CN110717571A - Prevent shifting chip and radio frequency label - Google Patents
Prevent shifting chip and radio frequency label Download PDFInfo
- Publication number
- CN110717571A CN110717571A CN201911070166.XA CN201911070166A CN110717571A CN 110717571 A CN110717571 A CN 110717571A CN 201911070166 A CN201911070166 A CN 201911070166A CN 110717571 A CN110717571 A CN 110717571A
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- chip
- transfer
- protective layer
- antenna
- tag antenna
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07726—Physical layout of the record carrier the record comprising means for indicating first use, e.g. a frangible layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses an anti-transfer chip and a radio frequency tag, wherein the anti-transfer chip comprises: a chip; the electric connection salient point and the supporting salient point are fixedly arranged on one surface of the chip facing the tag antenna; further comprising: the anti-transfer salient point is fixedly arranged near the electric connection salient point and is electrically connected with the electric connection salient point; the anti-transfer chip is coated on the surface of the anti-transfer salient point, and is used for isolating the anti-transfer salient point from the tag antenna so as to ensure that the anti-transfer salient point is not conducted with the tag antenna; when the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer salient points is corroded to cause short circuit failure of the anti-transfer chip after transfer. The anti-transfer salient points coated with the corrosion-prone protective layer on the surface of the chip are utilized, so that the physical damage to the chip during the chip transfer is realized, and the chip is effectively prevented from being transferred successfully.
Description
Technical Field
The invention relates to the technical field of electronic anti-counterfeiting, in particular to an anti-transfer chip and a radio frequency tag.
Background
In passive RFID anti-counterfeiting application, the RFID label is prevented from being transferred and reused, which is an important index considering the anti-counterfeiting capability of the system. The common anti-transfer scheme mostly considers the antenna anti-transfer, for example, the antenna base material is made of fragile materials such as fragile paper and ceramic sheets. The antenna breaks when attempting to transfer the tag, rendering the tag useless. However, this method has the disadvantage that the chip is intact, and a counterfeiter can take the chip off the tag completely through a special reagent and then flip the chip to a new antenna, thereby realizing the reuse of the chip. The scheme can not thoroughly realize label transfer prevention only by damaging the antenna.
In another chip transfer-proof scheme, a special memory and a comparator are arranged in a chip, when the chip is powered on for work for the first time, the characteristic parameters of the external antenna are measured and recorded in the special memory, and in the work state after initialization, the chip measures the characteristic parameters of the external antenna and compares the characteristic parameters with the values in the special memory, and if the characteristic parameters are inconsistent, the chip marks the chip as a transferred state. The scheme needs to design special function logic for the anti-transfer function, and the design complexity and the design cost of the chip are increased.
Disclosure of Invention
The invention provides an anti-transfer chip and a radio frequency tag, which solve the problem that an RFID tag chip is transferred and reused under the condition of not increasing the chip anti-transfer function logic.
The invention provides an anti-transfer chip, which comprises:
a chip;
the electric connection salient points are fixedly arranged on one surface of the chip facing the tag antenna and used for realizing the signal transmission between the chip and the tag antenna through the electric connection with the tag antenna after the anti-transfer chip and the tag antenna are packaged together;
the supporting salient points are fixedly arranged on one surface of the chip facing the tag antenna and used for supporting the chip after the anti-transfer chip and the tag antenna are packaged together;
the anti-migration chip further comprises:
the anti-transfer salient point is fixedly arranged near the electric connection salient point and is electrically connected with the electric connection salient point;
the anti-transfer chip is coated on the surface of the anti-transfer salient point, and is used for isolating the anti-transfer salient point from the tag antenna so as to ensure that the anti-transfer salient point is not conducted with the tag antenna;
when the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer salient points is corroded to cause short circuit failure of the anti-transfer chip after transfer.
Preferably, an anti-transfer bump coated with a corrosion-prone protective layer is fixedly arranged near at least one electrical connection bump.
