WO2012151919A1

WO2012151919A1 - Method for preventing removal of electronic label and electronic label

Info

Publication number: WO2012151919A1
Application number: PCT/CN2011/082487
Authority: WO
Inventors: 李广立; 金磊; 彭天柱; 王耀东
Original assignee: 中兴通讯股份有限公司
Priority date: 2011-07-27
Filing date: 2011-11-18
Publication date: 2012-11-15
Also published as: CN102903003A

Abstract

Disclosed are a method for preventing removal of an electronic label, and an electronic label. The electronic label comprises a label antenna layer, a chip, and a label sealing layer. The label antenna layer comprises an antenna substrate, and two antenna metal layers covering the antenna substrate. The antenna substrate is provided with a slot 1 located at the position where the chip is, the position being not covered by metal between the antenna metal layers. The slot 1 is wider than the chip by a set width. The chip connects the two antenna metal layers on the label antenna layer. The label sealing layer is adhered to the label antenna layer. The label sealing layer is provided with a slot 2 at the position corresponding to the slot 1 on the label antenna layer. The slot 1 and slot 2 are for being filled with a liquid adhesive when the label is adhered on a sticking surface, so as to realize close bonding between the chip and the sticking surface. When the electronic label is removed, the connections between the chip and the antenna metal layers break under the effect of the cured liquid adhesive. Therefore, as becoming damaged upon removal, a removed electronic label can no longer be used again.

Description

Electronic tag tampering implementation method and electronic tag

The invention relates to a microwave communication technology, in particular to an electronic label tampering implementation method and an electronic label. Background technique

RFID (Radio Frequency Identification) RFID tags are generally between 840 and 960 MHz. They can be divided into low frequency (LF, Low Frequency), high frequency (HF, High Frequency), and ultra high frequency. (UHF, Ultra High Frequency) and microwave. Currently, it is widely used in commercial fields, such as high frequency and ultra high frequency. High frequency mainly has high safety and high stability. Ultra high frequency has the characteristics of long distance recognition. , so that the application fields of the two are different. In the application process of UHF tags, such as in logistics tracking, product sales tracking, etc., in order to prevent the labels on the items from being disassembled and used on other items, the labels are required to be destroyed or destroyed, such as the current fake cigarettes. Many, adding RFID electronic tags to products such as tobacco and alcohol for anti-counterfeiting purposes must require that electronic tags cannot be removed for use on fake cigarettes.

At present, the anti-counterfeiting anti-theft technology of electronic tags mainly has algorithmic encryption and physical anti-explosion methods. The anti-explosion needs to be dismantled and destroyed. From the practical application point of view, the encryption on the algorithm is easy to be cracked, and the second is Theft of the label is "illegal" use. Regarding physical tampering, although the label of the RFID ultra-high frequency tag antenna is damaged, the performance of the antenna is degraded, but the tag cannot be unidentifiable.

That is to say, in the prior art, the electronic tag cannot be destroyed when it is removed, and it cannot be guaranteed that the removed electronic tag cannot be used again. Summary of the invention

The embodiment of the invention provides an electronic label tampering implementation method and an electronic label for solving the problem that the label cannot be reused when the label is removed in the prior art.

An electronic tag comprising: a tag antenna layer, a chip and a label encapsulation layer;

The tag antenna layer includes an antenna substrate and two antenna metal layers covering the antenna substrate. A slot is formed on the antenna substrate that is not covered by the metal between the antenna metal layers at the chip position, and the slot is compared. The chip is wider than a set width;

The chip is connected to two antenna metal layers on the tag antenna layer;

The label encapsulation layer is bonded to the tag antenna layer, and the label encapsulation layer defines a slot 2 at a position corresponding to the slot on the tag antenna layer;

The groove 1 and the groove 2 are used for injecting liquid glue when the label is attached to the bonding surface, so that the chip and the bonding surface are closely adhered, and the connection between the chip and the antenna metal layer is performed under the action of the liquid glue after solidification when the electronic label is removed. fracture.

