CN107633288A - A kind of anti-metal tag and its manufacture method - Google Patents
A kind of anti-metal tag and its manufacture method Download PDFInfo
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- CN107633288A CN107633288A CN201610563479.9A CN201610563479A CN107633288A CN 107633288 A CN107633288 A CN 107633288A CN 201610563479 A CN201610563479 A CN 201610563479A CN 107633288 A CN107633288 A CN 107633288A
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Abstract
A kind of anti-metal tag and its manufacture method, anti-metal tag includes antenna body and selectivity attachment is connected to the plastic-sealed body of antenna body upper surface, antenna body includes base material, it is arranged on the aerial radiation face of substrate upper surface, it is arranged on the antenna ground plane of base material lower surface, it is arranged on the groove of substrate upper surface, plastic-sealed body is arranged on groove, the plastic-sealed body includes lead frame, the pin of some connecting lead wire frameworks, and the label chip of connection pin, the positive pole of label chip connects a pin by lead, the negative pole of label chip connects another pin by lead, the pin of label chip is connected on plastic-sealed body and aerial radiation face is attached by surface mount mode, the pin for being not connected with label chip on plastic-sealed body does not do any connection.The present invention improves tamper performance, has good reliability, is applicable to adverse circumstances, flat appearance after installation, can meet to carve characters or print demand, suitable scale of mass production, and production cost is low.
Description
Technical field
The present invention relates to a kind of anti-metal tag and its manufacture method.
Background technology
Anti-metal tag is usually chip by the glue of epoxy resin paster on substrate, then by UHF chips just
Negative pole is connected by bonding wire mode with aerial radiation face, finally with black glue by chip package.This reliability of structure is poor, long
PCB and wire bond fracture, which easily occur, for the work of phase adverse circumstances causes disabler, and easily pulls down complete label, and adds
Work production capacity is relatively low, and cost is higher.
In order to improve tamper performance, the Chinese patent of Application No. 201110152675.4, which discloses one kind, has tamper work(
The hyperfrequency anti-metal electronic tag structure of energy, propose that chip will be connected by submounts on the main substrate with penetrating rectangle,
Tamper performance is realized by this mode.The program has tamper performance really, but such a method anti-metal tag outward appearance can not
Integrality is kept, it is higher with the mode link cost of submounts, it is not easy to realize that automation is produced in enormous quantities, if requiring reliability
Good submounts packaging cost can be higher, and label surface can not meet some specific occasions because there is the penetrating groove of rectangle
It is required that.
The content of the invention
The present invention provides a kind of anti-metal tag and its manufacture method, improves tamper performance, has good reliability,
Adverse circumstances are applicable to, flat appearance after installation, can meet to carve characters or print demand, are adapted to scale of mass production, production cost
It is low.
In order to achieve the above object, the present invention provides a kind of anti-metal tag, comprising：Antenna body and selectivity attachment connect
Plastic-sealed body in antenna body upper surface；
Described antenna body includes：Base material, the aerial radiation face for being arranged on substrate upper surface, the antenna for being arranged on base material lower surface
Ground plane, the groove for being arranged on substrate upper surface；
Described plastic-sealed body is arranged on groove, and the plastic-sealed body includes：The pin of lead frame, some connecting lead wire frameworks, with
And the label chip of connection pin, the positive pole of label chip connect a pin by lead, the negative pole of label chip is by drawing
Line connects another pin；
The depth of described groove is less than the thickness of base material, and the shape of groove does not limit, and can be arbitrary shape, and the size of groove is protected
Card plastic-sealed body will not only fall into groove but also will not block groove completely；
Described selectivity attachment connection refers to：The pin of label chip is connected on plastic-sealed body and aerial radiation face is pasted by surface
Dress mode is attached, and the pin that label chip is not connected with plastic-sealed body does not do any connection.
Described base material is ceramics or PCB materials, and described aerial radiation face is metal material, described antenna ground plane
For metal material.
