JPH07126079A - Soldering material for bonding ceramic material - Google Patents
Soldering material for bonding ceramic materialInfo
- Publication number
- JPH07126079A JPH07126079A JP29236493A JP29236493A JPH07126079A JP H07126079 A JPH07126079 A JP H07126079A JP 29236493 A JP29236493 A JP 29236493A JP 29236493 A JP29236493 A JP 29236493A JP H07126079 A JPH07126079 A JP H07126079A
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- ceramics
- tih
- metals
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、セラミックスと金属と
の接合、あるいはセラミックス同士の接合に使用される
ろう材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brazing material used for joining ceramics and metals, or for joining ceramics to each other.
【０００２】[0002]
【従来の技術】セラミックスと金属との接合あるいはセ
ラミックス同士の接合には、その用途に応じて様々な手
段が採用されてきた。例えば特開平１−２４９２６２号
公報や特開平５−１７０５６３号公報などに記載されて
いるように、活性金属法においては、銀ろうやニッケル
ろうなどに、セラミックス側と反応する化学的に活性な
金属成分（例えばＴｉ，Ｚｒ，Ｎｂなど）を添加したろ
う材が使用されている。この中で、ニッケルろうはろう
付け温度が高いため、熱膨張率が互いに大きく異なるセ
ラミックスと金属との接合では、熱応力の影響を受けや
すく、セラミックスに割れが発生するなど機械的特性の
劣化が生じる。2. Description of the Related Art Various means have been adopted for joining ceramics and metals or joining ceramics to each other depending on the application. For example, as described in JP-A-1-249262 and JP-A-5-170563, in the active metal method, a chemically active metal that reacts with the ceramic side, such as silver solder or nickel solder, is used. A brazing material added with components (for example, Ti, Zr, Nb, etc.) is used. Among them, since nickel brazing has a high brazing temperature, the joining of ceramics and metals, which have greatly different thermal expansion coefficients, is easily affected by thermal stress, resulting in deterioration of mechanical properties such as cracking of ceramics. Occurs.
【０００３】このため、セラミックスと金属との接合で
は、融点が比較的低く熱応力の影響が少ない銀ろうが主
に使用されている。その接合方法は、上述の活性金属ろ
う材をセラミックスと相手金属との間に挿入し、真空ま
たは不活性ガス中で１回の加熱操作により接合が行わ
れ、他の接合方法と比べて接合工程が短くてすむことが
その特徴である。For this reason, silver solder having a relatively low melting point and being less influenced by thermal stress is mainly used for joining ceramics and metal. The joining method is such that the above-mentioned active metal brazing material is inserted between the ceramic and the mating metal, and the joining is performed by one heating operation in a vacuum or an inert gas. Its characteristic is that it can be short.
【０００４】上述のＡｇろうを用いた活性金属ろう材
は、Ａｇをベースに融点を下げる目的でＣｕが添加さ
れ、またセラミックスとの濡れ性を確保する目的でＴ
ｉ，Ｚｒ，Ｎｂなど化学的に活性な金属を１種もしくは
複数種添加した組成になっている。これらの添加金属の
うち、セラミックスに対する濡れ性を確保する金属とし
て、Ｔｉが適しており、その組成比は１〜７０wt％と広
い範囲に及んでいる。In the above-mentioned active metal brazing material using Ag brazing, Cu is added based on Ag for the purpose of lowering the melting point, and T is used for the purpose of ensuring wettability with ceramics.
The composition is such that one or more kinds of chemically active metals such as i, Zr and Nb are added. Among these added metals, Ti is suitable as a metal for ensuring the wettability with respect to ceramics, and its composition ratio ranges from 1 to 70 wt% in a wide range.
