CN112993942A - Control method and device and electronic equipment - Google Patents
Control method and device and electronic equipment Download PDFInfo
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- CN112993942A CN112993942A CN202110297399.4A CN202110297399A CN112993942A CN 112993942 A CN112993942 A CN 112993942A CN 202110297399 A CN202110297399 A CN 202110297399A CN 112993942 A CN112993942 A CN 112993942A
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 168
- 229910052751 metal Inorganic materials 0.000 claims abstract description 168
- 239000002344 surface layer Substances 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 24
- 239000010410 layer Substances 0.000 description 24
- 229910052802 copper Inorganic materials 0.000 description 23
- 239000010949 copper Substances 0.000 description 23
- 238000002485 combustion reaction Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- 238000013021 overheating Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H7/00—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions
- H02H7/20—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for electronic equipment
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
- H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
- H02H5/042—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature using temperature dependent resistors
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Abstract
The application discloses a control method, a control device and electronic equipment, wherein the method comprises the following steps: obtaining a current electrical parameter in a target circuit, wherein the target circuit comprises at least one metal resistor, the metal resistor is covered on a surface layer of the electronic equipment on the side of a target component in a mesh structure, and the resistance value of the metal resistor is related to the temperature of the metal resistor; and under the condition that the current electrical parameter meets the power-off control condition, controlling the electronic equipment connected with the target circuit to be powered off.
Description
Technical Field
The present application relates to the field of power-off protection technologies, and in particular, to a control method and apparatus, and an electronic device.
Background
When the server board card is abnormal in short circuit, large current heating can be caused, and the heating high temperature is accumulated to a certain degree to cause combustion, so that power-off protection needs to be carried out on the server.
Disclosure of Invention
In view of the above, the present application provides a control method, an apparatus and an electronic device, as follows:
a control method, comprising:
obtaining a current electrical parameter in a target circuit, wherein the target circuit comprises at least one metal resistor, the metal resistor is covered on a surface layer of the electronic equipment on the side of a target component in a mesh structure, and the resistance value of the metal resistor is related to the temperature of the metal resistor;
and under the condition that the current electrical parameter meets the power-off control condition, controlling the electronic equipment connected with the target circuit to be powered off.
In the above method, preferably, the step of meeting the power-off control condition by the current electrical parameter includes: a parameter value in the current electrical parameter is greater than or equal to a parameter threshold.
In the above method, it is preferable that the metal resistor is a plurality of metal resistors, and any one of the metal resistors covers a part of a surface layer region of the electronic device on the side where the target component is located, and all of the metal resistors cover all of the surface layer region of the electronic device on the side where the target component is located;
wherein the method further comprises:
obtaining a target area on the target component based at least on the current electrical parameter.
The above method, preferably, the obtaining a target area on the target component according to at least the current electrical parameter includes:
judging whether the current electrical parameter is greater than or equal to a first threshold value or not to obtain a judgment result;
and according to the judgment result, obtaining a target area on the target component, wherein the target area is an area covered by the metal resistor of which the current electrical parameter is greater than or equal to the first threshold value on the target component.
In the above method, preferably, the current electrical parameter at least includes a current resistance value of the metal resistor and/or a current voltage value corresponding to the metal resistor.
In the above method, preferably, the step of meeting the power-off control condition by the current electrical parameter includes: the component temperature of the target component is greater than or equal to a temperature threshold, the component temperature of the target component being obtained from the current electrical parameter.
A control device, comprising:
the parameter obtaining unit is used for obtaining current electrical parameters in a target circuit, the target circuit comprises at least one metal resistor, the metal resistor covers the surface layer of the electronic equipment on the side where a target component is located in a mesh structure, and the resistance value of the metal resistor is related to the temperature of the metal resistor;
and the equipment control unit is used for controlling the electronic equipment connected with the target resistor to be powered off under the condition that the current electrical parameter meets the power-off control condition.
An electronic device, comprising:
a target component;
the target circuit comprises at least one metal resistor, the metal resistor covers the surface layer of the electronic equipment on the side where the target component is located, and the resistance value of the metal resistor is related to the temperature of the metal resistor;
a processor for obtaining a current electrical parameter in the target circuit; and controlling the electronic equipment to power off under the condition that the current electrical parameters meet power off control conditions.
