KR101174856B1 - System and method for inspecting a one chip microprocessor circuit device of power plant pcb - Google Patents

Abstract

PURPOSE: A system and a method for inspecting a semiconductor integrated circuit of a power plant PCB are provided to prevent the unexpected operation stop of a power plant. CONSTITUTION: A system for inspecting a semiconductor integrated circuit of a power plant PCB comprises a manipulation unit(10), a jig(20), a reading unit(40), a control unit(50), a memory unit(60), and a display unit(70). Conditions for inspecting a semiconductor IC are inputted to the manipulation unit. The jig detects data inputted and outputted through a lead pin. The reading unit reads the detected data and supplies the read data to the control unit. The control unit compares the supplied data with the normal I/O data of the semiconductor IC. The memory unit creates a new database using the data. The display unit outputs the inspection state and results of the semiconductor IC.

Description

Semiconductor integrated circuit inspection device and method for power plant control card {SYSTEM AND METHOD FOR INSPECTING A ONE CHIP MICROPROCESSOR CIRCUIT DEVICE OF POWER PLANT PCB}

The present invention is a power plant control card that enables the detailed inspection of the characteristics and functions of a semiconductor integrated circuit (One Chip Microprocessor) mounted on a control card that is in charge of the operation and status analysis of various operating and measuring equipments provided in the power plant. A semiconductor integrated circuit inspection apparatus and method are disclosed.

In order to meet the demand for electricity due to the acceleration of industrial development, various types of power plants, including hydroelectric power plants, thermal power plants, nuclear power plants, wind power plants, solar thermal power plants, and tidal power plants, have been constructed to produce power.

The operation and analysis of the various operating and measuring equipments in the power plant is carried out by a control card consisting of digital equipment.The semiconductor integrated circuit mounted on the control card is a SMD (Surface Mounting Device) method. It is directly mounted on the board.

As described above, a control card in which a semiconductor integrated circuit is mounted on a printed circuit board in a SMD type is used in a weak operating environment of a power plant. Therefore, the lead pin of the semiconductor integrated circuit is fixed by the progress and vibration of durability and the printed circuit board is Soldering that provides an electrical connection with the pattern of can be eliminated.

In addition, overvoltage, overcurrent, or noise may be introduced into the semiconductor integrated circuit during operation in a vulnerable environment, causing damage or outputting error data.

Therefore, at the time when the planned maintenance of the power plant is in progress or when it is deemed necessary, the electronic card is inspected for abnormality by the In Circuit Test (ICT) method.

As a method of performing ICT inspection on an electronic card, the operator's naked eye and an extremely limited inspection apparatus are checking for damage to general devices such as resistors, capacitors, transistors, and diodes.

For example, both ends of the above-described device are measured by a tester (tester) to detect whether or not the corresponding device is damaged.

Since the electronic card is composed of a mixture of digital and analog devices, different results are detected every time a measurement is made, so that reliability cannot be secured in the measurement, and only a part of the analog device is provided for measurement.

Therefore, in the harsh operating environment, the pins of the semiconductor integrated circuit mounted on the electronic card are fixed under the influence of the vibration, and the solder is removed or the input / output through the lead pin of the semiconductor integrated circuit provides an electrical connection with the pattern of the printed circuit board. There is a problem that the overhaul is not provided for the data.

As a result, an unexcited control function of the semiconductor integrated circuit may occur, which may cause a fatal risk for safe operation of the power plant.

The present invention has been proposed in view of the above-described problems, and an object thereof is an ICT capable of closely inspecting the performance and function of a semiconductor integrated circuit mounted on a control card that is in charge of the operation and condition analysis of various facilities in a power plant. To provide a device.

In addition, an object of the present invention is to compare the data input and output at the leaf pin of the semiconductor integrated circuit mounted on the control card with the reference data set by the manufacturer and the type of the semiconductor integrated circuit in the database for a detailed inspection that provides safety and reliability To provide.

In addition, an object of the present invention is to provide convenience and stability to the inspection by connecting the probe pin of the jig and the lit pin of the semiconductor integrated circuit without artificially removing the coating film for protecting the various elements mounted on the control card do.