Preferably, the number of the electrical connection bumps is 2, the number of the anti-transfer bumps is 1, and the 1 anti-transfer bump is fixedly arranged near any one of the 2 electrical connection bumps and electrically connected with the one electrical connection bump.
Preferably, the anti-transfer bump is a bump which is processed near an electrical connection bump on the chip in the chip processing process and has the same shape and size with the electrical connection bump.
Preferably, the corrosion-prone protective layer is a protective layer made of an acid-soluble material.
Preferably, the transfer-proof bump and the electrical connection bump are both bumps made of gold materials or copper materials.
Preferably, the corrosion-prone protective layer coated on the surface of the anti-transfer salient points will be corroded to cause short circuit failure of the anti-transfer chip after transfer, and specifically comprises the following steps: the corrosion-prone protective layer is corroded during transferring of the transfer-proof chip, so that after the transfer-proof chip is packaged with a new tag antenna, the transfer-proof salient points and the electric connection salient points are simultaneously connected with the tag antenna, and chip short circuit failure is caused.
The invention provides a radio frequency tag, which comprises:
a tag antenna comprising an antenna substrate and an antenna coil fixedly disposed on the antenna substrate;
the radio frequency tag also comprises the anti-transfer chip;
after the anti-transfer chip and the tag antenna are packaged together by using the conductive adhesive, the electric connection convex points on the anti-transfer chip are communicated with the antenna coil, so that the signal transmission between the chip and the tag antenna is realized; the anti-transfer salient points on the anti-transfer chip are isolated by the corrosion-prone protective layer coated on the surface of the anti-transfer chip, the anti-transfer salient points are not conducted with the antenna coil, and when the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer salient points is corroded to cause short circuit failure of the anti-transfer chip after the anti-transfer chip is transferred.
Preferably, the conductive adhesive is an anisotropic conductive adhesive.
Preferably, the corrosion-prone protective layer is capable of being cleaned or corroded by a conductive adhesive dedicated cleaning solution when the transfer prevention chip is transferred.
The chip is prevented from transferring through the anti-transfer salient points with the corrosion-prone protection layers on the chip, specifically, the top surfaces of the anti-transfer salient points are covered with the corrosion-prone protection layers, when the chip is taken down from the antenna, the protection layers are corroded, and therefore after the chip is bound to a new antenna, the chip is short-circuited and fails because the anti-transfer salient points and the electric connection salient points which lose the protection layers are simultaneously connected with the new antenna, and the purpose of preventing the chip from transferring is achieved.
Drawings
The invention is further described below with reference to the figures and examples.
Fig. 1 is a schematic flow chart of chip transfer prevention according to an embodiment of the present invention;
FIGS. 2a and 2b are a left side view and a top view of a chip and bumps provided by an embodiment of the invention;
fig. 3a and fig. 3b are a left side view and a top view of a binding position relationship between a chip and a tag antenna provided by an embodiment of the present invention;
fig. 4 is a diagram of an implementation process of chip anti-migration according to an embodiment of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, and it should be understood that the preferred embodiments described below are only for the purpose of illustrating and explaining the present invention, and are not to be construed as limiting the present invention.
The anti-transfer chip provided by the embodiment of the invention comprises: a chip; the electric connection salient points are fixedly arranged on one surface of the chip facing the tag antenna and used for realizing the signal transmission between the chip and the tag antenna through the electric connection with the tag antenna after the anti-transfer chip and the tag antenna are packaged together; the supporting salient points are fixedly arranged on one surface of the chip facing the tag antenna and used for supporting the chip after the anti-transfer chip and the tag antenna are packaged together; the anti-transfer salient point is fixedly arranged near the electric connection salient point and is electrically connected with the electric connection salient point; and the corrosion-prone protective layer is coated on the surface of the anti-transfer salient points and is used for isolating the anti-transfer salient points from the tag antenna to make the anti-transfer salient points not be connected (or disconnected) with the tag antenna after the anti-transfer chip and the tag antenna are packaged together. When the anti-transfer chip is transferred, the easy-corrosion protective layer coated on the surface of the anti-transfer salient points is corroded to cause short circuit failure of the anti-transfer chip after transfer, namely the easy-corrosion protective layer is corroded during the period of transferring the anti-transfer chip, so that the anti-transfer salient points and the electric connection salient points are simultaneously connected with the tag antenna to cause short circuit failure of the chip after the anti-transfer chip is packaged with a new tag antenna.