In the electronic device, it is preferable that, when there is one metal resistor, the metal resistor covers all of a surface layer region of the electronic device on a side where the target component is located;
when the number of the metal resistors is plural, any one of the metal resistors covers a part of a surface layer region of the electronic device on the side where the target component is located, and all of the metal resistors cover all of the surface layer region of the electronic device on the side where the target component is located.
The electronic device is preferably, the processor is further configured to: judging whether the current electrical parameter is larger than or equal to a first threshold value or not to obtain a judgment result, and obtaining a target area on the target component according to the judgment result, wherein the target area is an area covered by a metal resistor of which the current electrical parameter is larger than or equal to the first threshold value.
According to the scheme, in the control method, the control device and the electronic equipment, the metal resistor is covered on the surface layer of the electronic equipment on the side where the target component is located, whether the current electrical parameter of the target circuit containing the metal resistor meets the power-off control condition is monitored by utilizing the characteristic that the resistance value of the metal resistor changes along with the temperature, and then the electronic equipment connected with the target circuit is powered off under the condition that the current electrical parameter meets the power-off control condition, namely the temperature change state of the target component covered by the metal resistor is judged to have the risk of causing combustion, so that the condition that the target component continues to generate heat to cause combustion under the power-on state is avoided, and the effective power-off protection of the electronic equipment is realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a flowchart of a control method according to an embodiment of the present application;
FIG. 2 is a diagram illustrating an example of a surface layer on a side where a metal resistor covers a target component in an embodiment of the present application;
fig. 3 and fig. 4 are specific exemplary diagrams of a side surface layer where an exemplary diagram of a metal resistor covers a target component in an embodiment of the present application;
fig. 5 is another flowchart of a control method according to an embodiment of the present application;
fig. 6 is a partial flowchart of a control method according to an embodiment of the present application;
FIG. 7 is a schematic diagram of an embodiment of the present application;
fig. 8 is a schematic structural diagram of a control device according to a second embodiment of the present application;
fig. 9 is another schematic structural diagram of a control device according to a second embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of an electronic device according to a third embodiment of the present application;
fig. 11 is an exemplary diagram of a server PCB board to which the embodiment of the present application is applied.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, a flowchart for implementing a control method provided in an embodiment of the present application is provided, where the method may be applied to an electronic device, such as a computer or a server, that includes a target component, and the target component may be a component having a characteristic that a high temperature may cause heat generation or even burning, such as a printed Circuit board (pcb). The technical scheme in the embodiment is mainly used for realizing effective power-off protection of the electronic equipment.
Specifically, the method in this embodiment may include the following steps:
step 101: a current electrical parameter in the target circuit is obtained.
The target circuit may include at least one metal resistor, and of course, may also include a power supply and other resistors and cables connecting the power supply and the resistors, where the metal resistor covers a surface layer of the electronic device on the side where the target component is located in a mesh structure, as shown in fig. 2, and a resistance value of the metal resistor is related to a temperature of the metal resistor.
That is to say, the resistance of the metal resistor changes along with the change of the temperature of the metal resistor, so that the resistance of the metal resistor changes correspondingly under the condition that the temperature of the metal resistor changes, and further, the electrical parameter in the target current where the metal resistor is located also changes correspondingly.
In a specific implementation, the current electrical parameter may be a current resistance value of the metal resistor, or the current electrical parameter may be a current voltage value corresponding to the metal resistor, or the current electrical parameter may include both the current resistance value of the metal resistor and the current voltage value corresponding to the metal resistor.
It should be noted that the metal resistor may be a resistor made of copper, such as a copper sheet, and one or more copper sheets form a copper layer covering a surface layer of the electronic device on the side where the target component, such as a PCB board, is located.
Step 102: and judging whether the current electrical parameter meets the power-off control condition, and executing the step 103 under the condition that the current electrical parameter meets the power-off control condition.
