CN107324662A - A kind of TFT thinning glass substrates handling process - Google Patents
A kind of TFT thinning glass substrates handling process Download PDFInfo
- Publication number
- CN107324662A CN107324662A CN201710409575.2A CN201710409575A CN107324662A CN 107324662 A CN107324662 A CN 107324662A CN 201710409575 A CN201710409575 A CN 201710409575A CN 107324662 A CN107324662 A CN 107324662A
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- CN
- China
- Prior art keywords
- tft
- glass substrates
- pure water
- groove
- temperature
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
Abstract
The invention discloses a kind of TFT thinning glass substrates handling process, comprise the following steps:(1)Visual examination is carried out to TFT glass substrates, edge sealing processing is carried out to the side of TFT glass substrates four with UV glue, with UV curing UV curing glue, cleans and removes edge excessive glue;(2)TFT glass baseplate surfaces are cleaned, are put into groove, is that 30 DEG C of pure water soak 8 12min with temperature, removes glass surface foreign matter;(3)TFT glass substrates are put into the groove of etching solution with fixture, temperature is heated to 30 32 DEG C, 2 3h are etched to glass;(4)The TFT glass substrates etched are put into rinse bath with fixture, cleaned with pure water, are put into the first groove, it is that 30 DEG C of pure water soak 10 15min with temperature, place into the second groove and use temperature to be that 45 DEG C of pure water soak 5 8min, then carry out quality restriction, physics polishing, packaging and storage is examined eventually.
Description
Technical field
The present invention relates to TFT glass substrate technical fields, and in particular to a kind of TFT thinning glass substrates handling process.
Background technology
The current lightening requirement of mobile terminal grows to even greater heights, the emerging consumer electronics product such as smart mobile phone, tablet personal computer
Display screen often only have 0.4mm-0.6mm thickness.TFT equipment is difficult the base plate glass for handling below 0.3mm, and traditional
TFT is general in 0.5mm or so, adds central filler liquid crystal and commonly reaches 1.0mm-1.4mm or so, meets display device lightening
The most economical economical method of demand can only carry out glass thinning by chemically or physically method.The TFT glass bases used in industry
Plate thinning liquid main component be HF (hydrofluoric acid) and pure water, concentration between 8%-15%, glass surface etch effect is not good, its
Surface tear is exaggerated, concave point and salient point are relatively difficult to control, and hydrofluoric acid has severe toxicity, danger of the production process to operation employee
Evil property is larger, and waste water, offal treatment are difficult, and after being arrived twice using one, substantial amounts of sticky body of powder can be produced in etching solution,
The utilization rate of etching solution is influenceed, and hydrofluoric acid has severe toxicity, production process is larger to operation employee's harmfulness.
The content of the invention
The present invention is intended to provide a kind of TFT thinning glass substrates handling process.
The present invention provides following technical scheme:
A kind of TFT thinning glass substrates handling process, comprises the following steps:
(1) visual examination is carried out to TFT glass substrates, edge sealing processing is carried out to the side of TFT glass substrates four with UV glue, used
UV curing UV curing glue, cleans and removes edge excessive glue;
(2) TFT glass baseplate surfaces are cleaned, be put into groove, be that 30 DEG C of pure water soak 8-12min with temperature, go
Except glass surface foreign matter;
(3) TFT glass substrates are put into the groove of etching solution with fixture, temperature is heated to 30-32 DEG C, glass is lost
Carve processing 2-3h;
(4) the TFT glass substrates etched are put into rinse bath with fixture, cleaned with pure water, be put into the first groove
It is interior, it is that 30 DEG C of pure water soak 10-15min with temperature, places into the second groove and use temperature to be 45 DEG C of pure water immersion 5-8min, then enter
Row quality restriction, physics polishing, examine packaging and storage eventually.
Pure water is ultra-pure water, its purity >=99.99% in the step (4).
Etching solution is that mass percent is 10-14% hydrofluoric acid, 9-16% ammonium acid fluorides, 8-14% in the step (3)
Nitric acid, 12-18% sulfuric acid, 15-22% hydrochloric acid, 7-9% urea.