【０００５】[0005]
【発明が解決しようとする課題】上述のようにセラミッ
クスに対する濡れ性を確保する金属としてＴｉが適して
いるが、Ｔｉを多量に含むろう材はコストが高いため、
実用ろう材としては使用範囲が限定される。また、従来
の活性金属法には合金箔もしくは合金粉のろう材が使用
されているが、合金箔を使用した場合には、ろう材のセ
ットに時間がかかり、被接合材の形状的制約も受けやす
くなるため、量産性に乏しいという問題がある。As described above, Ti is suitable as a metal for ensuring the wettability with respect to ceramics, but a brazing material containing a large amount of Ti is expensive,
The practical range of brazing filler metal is limited. Further, alloy foil or brazing material of alloy powder is used in the conventional active metal method, but when alloy foil is used, it takes time to set the brazing material, and there is also a restriction on the shape of the material to be joined. Since it is easily received, there is a problem that mass productivity is poor.
【０００６】一方、活性金属法に従来の合金粉を用いた
場合には、ろう材中に含まれるＴｉ粉末の酸化の影響か
ら、ろう材の濡れ性が劣化し、ろう付け界面に未接合部
が生じやすい。このため、ろう付け部分の機械的特性が
劣化する。また、合金箔および合金粉はいずれも製造が
難しく、取扱いにくく、コストも高いなどの欠点があ
る。On the other hand, when the conventional alloy powder is used in the active metal method, the wettability of the brazing material is deteriorated due to the effect of the oxidation of the Ti powder contained in the brazing material, and the unbonded portion is not formed at the brazing interface. Is likely to occur. Therefore, the mechanical characteristics of the brazed portion deteriorate. Further, both alloy foil and alloy powder have drawbacks that they are difficult to manufacture, difficult to handle, and high in cost.
【０００７】従って本発明の目的は、セラミックスに対
する濡れ性および反応性が良好であり、容易にろう付け
が可能であり、ろう付け部分の強度が高いセラミックス
用ろう材を提供することにある。Accordingly, an object of the present invention is to provide a brazing material for ceramics which has good wettability and reactivity with ceramics, can be brazed easily, and has a high strength at the brazed portion.
【０００８】[0008]
【課題を解決するための手段】上記の目的を果たすため
に開発された本発明のろう材は、Ａｇをベースとし、融
点を下げるために、Ａｇと共晶組成になるようＣｕを添
加するとともに、セラミックスと反応させる目的でＴｉ
を添加する。また、更なる融点の降下を目的としてＳ
ｎ，Ｉｎを添加したり、ステンレス鋼と接合する場合
は、濡れ性や耐蝕性の向上を目的にＮｉを選択元素とし
て添加してもよい。The brazing material of the present invention developed to achieve the above object is based on Ag, and Cu is added so as to have a eutectic composition with Ag in order to lower the melting point. , Ti for the purpose of reacting with ceramics
Is added. In addition, for the purpose of further lowering the melting point, S
In the case of adding n and In or joining with stainless steel, Ni may be added as a selective element for the purpose of improving wettability and corrosion resistance.
【０００９】すなわち、ＡｇとＣｕとＴｉＨ2 （水素化
チタン）を必須成分として、重量比でＡｇ：６５〜８５
％，Ｃｕ：１２〜４０％，ＴｉＨ2 ：０．５〜５％の範
囲とし、これら３種類の金属の合計が不純物を含めて１
００％になるように調整するか、または、上記必須成分
に、ろう材の用途に応じてＳｎ，Ｉｎ，Ｎｉの中から選
択された１種もしくは複数種の選択元素を添加し、重量
比でＡｇ：６５〜８５％，Ｃｕ：１２〜４０％，ＴｉＨ
2 ：０．５〜５％，Ｓｎ：５〜２０％，Ｉｎ：５〜２０
％，Ｎｉ：１〜５％の範囲とし、これらの金属の合計が
不純物を含めて１００％になるように調整する。本発明
のろう材は、上記各金属の混合粉で構成され、この混合
粉に有機物のバインダーを添加するなどして、ペースト
状のろう材を作製する。That is, Ag, Cu and TiH 2 (titanium hydride) are contained as essential components, and Ag: 65-85 by weight ratio.
%, Cu: 12 to 40%, TiH 2 : 0.5 to 5%, and the total of these three kinds of metals is 1 including impurities.