An electronic label tampering implementation method is implemented based on the above electronic label, the method comprising: injecting a liquid glue into a slot of a label encapsulation layer, and when the electronic label is pasted onto the adhesive surface through the label encapsulation layer, the liquid glue The chip is closely attached to the adhesive surface;

When the electronic tag is removed, the connection between the chip on the tag antenna layer and the antenna metal layer breaks under the action of the solidified liquid glue.

The beneficial effects of the present invention are as follows:

The method for implementing the electronic label tampering and the electronic labeling method provided by the embodiment of the present invention, by forming a slot 2 on the antenna substrate of the label encapsulation layer of the electronic label and the label antenna layer, and pasting the electronic label, The liquid glue is injected into the groove to make the label chip and the adhesive surface closely adhere to each other. When the electronic label is removed, the connection between the chip and the antenna metal layer is broken under the action of the solidified liquid glue. Therefore, the electronic tag is removed and destroyed, and the electronic tag is prevented from being reused. DRAWINGS

The drawings are intended to provide a further understanding of the invention, and are intended to be a part of the invention. In the drawing:

1 is a schematic structural diagram of an electronic tag according to an embodiment of the present invention;

2 is a schematic structural diagram of a tag antenna layer plus a chip according to an embodiment of the present invention;

3 is a schematic structural diagram of a label encapsulation layer according to an embodiment of the present invention;

4 is a flowchart of a method for implementing an electronic tag tampering according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of an electronic tag portion removed in an embodiment of the present invention; FIG.

FIG. 6 is a schematic diagram of the electronic tag in the embodiment of the present invention. detailed description

The present invention will be further described in detail below with reference to the accompanying drawings and embodiments in order to make the present invention. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

An embodiment of the present invention provides an electronic tag, which has the structure shown in FIG. 1 and FIG. 3, and includes: a tag antenna layer 1, a tag encapsulation layer 2, and a chip 13. The structure of the tag antenna layer 1 and the chip 13 is as shown in FIG. 2 and the structure of the tag encapsulation layer 2 is as shown in FIG. 3.

The tag antenna layer 1 includes an antenna substrate 11 and two antenna metal layers 14 covering the antenna substrate 11; a slot 12 is formed on the antenna substrate 11 which is not covered by metal between the antenna metal layers 14 at the position of the chip 13 (slot one) The groove 12 is wider than the chip 13 by a set width.

The chip 13 connects the two antenna metal layers 14 on the tag antenna layer 1.

The label encapsulation layer 2 is bonded to the tag antenna layer 1, and the label encapsulation layer 2 is provided with a groove 22 (groove 2;) at a position corresponding to the groove 12 on the tag antenna layer 1.

The groove 12 and the groove 22 are used for injecting liquid glue when the electronic label is attached to the bonding surface, so that the chip 13 is closely adhered to the bonding surface, and the core is solidified by the liquid glue after the electronic label is removed. The connection of the sheet 13 to the antenna metal layer 14 is broken.

As shown in FIG. 2, the antenna substrate 11 on the tag antenna layer 1 of the electronic tag is wider than the antenna metal layer by a set width. For example, the four sides of the antenna substrate are about 1 mm wider than the antenna metal layer of the electronic tag, and may be, for example, 0.8 mm to 1.2 mm.

Preferably, the antenna substrate 11 is a ceramic substrate. The above antenna substrate has a thickness of 0.5 mm to 0.7 mm. More preferably, the substrate thickness is about 0.635 mm.

Preferably, the chip 13 is bonded to a printed circuit board (PCB) and soldered to the antenna metal layer 14 by a PCB.

Preferably, when the chip has a package, the chip is directly soldered to the antenna metal layer 14 through the package.

When the chip 13 is soldered on the antenna metal layer 14 by the PCB, the groove 12 is 0.4 mm-0.6 mm wider than the PCB; more preferably, the width of the antenna substrate 11 under the soldering portion of the chip 13 is wider than the PCB. A groove 12 of about 0.5 mm.