Solution is circulated and stirred by the useful pure air of groove inner bottom part of etching solution in the step (3).
Compared with prior art, the beneficial effects of the invention are as follows:The present invention is effectively controlled with environment-friendly type glass etching liquid energy
The concave point of glass generation, the amplification of scuffing defect in chemically etching process, softening glass dust solve edge protuberance in etching process
Problem, and it is safe and stable, TFT thinning glass substrate quality requirements are effectively met, the demand of client is met, while dropping significantly
The low toxicity of etching solution, Manufacturing Worker's operation is more safe and reliable, and novel environment friendly etching solution of the present invention after filtration may be used
To recycle, TFT quality requirements tool is greatly improved, the glass surface particularly occurred in process of production to glass
Scuffing amplification, concave point and salient point, which have, to be obviously improved.
Embodiment
Below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described,
Obviously, described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of protection of the invention.
A kind of TFT thinning glass substrates handling process of embodiment, comprises the following steps:
(1) visual examination is carried out to TFT glass substrates, edge sealing processing is carried out to the side of TFT glass substrates four with UV glue, used
UV curing UV curing glue, cleans and removes edge excessive glue;
(2) TFT glass baseplate surfaces are cleaned, be put into groove, be that 30 DEG C of pure water soak 8-12min with temperature, go
Except glass surface foreign matter;
(3) TFT glass substrates are put into the groove of etching solution with fixture, temperature is heated to 30-32 DEG C, glass is lost
Carve processing 2-3h;
(4) the TFT glass substrates etched are put into rinse bath with fixture, cleaned with pure water, be put into the first groove
It is interior, it is that 30 DEG C of pure water soak 10-15min with temperature, places into the second groove and use temperature to be 45 DEG C of pure water immersion 5-8min, then enter
Row quality restriction, physics polishing, examine packaging and storage eventually.
Pure water is ultra-pure water, its purity >=99.99% in the step (4).
Etching solution is that mass percent is 10-14% hydrofluoric acid, 9-16% ammonium acid fluorides, 8-14% in the step (3)
Nitric acid, 12-18% sulfuric acid, 15-22% hydrochloric acid, 7-9% urea.
Solution is circulated and stirred by the useful pure air of groove inner bottom part of etching solution in the step (3).
It is obvious to a person skilled in the art that the invention is not restricted to the details of the one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than the explanation is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Although not each moreover, it will be appreciated that the present specification is described in terms of embodiments
Embodiment is only comprising an independent technical scheme, and this narrating mode of specification is only this area for clarity
Technical staff should be using specification as an entirety, and the technical solutions in the various embodiments may also be suitably combined, forms this
Art personnel may be appreciated other embodiment.
Claims (4)
1. a kind of TFT thinning glass substrates handling process, it is characterised in that comprise the following steps:
(1) visual examination is carried out to TFT glass substrates, edge sealing processing is carried out to the side of TFT glass substrates four with UV glue, it is solid with UV
Change machine UV curing glue, cleans and removes edge excessive glue;
(2) TFT glass baseplate surfaces are cleaned, be put into groove, be that 30 DEG C of pure water soak 8-12min with temperature, remove glass
Glass Superficial Foreign Body;
(3) TFT glass substrates are put into the groove of etching solution with fixture, temperature is heated to 30-32 DEG C, place is etched to glass
Manage 2-3h;
(4) the TFT glass substrates etched are put into rinse bath with fixture, cleaned with pure water, is put into the first groove, used
Temperature is 30 DEG C of pure water immersion 10-15min, places into the second groove and uses temperature to be 45 DEG C of pure water immersion 5-8min, then carries out product
Quality inspection is tested, physics is polished, eventually inspection packaging and storage.
2. a kind of TFT thinning glass substrates handling process according to claim 1, it is characterised in that:In the step (4)
Pure water is ultra-pure water, its purity >=99.99%.
3. a kind of TFT thinning glass substrates handling process according to claim 1, it is characterised in that:In the step (3)
Etching solution is that mass percent is 10-14% hydrofluoric acid, 9-16% ammonium acid fluorides, 8-14% nitric acid, 12-18% sulfuric acid, 15-
22% hydrochloric acid, 7-9% urea.