A feature according to an embodiment of the present invention includes an operation unit for inputting a condition for inspecting a semiconductor integrated circuit mounted on a power plant control card; A jig electrically connected to a lead pin of the inspection target semiconductor integrated circuit to detect data input and output through the lead pin; A reading unit which reads input / output data of the inspection target semiconductor integrated circuit detected by the jig and provides the read / write data to the controller; Set the inspection interval of the inspection target semiconductor integrated circuit according to the condition input from the operation unit, and compare the inspection result with the input / output data of the inspection target semiconductor integrated circuit and the steady state input / output data of the semiconductor integrated circuit provided by the reading unit. A control unit for determining; A memory unit configured to classify semiconductor integrated circuits mounted on a power plant control card by a manufacturer and a type to build a steady state input / output data as a database; According to the control of the control unit is provided a semiconductor integrated circuit inspection apparatus for a power plant control card comprising a display unit for outputting the status and the inspection result of the inspection progress of the semiconductor integrated circuit in a predetermined manner.

The apparatus may further include an ultrasonic heating unit configured to adjust heating of the ultrasonic heater embedded in the body of the jig according to the control of the controller.

The apparatus may further include a buzzer that outputs a warning message when an abnormality is determined in the inspection result of the semiconductor integrated circuit under the control of the controller.

The operation unit is composed of a plurality of function keys and selection keys to input the manufacturer and type of the inspection target semiconductor integrated circuit, the execution of the inspection and the storage of the inspection results, the output of the inspection results and the transfer conditions to the peripheral device.

The operation unit may select the inspection target semiconductor integrated circuit by using manufacturer and type information of the semiconductor integrated circuit provided in a tree structure on the display unit.

The operation unit may be configured as a graphical user interface (GUI) on the display unit.

The jig may be provided in plural and may be manufactured in different structures according to the type of semiconductor integrated circuit and the number of lead pins of the semiconductor integrated circuit.

The jig body; It may include a probe provided on the lower side of the body and electrically connected to the lead pin of the semiconductor integrated circuit exposed on the printed circuit board of the control card to detect the input and output data.

The body has a built-in ultrasonic heater for heating the probe may melt the coating film to protect the lead pin of the semiconductor integrated circuit when jig connection.

The probe is made of a thin and resilient metal, and an end portion of the probe connected to the lead pin of the semiconductor integrated circuit may be flat for a large contact area.

When the jig probe is connected to the lead pin of the semiconductor integrated circuit exposed to the printed circuit board, the controller generates an ultrasonic heater that is embedded in the jig by the ultrasonic heating unit to melt the coating film protecting the lead pin of the semiconductor integrated circuit. Probes and lead pins can be in electrical contact.

When the probe of the jig is electrically connected to the lead pin of the semiconductor integrated circuit, the controller may turn off the ultrasonic heating unit to prevent overheating of the probe and block the melting range of the coating layer from widening.

In addition, a feature according to another embodiment of the present invention is the process of setting the inspection conditions of the semiconductor integrated circuit mounted on the power plant control card; Loading steady state input / output data of the inspection target semiconductor integrated circuit and storing the same in the temporary memory area; Heating the ultrasonic heater embedded in the body of the jig and electrically connecting the probe of the jig and the lead pin of the inspection target semiconductor integrated circuit protruding from the upper or lower portion of the printed circuit board of the control card; The semiconductor of the power plant control card includes reading the input / output data of the inspection target semiconductor integrated circuit through a jig probe, comparing the reference data stored in the temporary memory area to determine whether there is an error, and outputting and storing the inspection result. An integrated circuit inspection apparatus is provided.

If the probe of the jig and the lead pin of the semiconductor semiconductor circuit to be inspected are not electrically connected within a predetermined time while heating the ultrasonic heater embedded in the body of the jig, the heating of the ultrasonic heater may be stopped and the test condition may be initialized. have.

When it is determined that the inspection result of the inspection target semiconductor integrated circuit is abnormal, the set warning message may be output to notify the operator.

As described above, the present invention can provide ICT overhaul of the characteristics of the semiconductor integrated circuit mounted on the power plant control card and the function assigned to the lead pins, thereby preventing the operation stop unexcited in the operation of the power plant.

In addition, the present invention can provide reliable overhaul of data stored in various types of semiconductor memory devices including ROM, RAM, EPROM, Flash Memory, and the like mounted on a control card.

In addition, the present invention provides an ICT detailed inspection without artificially removing the coating film protecting various elements from the printed circuit board of the control card to provide convenience and time reduction of the inspection and do not perform recoating to the control card. It can provide safety of the device to be mounted.

