CN107356345A - A kind of electronic equipment and its global temperature monitoring system - Google Patents
A kind of electronic equipment and its global temperature monitoring system Download PDFInfo
- Publication number
- CN107356345A CN107356345A CN201710647348.3A CN201710647348A CN107356345A CN 107356345 A CN107356345 A CN 107356345A CN 201710647348 A CN201710647348 A CN 201710647348A CN 107356345 A CN107356345 A CN 107356345A
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- China
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- temperature
- pcb
- pcb board
- monitoring system
- temperature sensor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/026—Means for indicating or recording specially adapted for thermometers arrangements for monitoring a plurality of temperatures, e.g. by multiplexing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/24—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The present invention discloses the global temperature monitoring system of a kind of electronic equipment, some intersecting PCB wires being arranged at including the pcb board for installing electronic component, according to default layout on pcb board, the temperature sensor for being arranged on pcb board and being located at each PCB wire joinings position, and be arranged on pcb board and be respectively connected with each PCB wire, the temperature controller for the detected value according to each temperature sensor of preset order Scanning Detction.Whole pcb board is divided into several monitoring temperature regions by the present invention by the PCB wires of default layout, temperature value is carried out by temperature sensor in each monitoring temperature region simultaneously to detect in real time, the temperature value of each temperature sensor is gathered by temperature controller again, so as to obtain the real time temperature in each monitoring temperature region on monoblock pcb board, realize and the global temperature of each electronic component is monitored, avoid temperature blind area.Invention additionally discloses a kind of electronic equipment, its advantage are as described above.
Description
Technical field
The present invention relates to the global temperature monitoring system of technical field of heat dissipation, more particularly to a kind of electronic equipment.The present invention
Further relate to a kind of electronic equipment for including above-mentioned global temperature monitoring system.
Background technology
With the development of China Electronics's technology, increasing electronic equipment has been used widely.
Electronic equipment refers to be made up of electronic components such as integrated circuit, transistor, electron tubes, application electric technology software
The equipment to play a role, including electronic computer and robot, numerical control or stored program controlled by electronic computer control etc..
The component included in electronic equipment is numerous, can be with one piece of pcb board due to the development and application of integrated circuit
Integrate individual resistor, capacitor or chips up to ten thousand etc..When electronic equipment is in normal operation, electric current is led by the PCB on pcb board
Line flows through each component, and each component can operationally produce heat.Heat caused by single component operation can
To ignore, but quantity reach certain scale component and meanwhile operation caused by heat just it is considerable enough.And electronics is set
Standby interior electronic component, it is most of to have to temperature than more sensitive characteristic, when temperature range is not in accommodation, member
The operating efficiency of device reduces, in some instances it may even be possible to does not work or burns.Therefore, extremely important to the monitoring temperature of electronic equipment.
In the prior art, to the monitoring temperature mode of electronic equipment, set generally by near Important Components
Several thermistors are put to detect, or the monitoring temperature chip by being arranged on pcb board is monitored.However, such a temperature
Degree monitor mode is often operated under " point monitoring " pattern, can only realize the monitoring temperature to several points region on pcb board, its
Or the monitoring temperature of remaining position detects without actual temperature, or carrying out analogue simulation by software algorithm, it is blind to there is temperature
Area.This electronic component for likely resulting at temperature blind area position produces a large amount of persistent fevers, is caused more than secure threshold
The serious conditions such as burn, be on fire.
Therefore, the global temperature monitoring to electronic component how is realized, the presence of monitoring temperature blind area is avoided, is ability
Field technique personnel technical problem urgently to be resolved hurrily.
The content of the invention
It is an object of the invention to provide the global temperature monitoring system of a kind of electronic equipment, can realize to electronic component
Global temperature monitoring, avoid the presence of monitoring temperature blind area.It is a further object of the present invention to provide one kind to include the above-mentioned overall situation
The electronic equipment of temperature monitoring system.
In order to solve the above technical problems, the global temperature monitoring system of present invention offer a kind of electronic equipment, including for
The pcb board of electronic component is installed, is laid out some intersecting PCB wires being arranged on the pcb board, setting according to default
In on the pcb board and positioned at the temperature sensor of each PCB wires joining position, and it is arranged at the pcb board
Above and with each PCB wire it is respectively connected with, for the detection according to each temperature sensor of preset order Scanning Detction
The temperature controller of value.
Preferably, each temperature sensor is embedded in the pcb board.
Preferably, each temperature sensor is specially thermistor.
