CN114184294A - Temperature detection device of PCB and PCB - Google Patents

Temperature detection device of PCB and PCB Download PDF

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Publication number
CN114184294A
CN114184294A CN202111370771.6A CN202111370771A CN114184294A CN 114184294 A CN114184294 A CN 114184294A CN 202111370771 A CN202111370771 A CN 202111370771A CN 114184294 A CN114184294 A CN 114184294A
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China
Prior art keywords
pcb
temperature
temperature detection
target
target pcb
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Pending
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CN202111370771.6A
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Chinese (zh)
Inventor
廖明超
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Inspur Beijing Electronic Information Industry Co Ltd
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Inspur Beijing Electronic Information Industry Co Ltd
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Priority to CN202111370771.6A priority Critical patent/CN114184294A/en
Publication of CN114184294A publication Critical patent/CN114184294A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G01K7/24—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

The application discloses PCB's temperature-detecting device includes: the temperature detection circuit is arranged on the surface of the target PCB and is used for detecting the temperature value of the target PCB; and the thermistor is buried at the highest position of the current density of the target PCB, and is connected with the temperature detection circuit through a through hole arranged on the target PCB. In the temperature detection device, the thermistor is embedded at the highest position of the current density of the target PCB, so that the theoretical highest temperature value of the target PCB can be directly detected by the thermistor and the temperature detection circuit, and the problem of board burning caused by overhigh temperature of the PCB can be avoided. Correspondingly, the PCB and the temperature detection method of the PCB have the beneficial effects.

