CN107341537B - Anti-disassembly electronic tag - Google Patents
Anti-disassembly electronic tag Download PDFInfo
- Publication number
- CN107341537B CN107341537B CN201710744309.5A CN201710744309A CN107341537B CN 107341537 B CN107341537 B CN 107341537B CN 201710744309 A CN201710744309 A CN 201710744309A CN 107341537 B CN107341537 B CN 107341537B
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- Prior art keywords
- disassembly
- cavity
- chip
- electronic tag
- antenna
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
- G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Burglar Alarm Systems (AREA)
Abstract
The invention relates to an anti-disassembly electronic tag, which comprises: the substrate is provided with an anti-disassembly cavity in the middle, the anti-disassembly cavity is a multi-layer cavity, and anti-disassembly devices are arranged in a plurality of cavities in the anti-disassembly cavity; the antenna is arranged on the upper surface of the substrate and is fixed on the substrate through a curable strong adhesive; the chip is arranged in one cavity in the middle of the anti-disassembly cavity, and the anti-disassembly devices are respectively arranged in the cavities on the upper side and the lower side of the chip and are electrically connected with the antenna. The anti-disassembly electronic tag has the advantages of simple structure, low manufacturing cost, convenient use and achieving the anti-disassembly effect by damaging the chip and the antenna at the same time during the forced disassembly.
Description
Technical Field
The invention relates to the field of electronic labels, in particular to an anti-disassembly electronic label.
Background
Radio frequency identification electronic tags are generally classified into low frequency, high frequency and ultrahigh frequency according to frequency bands. The method is widely used for logistics tracking and product sales due to long reading and writing distance and large storage space. In order to avoid that the labels on the articles are detached and attached to other products for use, higher requirements are put on the disassembly prevention and the transfer prevention of the electronic labels. If the electronic tag is attached to products such as cigarettes and wines for anti-counterfeiting, the electronic tag cannot be detached for fake cigarettes and wines.
The anti-counterfeiting technology in the prior art mainly comprises chip algorithm encryption and physical tamper-proof of antenna materials. In practical application, the chip and the antenna element are connected by adopting various anisotropic conductive adhesives. Physical tamper-evident, although some damage to the tag antenna, may be done by using a special solvent or acid to break the connection between the chip and the antenna, and after the chip is removed, it is also feasible to rework a layer of tag antenna, encapsulate the chip on the antenna material, and repackage the tag, thereby avoiding the problem that the tag is imitated and reused due to the removal and repackage of the chip.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides the anti-disassembly electronic tag which has the advantages of simple structure, low manufacturing cost, convenience in use and capability of achieving the anti-disassembly effect by damaging a chip and an antenna at the same time during forced disassembly.
In order to achieve the above object, the technical scheme of the present invention is to provide an anti-disassembly electronic tag, comprising:
the substrate is provided with an anti-disassembly cavity in the middle, the anti-disassembly cavity is a multi-layer cavity, and anti-disassembly devices are arranged in a plurality of cavities in the anti-disassembly cavity;
the antenna is arranged on the upper surface of the substrate and is fixed on the substrate through a curable strong adhesive; the antenna is solidified through the solidifiable powerful glue, so that the antenna is damaged due to deformation, and the electronic tag is disabled.
The chip is arranged in one cavity in the middle of the anti-disassembly cavity, and the anti-disassembly devices are respectively arranged in the cavities on the upper side and the lower side of the chip and are electrically connected with the antenna.
In order to realize the establishment of the electronic tag anti-disassembly device, the preferable technical scheme is that the anti-disassembly cavity comprises a first layer cavity, a second layer cavity and a third layer cavity which are sequentially stacked and connected in a direction from being close to one side far away from the upper surface of the substrate, and the chip is arranged in the second layer cavity. The anti-disassembly device is respectively arranged in the first layer cavity and the third layer cavity of the anti-disassembly cavity. The chip is arranged between the anti-dismantling devices, so that when the electronic tag is forcibly dismantled, the anti-dismantling devices on the upper side and the lower side of the chip are started, and the chip is damaged to be invalid.
In order to realize that the anti-disassembly cavity is damaged when the electronic tag is forcibly disassembled, so that the anti-disassembly device is started, the preferable technical scheme is that the anti-disassembly cavity is an anti-corrosion and fragile cavity, and the cavity can be made of ceramic materials. The characteristics of the hard brittleness of the ceramic enable the ceramic to be broken when the ceramic is deformed under stress.
In order to destroy the chip when the electronic tag is subjected to forced disassembly, the preferable technical scheme is that the disassembly prevention device is set as a medium with corrosiveness to the chip, and the medium with corrosiveness can be set as an acid solution with corrosiveness to the chip. The chip is arranged among the anti-disassembly devices, so that when the electronic tag is forcibly disassembled, the anti-disassembly cavity is damaged due to deformation, the anti-disassembly devices are started, corrosive liquid in the anti-disassembly cavity is enabled to be in contact with the chip in the second cavity, copper bumps and surface layers on the chip are dissolved, the chip cannot be packaged again, and therefore the electronic tag is disabled.