Preferably, each PCB wire specifically includes some set parallel to the length direction of the pcb board
PCB lines, and some PCB alignments of the width setting parallel to the pcb board.
Preferably, the spacing of the PCB lines of arbitrary neighborhood two and/or the PCB alignments is equal.
Preferably, the temperature controller is specifically included for detecting each temperature sensor successively according to preset order
Temperature scanning module, and be connected with the temperature scanning module by signal, passed for recognizing the temperature of its Current Scan
The coordinate identification module of station location marker of the sensor on the pcb board.
Preferably, in addition to the LED warning lamps that are close on each temperature sensor, and mould is differentiated with the coordinate
Block signal connects, for when the detected value of the temperature scanning module exceedes predetermined threshold value, making the institute at correspondence position mark
State the temperature alarming module of the flashes of light such as the LED warnings on temperature sensor.
The present invention also provides a kind of electronic equipment, including body is with the global temperature monitoring being arranged in the body
System, wherein, the global temperature monitoring system is specially the global temperature monitoring system described in any of the above-described.
The global temperature monitoring system of electronic equipment provided by the present invention, mainly passed including pcb board, PCB wires, temperature
Sensor and temperature controller.Wherein, pcb board is mainly used in installing all kinds of electronic components, and PCB wires are arranged on pcb board,
And each electronic component is connected according to default layout, pcb board is divided into several monitoring temperatures according to default layout
Region.Temperature sensor is arranged on pcb board, and positioned at the intersecting opening position of each PCB wire, mainly for detection of current
The temperature value in the monitoring temperature region belonging to position.Temperature controller is arranged on pcb board, and is distinguished with each PCB wire
It is connected, is mainly used in the detected value according to each temperature sensor of preset order Scanning Detction, so as to realize to each temperature of pcb board
Spend the temperature value collection of monitor area.In this way, the global temperature monitoring system of electronic equipment provided by the present invention, by default
Whole pcb board is divided into several monitoring temperature regions by the PCB wires of layout, while logical in each monitoring temperature region
Excess temperature sensor carries out temperature value and detected in real time, then the temperature value of each temperature sensor is gathered by temperature controller,
So as to obtain the real time temperature in each monitoring temperature region on monoblock pcb board, the overall situation temperature to each electronic component is realized
Degree monitoring, avoids temperature blind area.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is a kind of overall structure diagram of embodiment provided by the present invention.
Wherein, in Fig. 1：
Pcb board -1, PCB wire -2, PCB line -201, PCB alignment -202, temperature sensor -3, temperature control
Device -4, temperature scanning module -401, coordinate identification module -402, temperature alarming module -403, LED warning lamp -5.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Fig. 1 is refer to, Fig. 1 is a kind of overall structure diagram of embodiment provided by the present invention.
In a kind of embodiment provided by the present invention, the global temperature monitoring system of electronic equipment mainly includes
Pcb board 1, PCB wires 2, temperature sensor 3 and temperature controller 4.
Wherein, pcb board 1 is mainly used in installing all kinds of electronic components, and PCB wires 2 are arranged on pcb board 1, and presses
Each electronic component is connected according to default layout, pcb board 1 is divided into several monitoring temperature regions according to default layout.
Temperature sensor 3 is arranged on pcb board 1, and positioned at the intersecting opening position of each PCB wire 2, mainly for detection of present bit
The temperature value in the monitoring temperature region belonging to putting.Temperature controller 4 is arranged on pcb board 1, and is distinguished with each PCB wire 2
It is connected, is mainly used in the detected value according to each temperature sensor 3 of preset order Scanning Detction, it is each to pcb board 1 so as to realize
The temperature value collection in monitoring temperature region.
In this way, the global temperature monitoring system for the electronic equipment that the present embodiment is provided, passes through the PCB wires of default layout
Whole pcb board 1 is divided into several monitoring temperature regions by 2, while passes through TEMP in each monitoring temperature region
Device 3 carries out temperature value and detected in real time, then the temperature value of each temperature sensor 3 is gathered by temperature controller 4, so as to obtain
The real time temperature in each monitoring temperature region on monoblock pcb board 1, the global temperature monitoring to each electronic component is realized,
Avoid temperature blind area.
A fairly large number of temperature sensor 3 is provided with view of pcb board 1, to avoid the presence of temperature sensor 3 from largely accounting for
With the installing space on pcb board 1, in the present embodiment, each temperature sensor 3 is embedded in pcb board 1.