Description

Temperature detection device of PCB and PCB
Technical Field
The invention relates to the technical field of servers, in particular to a temperature detection device of a PCB, a PCB and a temperature detection method of the PCB.
Background
With the rapid development of server technology, more and more electronic components are arranged on a Printed Circuit Board (PCB), which results in a larger and larger current carried by the PCB and a gradual rise in the temperature of the PCB, thereby bringing about a great potential safety hazard to the server.
In the prior art, in order to detect the temperature of the PCB, one method is to add eFuse (one time programmable memory) lines on the main board and limit the maximum current of the main board through the eFuse lines. That is, when the total current of the motherboard exceeds the preset current value, the power supply on the motherboard is triggered to be turned off through the eFuse line. Although the method can avoid the problem of board burning caused by short-circuit overcurrent, if the local current of the PCB is too high and the total current is less than the preset current value, the method still has no way to avoid the problem of board burning of the mainboard. The other method is to add a temperature sensor on the mainboard to detect the temperature value of the PCB on the mainboard in real time, and then judge whether the temperature of the PCB is normal or not through the temperature sensor, but the detection method can only acquire the surface temperature of the PCB and cannot reflect the temperature of the inner layer of the PCB, and the method is influenced by a fan heat dissipation system of a system, so that the detection precision of the temperature sensor cannot be ensured, and the problem of board burning of the PCB due to overhigh temperature of the inner layer cannot be avoided. At present, no effective solution exists for the above technical problems.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a temperature detecting device for a PCB, a PCB board and a temperature detecting method for a PCB, so as to avoid the problem of board burning of the PCB due to an excessively high temperature. The specific scheme is as follows:
a temperature sensing device of a PCB, comprising: the temperature detection circuit is arranged on the surface of the target PCB and is used for detecting the temperature value of the target PCB; and the thermistor is buried at the highest position of the current density of the target PCB, and is connected with the temperature detection circuit through a through hole arranged on the target PCB.
Preferably, the highest position of the current density is a position found by simulating the target PCB by using a PI simulation method.
Preferably, the temperature detection circuit includes: a first resistor, a second resistor and a voltage comparator;
the first end of the first resistor is connected with VCC, the second end of the first resistor is respectively connected with the first end of the thermistor and the first input end of the voltage comparator, the second end of the thermistor is grounded, the second input end of the voltage comparator is connected with the first end of the second resistor, and the second end of the second resistor is used for receiving target reference voltage.
Preferably, the target reference voltage is a voltage set according to a maximum temperature that the target PCB can withstand.
Preferably, the attribute parameters of the thermistor are set according to the detection precision of the temperature detection circuit and the temperature fluctuation range which can be borne by the target PCB.
Preferably, the method further comprises the following steps:
and the alarm is connected with the temperature detection circuit and used for prompting the early warning information when the temperature detection circuit detects that the temperature value of the target PCB is greater than a preset temperature value.
Preferably, when the target PCB is a multilayer, the thermistor can be further buried at a position in the adjacent layer where the current density is highest, the position being mirror-symmetrical to the current density highest position.
Correspondingly, the invention also discloses a PCB board which comprises the PCB temperature detection device disclosed in the foregoing.
Correspondingly, the invention also discloses a temperature detection method of the PCB, which comprises the following steps:
detecting the temperature value of the target PCB by using a temperature detection circuit; wherein the temperature detection circuit is arranged on the surface of the target PCB; a thermistor is embedded at the highest position of the current density of the target PCB, and the thermistor is connected with the temperature detection circuit through a via hole arranged on the target PCB;
and if the temperature value of the target PCB is greater than the preset temperature value, prompting early warning information.
As a preferred embodiment, the highest position of the current density is a position found by simulating the target PCB by using a PI simulation method.
It can be seen that, the temperature detection device provided by the present invention comprises: the temperature detection circuit is arranged on the surface of the target PCB and used for detecting the temperature value of the target PCB, and the thermistor is buried at the position of the highest current density of the target PCB and is connected with the temperature detection circuit through a through hole arranged on the target PCB. In the temperature detection device, the thermistor is embedded at the highest position of the current density of the target PCB, so that the theoretical highest temperature value of the target PCB can be directly detected by the thermistor and the temperature detection circuit, and the problem of board burning caused by overhigh temperature of the PCB can be avoided. Correspondingly, the PCB and the temperature detection method of the PCB provided by the invention also have the beneficial effects.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a structural diagram of a temperature detection apparatus of a PCB according to an embodiment of the present invention;
fig. 2 is a structural diagram of a temperature detection circuit according to an embodiment of the present invention;
fig. 3 is a flowchart of a method for detecting a temperature of a PCB according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a structural diagram of a temperature detecting device of a PCB according to an embodiment of the present invention, the temperature detecting device includes: the temperature detection circuit 12 is arranged on the surface of the target PCB11 and is used for detecting the temperature value of the target PCB 11; and a thermistor 13 buried at the highest position of the current density of the target PCB11, and the thermistor 13 is connected to the temperature detection circuit 12 through a via hole 14 provided on the target PCB 11.