When the chip 13 is soldered to the antenna metal layer 14 by the package, the groove 12 is 0.4 mm-0.6 mm wider than the package; more preferably, the width of the antenna substrate 11 below the soldered portion of the chip 13 is wider than A groove 12 having a width of about 0.5 mm is packaged.

Preferably, the antenna metal layer 14 is a conductive material, and may be, for example, a silver paste.

As shown in FIG. 2, a slot 12 slightly wider than the chip 13 is opened at the central chip 13 of the antenna substrate 11. The size of the slot 12 is such that the liquid glue can pass through the antenna substrate 11. If the chip 13 is too small, the chip can be tied first. It is soldered on a PCB and then soldered to the antenna metal layer 14 of the tag antenna layer. If the chip is packaged, it can be soldered directly to the metal layer 14.

Preferably, the label encapsulation layer 2 is a double-sided tape having a certain thickness and a high adhesive property. The double-sided tape is used for encapsulating and attaching an electronic label, and the slot 2 is formed in a corresponding portion of the slot, and the slot 1 and the slot 2 are used together.

Preferably, the above electronic tag is applicable to radio frequency identification in the frequency range of 840 MHz-960 MHz. do not.

The embodiment of the present invention further provides an electronic label tampering implementation method based on the electronic label shown in FIG. 1 . The flow is shown in FIG. 4 , and includes the following steps:

Step S11: Injecting an appropriate amount of liquid glue into the groove 2 of the label encapsulation layer, and when the electronic label is pasted onto the bonding surface through the label encapsulation layer, the liquid glue makes the chip and the bonding surface closely fit.

When the electronic label needs to be attached to the adhesive surface, the liquid glue is injected into the groove 22. The liquid glue has a certain area and thickness, so that the liquid glue can pass through the groove 12 when the label is pasted, so that the groove 12 and the adhesive surface are closely adhered to each other. together.

Liquid glue is best used for sticking organic or inorganic silica gels such as ceramic materials and glass. The bonding effect between ceramics and glass is particularly good, but liquid glue has a disadvantage in that it has a certain curing time and reliability. The advantage of the short curing time of the double-sided adhesive enables the label to be removed when the liquid glue has not been cured. Therefore, it is preferred that the two glues are used at the same time.

Among them, the amount of liquid glue is determined according to the curvature of the bonding surface. For example, the size of the groove 12 is about 4 mm 3.5 mm, and the present invention is not limited to this size depending on the chip size. The label encapsulation layer between the object and the object to be pasted is a high-strength double-sided tape, and a square groove 22 having an opening length of 1 cm in the middle of the double-sided tape corresponds to the size of the groove 12, in the gap. At the middle point, liquid or paste glue, that is, liquid glue, the amount of glue is 7 mm in diameter and 5 mm in width. The amount of such liquid or paste glue is related to the size of the groove of the metal layer of the label, and the size of the groove and the amount of the liquid glue can be adjusted according to the specific size.

When the label encapsulation layer is double-sided tape, the specific installation process can be: (1) Uncover the double-sided tape centrifugal paper, and in the middle of the gap of the double-sided tape, that is, the place where the antenna substrate is grooved, the liquid glue is squeezed. The height of the glue is 5mm. Front windshield for general curvature. (2) Remove the water vapor on the glass, paste the label, so that the surrounding double-sided tape can be glued to the glass, and the liquid glue is visible to the glass and pressed into a nearly circular shape. For the glass with particularly large curvature, it can be seen that the glue is not well flattened into a round shape, and it is necessary to apply a glue with a height of lmm~2mm. The groove on the antenna substrate and the glass can be effectively bonded together. For glass glues that are not particularly large in curvature, they cannot be applied too much, so there is a lot of glue spilling on the chip, and the area of the substrate pasted on the chip is large. At this time, the glue will stick the chip and a part of the antenna together. , the label will not break from the middle of the chip.