The via hole of some insertion aerial radiation faces and antenna ground plane is set inside base material, to connect aerial radiation face
And antenna ground plane, or, some feeder line connection aerial radiation faces and antenna ground plane are set.
Solder mask is set respectively in described aerial radiation face and antenna ground plane.
Described anti-metal tag also includes encapsulated layer, and it is filled up completely with groove and coats whole plastic-sealed body completely.
If base material uses PCB materials, solder mask uses high polymer material.
The present invention provides a kind of manufacture method of anti-metal tag, comprises the steps of：
Step S1, prepare and have reeded antenna body；
Step S2, the positive pole of label chip is connected into a pin by lead, negative pole connects another pin by lead, adopted
The exposed plastic-sealed body of pin is prepared with plastic packaging mode；
Step S3, plastic-sealed body is placed on the position above antenna body upper groove, the pin of label chip will be connected on plastic-sealed body
Attachment is carried out by surface mount mode to connect, form anti-metal tag with aerial radiation face；
Step S4, one side that anti-metal tag is provided with to plastic-sealed body by integrated injection molding mode is bonded to body surface；
Injection molding body is filled up completely with groove and coats whole plastic-sealed body completely.
The present invention also provides a kind of manufacture method of anti-metal tag, comprises the steps of：
Step S1, prepare and have reeded antenna body；
Step S2, the positive pole of label chip is connected into a pin by lead, negative pole connects another pin by lead, adopted
The exposed plastic-sealed body of pin is prepared with plastic packaging mode；
Step S3, plastic-sealed body is placed on the position above antenna body upper groove, the pin of label chip will be connected on plastic-sealed body
Attachment is carried out with aerial radiation face by surface mount mode to connect；
Step S4, groove is filled up completely with using liquid encapsulant material and coats whole plastic-sealed body completely, after encapsulated material solidification
Encapsulated layer is formed, obtains complete anti-metal tag；
Step S5, one side that anti-metal tag is provided with to encapsulated layer by integrated injection molding mode is bonded to body surface.
The present invention also provides a kind of manufacture method of anti-metal tag, comprises the steps of：
Step S1, prepare and have reeded antenna body；
Step S2, the positive pole of label chip is connected into a pin by lead, negative pole connects another pin by lead, adopted
The exposed plastic-sealed body of pin is prepared with plastic packaging mode；
Step S3, plastic-sealed body is placed on the position above antenna body upper groove, the pin of label chip will be connected on plastic-sealed body
Attachment is carried out with aerial radiation face by surface mount mode to connect；
Step S4, groove is filled up completely with using liquid encapsulant material and coats whole plastic-sealed body completely, anti-metal tag is set
The one side for having plastic-sealed body is bonded to body surface, and encapsulated layer is formed after encapsulated material solidification, and anti-metal tag and object is tight
Close connection.
The present invention improves tamper performance, has good reliability, is applicable to adverse circumstances, outward appearance is put down after installation
It is whole, it can meet to carve characters or print demand, suitable scale of mass production, production cost is low.
Brief description of the drawings
Fig. 1 is a kind of sectional view of anti-metal tag provided by the invention.
Fig. 2 is a kind of top view of anti-metal tag provided by the invention.
Fig. 3 is the structural representation of packaging body in a kind of anti-metal tag provided by the invention.
Embodiment
Below according to Fig. 1~Fig. 3, presently preferred embodiments of the present invention is illustrated.
As depicted in figs. 1 and 2, the present invention provides a kind of anti-metal tag, comprising：Antenna body 1 and attachment are connected to antenna
The plastic-sealed body 2 of the upper surface of body 1.
Described antenna body 1 includes：Base material 101, the aerial radiation face 102 for being arranged on the upper surface of base material 101, it is arranged on base
The antenna ground plane 103 of the lower surface of material 101, the groove 104 for being arranged on the upper surface of base material 101；In the present embodiment, described base material
101 be ceramics or PCB materials, described aerial radiation face 102 are metal material, and described antenna ground plane 103 is metal material
Matter.