1 is a view showing a semiconductor integrated circuit inspection apparatus of a power plant control card according to an embodiment of the present invention.
2 is a view showing a jig used in the semiconductor integrated circuit inspection apparatus of the power plant control card according to an embodiment of the present invention.
3 and 4 are diagrams illustrating a state of use of the jig illustrated in FIG. 2.
5 is an exemplary diagram illustrating a normal state of data input and output at a lead pin of an arbitrary semiconductor integrated circuit mounted on a control card.
FIG. 6 is a diagram illustrating an example of input / output data including abnormal data measured by a semiconductor integrated circuit test apparatus of a power plant control card according to an exemplary embodiment of the present invention.
7 is a flowchart illustrating an operation procedure of a semiconductor integrated circuit inspection apparatus of a power plant control card according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily practice the present invention.

The present invention can be embodied in various different forms, and thus the present invention is not limited to the embodiments described herein.

1 is a view showing a semiconductor integrated circuit inspection apparatus of a power plant control card according to an embodiment of the present invention, Figure 2 is a jig used in the semiconductor integrated circuit inspection apparatus of a power plant control card according to an embodiment of the present invention. One drawing.

Referring to FIG. 1, the present invention includes an operation unit 10, a jig 20, an ultrasonic heating unit 30, a reading unit 40, a control unit 50, a memory unit 60, a display unit 70, and a buzzer ( 80).

The operation unit 10 is composed of a plurality of function keys and selection keys to apply a selection signal to the control unit 50 for inspecting any semiconductor integrated circuit mounted on the power plant control card in accordance with an operation by an operator (operator).

The operation unit 10 is a peripheral device that connects the manufacturer and the type of the inspection target semiconductor integrated circuit, the execution of the inspection and the storage and output of the inspection result, and the inspection result to inspect the semiconductor integrated circuit mounted on the power plant control card. You can choose to save or send the data.

The operation unit 10 may conveniently select the semiconductor integrated circuit to be inspected by utilizing the manufacturer-specific and type-specific information of the semiconductor integrated circuit provided in the tree structure in the display unit 70.

The operation unit 10 may be configured as a graphical user interface (GUI) on the display unit 70.

The jig 20 detects data that is electrically connected to the lead pins of the inspection target semiconductor integrated circuit and input and output through the lead pins.

The jig 20 is composed of a plurality of, and has a different structure according to the type of semiconductor integrated circuit, the number of lead pins of the semiconductor integrated circuit, so that the use of the jig 20 suitable for the inspection target integrated circuit can be provided. do.

As shown in FIG. 2, the jig 20 includes a body 21 and a probe 23 at a lower side of the body 21, and the probe 23 is a printed circuit of a control card. It is electrically connected to the lead pins of the semiconductor integrated circuit mounted on the substrate.

The probe 23 is made of a metal having a thin and strong resilience material, and an end portion of the probe 23 connected to the lead pin of the semiconductor integrated circuit is flat to provide a stable connection to provide a large contact area.

An ultrasonic heater (not shown) is embedded in the body 21, and when the probe 23 and the lead pin of the semiconductor integrated circuit are connected, the coating film is heated to surround the lead pin of the semiconductor integrated circuit by heating the probe 23. Is instantaneously melted so that electrical contact can be provided at the probe pin and lead pin connections of the semiconductor integrated circuit.

The ultrasonic heater 30 heats an ultrasonic heater (not shown) embedded in the jig 20 according to a control signal applied from the controller 50 when a condition for inspecting a semiconductor integrated circuit mounted on the control card is selected. Let's do it.

The reading unit 40 processes the input / output data for each of the lead pins of the semiconductor integrated circuit detected by the jig 20 so that the control unit 50 can recognize and provides the same to the control unit 50.

The control unit 50 selects the inspection target semiconductor integrated circuit from the operation unit 10, and when the inspection condition is set, displays the type and inspection condition information of the selected inspection target semiconductor integrated circuit through the display unit 70. The reference data input and output through the lead pin of the semiconductor integrated circuit stored in 60) is loaded and temporarily stored.

The controller 50 controls the ultrasonic heating unit 30 to generate an ultrasonic heater (not shown) embedded in the jig 20, thereby bringing the probe 23 of the jig 20 into the lead pin of the semiconductor integrated circuit. When connecting, the coating film protecting the lead pin of the semiconductor integrated circuit is melted so that the probe 23 of the jig 20 and the lead pin are electrically contacted.

When the probe 23 of the jig 20 and the lead pin of the semiconductor integrated circuit are electrically connected by melting the coating film, the controller 50 turns off the ultrasonic heating unit 30 so that the overheat of the probe 23 is not generated. In addition, the melting range of the coating film is prevented from being widened.