In this embodiment, a temperature detecting device for a PCB is provided, by which the problem of board burning due to an excessively high temperature of the PCB can be avoided. It is understood that, since a large area of copper is usually coated on the target PCB, the highest current density position occurs after the copper is coated on the target PCB, and the highest current density position is usually the highest temperature position area on the target PCB, in this embodiment, the thermistor R0 is embedded at the highest current density position of the target PCB by the resistance-embedding technology. Therefore, during the operation of the target PCB, the resistance value of the thermistor R0 changes with the temperature change of the target PCB, and in this case, the temperature value of the target PCB can be detected by measuring the resistance value of the thermistor R0.
Referring to fig. 1, the hatched area in fig. 1 is a cross-sectional view of the target PCB embedded thermistor R0. Wherein, two ends of the thermistor R0 are led out to the surface of the target PCB through the via hole 14 on the target PCB and connected with the temperature detection circuit. When the temperature detection circuit converts the resistance value of the thermistor R0 into a corresponding electric signal, the temperature value of the target PCB can be measured. In addition, since the thermistor R0 is directly embedded into the inner layer of the target PCB, the temperature of the inner layer of the target PCB can be measured, and therefore the problem that the temperature detection result of the target PCB is inaccurate because only the surface temperature of the target PCB can be measured in the prior art is solved.
It can be thought that when the temperature value of the target PCB is detected by the temperature detection circuit, it is equivalent to obtaining the theoretical highest temperature value of the surface and inner layer of the target PCB, in this case, the problem of board burning due to the excessively high temperature of the PCB can be avoided.
It can be seen that, in the temperature detection apparatus provided in this embodiment, the temperature detection apparatus includes: the temperature detection circuit is arranged on the surface of the target PCB and used for detecting the temperature value of the target PCB, and the thermistor is buried at the position of the highest current density of the target PCB and is connected with the temperature detection circuit through a through hole arranged on the target PCB. In the temperature detection device, the thermistor is embedded at the highest position of the current density of the target PCB, so that the theoretical highest temperature value of the target PCB can be directly detected by the thermistor and the temperature detection circuit, and the problem of board burning caused by overhigh temperature of the PCB can be avoided.
Based on the above embodiments, this embodiment further describes and optimizes the technical solution, and as a preferred implementation, the highest position of the current density is a position found by simulating the target PCB by using a PI simulation method.
It can be understood that, since parameters such as the current density and the current carrying capacity of the target PCB can be analyzed by using the PI (Power Integrity) simulation, in the present embodiment, the highest position of the current density of the target PCB is found by performing the PI simulation on the target PCB.
Based on the above embodiments, the present embodiment further describes and optimizes the technical solution, please refer to fig. 2, and fig. 2 is a structural diagram of a temperature detection circuit according to an embodiment of the present invention. As a preferred embodiment, the temperature detection circuit includes: a first resistor R1, a second resistor R2 and a voltage comparator U;
the first end of the first resistor R1 is connected to VCC, the second end of the first resistor R1 is connected to the first end of the thermistor R0 and the first input end of the voltage comparator U, respectively, the second end of the thermistor R0 is grounded, the second input end of the voltage comparator U is connected to the first end of the second resistor R2, and the second end of the second resistor R2 is used for receiving a target reference voltage Vref.
In the present embodiment, a specific connection structure of the temperature detection circuit is provided. In this temperature detection circuit, the voltage across the thermistor R0 is: vtc＝R0*VCC/(R1+R0) (ii) a Wherein R is0Is the resistance value of the thermistor R0, R1Is the resistance value of the first resistor R1(ii) a When the temperature of the target PCB varies, the resistance of the thermistor R0 also varies.
In this embodiment, the target reference voltage Vref is a voltage set according to the maximum temperature that the target PCB can withstand. Since the highest temperature that the target PCB can withstand is closely related to the property characteristics of the voltage comparator, the target PCB, and the thermistor, the target reference voltage is specifically a voltage set according to the property characteristics of the voltage comparator, the target PCB, and the thermistor.
When the temperature of the target PCB exceeds a preset temperature value, the voltage at two ends of the thermistor is larger than or smaller than a target reference voltage Vref, and at the moment, the output voltage of the voltage comparator is overturned due to the action of the voltage comparator. When the system detects that the output voltage of the voltage comparator is overturned, the corresponding alarm circuit and the corresponding protection circuit are triggered, so that the target PCB can always work within a reasonable temperature range.
Based on the above embodiments, this embodiment further describes and optimizes the technical solution, and as a preferred implementation, the property parameters of the thermistor are set according to the detection precision of the temperature detection circuit and the temperature fluctuation range that the target PCB can endure.
In practical application, the attribute parameters of the thermistor can be selected and determined according to the detection precision of the temperature detection circuit and the temperature fluctuation range which can be borne by the target PCB, and the detection precision of the temperature detection circuit and the temperature fluctuation range which can be borne by the target PCB are relevant to the working performance of the thermistor, so that when the thermistor is selected in such a way, the working performance of the thermistor can be further ensured.