Further, concretely thermistor, temperature controller 4 can be according to the changes of its resistance for each temperature sensor 3
Change and calculate temperature change.Certainly, each temperature sensor 3 can also be thermocouple etc..
In addition, at the monitoring temperature region on dividing pcb board 1, it is preferable that the PCB wires 2 in the present embodiment specifically wrap
Include PCB lines 201 and PCB alignments 202.Wherein, each PCB line 201 is set each parallel to the length direction of pcb board 1, and
PCB alignments 202 are set each parallel to the width of pcb board 1, on the whole, on pcb board 1, PCB lines 201 and PCB row
202 crisscross distribution of line.It is arranged such, can be by the installing space on pcb board 1 by PCB lines 201 and PCB alignments 202
Several rectangular areas are fitly divided into, and the monitoring temperature in each rectangular area is then by the PCB rows in the rectangular area
Temperature sensor 3 on line 201 and the joining position of PCB alignments 202 is completed.Certainly, PCB lines 201 and PCB alignments 202
Can not be parallel with the length direction and width of pcb board 1, alternately it is distributed on pcb board 1 if both tilt, similarly
It is feasible.
Further, it is the operating efficiency that improves each temperature sensor 3, while avoids waist performance or performance deficiency
Situation, two PCB lines 201 of arbitrary neighborhood are equal with the spacing of PCB alignments 202, each deblocking temperature monitoring so marked off
Region, its area will be relatively average, and then the work area of each temperature sensor 3 is averaged.Certainly, it is contemplated that
The distribution situation of the electronic component of pcb board 1 is indefinite, and each PCB line 201 and PCB specifically can be also adjusted according to actual conditions
Spacing between alignment 202, meanwhile, the division in monitoring temperature region might not also be averaged completely, can be in electronic component point
The intensive region of cloth sets more monitoring temperature region, and vice versa.
In a kind of preferred embodiment on temperature controller 4, the actual temp scan module of temperature controller 4
401st, coordinate identification module 402 and temperature alarming module 403.Wherein, temperature scanning module 401 is mainly used according to preset order
Detect the detected value of each temperature sensor 3 successively, for example, can according to from left to right, from top to bottom etc. order detect successively it is each
Temperature sensor 3, it is of course also possible to be scanned to all temperature sensors 3 simultaneously.Coordinate identification module 402 is swept with temperature
The connection of the signal of module 401 is retouched, is mainly used in when temperature scanning module 401 carries out temperature value collection to some temperature sensor 3,
Recognize station location marker of the temperature sensor 3 of Current Scan collection on pcb board 1.In general, each temperature sensor 3 is in PCB
The set location of plate 1 is respectively provided with unique corresponding coordinate, and the coordinate can be made up of the numbering of PCB lines 201 and PCB alignments 202,
For example each numbering of PCB lines 201 can be A1, A2, A3 etc., while each numbering of PCB alignments 202 can be B1, B2, B3
Deng, in this way, coordinate corresponding to each temperature sensor 3 can be A1B1, A1B2, A1B3, A2B1 etc., and coordinate identification module
402 at the identification after the station location marker of each temperature sensor 3, you can knows the setting of the temperature sensor 3 on pcb board 1
Position, and then can quickly and accurately judge the temperature of certain deblocking temperature monitor area on pcb board 1.
Further, it is contemplated that when the quantity of PCB lines 201 and PCB alignments 202 is more, the quantity of temperature sensor 3 compared with
When more and monitoring temperature region division numbers are also more, even if the coordinate that technical staff passes through in said temperature controller 4 reflects
Other module 402 has known the real time temperature of certain deblocking temperature monitor area, also can not quickly and accurately realize determining for temperature sensor 3
Position.Pin is on the other hand, the present embodiment is close to be provided with LED warning lamps 5 on each temperature sensor 3, while in temperature controller 4
In be additionally arranged temperature alarming module 403.Specifically, the temperature alarming module 403 is connected with each signal of LED warning lamps 5, work as temperature
Scan module 401 is spent when gathering the temperature detection value of some or some temperature sensors 3, if detected value exceedes predetermined threshold value,
Illustrate that temperature is too high, it is necessary to the processing that cools, the temperature that now temperature alarming module 403 is recognized according to coordinate identification module 402
The station location marker of sensor 3, the LED warning lamps 5 corresponding to the temperature sensor 3 are lighted, and make its flash of light, with to technology people
Member is warned, and it is able to conveniently find the too high region of local temperature and is carried out alignment processing.