As depicted in figs. 1 and 2, in one embodiment, some insertion aerial radiation faces can be set inside base material 101
102 and the via hole 105 of antenna ground plane 103, to connect aerial radiation face 102 and antenna ground plane 103；In another implementation
In example, some feeder lines can be set（Do not shown in figure）Connect aerial radiation face 102 and antenna ground plane 103.
In another embodiment, solder mask can be set in described aerial radiation face 102 and antenna ground plane 103 respectively
（Do not shown in figure）.
In another embodiment, if base material 101 uses PCB materials, solder mask uses high polymer material.
The depth of described groove 104 is less than the thickness of base material, and the shape of groove 104 does not limit, and can be arbitrary shape, recessed
The Assurance of Size plastic-sealed body 2 of groove 104 will not only fall into groove 104 but also will not block groove 104 completely.
As shown in Fig. 2 in one embodiment of the invention, described groove 104 is shaped as rectangle, rectangle short side
Length is less than the size of plastic-sealed body 2, ensure that plastic-sealed body 2 will not fall into groove, the length of rectangle long side is more than the chi of plastic-sealed body 2
It is very little, it ensure that groove is not sheltered from completely by plastic-sealed body 2；In the other embodiment of the present invention, described groove 104 can be with
Using other shapes, such as：Ellipse, triangle etc..
As shown in figure 3, described plastic-sealed body 2 includes：The pin 202 of lead frame 201, some connecting lead wire frameworks 201,
And the label chip 3 of pin 202 is connected by lead 203.
The positive pole and negative pole of described label chip 3 are connected to a pipe on lead frame 201 by lead 203 respectively
Pin 202；There is chip bonding pad 301 respectively, the pin 202 of lead frame 201 connects respectively on the positive pole and negative pole of label chip 3
Leadframe pad 204, one end of lead 203 are connected with chip bonding pad 301, and the other end is connected with leadframe pad 204；This
In embodiment, described lead 203 uses gold thread or other materials lead.
As depicted in figs. 1 and 2, described plastic-sealed body 2 is arranged on groove 104, connects the He of pin 202 of label chip 3
The attachment connection of aerial radiation face 102, the discord aerial radiation of pin 202 face 102 for being not connected with label chip 3 mount connection；Antenna
There is pad on radiating surface 102（Not shown in figure）, the attachment of pin 202 that label chip 3 is connected on plastic-sealed body 2 is connected to antenna
Pad on radiating surface 102.
In one embodiment of the invention, described plastic-sealed body 2 uses TSOT23-3 packing forms, TSOT23-3 envelopes
Dress form has 3 pins 202, and two of which pin 202 connects the both positive and negative polarity of label chip 3 respectively, and the two pins 202 paste
Load connects the aerial radiation face 102 of antenna body, and remaining 1 pin is without any connection；In an alternative embodiment of the invention
In, described plastic-sealed body 2 can also use FBGA particles packing forms or WLCSP crystal wafer chip dimension encapsulation forms.
In one embodiment of the present of invention, described label chip 3 uses UHF chips.
As shown in figure 1, in one embodiment of the invention, described anti-metal tag also includes encapsulated layer 4, and its is complete
Filling groove 104 simultaneously coats whole plastic-sealed body 2 completely, and described encapsulated layer 4 uses black glue or the encapsulating material of remaining type.