Step S12: When the electronic tag is removed, the connection between the chip on the tag antenna layer and the antenna metal layer is broken under the action of the solidified liquid glue.

When the liquid glue is cured and the label is removed, the liquid glue tightly sticks the substrate around the groove to the adherend. At this time, the substrate breaks from the groove 12, and the chip falls, and the label can no longer be recognized.

Figure 4 shows the state of the state when the electronic tag is manually removed, and the state of the chip is not completely removed. At this time, the connection between the chip and the antenna metal layer is not guaranteed, and the tag can still be recognized. Demolition, can be reused. That is to say, after the electronic label is pasted to the pasting surface, if the edge portion is removed, it will not affect its use.

Figure 5 shows the state of the state when the electronic tag is manually removed. In this case, the connection between the chip and the antenna metal layer is broken, and the tag cannot be recognized. Therefore, the tamper is realized and cannot be reused. . Thus, when the electronic tag is completely removed and replaced with another car, the connection between the chip and the antenna metal layer is completely broken, and the chip is dropped and cannot be used again.

Once the above-mentioned electronic tag is used, it cannot be completely removed without using special means such as high-temperature baking. For a vehicle that attaches an electronic tag to the windshield, the electronic tag is less likely to be completely removed, unless the windshield is replaced. glass. Once the label is removed, the damage cannot be identified. The above method does not use an encryption algorithm, instead of using a simple physical tampering, a groove of about 0.5 mm wider than the chip is formed on the soldering chip on the substrate, and the chip and the antenna metal layer are connected to each other for design and liquid glue and double-sided. The use of glue to achieve physical tampering to achieve 100% anti-theft, realizes the purpose of re-use of the electronic label once the system is unrecognizable, The earth has improved the safety of UHF RFID electronic tags.

The above description shows and describes a preferred embodiment of the present invention, but as described above, it should be understood that the present invention is not limited to the forms disclosed herein, and should not be construed as Other combinations, modifications, and environments are possible and can be modified by the teachings or related art or knowledge within the scope of the inventive concept described herein. All changes and modifications made by those skilled in the art are intended to be within the scope of the appended claims.

Claims

Claim

An electronic tag, comprising: a tag antenna layer, a chip, and a label encapsulation layer;

The chip is connected to two antenna metal layers on the tag antenna layer;

The electronic tag according to claim 1, wherein a circumference of the antenna substrate is wider than a width of the antenna metal layer.

3. An electronic label according to claim 1, wherein the antenna substrate thickness is 0.5mm-0.7mm _o

4. The electronic tag of claim 1, wherein the chip is bonded to a printed circuit board PCB and soldered to the antenna metal layer by the PCB.

The electronic tag according to claim 1, wherein when the chip has a package, the chip is directly soldered to the antenna metal layer through the package.

The electronic tag according to claim 4 or 5, wherein the groove is 0.4 mm to 0.6 mm wider than the PCB;

Alternatively, the slot is 0.4 mm to 0.6 mm wider than the package PCB.

7. The electronic tag according to claim 1, wherein the label encapsulation layer is a double-sided tape.

The electronic tag according to any one of claims 1 to 7, wherein the antenna substrate is a ceramic substrate.

A method for implementing an electronic tag tampering, characterized in that the method is implemented based on the electronic tag of claim 1, the method comprising:

The liquid glue is injected into the groove of the label encapsulation layer, and when the electronic label is pasted onto the bonding surface through the label encapsulation layer, the liquid glue closely bonds the chip to the bonding surface;

10. The method according to claim 9, wherein the amount of the liquid glue is determined according to the curvature of the bonding surface.

The method according to claim 10, characterized in that, when the size of the groove 2 is 4 mm and 3.5 mm, the amount of the liquid glue is the size of a cylindrical volume having a diameter of 7 mm and a height of 5 mm.