The controller 50 compares the data input / output at the lead pin of the inspection target semiconductor integrated circuit provided by the reading unit 40 with the reference data of the semiconductor integrated circuit loaded from the memory unit 60. Determine if this has occurred.

The controller 50 stores the test result of the test target semiconductor integrated circuit in a designated area of the memory unit 60 and outputs the result through the display unit 70.

In addition, the controller 50 outputs a warning message through the buzzer 80 when an abnormality is determined in the inspection result of the inspection target semiconductor integrated circuit so that an operator (operator) can easily recognize it.

In the memory unit 60, reference data input and output through the lead pins are constructed as a database by dividing by manufacturer and type of a semiconductor integrated circuit mounted on a power plant control card in a designated area.

The memory unit 60 stores the inspection result of the inspection target semiconductor integrated circuit in another region designated under the control of the controller 50.

The display unit 70 displays the general state and the inspection result of the progress of the inspection of the semiconductor integrated circuit in a predetermined manner according to the control of the controller 50 so that an operator (operator) can easily recognize it.

The display unit 70 may be configured as a touch screen including a graphical user interface (GUI), and when the touch screen is configured as a touch screen, the display unit 70 includes a function of the operation unit 10 configured as a button. The configuration can be omitted.

The buzzer 80 notifies an operator (operator) by outputting a warning message when an abnormality is determined in the inspection process of the semiconductor integrated circuit under the control of the controller 50.

The operation of the present invention including the functions as described above is executed as follows.

First, a semiconductor integrated circuit to be inspected is selected from a plurality of semiconductor integrated circuits mounted on a power plant control card, and then, a plurality of function keys and selection keys of the operation unit 10 are used to control the manufacturer and type of information of the semiconductor integrated circuit to be inspected. Enter in (50).

The manufacturer and type of the inspection target semiconductor integrated circuit may be conveniently selected by using the manufacturer and type information of the semiconductor integrated circuit provided in the tree structure in the display unit 70.

When the inspection target semiconductor integrated circuit is selected as the input of the operation unit 10 as described above, the controller 50 accesses the input / output data of the semiconductor integrated circuit selected from the database stored in the memory unit 60 and stores the data in the temporary memory area.

The controller 50 controls the ultrasonic heater 30 to generate an ultrasonic heater (not shown) embedded in the jig 20.

Therefore, as shown in FIGS. 3 and 4, the probe 23 of the jig 20 is placed on the lead pin 111 of the semiconductor semiconductor circuit 110 to be inspected above or below the printed circuit board 100 of the control card. When connecting, the coating film protecting the lead pin 111 of the semiconductor integrated circuit 110 is melted instantaneously so that the probe 23 of the jig 20 and the lead pin 111 are electrically contacted.

The control unit 50 turns off the ultrasonic heating unit 30 when the probe 23 of the jig 20 and the lead pin 111 of the semiconductor integrated circuit 110 are electrically connected by melting the coating film. It is possible to prevent overheating of the film and to prevent the melting range of the coating film from being widened.

As described above, when the probe 23 of the jig 20 and the lead pin 111 of the semiconductor integrated circuit 110 to be inspected are electrically connected, the probe 23 of the jig 20 is the semiconductor integrated circuit 110 to be inspected. The data input / output through the read pin 111 of) is detected and provided to the reading unit 40.

The reading unit 40 provides the control unit 50 with input / output data at the lead pin of the inspection target semiconductor integrated circuit 110 detected by the jig 20.

The control unit 50 loads data input and output from the read pin 111 of the inspection target semiconductor integrated circuit 110 provided by the reading unit 40 and the corresponding semiconductor integrated circuit loaded from the memory unit 60 and stored in the temporary memory area. It is determined whether or not an abnormality has occurred in any part by comparison with reference data.

In addition, the controller 50 stores the test result of the test target semiconductor integrated circuit 110 in a designated area of the memory unit 60 and outputs the same through the display unit 70 so that an operator (operator) can recognize the test result. do.

In addition, the controller 50 outputs a warning message through the buzzer 80 when an abnormality is determined in the inspection result of the inspection target semiconductor integrated circuit so that an operator (operator) can easily recognize it.