In this embodiment, there may be a plurality of the electrical connection bumps, or a plurality of the support bumps, and the plurality of electrical connection bumps and the plurality of support bumps are uniformly distributed on the edge of the chip. For example, the number of the electrical connection bumps is 2, the number of the support bumps is 2, the 2 electrical connection bumps and the 2 support bumps are uniformly distributed on the edge of the chip, and if the chip is rectangular, the 2 electrical connection bumps and the 2 support bumps can be respectively arranged at the four corners of the chip.
In this embodiment, the number of the anti-transfer bumps may be less than or equal to the number of the electrical connection bumps, and an anti-transfer bump with a corrosion-prone protective layer coated on a surface thereof may be fixedly disposed near at least one electrical connection bump. For example, the number of the electrical connection bumps is 2 or more, the number of the anti-transfer bumps is 1, and at this time, 1 anti-transfer bump is fixedly arranged near any one of the electrical connection bumps (for example, 2) and is electrically connected with the one electrical connection bump.
In this embodiment, the anti-transfer bumps are processed in such a way that the electrical connection bumps are processed on the chip, in other words, the anti-transfer bumps of the present invention are still the electrical connection bumps in nature. Prevent changeing the bump with it all can be the bump of making by gold material or copper product material to connect the bump, can be in chip course of working one of electricity on the chip connect near the bump process with connect the bump of the shape and the unanimous bump of size as preventing changeing the bump.
In addition, since the anti-transfer chip and the tag antenna are usually connected by using the anisotropic conductive adhesive, the easy-corrosion protective layer can be coated only on the top surface of the anti-transfer bump, in other words, the easy-corrosion protective layer is coated on at least the top surface of the anti-transfer bump, so that the short circuit failure of the chip caused by the fact that the anti-transfer bump and the electric connection bump are simultaneously connected with the antenna coil of the tag antenna after the anti-transfer chip and the tag antenna are packaged together can be avoided.
Wherein, the corrosion-prone protective layer can be a protective layer made of acid-soluble material.
Based on the anti-transfer chip, the embodiment of the invention also provides a radio frequency tag, which comprises the anti-transfer chip and a tag antenna, wherein the anti-transfer chip and the tag antenna are packaged together through conductive adhesive.
In an embodiment of the present invention, the tag antenna may include an antenna substrate and an antenna coil fixedly disposed on the antenna substrate. The antenna base material can be made of fragile materials such as fragile paper and ceramic sheets; the number of the antenna coils may be 1 group.
After the anti-transfer chip and the tag antenna are packaged together through the conductive adhesive, the electric connection convex points on the anti-transfer chip are communicated with the antenna coil, so that the signal transmission between the chip and the tag antenna is realized; the anti-transfer salient points on the anti-transfer chip are isolated by the corrosion-prone protective layer coated on the surface of the anti-transfer salient points, and are not communicated (or disconnected) with the antenna coil, when the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer salient points is corroded to cause short circuit failure of the anti-transfer chip after the anti-transfer chip is transferred, namely the corrosion-prone protective layer is corroded during the process of transferring the anti-transfer chip, so that the anti-transfer salient points and the electric connection salient points are simultaneously connected with the tag antenna after the anti-transfer chip is packaged with a new tag antenna to cause short circuit failure of the chip.
Wherein the conductive adhesive is an anisotropic conductive adhesive.
The corrosion-prone protective layer can be cleaned or corroded by a conductive adhesive dedicated cleaning solution for cleaning the conductive adhesive when the transfer prevention chip is transferred.
When the chip transfer prevention is implemented, the specific flow of the chip transfer prevention is shown in fig. 1, and comprises the following steps:
step S101: and arranging anti-transfer bumps with the surfaces coated with corrosion-prone protective layers near the electric connection bumps on the chip.