The present invention also provides a kind of manufacture method of anti-metal tag, comprises the steps of：
Step S1, the antenna body 1 with groove 104 is prepared；
Described antenna body 1 includes：Base material 101, the aerial radiation face 102 for being arranged on the upper surface of base material 101, it is arranged on base material
The antenna ground plane 103 of 101 lower surfaces, the groove 104 for being arranged on the upper surface of base material 101；The depth of described groove 104 is less than
The thickness of base material, the Assurance of Size plastic-sealed body 2 of groove 104 will not only fall into groove 104 but also will not block groove 104 completely；
Step S2, a pipe being connected to the positive pole of label chip 3 and negative pole by lead 203 respectively on lead frame 201
Pin 202, the exposed plastic-sealed body 2 of pin is prepared using plastic packaging mode；
Step S3, plastic-sealed body 2 is placed on to the position of the top of 1 upper groove of antenna body 104, label chip 3 will be connected on plastic-sealed body 2
Pin 202 attachment carried out by surface mount mode with aerial radiation face 102 connected, form anti-metal tag；
Step S4, one side that anti-metal tag is provided with to plastic-sealed body 2 by integrated injection molding mode is bonded to body surface；
Injection molding body is filled up completely with groove 104 and coats whole plastic-sealed body 2 completely；
Described object is the ammeter of practical application, transformer or other have the product of integrated injection molding technique.
If the temperature of injection moulding process is higher than the tin cream melt temperature of tie point, the present invention also provides a kind of anti-metal tag
Manufacture method, comprise the steps of：
Step S1, the antenna body 1 with groove 104 is prepared；
Described antenna body 1 includes：Base material 101, the aerial radiation face 102 for being arranged on the upper surface of base material 101, it is arranged on base material
The antenna ground plane 103 of 101 lower surfaces, the groove 104 for being arranged on the upper surface of base material 101；The depth of described groove 104 is less than
The thickness of base material, the Assurance of Size plastic-sealed body 2 of groove 104 will not only fall into groove 104 but also will not block groove 104 completely；
Step S2, a pipe being connected to the positive pole of label chip 3 and negative pole by lead 203 respectively on lead frame 201
Pin 202, the exposed plastic-sealed body 2 of pin is prepared using plastic packaging mode；
Step S3, plastic-sealed body 2 is placed on to the position of the top of 1 upper groove of antenna body 104, label chip 3 will be connected on plastic-sealed body 2
Pin 202 attachment carried out by surface mount mode with aerial radiation face 102 connected；
Step S4, groove 104 is filled up completely with using liquid encapsulant material and coats whole plastic-sealed body 2 completely, encapsulated material is solid
Encapsulated layer 4 is formed after change, obtains complete anti-metal tag；
Step S5, one side that anti-metal tag is provided with to encapsulated layer 4 by integrated injection molding mode is bonded to body surface；
Described object is the ammeter of practical application, transformer or other have the product of integrated injection molding technique.
The present invention also provides a kind of manufacture method of anti-metal tag, comprises the steps of：
Step S1, the antenna body 1 with groove 104 is prepared；
Described antenna body 1 includes：Base material 101, the aerial radiation face 102 for being arranged on the upper surface of base material 101, it is arranged on base material
The antenna ground plane 103 of 101 lower surfaces, the groove 104 for being arranged on the upper surface of base material 101；The depth of described groove 104 is less than
The thickness of base material, the Assurance of Size plastic-sealed body 2 of groove 104 will not only fall into groove 104 but also will not block groove 104 completely；
Step S2, a pipe being connected to the positive pole of label chip 3 and negative pole by lead 203 respectively on lead frame 201
Pin 202, the exposed plastic-sealed body 2 of pin is prepared using plastic packaging mode；
Step S3, plastic-sealed body 2 is placed on to the position of the top of 1 upper groove of antenna body 104, label chip 3 will be connected on plastic-sealed body 2
Pin 202 attachment carried out by surface mount mode with aerial radiation face 102 connected；
Step S4, groove 104 is filled up completely with using liquid encapsulant material and coats whole plastic-sealed body 2 completely, by anti-metal tag
The one side for being provided with plastic-sealed body 2 is bonded to body surface, and encapsulated layer 4 is formed after encapsulated material solidification, by anti-metal tag and
Object closely connects；
Described object is the ammeter of practical application, transformer or other have the product of integrated injection molding technique.
After by encapsulating material or plastic-sealed body, anti-metal tag is bonded on object, if removing label by force,
The connection pin of plastic-sealed body and antenna body can be broken, and be destroyed the structure of anti-metal tag.
