CN107322187A - A kind of active soldering paste of silver-bearing copper titanium - Google Patents
A kind of active soldering paste of silver-bearing copper titanium Download PDFInfo
- Publication number
- CN107322187A CN107322187A CN201710792287.XA CN201710792287A CN107322187A CN 107322187 A CN107322187 A CN 107322187A CN 201710792287 A CN201710792287 A CN 201710792287A CN 107322187 A CN107322187 A CN 107322187A
- Authority
- CN
- China
- Prior art keywords
- powder
- silver
- copper
- titanium
- binding agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3616—Halogen compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Abstract
The invention provides a kind of active soldering paste of silver-bearing copper titanium, including：Solder powder and binding agent；The mass percent of the solder powder and the binding agent is respectively：Solder powder 85 90%, binding agent 10 15%；The solder powder, is the mixed-powder of silver powder, copper powder, hydride powder；In the mixed-powder, silver, copper, the mass percent of titanium are：Silver 65 93%, copper 5 35%, titanium 1 4%；The binding agent, includes the material of following mass percent：Paste making agent 20% 30%；Solvent 50% 70%；Thixotropic agent 2 5%.The present invention adds titantium hydride due to using in the metal mixed powder in solder powder; hydrogen can be discharged in brazing process; butt welding picks up the effect of reduction protection; simultaneously; titanium is activated to ceramic surface, metal is carried out soldering with ceramics, and brazing temperature is down to 850 DEG C; reduce influence of the high temperature to metallicity, while also reducing process costs.
Description
Technical field
The present invention relates to welding technology field, more particularly to a kind of active soldering paste of silver-bearing copper titanium.
Background technology
Ceramic material has the anti-oxidant, corrosion-resistant of uniqueness, high temperature resistant, higher hardness and wearability, intensity height, insulation
Property it is good the characteristics of, but the poor toughness of ceramics, it is difficult to complex component is created, typically with the method for soldering ceramics and ceramics, pottery
Porcelain and metal material are combined preferably to play the superiority of ceramics.
But ceramics are difficult to be soaked by common metal material, therefore the ceramic method for welding that prior art is used is divided into two kinds：
One kind is indirect welding, and one kind is direct welding.Welding indirectly, mostly using Mo-Mn methods, electroless plating, thick film and film
Process etc. is in ceramic surface formation metal layer, still, the metal that chemical plating, thick film and thin-film technique are formed in ceramic surface
Change layer reliability is bad, and Mo-Mn methods need to be carried out at high temperature, and process costs are high.Directly weld, vacuum melting weld tabs is used mostly
Method, hydrostatic profile weld tabs method, but the easy segregation of silver-bearing copper Ti Alloy brazing of both approaches, wherein Ti are oxidizable, cause soldering
When activity reduction, influence brazing property.
Therefore, technical staff, which have developed silver-bearing copper titanium active solder, is used for ceramic and ceramic, ceramics and metal direct welding.
But, existing silver-bearing copper titanium active solder still fails to solve the easy segregation of silver-bearing copper Ti Alloy brazing well, Ti is oxidizable, pricker
Activity low technical problem during weldering.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of active soldering paste of silver-bearing copper titanium, this method can effectively solve silver-bearing copper titanium
The problem of activity is low when easy segregation, Ti oxidizable, soldering during alloy melting.
In order to solve the above technical problems, the invention provides a kind of active soldering paste of silver-bearing copper titanium, including：Solder powder and bonding
Agent；
The mass percent of the solder powder and the binding agent is respectively：Solder powder 85-90%, binding agent 10-15%；
The solder powder, is the mixed-powder of silver powder, copper powder, hydride powder；In the mixed-powder, silver, copper, titanium
Mass percent is：Silver-colored 65-93%, copper 5%-35%, titanium 1%-4%；
The binding agent, includes the material of following mass percent：
Paste making agent 20%-30%；
Solvent 50%-70%；
Thixotropic agent 2%-5%.
It is preferred that, yellow gold powder, the mixed metal powder of hydride powder；In the mixed-powder, silver, copper, titanium
Mass percent be：Silver-colored 65%-93%, copper 5%-35%, titanium 1%-4%；In the yellow gold powder, silver, the mass ratio of copper metal
For：Silver-colored 20%-72%, copper 28%-80%.
It is preferred that, the powder footpath grain scope of the solder powder is 20um to 100um.
It is preferred that, the thixotropic agent is：One or more in the materials such as polyamide wax, rilanit special, polyureas.
It is preferred that, the paste making agent is：Polyvinyl alcohol, silicone oil, white oil, acrylic resin, nitrocellulose, ethyl cellulose
One or more in element, repefral, the medium material of carboxymethyl cellulose.