The present embodiment also provides a kind of electronic equipment, main including body and the global temperature being arranged in body monitoring system
System.Wherein, the global temperature monitoring system is identical with above-mentioned related content, and here is omitted.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (8)
1. the global temperature monitoring system of a kind of electronic equipment, it is characterised in that including the pcb board for installing electronic component
(1), according to it is default be laid out be arranged on the pcb board (1) some intersecting PCB wires (2), be arranged at the pcb board
(1) on and positioned at the temperature sensor (3) of each PCB wires (2) the joining position, and it is arranged at the pcb board (1)
Above and with each PCB wire (2) it is respectively connected with, for according to each temperature sensor (3) of preset order Scanning Detction
Detected value temperature controller (4).
2. global temperature monitoring system according to claim 1, it is characterised in that each temperature sensor (3) is buried
It is located in the pcb board (1).
3. global temperature monitoring system according to claim 2, it is characterised in that each temperature sensor (3) is specific
For thermistor.
4. global temperature monitoring system according to claim 3, it is characterised in that each PCB wire (2) is specifically wrapped
Some PCB lines (201) of the length direction setting parallel to the pcb board (1) are included, and parallel to the pcb board (1)
Width set some PCB alignments (202).
5. global temperature monitoring system according to claim 4, it is characterised in that the PCB lines of arbitrary neighborhood two
(201) and/or the PCB alignments (202) spacing it is equal.
6. according to the global temperature monitoring system described in claim any one of 1-5, it is characterised in that the temperature controller
(4) the temperature scanning module (401) for detecting each temperature sensor (3) successively according to preset order is specifically included, with
And it is connected with temperature scanning module (401) signal, for recognizing the temperature sensor (3) of its Current Scan described
The coordinate identification module (402) of station location marker on pcb board (1).
7. global temperature monitoring system according to claim 6, it is characterised in that also include being close to each temperature biography
LED warning lamps (5) on sensor (3), and be connected, with coordinate identification module (402) signal for being swept in the temperature
When retouching the detected value of module (401) and exceeding predetermined threshold value, make described on the temperature sensor (3) at correspondence position mark
The temperature alarming module (403) of LED warning lamps (5) flash of light.
8. a kind of electronic equipment, including body and the global temperature monitoring system that is arranged in the body, it is characterised in that institute
It is specially the global temperature monitoring system described in claim any one of 1-7 to state global temperature monitoring system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710647348.3A CN107356345A (en) | 2017-08-01 | 2017-08-01 | A kind of electronic equipment and its global temperature monitoring system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710647348.3A CN107356345A (en) | 2017-08-01 | 2017-08-01 | A kind of electronic equipment and its global temperature monitoring system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107356345A true CN107356345A (en) | 2017-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710647348.3A Pending CN107356345A (en) | 2017-08-01 | 2017-08-01 | A kind of electronic equipment and its global temperature monitoring system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112993942A (en) * | 2021-03-19 | 2021-06-18 | 联想(北京)有限公司 | Control method and device and electronic equipment |
| CN114184294A (en) * | 2021-11-18 | 2022-03-15 | 浪潮(北京)电子信息产业有限公司 | Temperature detection device of PCB and PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105183616A (en) * | 2015-08-17 | 2015-12-23 | 浪潮(北京)电子信息产业有限公司 | Processor temperature monitoring apparatus and method |
| CN106197722A (en) * | 2016-06-24 | 2016-12-07 | 陈丽 | Matrix-scanning-type temperature acquisition method and system |
| CN106793490A (en) * | 2016-12-28 | 2017-05-31 | 苏州寅初信息科技有限公司 | The PCB and its detection method of circuit abnormality are detected based on temperature fluctuation |
-
2017
- 2017-08-01 CN CN201710647348.3A patent/CN107356345A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105183616A (en) * | 2015-08-17 | 2015-12-23 | 浪潮(北京)电子信息产业有限公司 | Processor temperature monitoring apparatus and method |
| CN106197722A (en) * | 2016-06-24 | 2016-12-07 | 陈丽 | Matrix-scanning-type temperature acquisition method and system |
| CN106793490A (en) * | 2016-12-28 | 2017-05-31 | 苏州寅初信息科技有限公司 | The PCB and its detection method of circuit abnormality are detected based on temperature fluctuation |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112993942A (en) * | 2021-03-19 | 2021-06-18 | 联想(北京)有限公司 | Control method and device and electronic equipment |
| CN114184294A (en) * | 2021-11-18 | 2022-03-15 | 浪潮(北京)电子信息产业有限公司 | Temperature detection device of PCB and PCB |
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Application publication date: 20171117 |