Based on that, the current electrical parameter is analyzed in this embodiment to determine whether the current electrical parameter in the target circuit including the metal resistor satisfies the power-off control condition, and then determine whether the temperature change state of the target component covered by the metal resistor has a risk of causing combustion, and execute step 103 when it is determined that the temperature change state of the target component covered by the metal resistor has a risk of causing combustion.
Step 103: and controlling the electronic equipment connected with the target circuit to be powered off.
The electronic device refers to a device where the target component is located and the target component is covered by the metal resistor in the target circuit, such as a server and the like where the metal resistor is covered on a PCB. In this embodiment, after the current electrical parameter is analyzed, if it is determined that the temperature change state of the target component covered by the metal resistor is at risk of causing combustion, the electronic device in which the target component is located is controlled to be powered off, thereby avoiding the situation in which the target component continues to generate heat and cause combustion in the powered-on state.
According to the scheme, in the control method provided by the embodiment of the application, the metal resistor is covered on the surface layer of the electronic equipment on the side where the target component is located, whether the current electrical parameter of the target circuit containing the metal resistor meets the power-off control condition is monitored by utilizing the characteristic that the resistance value of the metal resistor changes along with the temperature, and then the electronic equipment connected with the target circuit is powered off under the condition that the current electrical parameter meets the power-off control condition, namely the temperature change state of the target component covered by the metal resistor is judged to have the risk of causing combustion, so that the situation that the target component continues to generate heat to cause combustion in the power-on state is avoided, and the effective power-off protection of the electronic equipment is realized.
In specific implementation, the power-off control condition in this embodiment may have a plurality of implementation manners, as follows:
in one implementation, the power-off control condition may be: the parameter is greater than or equal to the parameter threshold, and accordingly, the current electrical parameter in this embodiment satisfies the power-off control condition, which may include: the value of the parameter in the current electrical parameter is greater than or equal to the parameter threshold.
For example, the current electrical parameter satisfying the power-off control condition may be: the current resistance value corresponding to the metal resistor is greater than or equal to the corresponding resistance threshold value; alternatively, the current electrical parameter satisfying the power-off control condition may be: the current voltage value corresponding to the metal resistor is greater than or equal to the corresponding voltage threshold value; alternatively, the current electrical parameter satisfying the power-off control condition may be: the current resistance value corresponding to the metal resistor is greater than or equal to the corresponding resistance threshold value, and the current voltage value corresponding to the metal resistor is greater than or equal to the corresponding voltage threshold value.
Wherein the voltage threshold is related to the total voltage in the target circuit and the resistance of other fixed resistors in the target circuit, and the resistance threshold is related to the characteristics of the metal resistor.
That is to say, in this embodiment, after the current voltage value and/or the current resistance value corresponding to the metal resistor in the target circuit are obtained, whether the divided voltage of the metal resistor is increased to the voltage threshold value requiring power-off protection is determined by using the current voltage value, and/or whether the resistance is increased to the resistance threshold value requiring power-off protection is determined by using the current resistance value, and then the electronic device is powered off when the increased resistance value reaches the resistance threshold value due to the heating of the metal resistor and/or when the divided voltage reaches the voltage threshold value due to the increase of the resistance value of the metal resistor, so as to implement power-off protection of the electronic device.
For example, in this embodiment, a PCB in the server is powered on to generate heat, and the heat is transferred to a copper layer covering the PCB to cause a change in resistance of the copper layer; and/or when the voltage of the copper layer in the circuit is monitored to be increased to the voltage threshold value due to the increase of the heating resistance value, the server is powered off, and the risk of burning possibly caused by the fact that the PCB in the server is continuously powered on and generates heat is avoided.
In another implementation, the power-off protection condition may be: the temperature is greater than or equal to the temperature threshold, and accordingly, the current parameter in this embodiment satisfies the power-off control condition, which may include: the component temperature of the target component is greater than or equal to the temperature threshold, and the component temperature of the target component is obtained according to a current electrical parameter in the target circuit, wherein the current electrical parameter can be a current resistance value and/or a current voltage value corresponding to the metal resistor.