Based on the above embodiment, this embodiment further describes and optimizes the technical solution, and as a preferred implementation, the temperature detection apparatus further includes:
and the alarm is connected with the temperature detection circuit and used for prompting the early warning information when the temperature detection circuit detects that the temperature value of the target PCB is greater than the preset temperature value.
In this embodiment, an alarm connected to the temperature detection circuit may be further disposed in the temperature detection device, so that when the temperature detection circuit detects that the temperature value of the target PCB is greater than the preset temperature value, the real-time operation state of the target PCB of the worker may be prompted in a manner of prompting alarm information, and corresponding protection measures are taken in time to avoid occurrence of safety accidents.
Obviously, the technical scheme provided by the embodiment can further ensure the safety and reliability of the temperature detection device in the use process.
Based on the above embodiments, this embodiment further describes and optimizes the technical solution, as a preferred implementation, when the target PCB is a multilayer, the thermistor can also be embedded in a position that is mirror-symmetrical to the current density highest position on the adjacent layer where the current density highest position is located.
In practical application, if the target PCB is a 3-layer or more than 3-layer structure, since the operating space of the worker on the target PCB is small, in order to improve the operability of the worker when embedding the thermistor in the target PCB, the thermistor can be embedded at a position which is mirror-symmetrical to the current density highest position on the adjacent layer at the current density highest position. Because the theoretical highest temperature value of the target PCB can be accurately detected through the arrangement mode, the problem of board burning caused by overhigh temperature of the PCB can be avoided.
Correspondingly, the embodiment of the invention also discloses a PCB, which comprises the PCB temperature detection device disclosed in the foregoing.
The PCB provided by the embodiment of the invention has the beneficial effects of the PCB temperature detection device disclosed by the invention.
Referring to fig. 3, fig. 3 is a flowchart of a method for detecting a temperature of a PCB according to an embodiment of the present invention, including:
step S11: detecting the temperature value of the target PCB by using a temperature detection circuit;
the temperature detection circuit is arranged on the surface of the target PCB; a thermistor is embedded at the highest position of the current density of the target PCB, and the thermistor is connected with a temperature detection circuit through a via hole arranged on the target PCB;
step S12: and if the temperature value of the target PCB is greater than the preset temperature value, prompting early warning information.
In this embodiment, a method for detecting the temperature of a PCB is provided, and by using the method to detect the temperature of the PCB, the problem of board burning of the PCB due to an excessively high temperature can be avoided. In the temperature detection method, a temperature detection circuit is arranged on the surface of a target PCB in advance, and a thermistor is embedded at the highest position of the current density of the target PCB, wherein the thermistor is connected with the temperature detection circuit through a through hole arranged on the target PCB.
It will be appreciated that the highest current density location will occur after copper is applied to the target PCB, since a large area of copper will typically be coated on the target PCB, and is typically the area of the target PCB where the temperature is highest. Therefore, in the present embodiment, the thermistor is embedded at the highest position of the current density of the target PCB by the resistance-embedding technology, so that the resistance value of the thermistor changes with the temperature change of the target PCB during the operation of the target PCB. In this case, the temperature value of the target PCB can be detected by measuring the resistance value of the thermistor using the temperature detection circuit.
That is, when the temperature detection circuit detects the temperature value of the target PCB, it is equivalent to obtain the theoretical maximum temperature value of the surface and inner layer of the target PCB, and in this case, the problem of board burning due to the excessively high temperature of the PCB can be avoided. In addition, the PCB temperature detection method provided in this embodiment may refer to the PCB temperature detection device provided in the foregoing embodiment, which is not described herein in detail.
It can be seen that in the PCB temperature detection method provided in this embodiment, a temperature detection circuit is previously disposed on the surface of the target PCB, and a thermistor is embedded at the highest position of the current density of the target PCB, wherein the thermistor is connected to the temperature detection circuit through a via hole disposed on the target PCB. When the temperature of the target PCB is detected, the theoretical highest temperature value of the target PCB can be obtained only by detecting the temperature value of the target PCB by using the temperature detection circuit, and if the temperature value of the target PCB is greater than the preset temperature value, the problem of board burning caused by overhigh temperature of the PCB can be avoided by prompting the early warning information.
Based on the above embodiments, this embodiment further describes and optimizes the technical solution, and as a preferred implementation, the highest position of the current density is a position found by simulating the target PCB by using a PI simulation method.
It can be understood that, because parameters such as the current density and the current carrying capacity of the target PCB can be analyzed by using PI simulation, in the present embodiment, the highest position of the current density of the target PCB is found by performing PI simulation on the target PCB.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The temperature detection device of a PCB, the PCB and the temperature detection method of a PCB provided by the present invention are described in detail above, and specific examples are applied herein to explain the principle and the implementation of the present invention, and the description of the above embodiments is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (10)