The anti-transfer salient points and the electric connection salient points are both electrically connected, and in order to avoid short circuit caused by the fact that the anti-transfer salient points are introduced into a loop formed by the electric connection salient points and the tag antenna, a protective layer, such as a corrosion-prone protective layer, is coated on the surfaces of the anti-transfer salient points.
The step S101 may specifically be to provide an anti-transfer bump with a surface coated with an easily corrosive protective layer near at least one electrical connection bump on the chip, for example, to provide an anti-transfer bump with a surface coated with an easily corrosive protective layer near each electrical connection bump, or to provide an anti-transfer bump with a surface coated with an easily corrosive protective layer near one electrical connection bump on the chip. Taking the example of arranging an anti-transfer bump with a surface coated with a corrosion-prone protective layer near one electrical connection bump on the chip, in the chip processing process, for example, in the step of processing a "long bump" of the chip, a bump with a shape and a size consistent with those of the electrical connection bump is processed near one electrical connection bump on the chip as an anti-transfer bump, and a layer of corrosion-prone protective layer is coated (for example, sprayed) on the top surface of the anti-transfer bump, so as to obtain the anti-transfer bump with the surface coated with the corrosion-prone protective layer.
Step S102: and connecting the anti-transfer salient points with the electric connection salient points, the surface of which is coated with the corrosion-prone protective layer.
The step S102 may specifically be to connect the anti-transfer bumps, the surface of which is coated with the corrosion-prone protective layer, with the electrical connection bumps located near the anti-transfer bumps, the surface of which is coated with the corrosion-prone protective layer, inside the chip.
Step S103: after the chip and the tag antenna are packaged together, the electric connection salient points are conducted with the tag antenna, and the anti-transfer salient points coated with the corrosion-prone protective layer on the surface are not conducted (or disconnected) with the tag antenna.
Assuming that the chip is provided with two electric connection salient points, one of the electric connection salient points is provided with an anti-transfer salient point nearby, the tag antenna comprises 1 group of induction coils (or called antenna coils), and the two electric connection salient points are respectively connected with the antenna coils, so that a circuit on the chip is conducted with the antenna coils through the two electric connection salient points to realize signal transmission. And the anti-transfer salient points which have electrical connectivity like the electrical connection salient points are coated with the corrosion-prone protective layer on the surfaces (such as the top surfaces) of the anti-transfer salient points, so that the anti-transfer salient points and the antenna coil cannot be conducted under the isolation of the corrosion-prone protective layer, and the short circuit phenomenon cannot occur.
When transferring a chip, firstly, the chip and the tag antenna which are packaged together need to be separated; secondly, soaking the separated chip into a special cleaning solution for conductive adhesive to clean the conductive adhesive attached to the chip, and simultaneously, cleaning the conductive adhesive attached to the chip by using the special cleaning solution for conductive adhesive, wherein the corrosion-prone protective layer is corroded by the special cleaning solution for conductive adhesive to obtain a transfer-preventing salient point which loses the corrosion-prone protective layer; and then packaging the chip and the new tag antenna together, wherein the electric connection salient point is conducted with the new tag antenna, and the anti-transfer salient point which loses the easily corroded protective layer is conducted with the new tag antenna, so that the chip is in short circuit.
After the chip is bound with the new tag antenna, because the corrosion-prone protective layer coated on the surface of the anti-transfer salient point is corroded by the cleaning solution special for the conductive adhesive, the electric connection salient point is electrically connected with the anti-transfer salient point, the electric connection salient point is electrically connected with the antenna coil of the new tag antenna, the anti-transfer salient point is electrically connected with the antenna coil of the new tag antenna, a circuit is short-circuited, the chip fails, and the chip transfer and reuse fails.
It should be noted that, the number of bumps on the chip is large, the size is small, the appearance is basically consistent, the absolute thickness of the corrosion-prone protective layer is extremely small and can be basically ignored relative to the thickness of the bumps, so before and after the corrosion-prone protective layer is corroded by the cleaning solution special for conductive adhesive, the anti-transfer bumps with the corrosion-prone protective layer coated on the surface and the anti-transfer bumps with the corrosion-prone protective layer lost have no difference from other bumps on the chip in appearance, and therefore it is extremely difficult to distinguish the anti-transfer bumps of the embodiment from the bumps of the chip and transfer the chip by adding the protective layer again when transferring.