That is to say, in this embodiment, after the current resistance value corresponding to the metal resistor is obtained, according to the characteristic that the resistance value of the metal resistor changes with temperature, such as a characteristic curve that the resistance value changes with temperature, the current resistance value corresponding to the metal resistor is converted into a temperature value, so that the current temperature value of the metal resistor can be obtained.
Or, in this embodiment, after obtaining the current voltage value corresponding to the metal resistor, the current resistance value corresponding to the metal resistor is calculated according to the voltage value, and then the current resistance value corresponding to the metal resistor is converted into the temperature value according to the characteristics of the resistance value of the metal resistor changing with the temperature, such as the characteristic curve of the resistance value changing with the temperature, so as to obtain the current temperature value of the metal resistor, because the metal resistor covers the surface layer of the electronic device on the side where the target component is located, the component temperature of the target component can be calculated according to the current temperature value of the metal resistor, for example, the current temperature value of the metal resistor can be used as the component temperature of the target component, or a certain difference value is added on the basis of the current temperature value of the metal resistor to obtain the component temperature value of the target component, where the difference value is related to the distance between the metal resistor and, the larger the distance, the larger the difference.
That is to say, in this embodiment, after the current voltage value and/or the current resistance value corresponding to the metal resistor in the target circuit are obtained, the current voltage value and/or the current resistance value corresponding to the metal resistor are used to calculate the current temperature value of the metal resistor, and then the possible component temperature of the target component covered by the metal resistor is correspondingly calculated, so that when the component temperature of the target component increased due to energization reaches the preset temperature threshold, it can be determined that if the target component continues to be energized at this time, the risk of combustion exists due to temperature increase, and therefore, when the component temperature of the target component reaches the temperature threshold, the electronic device is powered off, so that power-off protection of the electronic device is implemented.
For example, in this embodiment, the PCB in the server is powered on to generate heat, and the heat is transferred to the copper layer covering the PCB to cause a change in the resistance of the copper layer.
In one implementation, the target circuit may include one metal resistor, and the metal resistor may have an integral sheet structure and may cover the entire surface area of the electronic device on the side where the target component is located, as shown in fig. 3. When the target component generates heat due to electrification, the temperature of the metal resistor rises due to the heat transferred by the target component, and the change of the resistance value of the metal resistor is caused.
For example, in this embodiment, a copper layer is added to an inner layer on a PCB of the server, the added copper layer is of a monolithic structure, after the PCB is powered on, in this embodiment, an electrical parameter in a circuit where the copper layer is located is monitored, such as a resistance value or a voltage value of the copper layer, and when it is monitored that a resistance value of the copper layer in the circuit is increased to a resistance threshold value or a voltage division value is increased to a voltage resistance value due to heating, the server is powered off, so that a risk of burning possibly caused by continuous power-on heating of the PCB is avoided.
In another implementation manner, the number of metal resistors included in the target circuit may be multiple, each metal resistor covers a part of the surface layer region on the side where the target component is located in the electronic device, and all the metal resistors form a whole structure to cover the whole surface layer region on the side where the target component is located in the electronic device, as shown in fig. 4.
Based on this, the current electrical parameter in the target circuit obtained in this embodiment may include the current resistance value and/or the current voltage value of each metal resistor. When the target component generates heat due to electrification, the area on the side of the target component covered by the metal resistor transfers heat to the metal resistor covering the partial area, so that the temperature of the metal resistor is increased, and the change of the resistance value of the metal resistor is caused.
Based on the above implementation, after step 101, the method in this embodiment may further include the following steps, as shown in fig. 5:
step 104: a target area on the target component is obtained based at least on the current electrical parameter.
The target area is a partial area covered by a metal resistor with current electrical parameters meeting the power-off control condition, that is, a partial area where overheating may cause combustion exists on the target component, such as an area where a fan or a central processing unit (cpu) on a PCB (printed circuit board) is located.
Specifically, when the target area on the target component is obtained according to at least the current electrical parameter in step 104, the following steps may be implemented, as shown in fig. 6:
step 601: and judging whether the current electrical parameter is greater than or equal to a first threshold value or not to obtain a judgment result.