1. A temperature detection device of a PCB, comprising: the temperature detection circuit is arranged on the surface of the target PCB and is used for detecting the temperature value of the target PCB; and the thermistor is buried at the highest position of the current density of the target PCB, and is connected with the temperature detection circuit through a through hole arranged on the target PCB.
2. The temperature detection device according to claim 1, wherein the highest position of the current density is a position found by simulating the target PCB by using a PI simulation method.
3. The temperature detection device according to claim 1, wherein the temperature detection circuit includes: a first resistor, a second resistor and a voltage comparator;
the first end of the first resistor is connected with VCC, the second end of the first resistor is respectively connected with the first end of the thermistor and the first input end of the voltage comparator, the second end of the thermistor is grounded, the second input end of the voltage comparator is connected with the first end of the second resistor, and the second end of the second resistor is used for receiving target reference voltage.
4. The temperature sensing device of claim 3, wherein the target reference voltage is a voltage set according to a maximum temperature that the target PCB can withstand.
5. The temperature detecting apparatus according to claim 1, wherein the property parameter of the thermistor is set in accordance with the detection accuracy of the temperature detecting circuit and a temperature fluctuation range that the target PCB can endure.
6. The temperature detection apparatus according to claim 1, further comprising:
and the alarm is connected with the temperature detection circuit and used for prompting the early warning information when the temperature detection circuit detects that the temperature value of the target PCB is greater than a preset temperature value.
7. The temperature detecting device according to any one of claims 1 to 6, wherein when the target PCB is a multilayer, the thermistor is further buried at a position mirror-symmetrical to the current density highest position on an adjacent layer to the current density highest position.
8. A PCB board comprising a temperature sensing device of a PCB as claimed in any one of claims 1 to 7.
9. A temperature detection method of a PCB is characterized by comprising the following steps:
detecting the temperature value of the target PCB by using a temperature detection circuit; wherein the temperature detection circuit is arranged on the surface of the target PCB; a thermistor is embedded at the highest position of the current density of the target PCB, and the thermistor is connected with the temperature detection circuit through a via hole arranged on the target PCB;
and if the temperature value of the target PCB is greater than the preset temperature value, prompting early warning information.
10. The temperature detection method according to claim 9, wherein the highest position of the current density is a position found by simulating the target PCB by using a PI simulation method.
CN202111370771.6A 2021-11-18 2021-11-18 Temperature detection device of PCB and PCB Pending CN114184294A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111370771.6A CN114184294A (en) 2021-11-18 2021-11-18 Temperature detection device of PCB and PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111370771.6A CN114184294A (en) 2021-11-18 2021-11-18 Temperature detection device of PCB and PCB

Publications (1)

Publication Number Publication Date
CN114184294A true CN114184294A (en) 2022-03-15

Family

ID=80540368

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111370771.6A Pending CN114184294A (en) 2021-11-18 2021-11-18 Temperature detection device of PCB and PCB

Country Status (1)

Country Link
CN (1) CN114184294A (en)

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