The embodiment of the invention can effectively prevent the chip from being transferred and reused, and is suitable for chip anti-transfer scenes such as an identity chip anti-transfer scene, a commodity anti-counterfeiting chip anti-transfer scene, a ticket chip anti-transfer scene and the like based on the RFID label.
The invention takes the chip as a starting point, and effectively realizes the anti-transfer of the label through the physical damage to the chip. Specifically, the chip of the invention is electrically connected with the antenna through the salient points, the chip is provided with the anti-transfer salient points, and the anti-transfer salient points can not be connected with the antenna when the chip is used. The surface of the anti-transfer salient point is covered with a protective layer which is easy to be cleaned or corroded by the conductive adhesive cleaning solution. When the chip is taken down from the antenna, the protective layer can be cleaned or corroded, and when the chip is bound again, the anti-transfer salient points can be connected with the antenna to cause the chip to be invalid, so that the anti-transfer purpose is realized. The invention relates to a passive RFID chip processing and packaging technology, which can be applied to the field of chip transfer prevention based on RFID labels. To further illustrate the technical principle and implementation process of the present invention, the following detailed description is made with reference to fig. 2a to 4.
Fig. 2a and 2b are a left side view and a top view of a chip and bumps provided by an embodiment of the present invention, as shown in fig. 2a and 2b, a chip 9 is rectangular, and four corners of the chip are respectively provided with electrical connection bumps 1 and 2 and support bumps 4 and 5, an anti-transfer bump 3 is disposed between the electrical connection bump 2 and the support bump 5 and near the electrical connection bump 2, and an outer surface (e.g., a top surface) of the anti-transfer bump 3 is covered with a corrosion-prone protective layer 3 ', e.g., a protective layer that is easily corroded by strong acid, to form an anti-transfer bump 3 with a surface coated with the corrosion-prone protective layer 3'.
The electric connection bumps 1 and 2 have electric connectivity and can be conducted with a tag antenna to form a loop;
the anti-transfer salient point 3 has electrical connectivity and can be conducted with a tag antenna to form a loop, but the anti-transfer salient point 3 cannot be conducted with the tag antenna to form the loop due to the fact that the surface of the anti-transfer salient point is provided with the corrosion-prone protective layer 3';
wherein the supporting bumps 4 and 5 have no electrical connectivity, which supports the chip 9 when the chip 9 is packaged with the tag antenna.
Fig. 3a and 3b are a left side view and a top view of a binding position relationship between a chip and a tag antenna provided by an embodiment of the present invention, and as shown in fig. 3a and 3b, the tag antenna includes an antenna substrate 6 (made of PET, coated paper, fragile paper, etc.) and 1 set of antenna coils 8 fixedly disposed on the antenna substrate 6.
The chip 9 with the anti-transfer salient points 3 which are provided with the electric connection salient points 1 and 2, the supporting salient points 4 and 5 and the surface of which is coated with the corrosion-prone protective layer 3 'is inversely packaged on the label antenna, so that the electric connection salient point 1 is connected and conducted with the antenna coil 8 through the anisotropic conductive adhesive 7, the electric connection salient point 2 is connected and conducted with the antenna coil 8 through the anisotropic conductive adhesive 7, and the anti-transfer salient point 3 is not connected and conducted with the antenna coil 8 under the isolation of the corrosion-prone protective layer 3' coated on the top surface of the anti-transfer salient point.
Fig. 4 is a diagram of an implementation process of chip anti-transfer provided in the embodiment of the present invention, as shown in fig. 4, including the following steps:
step S201, chip processing (or chip bump processing).
Through the processing of the salient points of the chip, the chip is provided with electric connection salient points 1 and 2, an anti-transfer salient point 3 and supporting salient points (or mechanical supporting salient points) 4 and 5.