The present invention has advantages below：
1st, using plastic packaging form encapsulated tags chip, and plastic-sealed body and antenna body are connected using surface mount mode, improves mark
The reliability of label, high/low-temperature impact and temperature cycling is improved particularly, can be suitably used for the severe application scenario of extreme environment；
2nd, the groove on antenna body base material ensure that the comprehensive encapsulating of plastic-sealed body, label can be destroyed by encapsulated layer or injection molding body
When easily plastic-sealed body is peeled off from antenna body, the pin and antenna body of plastic-sealed body carry out selective surface's attachment, by force
The connection pin of plastic-sealed body and antenna body can be broken when removing label, improve tamper performance；
3rd, the surface of antenna ground plane side is complete plane on anti-metal tag, can be printed or the technique such as carve characters；
4th, suitable scale of mass production, production cost are low.
Although present disclosure is discussed in detail by above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read the above, for the present invention's
A variety of modifications and substitutions all will be apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (9)
1. a kind of anti-metal tag, it is characterised in that include：Antenna body（1）Antenna body is connected to selectivity attachment（1）Upper table
The plastic-sealed body in face（2）；
Described antenna body（1）Comprising：Base material（101）, be arranged on base material（101）The aerial radiation face of upper surface（102）, set
In base material（101）The antenna ground plane of lower surface（103）, be arranged on base material（101）The groove of upper surface（104）；
Described plastic-sealed body（2）It is arranged on groove（104）On, the plastic-sealed body（2）Comprising：Lead frame（201）, it is some connection draw
Wire frame（201）Pin（202）, and connection pin（202）Label chip（3）, label chip（3）Positive pole by drawing
Line（203）Connect a pin（202）, label chip（3）Negative pole pass through lead（203）Connect another pin（202）；
Described groove（104）Depth be less than base material thickness, groove（104）Shape do not limit, can be arbitrary shape, it is recessed
Groove（104）Assurance of Size plastic-sealed body（2）Both groove will not be fallen into（104）Again will not be by groove（104）Block completely；
Described selectivity attachment connection refers to：Plastic-sealed body（2）Upper connection label chip（3）Pin（202）And aerial radiation
Face（102）It is attached by surface mount mode, plastic-sealed body（2）Upper not connected label chip（3）Pin（202）Do not appoint
What is connected.
2. anti-metal tag as claimed in claim 1, it is characterised in that described base material（101）For ceramics or PCB materials,
Described aerial radiation face（102）For metal material, described antenna ground plane（103）For metal material.
3. anti-metal tag as claimed in claim 2, it is characterised in that in base material（101）Inside sets some insertion antennas
Radiating surface（102）And antenna ground plane（103）Via hole（105）, to connect aerial radiation face（102）And antenna ground plane
（103）, or, some feeder line connection aerial radiation faces are set（102）And antenna ground plane（103）.
4. anti-metal tag as claimed in claim 3, it is characterised in that described aerial radiation face（102）And antenna ground
Face（103）It is upper that solder mask is set respectively.
5. anti-metal tag as claimed in claim 4, it is characterised in that if base material（101）Using PCB materials, then welding resistance
Layer uses high polymer material.
6. anti-metal tag as claimed in claim 3, it is characterised in that described anti-metal tag also includes encapsulated layer（4）,
It is filled up completely with groove（104）And whole plastic-sealed body is coated completely（2）.
A kind of 7. manufacture method of the anti-metal tag in 1-6 such as claim as described in any one, it is characterised in that comprising with
Lower step：
Step S1, preparing has groove（104）Antenna body（1）；
Step S2, by label chip（3）Positive pole pass through lead（203）Connect a pin（202）, negative pole passes through lead
（203）Connect another pin（202）, the exposed plastic-sealed body of pin is prepared using plastic packaging mode（2）；
Step S3, by plastic-sealed body（2）It is placed on antenna body（1）Upper groove（104）The position of top, by plastic-sealed body（2）Upper connection
Label chip（3）Pin（202）With aerial radiation face（102）Attachment connection is carried out by surface mount mode, forms anti-gold
Belong to label；
Step S4, anti-metal tag is provided with by plastic-sealed body by integrated injection molding mode（2）One side be bonded to body surface；
Injection molding body is filled up completely with groove（104）And whole plastic-sealed body is coated completely（2）.