In order to enable the electronic tag to be broken when being forcibly detached, the substrate is preferably a brittle substrate, and the substrate may be made of ceramic material. The characteristics of the hard brittleness of the ceramic enable the ceramic to be broken when the ceramic is deformed under stress.
In order to make the electronic tag adhere to the article to be anti-counterfeiting, the electronic tag preferably further comprises a non-adhesive layer arranged on one side surface far away from the base material.
The preferable technical scheme is that the anti-disassembly cavity can be of any shape and is not limited in shape.
Compared with the prior art, the invention has the advantages that: the electronic tag takes the fragile ceramic material as the base material, and when the electronic tag is forcibly disassembled, the base material is broken when the electronic tag is deformed due to the stress caused by the characteristics of the hardness and the brittleness of the ceramic of the base material; the antenna is solidified through the solidifiable powerful glue, so that the antenna is damaged due to deformation, and the electronic tag is disabled. Simultaneously still be equipped with on the substrate and prevent tearing open the chamber, it is equipped with the multilayer to prevent tearing open the chamber, is equipped with corrosive liquids at the upper and lower two-layer of chip respectively, and electronic tags makes it when being forced to tear open, makes it when receiving the stress and take place deformation because of the characteristics of the stereoplasm brittleness of the pottery of preventing tearing open the chamber, damages and prevents tearing open the chamber cavity, makes the corrosive liquids in preventing tearing open the chamber and contacts with the chip to dissolve copper bump and top layer on the chip, make electronic tags inefficacy and the chip can not be packaged once more. During forced disassembly, the antenna and the chip in the electronic tag are destroyed simultaneously, so that the electronic tag cannot be read and is invalid, and the purpose of disassembly prevention is achieved.
Drawings
In order to more clearly illustrate the detailed description of the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the detailed description or the prior art description will be briefly described below.
Fig. 1 is a schematic structural diagram of an anti-disassembly electronic tag according to an embodiment of the present invention;
FIG. 2 is a schematic side elevational view of FIG. 1;
fig. 3 is a schematic structural view of the disassembly preventing cavity in fig. 2.
Detailed Description
The following description of the specific embodiments of the present invention will be further described with reference to the accompanying drawings and examples, which are only used for more clearly illustrating the technical solution of the present invention, but are not to be construed as limiting the scope of the present invention.
As shown in fig. 1 to 3, the anti-disassembly electronic tag provided by the invention includes:
the substrate 1 is provided with an anti-disassembly cavity 1-1 in the middle, the anti-disassembly cavity 1-1 is a multi-layer cavity, and anti-disassembly devices are arranged in a plurality of cavities in the anti-disassembly cavity 1-1;
the antenna 2 is arranged on the upper surface of the base material 1 and is fixed on the base material 1 through a curable strong adhesive; the antenna 2 is cured by the curable strong adhesive, so that the antenna 2 is damaged due to deformation, and the electronic tag is disabled.
The chip 3 is arranged in a cavity in the middle of the anti-disassembly cavity 1-1, and the anti-disassembly devices are respectively arranged in the cavities on the upper side and the lower side of the chip 3 and are electrically connected with the antenna 2.
In order to realize the establishment of the anti-disassembly device of the electronic tag, the invention provides a preferred embodiment that the anti-disassembly cavity 1-1 comprises a first layer cavity 1-11, a second layer cavity 1-12 and a third layer cavity 1-13 which are sequentially arranged in a stacked manner from a direction close to one side far away from the upper surface of the substrate 1, and the chip 3 is arranged in the second layer cavity 1-12. The anti-disassembly device is respectively arranged in the first layer cavity 1-11 and the third layer cavity 1-13 of the anti-disassembly cavity. The chip 3 is arranged between the anti-dismantling devices, so that when the electronic tag is forcibly dismantled, the anti-dismantling devices on the upper side and the lower side of the chip are started, and the chip 3 is damaged to be invalid.
In order to realize that when the electronic tag is forcibly disassembled, the disassembly preventing cavity is damaged, so that the disassembly preventing device is started, the preferred embodiment of the invention is that the disassembly preventing cavity 1-1 is a corrosion-resistant and fragile cavity, and the cavity can be made of ceramic materials. The characteristics of the hard brittleness of the ceramic enable the ceramic to be broken when the ceramic is deformed under stress.
In order to achieve the damage to the chip when the electronic tag is subjected to strong disassembly, the preferred embodiment of the invention is that the disassembly prevention device is provided with a medium which is corrosive to the chip 3, and the medium which is corrosive can be provided with an acid solution which is corrosive to the chip 3. The chip 3 is arranged among the anti-disassembly devices, so that when the electronic tag is forcibly disassembled, the anti-disassembly cavity 1-1 is damaged due to deformation, the anti-disassembly devices are started, corrosive liquid in the anti-disassembly cavity 1-1 is contacted with the chip 3 in the second cavity 1-12, copper bumps and surface layers on the chip 3 are dissolved, the chip cannot be packaged again, and therefore the electronic tag is invalid.