It is adjusted so as to be 100%, or one or more kinds of selective elements selected from Sn, In, and Ni depending on the use of the brazing material are added to the above essential components, and the weight ratio is Ag: 65-85%, Cu: 12-40%, TiH
2 : 0.5 to 5%, Sn: 5 to 20%, In: 5 to 20
%, Ni: 1 to 5%, and the total of these metals is adjusted to 100% including impurities. The brazing material of the present invention is composed of a mixed powder of the above metals, and a paste-like brazing material is produced by adding an organic binder to the mixed powder.
【００１０】[0010]
【作用】本発明のろう材中に含まれるＴｉＨ2 は、ろう
付け時にセラミックス側と直接反応する活性な金属であ
り、ろう材の酸化の防止と、ろう流れ性の確保という重
要な役割を担っている。The TiH 2 contained in the brazing material of the present invention is an active metal that reacts directly with the ceramics side during brazing, and plays an important role in preventing oxidation of the brazing material and ensuring brazing flowability. ing.
【００１１】ろう材中のＴｉＨ2 は、セラミックスとろ
う材との界面に集中してＴｉの均一な凝集層を生成す
る。この凝集層は、ＴｉＨ2 の重量比が増加すると凝集
層の厚さが厚くなる傾向があり、添加量が５wt％を越え
ると、ろう材中のＴｉＨ2 は、Ａｇ，Ｃｕと反応し、脆
い金属間化合物を生成する。その結果、接合強度が低下
し、ろう付け接合体の機械的特性が大きく劣化する原因
となる。しかしＴｉＨ2の添加量が５wt％以内であれば
接合体の強度は大きな変化を示さない。添加量が０．５
wt％未満であると、Ｔｉの凝集層が形成されなくなる。
従って、ろう材中のＴｉＨ2 の添加量は０．５〜５wt％
の範囲にする必要がある。TiH 2 in the brazing material concentrates at the interface between the ceramic and the brazing material to form a uniform agglomerated layer of Ti. In this agglomerated layer, the thickness of the agglomerated layer tends to increase as the weight ratio of TiH 2 increases, and if the addition amount exceeds 5 wt%, TiH 2 in the brazing material reacts with Ag and Cu and becomes brittle. This produces an intermetallic compound. As a result, the bonding strength is reduced, which causes the mechanical properties of the brazed bonded body to be greatly deteriorated. However, if the added amount of TiH 2 is within 5 wt%, the strength of the joined body does not change significantly. Addition amount is 0.5
If it is less than wt%, a Ti agglomeration layer will not be formed.
Therefore, the addition amount of TiH 2 in the brazing material is 0.5 to 5 wt%
Must be in the range.
【００１２】セラミックスと金属とを接合する場合、両
者の熱膨張率の差により、熱応力が発生する。この熱応
力を緩和するための対策の一つとして、ろう材の融点を
下げてろう付け温度を低くする方法がある。その場合、
前述のＡｇ−Ｃｕ−ＴｉＨ2系にＳｎまたはＩｎのうち
の一方あるいは双方を添加する。When ceramics and metal are joined, thermal stress is generated due to the difference in coefficient of thermal expansion between the two. One of the measures to alleviate this thermal stress is to lower the brazing temperature by lowering the melting point of the brazing material. In that case,
Adding one or both of Sn or In the foregoing Ag-Cu-TiH 2 system.
【００１３】Ｓｎ，Ｉｎが５％以上添加されたろう材の
融点は６００℃〜７３０℃となり、融点を下げる効果が
顕著に現れる。しかし、Ｓｎ，Ｉｎの添加量がいずれも
２０wt％を越えると、ろう材の固相線と液相線の幅が大
きく広がり、ろう材中の融点の低い成分の流れ出しが起
こる。また、過剰に添加されたＳｎ，Ｉｎと、ろう材中
のＡｇ，Ｃｕ，ＴｉＨ2 との間に脆い化合物が生成され
る。その結果、ろう付け接合部の組織にマクロ的な偏析
が起こり、機械的特性を劣化させ、接合体の強度を低下
させる。このため、Ｓｎ，Ｉｎの添加量はそれぞれ２０
wt％を上限とする。The melting point of the brazing material to which Sn or In is added by 5% or more is 600 ° C. to 730 ° C., and the effect of lowering the melting point is remarkable. However, when the addition amounts of Sn and In both exceed 20 wt%, the widths of the solidus line and the liquidus line of the brazing material widen greatly, and the components with a low melting point in the brazing material flow out. Further, a brittle compound is generated between the excessively added Sn and In and the Ag, Cu and TiH 2 in the brazing material. As a result, macroscopic segregation occurs in the structure of the brazed joint, deteriorating the mechanical properties and lowering the strength of the joint. Therefore, the amounts of Sn and In added are each 20
The upper limit is wt%.