A kind of 8. manufacture method of the anti-metal tag in 1-6 such as claim as described in any one, it is characterised in that comprising with
Lower step：
Step S1, preparing has groove（104）Antenna body（1）；
Step S2, by label chip（3）Positive pole pass through lead（203）Connect a pin（202）, negative pole passes through lead
（203）Connect another pin（202）, the exposed plastic-sealed body of pin is prepared using plastic packaging mode（2）；
Step S3, by plastic-sealed body（2）It is placed on antenna body（1）Upper groove（104）The position of top, by plastic-sealed body（2）Upper connection
Label chip（3）Pin（202）With aerial radiation face（102）Attachment connection is carried out by surface mount mode；
Step S4, groove is filled up completely with using liquid encapsulant material（104）And whole plastic-sealed body is coated completely（2）, material to be encapsulated
Encapsulated layer is formed after material solidification（4）, obtain complete anti-metal tag；
Step S5, anti-metal tag is provided with by encapsulated layer by integrated injection molding mode（4）One side be bonded to body surface.
A kind of 9. manufacture method of the anti-metal tag in 1-6 such as claim as described in any one, it is characterised in that comprising with
Lower step：
Step S1, preparing has groove（104）Antenna body（1）；
Step S2, by label chip（3）Positive pole pass through lead（203）Connect a pin（202）, negative pole passes through lead
（203）Connect another pin（202）, the exposed plastic-sealed body of pin is prepared using plastic packaging mode（2）；
Step S3, by plastic-sealed body（2）It is placed on antenna body（1）Upper groove（104）The position of top, by plastic-sealed body（2）Upper connection
Label chip（3）Pin（202）With aerial radiation face（102）Attachment connection is carried out by surface mount mode；
Step S4, groove is filled up completely with using liquid encapsulant material（104）And whole plastic-sealed body is coated completely（2）, by anti-metal
Label is provided with plastic-sealed body（2）One side be bonded to body surface, form encapsulated layer after encapsulated material solidification（4）, by anti-gold
Category label and object closely connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610563479.9A CN107633288A (en) | 2016-07-18 | 2016-07-18 | A kind of anti-metal tag and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610563479.9A CN107633288A (en) | 2016-07-18 | 2016-07-18 | A kind of anti-metal tag and its manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107633288A true CN107633288A (en) | 2018-01-26 |
Family
ID=61112672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610563479.9A Pending CN107633288A (en) | 2016-07-18 | 2016-07-18 | A kind of anti-metal tag and its manufacture method |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109754054A (en) * | 2018-12-31 | 2019-05-14 | 上海仪电特镭宝信息科技有限公司 | A kind of high temperature resistant anti-metal electronic tag and packaging technology |
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| CN104766843A (en) * | 2015-04-24 | 2015-07-08 | 南京晟芯半导体有限公司 | High-power semiconductor package structure capable of being pasted through SMT technology |
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| US20060187057A1 (en) * | 2005-02-09 | 2006-08-24 | San-Lien Yang | Radio frequency label module |
| CN102346866A (en) * | 2010-07-30 | 2012-02-08 | 天津津亚电子有限公司 | Anti-disassembling electronic tag |
| CN102819761A (en) * | 2011-06-09 | 2012-12-12 | 北京同方微电子有限公司 | Anti-tamper ultrahigh frequency metal-resistant electronic tag structure |
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| CN109754054A (en) * | 2018-12-31 | 2019-05-14 | 上海仪电特镭宝信息科技有限公司 | A kind of high temperature resistant anti-metal electronic tag and packaging technology |
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Application publication date: 20180126 |