In this embodiment, a threshold determination is performed on the current resistance value and/or the current voltage value corresponding to each metal resistor, for example, it is determined whether the current resistance value corresponding to each metal resistor is greater than or equal to a resistance threshold, and/or it is determined whether the current voltage value corresponding to each metal resistor is greater than or equal to a voltage threshold; or, in this embodiment, the current temperature value of each metal resistor may be calculated according to the current resistance value and/or the current voltage value corresponding to each metal resistor, and then, whether the current temperature value of each metal resistor is greater than or equal to the temperature threshold value is determined, so as to obtain a determination result corresponding to each metal resistor, where the determination result can represent whether a partial surface layer region on the side of the electronic device covered by the corresponding metal resistor, where the target component is located, is at risk of burning due to overheating.
Step 602: and obtaining the target area on the target component according to the judgment result.
The target area is an area covered by metal resistance of which the current electrical parameter is greater than or equal to a first threshold value on the target component.
As shown in fig. 7, in this embodiment, it is monitored that the current resistance value of the metal resistor a covered on the area a is greater than the resistance threshold, the current voltage value of the metal resistor B covered on the area B is greater than the voltage threshold, and the current temperature value of the metal resistor C covered on the area C is greater than the temperature threshold, so that A, B, C is determined as the target area in this embodiment, which indicates that there is a risk that corresponding components, such as a fan, a CPU, or other components, in the three areas on the target component may be burned due to overheating.
Further, in this embodiment, the target area may be output to a user to remind the user to check and update the corresponding component in time. For example, the area information of the target area is transmitted to the user terminal in the form of a short message, or the area information of the target area is output on the display screen of the electronic device in the form of screen output, or the like.
Referring to fig. 8, a schematic structural diagram of a control apparatus according to the second embodiment of the present disclosure is provided, where the apparatus may be configured in an electronic device, such as a computer or a server, which includes a target component, and the target component may be a component having a characteristic that a high temperature may cause heat generation or even burning, such as a printed Circuit board (pcb). The technical scheme in the embodiment is mainly used for realizing effective power-off protection of the electronic equipment.
Specifically, the apparatus in this embodiment may include the following units:
a parameter obtaining unit 801, configured to obtain a current electrical parameter in a target circuit, where the target circuit includes at least one metal resistor, the metal resistor is covered on a surface layer of the electronic device where a target component is located in a mesh structure, and a resistance value of the metal resistor is related to a temperature of the metal resistor;
and the device control unit 802 is configured to control the electronic device connected to the target resistor to power off when the current electrical parameter meets the power off control condition.
According to the above technical scheme, in the control device provided in the second embodiment of the present application, the metal resistor is covered on the surface layer of the electronic device on the side where the target component is located, and the characteristic that the resistance value of the metal resistor changes with temperature is utilized to monitor whether the current electrical parameter of the target circuit including the metal resistor meets the power-off control condition, so that the electronic device connected to the target circuit is powered off when the current electrical parameter is judged to meet the power-off control condition, that is, when the temperature change state of the target component covered by the metal resistor is judged to have the risk of causing combustion, the situation that the target component continues to generate heat to cause combustion in the power-on state is avoided, and thus effective power-off protection of the electronic device is achieved.
Specifically, the current electrical parameter at least includes a current resistance value of the metal resistor and/or a current voltage value corresponding to the metal resistor.
In one implementation, the current electrical parameter satisfies a power outage control condition, including: a parameter value in the current electrical parameter is greater than or equal to a parameter threshold.
In another implementation, the current electrical parameter satisfies a power outage control condition, including: the component temperature of the target component is greater than or equal to a temperature threshold, the component temperature of the target component being obtained from the current electrical parameter.
In one implementation, the number of the metal resistors is multiple, any one of the metal resistors covers a part of a surface layer region of the electronic device on the side where the target component is located, and all of the metal resistors cover all of the surface layer region of the electronic device on the side where the target component is located;
based on this, the apparatus in the present embodiment may further include the following units, as shown in fig. 9:
a region obtaining unit 803, configured to obtain a target region on the target component at least according to the current electrical parameter. For example, the region obtaining unit 803 determines whether the current electrical parameter is greater than or equal to a first threshold value to obtain a determination result; and according to the judgment result, obtaining a target area on the target component, wherein the target area is an area covered by the metal resistor of which the current electrical parameter is greater than or equal to the first threshold value on the target component.