【００１４】[0014]
【実施例】表１に、ろう材の組成例を示す。表１におい
て、ろう材の成分はＮｏ．１からＮｏ．６までの６つの
グループに分かれており、各グループごとに各金属成分
の含有量を種々に変化させて、ろう材サンプルを作製し
た。Ｎｏ．１は、実質的にＡｇ，Ｃｕ，ＴｉＨ2 の３種
類の金属単体の粉末からなる。Ｎｏ．２はＮｏ．１と成
分は共通であるが、ＡｇとＣｕの合金粉末を用いた。Ｎ
ｏ．３はＮｏ．１のものにＳｎを添加し、Ｎｏ．４はＮ
ｏ．１のものにＳｎとＩｎを添加している。Ｎｏ．５
は、Ｎｏ．１にＩｎのみを添加したものである。Ｎｏ．
６はＮｏ．１にＮｉを添加したものであり、ステンレス
鋼の接合に適している。EXAMPLES Table 1 shows an example of the composition of the brazing material. In Table 1, the components of the brazing filler metal are No. 1 to No. It was divided into 6 groups up to 6, and the content of each metal component was variously changed for each group to prepare a brazing material sample. No. 1 consists essentially of powders of three kinds of simple metals, Ag, Cu and TiH 2 . No. No. 2 is No. Although the same components as 1 were used, an alloy powder of Ag and Cu was used. N
o. No. 3 is No. No. 1 was added with Sn, and No. 1 was added. 4 is N
o. Sn and In are added to the No. 1 alloy. No. 5
No. In is added only to In. No.
No. 6 is No. Ni is added to 1 and is suitable for joining stainless steel.
【００１５】[0015]
【表１】 表１のろう材サンプルに用いた金属粉の粒度は、次の通
りである。 Ａｇ：４５μｍ Ｃｕ：２０μｍ ＴｉＨ2 ：１０
μｍ Ｎｉ：１０μｍ Ｓｎ：１５μｍ Ｉｎ：１５
μｍ なお、上記金属粉の粒度の実用範囲は、 Ａｇ：１０〜３００μｍ Ｃｕ：５〜３００μｍ ＴｉＨ2 ：１〜２００μｍ Ｎｉ：１〜２００μｍ Ｓｎ：１０〜２００μｍ Ｉｎ：１０〜２００μｍ
である。[Table 1] The particle size of the metal powder used for the brazing material sample in Table 1 is as follows. Ag: 45 μm Cu: 20 μm TiH 2 : 10
μm Ni: 10 μm Sn: 15 μm In: 15
The practical range of the particle size of the metal powder is: Ag: 10 to 300 μm Cu: 5 to 300 μm TiH 2 : 1 to 200 μm Ni: 1 to 200 μm Sn: 10 to 200 μm In: 10 to 200 μm
Is.
【００１６】各金属粉の粒度が上記の下限値よりも小さ
くなると、金属粉が酸化しやすくなり、濡れ性などに悪
影響がでる。一方、各金属粉の粒度が上記の上限値を越
えると反応性が悪くなる。When the particle size of each metal powder is smaller than the above lower limit value, the metal powder is easily oxidized, and the wettability is adversely affected. On the other hand, if the particle size of each metal powder exceeds the above upper limit, the reactivity becomes poor.