The electric connection bumps 1 and 2 enable the chip and the antenna to form a loop through conductive adhesive; the support bumps 4 and 5 are only supporting and have no electrical connectivity.
According to the invention, the protective layer 3 'which is easily corroded by acid is added on the anti-transfer salient points 3, and after the protective layer 3' is arranged on the surfaces of the anti-transfer salient points 3, the anti-transfer salient points 3 cannot be communicated with the antenna.
The protective layer 3' may be made of an acid-dissolving material.
And S202, packaging the label by adopting a common reverse packaging mode.
The inverted packaging refers to a packaging form that the salient points of the chip are downwards connected with the tag antenna. The specific process is that firstly, anisotropic conductive adhesive is put on the antenna connection point, then the chip salient point is pressed down on the conductive adhesive, and then a hot pressing head (with certain temperature and pressure) is used for pressing the chip surface, so that the conductive adhesive is solidified to realize the conduction between the chip and the antenna.
At present, all common RFID tags are in a form of an inverted packaging process. According to the requirement, the chip used by the coil of the other winding process is in a module form, and the packaging form is gold wire Bonding (Bonding).
And step S203, label cutting.
And step S204, taking chips.
First, the chip is taken off from the label, and the chip is provided with the conductive adhesive at the moment.
Specifically, since the main material of the anisotropic conductive adhesive is epoxy resin, and the conductive adhesive can be dissolved by using a strong acid solution, the tag is generally soaked in the strong acid solution for a period of time, the chip and the antenna are separated after the conductive adhesive is dissolved, and at this time, residual conductive adhesive may be left on the surfaces of the chip and the antenna.
The chip is then cleaned.
Specifically, the chip is cleaned by using a special cleaning solution for the conductive adhesive, and the protective layer on the surface of the anti-transfer salient points is washed away in the process, so that the anti-transfer salient points are exposed.
And S205, re-binding, and binding the chip and the new tag antenna.
The anti-transfer salient points and the electric connection salient points are connected with the new tag antenna, so that the chip is short-circuited and fails.
The anti-transfer salient points and the electric connection salient points can not be connected with the antenna at the same time. Specifically, prior to the present invention, no anti-transfer bumps were grown on the chip, i.e., no such anti-transfer bumps were present on the chip, in a location that was completely covered by a protective layer on the surface of the chip. According to the invention, the anti-transfer salient point which is connected with the electric connection node and the surface of which is coated with the corrosion-prone protective layer is arranged near the electric connection node on the chip, so that the chip can normally work after being bound with the tag antenna, and after the protective layer on the surface of the anti-transfer salient point is damaged during chip transfer, the anti-transfer salient point and the electric connection salient point are simultaneously connected with a new tag antenna, so that the chip is short-circuited and invalid, and the chip can not be transferred and reused successfully.
In summary, the present invention has the following technical effects:
1. in the process of cleaning the conductive adhesive, the protective layer on the surface of the anti-transfer salient point is damaged, so that when the chip is bound with a new tag antenna and works, the chip is short-circuited and fails because the anti-transfer salient point and the electric connection salient point are simultaneously connected and conducted with the tag antenna, and the purpose of effectively preventing the RFID chip from being transferred and reused is achieved.
2. According to the chip anti-transfer method, the chip anti-transfer is realized by destroying the physical structure of the chip, the chip does not need to be specially designed with anti-transfer function logic, and the increase of the design complexity and the design cost of the chip is avoided.
Although the present invention has been described in detail hereinabove, the present invention is not limited thereto, and various modifications can be made by those skilled in the art in light of the principle of the present invention. Thus, modifications made in accordance with the principles of the present invention should be understood to fall within the scope of the present invention.