It should be noted that, for the specific implementation of each unit in the present embodiment, reference may be made to the corresponding content in the foregoing, and details are not described here.
Referring to fig. 10, a schematic structural diagram of an electronic device according to a third embodiment of the present application is shown, where the electronic device may include the following structure:
a target component 1001;
the target circuit 1002, the target circuit 1002 comprises at least one metal resistor 1003, the metal resistor 103 covers the surface layer of the electronic device on the side where the target component 1001 is located, and the resistance value of the metal resistor 1003 is related to the temperature of the metal resistor 1003;
a processor 1004 for obtaining a current electrical parameter in the target circuit; and controlling the electronic equipment to power off under the condition that the current electrical parameters meet the power-off control conditions.
In particular, the metal resistance is realized by a copper layer.
In one implementation, the current electrical parameter satisfies a power outage control condition, including: the parameter value in the current electrical parameter is greater than or equal to a parameter threshold value, or the component temperature of the target component is greater than or equal to a temperature threshold value, and the component temperature of the target component is obtained according to the current electrical parameter.
In a specific implementation, the current electrical parameter at least includes a current resistance value of the metal resistor and/or a current voltage value corresponding to the metal resistor.
In one implementation, when there is one metal resistor 1003, the metal resistor 1003 covers all the surface layer area of the electronic device on the side where the target component 1001 is located;
in another implementation manner, when there are a plurality of metal resistors 1003, any metal resistor 1003 covers a part of the surface layer region on the side where the target component 1001 is located in the electronic device, and all metal resistors 1003 cover the whole surface layer region on the side where the target component 1001 is located in the electronic device.
Based on this, the processor 1003 is further configured to: and judging whether the current electrical parameter is greater than or equal to a first threshold value to obtain a judgment result, and obtaining a target area on the target component 1001 according to the judgment result, wherein the target area is an area covered by the metal resistor 1003 with the current electrical parameter greater than or equal to the first threshold value.
According to the scheme, in the electronic device provided by the third embodiment of the application, the metal resistor is covered on the surface layer of the side where the target component is located in the electronic device, the characteristic that the resistance value of the metal resistor changes along with the temperature is utilized, whether the current electrical parameter of the target circuit containing the metal resistor meets the power-off control condition or not is monitored, and then the electronic device connected with the target circuit is powered off under the condition that the current electrical parameter meets the power-off control condition, namely the temperature change state of the target component covered by the metal resistor is judged to have the risk of causing combustion, so that the situation that the target component continues to generate heat to cause combustion under the power-on state is avoided, and the effective power-off protection of the electronic device is realized.
Taking a target component as an example of a board card in a server, the following detailed examples of the technical solutions in the present application are given:
firstly, when the server board card is abnormal in short circuit, large current can be caused to generate heat, and when the generated heat is accumulated to 300 ℃, the PCB material can be ignited to cause combustion, so that the server works abnormally. Therefore, for the security of the server, power-off protection is usually performed by adding a fuse.
The inventor of the present application finds out that: the fuse can only protect one area, but the fuse cannot be beyond the protected area and cannot protect each area of the board card.
In view of the above, the inventor of the present application proposes a technical solution capable of performing effective power-off protection on a board, which is specific to the following problems and disadvantages of the existing solutions:
1. adding a copper layer to the inner layer of the board PCB may cover the entire copper layer in the entire area of the inner layer of the PCB, or cover the entire copper layer composed of multiple copper layers in the entire area of the inner layer of the PCB, as shown in fig. 3 and 4.