For example, assuming that normal data input and output from the lead pin 111 of the inspection target semiconductor integrated circuit 110 is the same as that of FIG. 5, when the result of inspection by the inspection apparatus according to the present invention is detected with FIG. 6, a trip ( The test result can be obtained as a state in which an abnormal output A is generated in the TRAP [6]) information and a state in which an abnormal output B is generated in the clock CLK [37].

The result of the inspection according to the above procedure is stored in the peripheral device connected to the selection of the operation unit 10 so that history management for the occurrence of a failure can be provided.

When the inspection of the semiconductor integrated circuit mounted on the control card is completed and the jig 20 connected to the lead pin 111 is removed according to the above procedure, the coating film melted by the heat generation of the ultrasonic heater is naturally cooled and restored to its original state. It can be provided to the normal protection function against the lead pin of the semiconductor integrated circuit in a state where no separate coating treatment is involved.

The inspection time using the semiconductor integrated circuit inspection apparatus according to the present invention varies depending on the type of the semiconductor integrated circuit, but the inspection is completed within approximately 5 to 10 seconds, thereby damaging the coating layer by melting and natural cooling of the coating layer by an ultrasonic heater. This does not occur.

In addition, the heat transferred to the probe by the heat generation of the ultrasonic heater generates a loss in the process of fusing the coating film, and thus does not affect the lead pin of the semiconductor integrated circuit.

7 is a flowchart illustrating an operation procedure of a semiconductor integrated circuit inspection apparatus of a power plant control card according to an embodiment of the present invention.

The control unit 50 of the semiconductor integrated circuit inspection apparatus of the power plant control card according to the present invention receives the selection of the manufacturer, type and inspection method of the inspection target semiconductor integrated circuit from the operation unit 10 (S101) (S102). 50 accesses the input / output data of the semiconductor integrated circuit selected from the database stored in the memory unit 60 and stores it in the temporary memory area (S103).

Thereafter, when the start of the test is detected, the controller 50 controls the ultrasonic heating unit 30 to heat an ultrasonic heater (not shown) embedded in the jig 20 (S105).

On the lead pin 111 of the inspection target semiconductor integrated circuit 110 exposed to the upper or lower side of the printed circuit board 100 of the control card while heating the ultrasonic heater (not shown) embedded in the jig 20. When the probes 23 of the jig 20 are in contact with each other, the coating film protecting the lead pins 111 of the semiconductor integrated circuit 110 is instantly melted to form the probes 23 and the lead pins 111 of the jig 20. Electrical contact.

The control unit 50 turns off the ultrasonic heating unit 30 when the probe 23 of the jig 20 and the lead pin 111 of the semiconductor integrated circuit 110 are electrically connected by melting the coating film (S106). The overheating of (23) is not generated and the melting range of the coating film is prevented from being widened.

The probe 23 of the jig 20 detects data input / output through the lead pins 111 of the inspection target semiconductor integrated circuit 110 and provides the data to the controller 50 through the read unit 40 (S107). ).

The control unit 50 loads data input and output from the read pin 111 of the inspection target semiconductor integrated circuit 110 provided by the reading unit 40 and the corresponding semiconductor integrated circuit loaded from the memory unit 60 and stored in the temporary memory area. It is determined whether an abnormality has occurred in any part by comparison with the reference data of (S108).

In addition, the controller 50 stores the test result of the test target semiconductor integrated circuit 110 in a designated area of the memory unit 60 and outputs the same through the display unit 70 so that an operator (operator) can recognize the test result. (S109).

For example, assuming that normal data input and output from the lead pin 111 of the inspection target semiconductor integrated circuit 110 is the same as that of FIG. 5, when the result of inspection by the inspection apparatus according to the present invention is detected with FIG. 6, a trip ( The test result can be obtained as a state in which an abnormal output A is generated in the TRAP [6]) information and a state in which an abnormal output B is generated in the clock CLK [37].

In addition, the probe 23 and the semiconductor integrated circuit 110 of the jig 20 within a predetermined time in a state of controlling the ultrasonic heating unit 30 to heat the ultrasonic heater (not shown) embedded in the jig 20. If the lead pins 111 are not electrically connected, the heating of the ultrasonic heater (not shown) is blocked to protect the jig 20 (S111), and the inspection condition is initialized (S112).

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be understood that various modifications and changes may be made without departing from the scope of the appended claims.

