: Intel Corporation Address before: Tokyo, Japan, Japan Applicant before: Advantest K. K. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20181114 Address after: Tokyo, Japan Applicant after: Advantest K. K. Address before: American California Applicant before: Intel Corporation |
|
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171117 |