CN107331758A - 一种Micro LED显示器件的制备方法 - Google Patents
一种Micro LED显示器件的制备方法 Download PDFInfo
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- CN107331758A CN107331758A CN201710499014.6A CN201710499014A CN107331758A CN 107331758 A CN107331758 A CN 107331758A CN 201710499014 A CN201710499014 A CN 201710499014A CN 107331758 A CN107331758 A CN 107331758A
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- 238000002360 preparation method Methods 0.000 title claims description 20
- 239000000463 material Substances 0.000 claims abstract description 177
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000002096 quantum dot Substances 0.000 claims description 62
- 239000011358 absorbing material Substances 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 42
- 239000000843 powder Substances 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000007648 laser printing Methods 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000013307 optical fiber Substances 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 5
- 238000007641 inkjet printing Methods 0.000 claims description 4
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 17
- 239000002131 composite material Substances 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000003086 colorant Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 description 5
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical class COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920005570 flexible polymer Polymers 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- -1 indium metal oxide Chemical class 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 238000005424 photoluminescence Methods 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201710499014.6A CN107331758B (zh) | 2017-06-27 | 2017-06-27 | 一种Micro LED显示器件的制备方法 |
PCT/CN2018/088176 WO2019001183A1 (zh) | 2017-06-27 | 2018-05-24 | 微型发光二极管显示器件及其制备方法 |
Applications Claiming Priority (1)
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CN201710499014.6A CN107331758B (zh) | 2017-06-27 | 2017-06-27 | 一种Micro LED显示器件的制备方法 |
Publications (2)
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CN107331758A true CN107331758A (zh) | 2017-11-07 |
CN107331758B CN107331758B (zh) | 2019-03-05 |
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CN201710499014.6A Active CN107331758B (zh) | 2017-06-27 | 2017-06-27 | 一种Micro LED显示器件的制备方法 |
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CN (1) | CN107331758B (zh) |
WO (1) | WO2019001183A1 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108511390A (zh) * | 2018-05-09 | 2018-09-07 | 广东普加福光电科技有限公司 | 一种量子点全彩微显示器件的制备方法 |
CN108878602A (zh) * | 2018-06-29 | 2018-11-23 | 武汉大学 | 一种三基色垂直结构微型led芯片制造与转印方法 |
WO2019001183A1 (zh) * | 2017-06-27 | 2019-01-03 | 南方科技大学 | 微型发光二极管显示器件及其制备方法 |
CN109216590A (zh) * | 2018-09-21 | 2019-01-15 | 福州大学 | 一种柔性彩色micro-LED显示器件制备方法 |
CN109713005A (zh) * | 2019-02-15 | 2019-05-03 | 易美芯光(北京)科技有限公司 | 一种白光Micro LED结构的工艺实现方式 |
CN109935614A (zh) * | 2019-04-09 | 2019-06-25 | 南京大学 | 基于深硅刻蚀模板量子点转移工艺的微米全色qled阵列器件及其制备方法 |
CN111613699A (zh) * | 2020-05-25 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | 微型发光二极管及其制作方法 |
CN113316838A (zh) * | 2019-12-24 | 2021-08-27 | 乐金显示有限公司 | 发光二极管输送装置 |
CN117239024A (zh) * | 2023-11-10 | 2023-12-15 | 中国科学院长春光学精密机械与物理研究所 | 基于硅基掩膜片的全彩色Micro-LED制备方法 |
CN118039754B (zh) * | 2024-04-12 | 2024-06-07 | 江西兆驰半导体有限公司 | 一种倒装mini发光二极管芯片的制备方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110416148A (zh) * | 2019-07-23 | 2019-11-05 | 深圳市华星光电半导体显示技术有限公司 | 一种微器件巨量转移方法及通光片 |
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CN102148335A (zh) * | 2009-12-17 | 2011-08-10 | 富士胶片株式会社 | 光热转换片以及使用它的有机场致发光原料片及有机场致发光装置的制造方法 |
KR101606290B1 (ko) * | 2014-12-02 | 2016-03-24 | 서울대학교산학협력단 | 양자점 전사 인쇄 방법 |
CN105511155A (zh) * | 2016-02-22 | 2016-04-20 | 深圳市华星光电技术有限公司 | 量子点彩色滤光片的制造方法 |
CN105514302A (zh) * | 2016-01-26 | 2016-04-20 | 京东方科技集团股份有限公司 | 量子点发光二极管亚像素阵列、其制造方法以及显示装置 |
CN106129083A (zh) * | 2016-06-30 | 2016-11-16 | 纳晶科技股份有限公司 | 一种量子点转印方法 |