4. a kind of TFT thinning glass substrates handling process according to claim 1, it is characterised in that:In the step (3)
Solution is circulated and stirred by the useful pure air of groove inner bottom part of etching solution.
Priority Applications (1)
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CN201710409575.2A CN107324662A (en) | 2017-06-02 | 2017-06-02 | A kind of TFT thinning glass substrates handling process |
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CN201710409575.2A CN107324662A (en) | 2017-06-02 | 2017-06-02 | A kind of TFT thinning glass substrates handling process |
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CN201710409575.2A Pending CN107324662A (en) | 2017-06-02 | 2017-06-02 | A kind of TFT thinning glass substrates handling process |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110158024A (en) * | 2019-05-15 | 2019-08-23 | 惠晶显示科技(苏州)有限公司 | Crystal liquid substrate plates ito film pre-treating method |
CN113219705A (en) * | 2021-05-17 | 2021-08-06 | 绍兴同芯成集成电路有限公司 | TFT-LCD panel glass thinning process |
CN113336447A (en) * | 2021-06-24 | 2021-09-03 | 重庆永信科技有限公司 | Single-side thinning method for ultrathin glass |
CN114180849A (en) * | 2021-12-30 | 2022-03-15 | 苏州凯利昂光电科技有限公司 | Supporting type ultrathin glass thinning method |
CN114749418A (en) * | 2022-04-13 | 2022-07-15 | 安徽光智科技有限公司 | Film removing process for plastic coated lens |
CN115925272A (en) * | 2022-12-07 | 2023-04-07 | 蚌埠中光电科技有限公司 | Chemical treatment process used before grinding of TFT-LCD glass substrate |
Citations (4)
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CN101054265A (en) * | 2007-05-09 | 2007-10-17 | 信利半导体有限公司 | Glass etching liquid for flat panel display |
CN104556717A (en) * | 2015-02-03 | 2015-04-29 | 张小琼 | TFT glass substrate thinning environment-friendly etching solution and thinning process thereof |
CN105924016A (en) * | 2016-04-27 | 2016-09-07 | 深圳力合光电传感股份有限公司 | Thinning liquid and glass substrate thinning method |
CN106430991A (en) * | 2016-08-31 | 2017-02-22 | 湖北优尼科光电技术股份有限公司 | Sheet glass substrate acid etching liquid and sheet glass substrate thinning technology |
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2017
- 2017-06-02 CN CN201710409575.2A patent/CN107324662A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101054265A (en) * | 2007-05-09 | 2007-10-17 | 信利半导体有限公司 | Glass etching liquid for flat panel display |
CN104556717A (en) * | 2015-02-03 | 2015-04-29 | 张小琼 | TFT glass substrate thinning environment-friendly etching solution and thinning process thereof |
CN105924016A (en) * | 2016-04-27 | 2016-09-07 | 深圳力合光电传感股份有限公司 | Thinning liquid and glass substrate thinning method |
CN106430991A (en) * | 2016-08-31 | 2017-02-22 | 湖北优尼科光电技术股份有限公司 | Sheet glass substrate acid etching liquid and sheet glass substrate thinning technology |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110158024A (en) * | 2019-05-15 | 2019-08-23 | 惠晶显示科技(苏州)有限公司 | Crystal liquid substrate plates ito film pre-treating method |
CN113219705A (en) * | 2021-05-17 | 2021-08-06 | 绍兴同芯成集成电路有限公司 | TFT-LCD panel glass thinning process |
CN113336447A (en) * | 2021-06-24 | 2021-09-03 | 重庆永信科技有限公司 | Single-side thinning method for ultrathin glass |
CN114180849A (en) * | 2021-12-30 | 2022-03-15 | 苏州凯利昂光电科技有限公司 | Supporting type ultrathin glass thinning method |
CN114749418A (en) * | 2022-04-13 | 2022-07-15 | 安徽光智科技有限公司 | Film removing process for plastic coated lens |
CN115925272A (en) * | 2022-12-07 | 2023-04-07 | 蚌埠中光电科技有限公司 | Chemical treatment process used before grinding of TFT-LCD glass substrate |
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Application publication date: 20171107 |