It is preferred that, the solvent is：Diethylene glycol (DEG), triethanolamine, butyl cellosolve, the tert-butyl alcohol, DMF,
One or more in the materials such as terpinol, nonyl phenol polyglycol ether.
The present invention in brazing process due to that using titantium hydride is added in the metal mixed powder in solder powder, can discharge
Hydrogen, butt welding picks up the effect of reduction protection, meanwhile, titanium is activated to ceramic surface, metal is carried out pricker with ceramics
Weldering, and brazing temperature is down to 850 DEG C, reduces influence of the high temperature to metallicity, while also reducing process costs.
Embodiment
Such scheme is described further below in conjunction with specific embodiment.It should be understood that these embodiments are to be used to illustrate
The present invention rather than limitation the scope of the present invention.The implementation condition used in embodiment can be done according to the condition of specific producer into
One successive step, unreceipted implementation condition is usually the condition in normal experiment.
A kind of active soldering paste of silver-bearing copper titanium, including：Solder powder and binding agent.
Wherein, the mass percent of the solder powder and the binding agent is respectively：Solder powder 85%-90%, is bonded
Agent 10%-15%.
The solder powder, is to include the mixed metal powder of silver powder, copper powder, hydride powder；The mixed metal powder
In, silver, copper, the mass percent of titanium are：Silver-colored 65%-93%, copper 5%-35%, titanium 1%-4%.
Optionally, the solder powder, is the mixed metal powder of yellow gold powder, hydride powder；The hybrid metal
In powder, silver, copper, the mass percent of titanium are：Silver-colored 65%-93%, copper 5%-35%, titanium 1%-4%；The yellow gold powder
In, silver, the mass ratio of copper metal are：Silver-colored 20%-72%, copper 28%-80%.
In the solder powder, grain scope 20-100um in powder footpath used.
The binding agent, includes the material of following mass percent：
Paste making agent 20%-30%；Solvent 50%-70%；Thixotropic agent 2-5%.
The paste making agent, is polyvinyl alcohol, silicone oil, white oil, acrylic resin, nitrocellulose, ethyl cellulose, adjacent benzene
One or more combinations of the materials such as dicarboxylic acid dimethyl ester, carboxymethyl cellulose.
The solvent, be diethylene glycol (DEG), triethanolamine, butyl cellosolve, the tert-butyl alcohol, DMF, terpinol,
One or more combinations of the materials such as nonyl phenol polyglycol ether.
The thixotropic agent, is one or more combinations of the materials such as polyamide wax, rilanit special, polyureas.
Compared with existing Mo-Mn methods, the welding using ceramics of the invention and metal simplifies technique, and ceramic surface need not
Plated film can complete the welding with metal.Titantium hydride in metal mixed powder can discharge hydrogen in brazing process, and butt welding is picked up
To the effect of reduction protection, while titanium is activated to ceramic surface, metal is set to carry out soldering, and brazing temperature with ceramics
850 DEG C are down to, reduces influence of the high temperature to metallicity, while also reducing process costs.
Embodiment one
A kind of active soldering paste of silver-bearing copper titanium, including：Solder powder and binding agent, wherein, the quality percentage of solder powder and binding agent
Than for solder powder 85% and binding agent 15%.
Above-mentioned solder powder, including：Yellow gold powder and hydride powder；Wherein, yellow gold powder is that Ag72Cu28 is closed
Bronze；
The mass percent of above-mentioned yellow gold powder and hydride powder is：Ag72Cu28 alloyed powders 96% and hydride powder 4%.
Above-mentioned binding agent, including：Paste making agent, solvent and thixotropic agent；
The mass percent of each composition is specific as follows in above-mentioned paste making agent, solvent and thixotropic agent：
Paste making agent：Polyvinyl alcohol 15%, ethyl cellulose 10%；
Solvent：Triethanolamine 30%, butyl cellosolve 25%, DMF 17%；
Thixotropic agent：Rilanit special 3%.
Embodiment two
A kind of active soldering paste of silver-bearing copper titanium, including：Solder powder and binding agent, wherein, the quality percentage of solder powder and binding agent
Than for solder powder 88% and binding agent 12%.
Above-mentioned solder powder, including：Silver powder, copper powder and hydride powder；Wherein, the matter of silver powder, copper powder and hydride powder
Measuring percentage is：Silver powder 70%, copper powder 26%, hydride powder 4%.
Above-mentioned binding agent, including：Paste making agent, solvent and thixotropic agent；
The mass percent of each composition is specific as follows in above-mentioned paste making agent, solvent and thixotropic agent：
Paste making agent：Acrylic resin 30%；
Solvent：The tert-butyl alcohol 20%, polyvinyl alcohol 18%, DMF 17%, nonyl phenol polyglycol ether 11%；
Thixotropic agent：Polyamide wax 4%.