Claims (10)
1. An anti-migration chip, comprising:
a chip;
the electric connection salient points are fixedly arranged on one surface of the chip facing the tag antenna and used for realizing the signal transmission between the chip and the tag antenna through the electric connection with the tag antenna after the anti-transfer chip and the tag antenna are packaged together;
the supporting salient points are fixedly arranged on one surface of the chip facing the tag antenna and used for supporting the chip after the anti-transfer chip and the tag antenna are packaged together;
characterized in that, prevent shifting the chip and still include:
the anti-transfer salient point is fixedly arranged near the electric connection salient point and is electrically connected with the electric connection salient point;
the anti-transfer chip is coated on the surface of the anti-transfer salient point, and is used for isolating the anti-transfer salient point from the tag antenna so as to ensure that the anti-transfer salient point is not conducted with the tag antenna;
when the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer salient points is corroded to cause short circuit failure of the anti-transfer chip after transfer.
2. The chip of claim 1, wherein an anti-migration bump coated with a corrosion-prone protective layer is fixedly disposed near at least one electrical connection bump.
3. The chip of claim 2, wherein the number of the electrical connection bumps is 2, the number of the anti-transfer bumps is 1, and 1 anti-transfer bump is fixedly disposed near any one of the 2 electrical connection bumps and electrically connected to the one electrical connection bump.
4. The chip of claim 3, wherein the anti-transfer bump is a bump formed around an electrical connection bump on the chip during the chip processing process, the bump having a shape and size corresponding to the electrical connection bump.
5. The chip of any one of claims 1 to 4, wherein the corrosion-prone protective layer is a protective layer made of an acid-soluble material.
6. The chip of any one of claims 1 to 4, wherein the anti-transfer bumps and the electrical connection bumps are bumps made of gold or copper material.
7. The anti-transfer chip according to any one of claims 1 to 4, wherein the anti-transfer bump is coated with a corrosion-prone protective layer to corrode, which causes short-circuit failure of the anti-transfer chip after transfer, specifically: the corrosion-prone protective layer is corroded during transferring of the transfer-proof chip, so that after the transfer-proof chip is packaged with a new tag antenna, the transfer-proof salient points and the electric connection salient points are simultaneously connected with the tag antenna, and chip short circuit failure is caused.
8. A radio frequency tag, the radio frequency tag comprising:
a tag antenna comprising an antenna substrate and an antenna coil fixedly disposed on the antenna substrate;
the radio frequency tag is characterized by further comprising an anti-transfer chip according to any one of claims 1 to 7;
after the anti-transfer chip and the tag antenna are packaged together by using the conductive adhesive, the electric connection convex points on the anti-transfer chip are communicated with the antenna coil, so that the signal transmission between the chip and the tag antenna is realized; the anti-transfer salient points on the anti-transfer chip are isolated by the corrosion-prone protective layer coated on the surface of the anti-transfer chip, the anti-transfer salient points are not conducted with the antenna coil, and when the anti-transfer chip is transferred, the corrosion-prone protective layer coated on the surface of the anti-transfer salient points is corroded to cause short circuit failure of the anti-transfer chip after the anti-transfer chip is transferred.
9. The radio frequency tag of claim 8, wherein the conductive adhesive is an anisotropic conductive adhesive.
10. The radio frequency tag according to claim 8, wherein the corrosion-prone protective layer is capable of being cleaned or corroded by a conductive paste dedicated cleaning liquid for cleaning a conductive paste when the transfer prevention chip is transferred.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911070166.XA CN110717571A (en) | 2019-11-05 | 2019-11-05 | Prevent shifting chip and radio frequency label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911070166.XA CN110717571A (en) | 2019-11-05 | 2019-11-05 | Prevent shifting chip and radio frequency label |
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| CN110717571A true CN110717571A (en) | 2020-01-21 |
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| CN201911070166.XA Pending CN110717571A (en) | 2019-11-05 | 2019-11-05 | Prevent shifting chip and radio frequency label |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112163658A (en) * | 2020-09-08 | 2021-01-01 | 四川华大恒芯科技有限公司 | Chip transfer prevention method, chip transfer prevention chip and radio frequency tag |
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2019
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112163658A (en) * | 2020-09-08 | 2021-01-01 | 四川华大恒芯科技有限公司 | Chip transfer prevention method, chip transfer prevention chip and radio frequency tag |
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