2. Two electrodes led out from the added copper layer are connected with a motherboard Field Programmable Gate Array (FPGA) (field Programmable Gate array) power-off protection module, namely a processor in the foregoing, as shown in fig. 11, a layer of grid copper foil is embedded between L04 and L05 in a PCB, a temperature change between L04 and L05 is detected by equivalently forming a thermal change resistor by using a change in a copper heating resistance value, and the electrodes are grounded and +3.3V, respectively, so that the power-off protection is realized by monitoring a voltage change shutdown on the motherboard FPGA, specifically as follows:
3. when the high temperature abnormality of a certain area exceeds 200 ℃, the copper layer is heated to cause the resistance value to change;
4. the resistance change of the copper layer causes the detection voltage change on the voltage division circuit;
5. the FPGA power-off protection module of the mainboard detects the resistance change or the voltage change through the two electrodes connected with the FPGA power-off protection module, so that the Power Switching Unit (PSU) is prevented from continuously supplying power and continuously heating, and the power Switching unit cannot reach the high temperature of 300 ℃ to cause combustion.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A control method, comprising:
obtaining a current electrical parameter in a target circuit, wherein the target circuit comprises at least one metal resistor, the metal resistor is covered on a surface layer of the electronic equipment on the side of a target component in a mesh structure, and the resistance value of the metal resistor is related to the temperature of the metal resistor;
and under the condition that the current electrical parameter meets the power-off control condition, controlling the electronic equipment connected with the target circuit to be powered off.
2. The method of claim 1, the current electrical parameter satisfying a power outage control condition, comprising: a parameter value in the current electrical parameter is greater than or equal to a parameter threshold.
3. The method of claim 1, wherein the metal resistor is a plurality of metal resistors, any one of the metal resistors covers a part of a surface layer area of the electronic device on the side of the target component, and all of the metal resistors cover all of the surface layer area of the electronic device on the side of the target component;
wherein the method further comprises:
obtaining a target area on the target component based at least on the current electrical parameter.
4. The method of claim 3, said obtaining a target area on the target component based at least on the current electrical parameter, comprising:
judging whether the current electrical parameter is greater than or equal to a first threshold value or not to obtain a judgment result;
and according to the judgment result, obtaining a target area on the target component, wherein the target area is an area covered by the metal resistor of which the current electrical parameter is greater than or equal to the first threshold value on the target component.
5. The method of claim 1, the current electrical parameter comprising at least a current resistance value of the metal resistance and/or a corresponding current voltage value of the metal resistance.
6. The method of claim 1, the current electrical parameter satisfying a power outage control condition, comprising: the component temperature of the target component is greater than or equal to a temperature threshold, the component temperature of the target component being obtained from the current electrical parameter.
7. A control device, comprising:
the parameter obtaining unit is used for obtaining current electrical parameters in a target circuit, the target circuit comprises at least one metal resistor, the metal resistor covers the surface layer of the electronic equipment on the side where a target component is located in a mesh structure, and the resistance value of the metal resistor is related to the temperature of the metal resistor;
and the equipment control unit is used for controlling the electronic equipment connected with the target resistor to be powered off under the condition that the current electrical parameter meets the power-off control condition.
8. An electronic device, comprising:
a target component;
the target circuit comprises at least one metal resistor, the metal resistor covers the surface layer of the electronic equipment on the side where the target component is located, and the resistance value of the metal resistor is related to the temperature of the metal resistor;
a processor for obtaining a current electrical parameter in the target circuit; and controlling the electronic equipment to power off under the condition that the current electrical parameters meet power off control conditions.
9. The electronic device according to claim 8, wherein if there is one metal resistor, the metal resistor covers all surface regions of the electronic device on the side where the target component is located;
when the number of the metal resistors is plural, any one of the metal resistors covers a part of a surface layer region of the electronic device on the side where the target component is located, and all of the metal resistors cover all of the surface layer region of the electronic device on the side where the target component is located.
10. The electronic device of claim 9, the processor further to: judging whether the current electrical parameter is larger than or equal to a first threshold value or not to obtain a judgment result, and obtaining a target area on the target component according to the judgment result, wherein the target area is an area covered by a metal resistor of which the current electrical parameter is larger than or equal to the first threshold value.
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| CN202110297399.4A CN112993942A (en) | 2021-03-19 | 2021-03-19 | Control method and device and electronic equipment |
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| CN202110297399.4A CN112993942A (en) | 2021-03-19 | 2021-03-19 | Control method and device and electronic equipment |
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