Embodiment three
A kind of active soldering paste of silver-bearing copper titanium, including：Solder powder and binding agent, wherein, the quality percentage of solder powder and binding agent
Than for solder powder 90% and binding agent 10%.
Above-mentioned solder powder, including：Silver powder, copper powder and hydride powder；Wherein, the matter of silver powder, copper powder and hydride powder
Measuring percentage is：Silver powder 80%, copper powder 16%, hydride powder 4%.
Above-mentioned binding agent, including：Paste making agent, solvent and thixotropic agent；
The mass percent of each composition is specific as follows in above-mentioned paste making agent, solvent and thixotropic agent：
Paste making agent：Polyvinyl alcohol 13%, carboxymethyl cellulose 7%；
Solvent：Diethylene glycol (DEG) 21%, triethanolamine 25%, nonyl phenol polyglycol ether 31%；
Thixotropic agent：Polyureas 3%.
Finally it should be noted that the foregoing is only presently preferred embodiments of the present invention, rather than to the technology of the present invention side
The restriction of case, any equivalent substitution done to the technology of the present invention feature or it is corresponding improve, still protection scope of the present invention it
It is interior.
Claims (6)
1. a kind of active soldering paste of silver-bearing copper titanium, including：Solder powder and binding agent；Characterized in that,
The mass percent of the solder powder and the binding agent is respectively：Solder powder 85-90%, binding agent 10-15%；
The solder powder, is the mixed-powder of silver powder, copper powder, hydride powder；In the mixed-powder, silver, copper, titanium
Mass percent is：Silver-colored 65%-93%, copper 5%-35%, titanium 1%-4%；
The binding agent, includes the material of following mass percent：
Paste making agent 20%-30%；
Solvent 50%-70%；
Thixotropic agent 2%-5%.
2. the active soldering paste of a kind of silver-bearing copper titanium as claimed in claim 1, it is characterised in that：The solder powder is：Yellow gold
The mixed metal powder of powder, hydride powder；In the mixed-powder, silver, copper, the mass percent of titanium are：Silver-colored 65%-
93%, copper 5%-35%, titanium 1%-4%；In the yellow gold powder, silver, the mass ratio of copper metal are：Silver-colored 20%-72%, copper 28%-
80%。
3. the active soldering paste of a kind of silver-bearing copper titanium as claimed in claim 1 or 2, it is characterised in that：The powder footpath of the solder powder
Grain scope is 20um to 100um.
4. the active soldering paste of a kind of silver-bearing copper titanium as claimed in claim 1, it is characterised in that：The thixotropic agent is：Polyamide wax, hydrogen
Change the one or more in the materials such as castor oil, polyureas.
5. the active soldering paste of a kind of silver-bearing copper titanium as claimed in claim 1, it is characterised in that：The paste making agent is：Polyvinyl alcohol, silicon
The materials such as oil, white oil, acrylic resin, nitrocellulose, ethyl cellulose, repefral, carboxymethyl cellulose
In one or more.
6. the active soldering paste of a kind of silver-bearing copper titanium as claimed in claim 1, it is characterised in that：The solvent is：Diethylene glycol (DEG), three ethanol
One kind in the materials such as amine, butyl cellosolve, the tert-butyl alcohol, DMF, terpinol, nonyl phenol polyglycol ether or
It is a variety of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710792287.XA CN107322187A (en) | 2017-09-05 | 2017-09-05 | A kind of active soldering paste of silver-bearing copper titanium |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710792287.XA CN107322187A (en) | 2017-09-05 | 2017-09-05 | A kind of active soldering paste of silver-bearing copper titanium |
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| Publication Number | Publication Date |
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| CN107322187A true CN107322187A (en) | 2017-11-07 |
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| CN201710792287.XA Pending CN107322187A (en) | 2017-09-05 | 2017-09-05 | A kind of active soldering paste of silver-bearing copper titanium |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108032003A (en) * | 2017-11-29 | 2018-05-15 | 温州宏丰电工合金股份有限公司 | It is a kind of for Cu-Sn-Ti solder powders into lotion |