【００１７】上述の各種金属の粉末の組成を、表１の範
囲内で調整する。そしてこれらの金属の混合粉に有機物
のバインダーを添加し、ペースト状のろう材を作製し
た。その際に、Ｔｉは従来使用されていたＴｉ単体とし
てではなく、ＴｉＨ2 の形で添加する。ＴｉＨ2 を使用
することにより、Ｔｉの取扱い性の向上と粉末の酸化を
防止することができるとともに、ろう材中のＴｉの割合
を低くすることにより低コスト化が可能となる。また、
ろう材の形状を、従来のように合金粉のまま使用するの
ではなく、ペースト状にしたため、被接合材への適用に
際して印刷技術の利用が可能であり、従来の問題点であ
った量産性を大幅に向上させることができる。The compositions of the above-mentioned various metal powders are adjusted within the range shown in Table 1. Then, an organic binder was added to the mixed powder of these metals to prepare a paste-like brazing material. At that time, Ti is added not in the conventionally used Ti alone but in the form of TiH 2 . By using TiH 2 , it is possible to improve the handleability of Ti and prevent the powder from being oxidized, and it is possible to reduce the cost by reducing the proportion of Ti in the brazing material. Also,
Since the shape of the brazing filler metal is made into a paste form instead of using it as it is as in the past, it is possible to use printing technology when applying it to the materials to be joined. Can be significantly improved.
【００１８】前述のＡｇ−Ｃｕ−ＴｉＨ2 系ろう材を用
いて、８３０℃、真空中でアルミナ（純度９６％および
９９％）とコバール合金（Ｆｅ−Ｎｉ−Ｃｏ系）とのろ
う付けを行った。ろう材は、アルミナの純度に関係なく
良好な濡れ性を示し、容易にろう付けが可能であった。Using the above-mentioned Ag-Cu-TiH 2 -based brazing material, alumina (purity 96% and 99%) and Kovar alloy (Fe-Ni-Co based) are brazed at 830 ° C. in vacuum. It was The brazing material showed good wettability regardless of the purity of alumina, and could be brazed easily.
【００１９】図１は、表１のＮｏ．１グループのうち、
代表的なろう材のサンプル（Ａｇ：７１wt％，Ｃｕ：２
７wt％，ＴｉＨ2 ：２wt％）を用いてろう付けを行った
場合のアルミナとろう材との接合界面を示す走査電子顕
微鏡写真である。図１の写真で右半分がろう材、左半分
がアルミナ、両者の間がろう材の反応層（凝集層）であ
る。図１から判るように、ろう材中のＴｉＨ2 は、アル
ミナとろう材の界面に集中してＴｉの均一な凝集層を生
成している。FIG. 1 shows No. 1 in Table 1. Out of one group
Sample of typical brazing material (Ag: 71 wt%, Cu: 2
7 is a scanning electron micrograph showing a joint interface between alumina and a brazing material when brazing is performed using 7 wt% and TiH 2 : 2 wt%). In the photograph of FIG. 1, the right half is the brazing material, the left half is the alumina, and the space between the two is the reaction layer (aggregation layer) of the brazing material. As can be seen from FIG. 1, TiH 2 in the brazing material is concentrated at the interface between the alumina and the brazing material to form a uniform agglomerated layer of Ti.
【００２０】上記サンプルの接合界面の金属組織を、Ｅ
ＰＭＡ（エレクトロンプローブマイクロアナライザ）で
処理した結果を図２ないし図５に示す。図２はＡｇ、図
３はＣｕ、図４はＡｌ、図５はＴｉの各成分がそれぞれ
白く写っており、白色の度合いが強い箇所ほど上記成分
が多く存在していることになる。これらの分析結果から
判るように、ろう材中のＴｉはアルミナの純度に関係な
く、接合界面にＴｉの１０μｍ以下の薄い凝集層を均一
に生成している。この結果、ボイドや未接合部のない密
着性の高い接合体が得られた。The metallic structure of the joint interface of the above sample was
The results of treatment with PMA (electron probe microanalyzer) are shown in FIGS. Each component of Ag in FIG. 2, Cu in FIG. 3, Al in FIG. 4, and Ti in FIG. 5 is shown in white, and the greater the degree of whiteness, the more the above components are present. As can be seen from these analysis results, Ti in the brazing filler metal uniformly forms a thin agglomerated layer of 10 μm or less of Ti at the bonding interface regardless of the purity of alumina. As a result, a bonded body having high adhesion without voids or unbonded portions was obtained.