WO2016200882A1 (en) * | 2015-06-08 | 2016-12-15 | Corning Incorporated | Microled display without transfer |
CN106299144A (zh) * | 2016-09-23 | 2017-01-04 | 京东方科技集团股份有限公司 | 一种辅助基板、图案制备方法、qled显示基板及其制备方法 |
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JP2010153051A (ja) * | 2008-12-24 | 2010-07-08 | Sony Corp | 転写用基板および表示装置の製造方法 |
KR20160030002A (ko) * | 2014-09-05 | 2016-03-16 | 삼성디스플레이 주식회사 | 도너마스크 및 이를 이용한 유기발광 디스플레이 장치 제조방법 |
CN107331758B (zh) * | 2017-06-27 | 2019-03-05 | 南方科技大学 | 一种Micro LED显示器件的制备方法 |
-
2017
- 2017-06-27 CN CN201710499014.6A patent/CN107331758B/zh active Active
-
2018
- 2018-05-24 WO PCT/CN2018/088176 patent/WO2019001183A1/zh active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102148335A (zh) * | 2009-12-17 | 2011-08-10 | 富士胶片株式会社 | 光热转换片以及使用它的有机场致发光原料片及有机场致发光装置的制造方法 |
KR101606290B1 (ko) * | 2014-12-02 | 2016-03-24 | 서울대학교산학협력단 | 양자점 전사 인쇄 방법 |
WO2016200882A1 (en) * | 2015-06-08 | 2016-12-15 | Corning Incorporated | Microled display without transfer |
CN105514302A (zh) * | 2016-01-26 | 2016-04-20 | 京东方科技集团股份有限公司 | 量子点发光二极管亚像素阵列、其制造方法以及显示装置 |
CN105511155A (zh) * | 2016-02-22 | 2016-04-20 | 深圳市华星光电技术有限公司 | 量子点彩色滤光片的制造方法 |
CN106129083A (zh) * | 2016-06-30 | 2016-11-16 | 纳晶科技股份有限公司 | 一种量子点转印方法 |
CN106299144A (zh) * | 2016-09-23 | 2017-01-04 | 京东方科技集团股份有限公司 | 一种辅助基板、图案制备方法、qled显示基板及其制备方法 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019001183A1 (zh) * | 2017-06-27 | 2019-01-03 | 南方科技大学 | 微型发光二极管显示器件及其制备方法 |
CN108511390B (zh) * | 2018-05-09 | 2020-07-07 | 广东普加福光电科技有限公司 | 一种量子点全彩微显示器件的制备方法 |
CN108511390A (zh) * | 2018-05-09 | 2018-09-07 | 广东普加福光电科技有限公司 | 一种量子点全彩微显示器件的制备方法 |
CN108878602A (zh) * | 2018-06-29 | 2018-11-23 | 武汉大学 | 一种三基色垂直结构微型led芯片制造与转印方法 |
CN109216590A (zh) * | 2018-09-21 | 2019-01-15 | 福州大学 | 一种柔性彩色micro-LED显示器件制备方法 |
CN109713005A (zh) * | 2019-02-15 | 2019-05-03 | 易美芯光(北京)科技有限公司 | 一种白光Micro LED结构的工艺实现方式 |
CN109935614A (zh) * | 2019-04-09 | 2019-06-25 | 南京大学 | 基于深硅刻蚀模板量子点转移工艺的微米全色qled阵列器件及其制备方法 |
US11050004B2 (en) | 2019-04-09 | 2021-06-29 | Nanjing University | Micro panchromatic QLED array device based on quantum dot transfer process of deep silicon etching templates, and preparation method therefor |
CN109935614B (zh) * | 2019-04-09 | 2021-10-26 | 南京大学 | 基于深硅刻蚀模板量子点转移工艺的微米全色qled阵列器件及其制备方法 |
CN113316838A (zh) * | 2019-12-24 | 2021-08-27 | 乐金显示有限公司 | 发光二极管输送装置 |
CN111613699A (zh) * | 2020-05-25 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | 微型发光二极管及其制作方法 |
CN111613699B (zh) * | 2020-05-25 | 2021-06-01 | 深圳市华星光电半导体显示技术有限公司 | 微型发光二极管及其制作方法 |
CN117239024A (zh) * | 2023-11-10 | 2023-12-15 | 中国科学院长春光学精密机械与物理研究所 | 基于硅基掩膜片的全彩色Micro-LED制备方法 |
CN118039754B (zh) * | 2024-04-12 | 2024-06-07 | 江西兆驰半导体有限公司 | 一种倒装mini发光二极管芯片的制备方法 |
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CN107331758B (zh) | 2019-03-05 |
WO2019001183A1 (zh) | 2019-01-03 |
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Effective date of registration: 20191106 Address after: 518000 Guangdong city of Shenzhen province Nanshan District Taoyuan Xueyuan Road 1088 Street Co-patentee after: Liu Zhaojun Patentee after: Shenzhen Nanke big asset management limited company Co-patentee after: Sun Xiaowei Co-patentee after: Qiu Chengfeng Address before: 1088 No. 518055 Guangdong city of Shenzhen province Nanshan District Xili Xueyuan Road Patentee before: South University of Science and Technology of China |
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Effective date of registration: 20191212 Address after: 518000 Kaihaoda Building, No. 1 Tongsheng Community Industrial Park Road, Dalang Street, Longhua District, Shenzhen City, Guangdong Province, 1309, 13th floor Patentee after: Shenzhen Stan Technology Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Nanshan District Taoyuan Xueyuan Road 1088 Street Co-patentee before: Liu Zhaojun Patentee before: Shenzhen Nanke big asset management limited company Co-patentee before: Sun Xiaowei Co-patentee before: Qiu Chengfeng |
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