10: operation unit 20: jig
30: ultrasonic heating unit 40: reading unit
50: control unit 60: memory unit
70: display unit

Claims (16)

An operation unit for inputting a condition for inspecting a semiconductor integrated circuit mounted on a power plant control card;
A jig electrically connected to a lead pin of the inspection target semiconductor integrated circuit to detect data input and output through the lead pin;
A reading unit which reads input / output data of the inspection target semiconductor integrated circuit detected by the jig and provides the read / write data to the controller;
The inspection conditions of the inspection target semiconductor integrated circuit are set according to the condition input from the operation unit, and the inspection result is compared with the input / output data of the inspection target semiconductor integrated circuit and the steady state input / output data of the semiconductor integrated circuit. A control unit for determining;
A memory unit configured to classify semiconductor integrated circuits mounted on a power plant control card by a manufacturer and a type to build a steady state input / output data as a database;
A display unit for outputting a state and a test result of a test progress of the semiconductor integrated circuit in a predetermined method according to the control of the controller;
Including,
And an ultrasonic heating unit for controlling the heating of the ultrasonic heater embedded in the body of the jig according to the control of the control unit. delete delete The method of claim 1,
The operation unit is composed of a plurality of function keys and selection keys, characterized in that the manufacturer and type of the semiconductor integrated circuit to be tested, the test execution and storage of the test results, the output of the test results and input the transfer conditions to the peripheral device Semiconductor integrated circuit inspection device for a control card. The method of claim 1,
And the operation unit selects an inspection target semiconductor integrated circuit using information of each manufacturer and type of the semiconductor integrated circuit provided in a tree structure on the display unit. The method of claim 1,
And said operation portion comprises a graphical user interface (GUI) on a display portion. The method of claim 1,
The jig is provided with a plurality, the semiconductor integrated circuit inspection apparatus for a power plant control card, characterized in that the structure is manufactured in a different structure according to the type of semiconductor integrated circuit, the number of lead pins of the semiconductor integrated circuit. The method of claim 1,
The jig body;
A probe provided at a lower side of the body and electrically connected to a lead pin of a semiconductor integrated circuit exposed on a printed circuit board of a control card to detect input / output data;
Semiconductor integrated circuit inspection apparatus of the power plant control card comprising a. The method of claim 8,
The body has a built-in ultrasonic heater for heating the probe is integrated semiconductor inspection apparatus, characterized in that for melting the coating film to protect the lead pin of the semiconductor integrated circuit when jig connection. The method of claim 8,
The probe is made of a thin and resilient metal, the end portion connected to the lead pin of the semiconductor integrated circuit is a semiconductor integrated circuit inspection apparatus of a power plant control card, characterized in that the flat configuration for a large contact area. The method of claim 1,
When the jig probe is connected to the lead pin of the semiconductor integrated circuit exposed on the printed circuit board, the controller generates an ultrasonic heater that is embedded in the jig by the ultrasonic heating unit to melt the coating film protecting the lead pin of the semiconductor integrated circuit. The semiconductor integrated circuit inspection apparatus of a power plant control card, characterized in that the electrical contact between the probe and the lead pin. The method of claim 1,
When the probe is electrically connected to the lead pin of the semiconductor integrated circuit, the control unit turns off the ultrasonic heating unit to prevent overheating of the probe and prevents the melting range of the coating layer from being widened. Circuit tester. The method of claim 1,
The display unit is a semiconductor integrated circuit inspection device of a power plant control card, characterized in that the touch screen comprising a GUI. Setting an inspection condition of a semiconductor integrated circuit mounted on a power plant control card input from an operation unit;
Loading steady state input / output data of the inspection target semiconductor integrated circuit and storing the same in the temporary memory area;
Heating the ultrasonic heater embedded in the body of the jig and electrically connecting the probe pin of the jig and the lead pin of the inspection target semiconductor integrated circuit protruding from the upper or lower portion of the printed circuit board of the control card;
Reading input / output data of the inspection target semiconductor integrated circuit through a probe of a jig, comparing the reference data stored in the temporary memory area to determine whether there is an abnormality, and outputting and storing the inspection result;
Semiconductor integrated circuit inspection method of the power plant control card comprising a. The method of claim 14,
If the electrical connection between the probe of the jig and the lead pin of the inspection target semiconductor integrated circuit is not detected within a predetermined time while heating the ultrasonic heater embedded in the body of the jig, the heating of the ultrasonic heater is stopped and the inspection condition is initialized. Semiconductor integrated circuit inspection method of a power plant control card, characterized in that. The method of claim 14,
And if it is determined that the inspection target semiconductor integrated circuit is abnormal, outputting a set warning message.

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