【００２１】更に、上記ろう材を用いて窒化アルミニウ
ムとモリブデンとのろう付けも行った。この場合も、ろ
う材は前記実施例と同様に良好な濡れ性を示し、容易に
ろう付けが可能であり、その界面についても、ろう材中
のＴｉによる薄い凝集層が均一に生成され、密着性の高
い接合体が得られた。Further, brazing of aluminum nitride and molybdenum was performed using the above brazing material. In this case as well, the brazing material exhibits good wettability as in the above-mentioned examples and can be brazed easily, and even at its interface, a thin agglomerated layer of Ti in the brazing material is uniformly generated, resulting in close contact. A highly bonded body was obtained.
【００２２】上述のＡｇ−Ｃｕ−ＴｉＨ2 系ろう材の機
械的特性を評価するために、直径φ１４mm，長さ１０mm
のアルミナ（純度９６％および９９％）のテストピース
と各種金属（コバール合金，インバー合金，Ｔｉ，Ｃ
ｕ，Ｍｏ，Ｗ）とのろう付けを行い、また、上記寸法の
窒化アルミニウム（ＡｌＮ）のテストピースと上記各種
金属とのろう付けを行い、各接合部の剪断強度を調べる
試験を行った。その結果を表２に示す。In order to evaluate the mechanical properties of the above-mentioned Ag-Cu-TiH 2 brazing material, the diameter φ14 mm and the length 10 mm.
Test piece of alumina (96% and 99% purity) and various metals (Kovar alloy, Invar alloy, Ti, C
u, Mo, W), and a test piece of aluminum nitride (AlN) having the above dimensions and the above various metals were brazed to perform a test for examining the shear strength of each joint. The results are shown in Table 2.
【００２３】[0023]
【表２】 表２において、アルミナとコバール合金との接合体は熱
膨張率が小さいため、９６％アルミナの場合は平均破断
強度が１０４Ｍｐａ、９９％アルミナの場合の平均破断
強度は１２０Ｍｐａと、セラミックスの純度に関係なく
安定した高い接合強度が得られた。[Table 2] In Table 2, since the joined body of alumina and Kovar alloy has a small coefficient of thermal expansion, the average breaking strength in the case of 96% alumina is 104 Mpa and the average breaking strength in the case of 99% alumina is 120 Mpa, which is related to the purity of ceramics. A stable and high bonding strength was obtained.
【００２４】また、アルミナとの熱膨張差が大きい銅と
アルミナとの接合体は、銅自体の塑性変形と冷却速度を
調整することにより、熱応力が緩和され、アルミナが破
壊することなく接合が可能であった。その接合強度は、
９６％アルミナの場合は平均破断強度が６６Ｍｐａ、９
９％アルミナの場合の平均破断強度は７２Ｍｐａであっ
た。In addition, in the joined body of copper and alumina, which has a large difference in thermal expansion from alumina, thermal stress is relaxed by adjusting the plastic deformation of copper itself and the cooling rate, and the joining is achieved without destruction of alumina. It was possible. The bond strength is
In the case of 96% alumina, the average breaking strength is 66 MPa, 9
The average breaking strength in the case of 9% alumina was 72 Mpa.
【００２５】一方、窒化アルミニウムでは、接合する相
手金属がモリブデンの場合、熱膨張差が小さいため、平
均破壊強度で１１８Ｍｐａ、更にタングステンおよびコ
バール合金との接合体でも平均破断強度がそれぞれ１０
０Ｍｐａ、９２Ｍｐａと、安定した高い接合強度が得ら
れた。また、銅についても、窒化アルミニウムを破壊す
ることなく接合が可能であり、その平均破壊強度は４０
Ｍｐａであった。On the other hand, in the case of aluminum nitride, when the mating metal to be joined is molybdenum, the difference in thermal expansion is small, so that the average breaking strength is 118 MPa, and the average breaking strength of the joined body with tungsten and Kovar alloy is 10 each.
A stable high bonding strength of 0 Mpa and 92 Mpa was obtained. Also, copper can be joined without breaking aluminum nitride, and its average breaking strength is 40%.