In order to enable the electronic tag to be broken when being forcibly detached, the substrate 1 is preferably a brittle substrate, and the substrate 1 may be made of ceramic material. The characteristics of the hard brittleness of the ceramic enable the ceramic to be broken when the ceramic is deformed under stress.
In order to apply the electronic label to an article to be protected from counterfeiting, a preferred embodiment of the invention is that the electronic label further comprises a non-adhesive layer provided on a side facing away from the substrate 1.
In a preferred embodiment of the present invention, the disassembly preventing cavity 1-1 may be any shape, and the shape is not limited.
According to the technical scheme, the fragile ceramic material is used as the base material, when the electronic tag is forcibly disassembled, the base material is broken when the electronic tag is deformed due to the stress caused by the characteristics of the hard brittleness of the ceramic of the base material; the antenna is solidified through the solidifiable powerful glue, so that the antenna is damaged due to deformation, and the electronic tag is disabled. Simultaneously still be equipped with on the substrate and prevent tearing open the chamber, it is equipped with the multilayer to prevent tearing open the chamber, is equipped with corrosive liquids at the upper and lower two-layer of chip respectively, and electronic tags makes it when being forced to tear open, makes it when receiving the stress and take place deformation because of the characteristics of the stereoplasm brittleness of the pottery of preventing tearing open the chamber, damages and prevents tearing open the chamber cavity, makes the corrosive liquids in the chamber of preventing tearing open and chip contact to dissolve copper bump and top layer on the chip, make electronic tags inefficacy and the chip can not be packaged once more, thereby reaches the purpose of preventing tearing open.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that it will be apparent to those skilled in the art that modifications and variations can be made without departing from the technical principles of the present invention, and these modifications and variations should also be regarded as the scope of the invention.
Claims (3)
1. An anti-tamper electronic tag, comprising:
the anti-disassembly device comprises a base material (1), wherein an anti-disassembly cavity (1-1) is arranged in the middle of the base material, the anti-disassembly cavity (1-1) is a multi-layer cavity, and anti-disassembly devices are arranged in a plurality of cavities in the anti-disassembly cavity (1-1);
the antenna (2) is arranged on the upper surface of the base material (1) and is fixed on the base material (1) through a curable strong adhesive;
the chip (3) is arranged in one cavity in the middle of the anti-disassembly cavity (1-1), and the anti-disassembly devices are respectively arranged in the cavities on the upper side and the lower side of the chip (3) and are electrically connected with the antenna (2);
the anti-disassembly cavity (1-1) comprises a first layer cavity (1-11), a second layer cavity (1-12) and a third layer cavity (1-13) which are sequentially stacked and connected in the direction from approaching to one side far away from the upper surface of the substrate (1), and the chip (3) is arranged in the second layer cavity (1-12);
the anti-disassembly device is respectively arranged in the first layer cavity (1-11) and the third layer cavity (1-13) of the anti-disassembly cavity;
the anti-dismantling device is set as a medium which is corrosive to the chip (3);
the anti-disassembly cavity (1-1) is an anti-corrosion and fragile cavity;
the base material (1) is a fragile base material and is made of ceramic material.
2. The tamper-evident electronic label according to claim 1, further comprising a non-adhesive layer (4) provided on a side facing away from the substrate (1).
3. Tamper-evident electronic label according to claim 1, characterized in that the tamper-evident cavity (1-1) is not limited in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710744309.5A CN107341537B (en) | 2017-08-25 | 2017-08-25 | Anti-disassembly electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710744309.5A CN107341537B (en) | 2017-08-25 | 2017-08-25 | Anti-disassembly electronic tag |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107341537A CN107341537A (en) | 2017-11-10 |
| CN107341537B true CN107341537B (en) | 2023-05-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710744309.5A Active CN107341537B (en) | 2017-08-25 | 2017-08-25 | Anti-disassembly electronic tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107341537B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108875885A (en) * | 2018-06-21 | 2018-11-23 | 深圳市国芯物联科技有限公司 | A kind of two-band electronic label chip |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204288268U (en) * | 2014-12-15 | 2015-04-22 | 武汉滕格科技有限公司 | Electronic tag |
| CN105956651B (en) * | 2016-04-27 | 2019-02-19 | 江苏凯路威电子科技有限公司 | The RFID chip utilized is shifted in prevention corrosion treatment |
| CN106156834A (en) * | 2016-06-27 | 2016-11-23 | 浙江立芯信息科技股份有限公司 | A kind of Anti-scrape label |
| CN106096699A (en) * | 2016-08-17 | 2016-11-09 | 浙江图维科技股份有限公司 | Long-distance electronic tag and long-distance electronic tag management system for monitoring |
| CN207148891U (en) * | 2017-08-25 | 2018-03-27 | 昆山法拉第智能科技有限公司 | A kind of anti-demolition electronic tags |
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2017
- 2017-08-25 CN CN201710744309.5A patent/CN107341537B/en active Active
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| Publication number | Publication date |
|---|---|
| CN107341537A (en) | 2017-11-10 |
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