| CN108080812A (en) * | 2017-11-29 | 2018-05-29 | 温州宏丰电工合金股份有限公司 | A kind of preparation method into lotion for Cu-Sn-Ti solder powders |
| CN109865960A (en) * | 2019-03-05 | 2019-06-11 | 苏州昆腾威新材料科技有限公司 | A kind of thixotropic alloy and the preparation method and application thereof |
| CN112756845A (en) * | 2021-01-15 | 2021-05-07 | 杭州华光焊接新材料股份有限公司 | Silver soldering paste and preparation method thereof |
| CN112775587A (en) * | 2021-01-14 | 2021-05-11 | 深圳市兴鸿泰锡业有限公司 | Smokeless solder wire and preparation method thereof |
| CN113084392A (en) * | 2021-03-29 | 2021-07-09 | 华南理工大学 | Ag-Cu-Ti-Sn-Ni active alloy solder and preparation method thereof |
| US20220009042A1 (en) * | 2019-01-24 | 2022-01-13 | Koki Company Limited | Flux and solder paste |
| CN113953612A (en) * | 2021-12-22 | 2022-01-21 | 广州先艺电子科技有限公司 | Preparation method of active metal brazing copper-clad ceramic substrate |
| CN113976877A (en) * | 2021-12-29 | 2022-01-28 | 广州先艺电子科技有限公司 | Metal composition for preparing AgCuTi soldering lug, soldering lug and preparation method of soldering lug |
| CN114029651A (en) * | 2021-11-18 | 2022-02-11 | 东北大学 | Titanium-containing active solder and preparation method and application thereof |
| CN114230360A (en) * | 2021-12-30 | 2022-03-25 | 大连海外华昇电子科技有限公司 | AMB method silver-copper slurry for water-soluble ceramic metallization and preparation method thereof |
| CN115609189A (en) * | 2022-12-16 | 2023-01-17 | 西安稀有金属材料研究院有限公司 | Pasty titanium-based brazing material for titanium alloy vacuum brazing and preparation method thereof |
| WO2023051410A1 (en) * | 2021-09-29 | 2023-04-06 | 比亚迪股份有限公司 | Active metal solder paste composition, solder paste, and method for soldering ceramic and metal |
| CN116477969A (en) * | 2023-04-27 | 2023-07-25 | 无锡湃泰电子材料科技有限公司 | Active molybdenum-silver copper titanium slurry for ceramic metallized packaging and preparation method thereof |
| WO2024022523A1 (en) * | 2022-07-29 | 2024-02-01 | 比亚迪股份有限公司 | Active solder paste composition for cladding ceramic with copper, method for cladding ceramic with copper, and copper-clad ceramic |
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| CN108032003B (en) * | 2017-11-29 | 2020-12-11 | 温州宏丰电工合金股份有限公司 | Paste forming body for Cu-Sn-Ti solder powder |
| CN108080812A (en) * | 2017-11-29 | 2018-05-29 | 温州宏丰电工合金股份有限公司 | A kind of preparation method into lotion for Cu-Sn-Ti solder powders |
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| US20220009042A1 (en) * | 2019-01-24 | 2022-01-13 | Koki Company Limited | Flux and solder paste |
| US11975411B2 (en) * | 2019-01-24 | 2024-05-07 | Koki Company Limited | Flux and solder paste |
| CN109865960B (en) * | 2019-03-05 | 2021-11-02 | 苏州昆腾威新材料科技有限公司 | Thixotropic alloy and preparation method and application thereof |
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| CN112775587A (en) * | 2021-01-14 | 2021-05-11 | 深圳市兴鸿泰锡业有限公司 | Smokeless solder wire and preparation method thereof |
| CN112775587B (en) * | 2021-01-14 | 2021-11-16 | 深圳市兴鸿泰锡业有限公司 | Smokeless solder wire and preparation method thereof |
| CN112756845A (en) * | 2021-01-15 | 2021-05-07 | 杭州华光焊接新材料股份有限公司 | Silver soldering paste and preparation method thereof |
| CN113084392A (en) * | 2021-03-29 | 2021-07-09 | 华南理工大学 | Ag-Cu-Ti-Sn-Ni active alloy solder and preparation method thereof |
| WO2023051410A1 (en) * | 2021-09-29 | 2023-04-06 | 比亚迪股份有限公司 | Active metal solder paste composition, solder paste, and method for soldering ceramic and metal |
| CN114029651B (en) * | 2021-11-18 | 2022-07-01 | 东北大学 | Titanium-containing active solder and preparation method and application thereof |
| CN114029651A (en) * | 2021-11-18 | 2022-02-11 | 东北大学 | Titanium-containing active solder and preparation method and application thereof |
| CN113953612A (en) * | 2021-12-22 | 2022-01-21 | 广州先艺电子科技有限公司 | Preparation method of active metal brazing copper-clad ceramic substrate |
| CN113976877A (en) * | 2021-12-29 | 2022-01-28 | 广州先艺电子科技有限公司 | Metal composition for preparing AgCuTi soldering lug, soldering lug and preparation method of soldering lug |
| CN114230360A (en) * | 2021-12-30 | 2022-03-25 | 大连海外华昇电子科技有限公司 | AMB method silver-copper slurry for water-soluble ceramic metallization and preparation method thereof |
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Application publication date: 20171107 |