It was Mpa.
【００２６】[0026]
【発明の効果】本発明によれば、セラミックスに対して
良好な濡れ性と反応性を示し、容易にろう付け可能であ
るとともに、接合界面にＴｉの薄い凝集層が均一に生成
され、ボイドや未接合部が存在せず、密着性の高い高強
度な接合体が得られる。According to the present invention, it exhibits good wettability and reactivity with ceramics, can be easily brazed, and a thin agglomerated layer of Ti is uniformly formed at the joint interface, so that voids and There is no unbonded portion, and a high-strength bonded body having high adhesion can be obtained.
【図１】アルミナとろう材との接合界面の金属組織を顕
微鏡で２０００倍に拡大した写真。FIG. 1 is a photograph obtained by enlarging a metal structure at a bonding interface between alumina and a brazing material with a microscope at a magnification of 2000 times.
【図２】アルミナとろう材のＡｇ成分を示す金属組織を
顕微鏡で１５００倍に拡大した写真。FIG. 2 is a photograph of a metal structure showing the Ag component of alumina and a brazing material magnified 1500 times with a microscope.
【図３】アルミナとろう材のＣｕ成分を示す金属組織を
顕微鏡で１５００倍に拡大した写真。FIG. 3 is a photograph of a metal structure showing alumina and Cu components of a brazing material, which is magnified 1500 times with a microscope.
【図４】アルミナとろう材のＡｌ成分を示す金属組織を
顕微鏡で１５００倍に拡大した写真。FIG. 4 is a photograph of a metal structure showing alumina and Al components of a brazing material, which is magnified 1500 times with a microscope.
【図５】アルミナとろう材のＴｉ成分を示す金属組織を
顕微鏡で１５００倍に拡大した写真。FIG. 5 is a photograph of a metal structure showing Ti components of alumina and a brazing material, which is magnified 1500 times with a microscope.
Claims (3)
量比でＡｇ：６５〜８５％，Ｃｕ：１２〜４０％，Ｔｉ
Ｈ2 ：０．５〜５％の範囲とし、これら金属の合計が不
純物を含めて１００％になるように調整したことを特徴
とするセラミックス接合用ろう材。1. Ag, Cu and TiH 2 are essential components, and by weight ratio Ag: 65-85%, Cu: 12-40%, Ti.
H 2 : A brazing filler material for ceramics, characterized in that it is adjusted to a range of 0.5 to 5% so that the total of these metals is 100% including impurities.
た請求項１記載のセラミックス接合用ろう材。2. A brazing material for ceramics bonding according to claim 1, wherein the powder of the metal is mixed with a binder.
つＳｎ，Ｉｎ，Ｎｉの中から選択された１種もしくは複
数種の金属を添加し、重量比でＡｇ：６５〜８５％，Ｃ
ｕ：１２〜４０％，ＴｉＨ2 ：０．５〜５％，Ｓｎ：５
〜２０％，Ｉｎ：５〜２０％，Ｎｉ：１〜５％の範囲と
し、これら金属の合計が不純物を含めて１００％になる
ように調整したことを特徴とするセラミックス接合用ろ
う材。3. Ag, Cu and TiH 2 are essential components, and one or more metals selected from Sn, In and Ni are added, and Ag: 65-85% C by weight.
u: 12~40%, TiH 2: 0.5~5%, Sn: 5
A brazing material for ceramics bonding, characterized in that the content of these metals is adjusted to 100% including impurities, in the range of -20%, In: 5-20%, Ni: 1-5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29236493A JP3495770B2 (en) | 1993-10-29 | 1993-10-29 | Brazing filler metal for ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29236493A JP3495770B2 (en) | 1993-10-29 | 1993-10-29 | Brazing filler metal for ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07126079A true JPH07126079A (en) | 1995-05-16 |
| JP3495770B2 JP3495770B2 (en) | 2004-02-09 |
Family
ID=17780854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29236493A Expired - Lifetime JP3495770B2 (en) | 1993-10-29 | 1993-10-29 | Brazing filler metal for ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3495770B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09321400A (en) * | 1995-10-18 | 1997-12-12 | Cts Corp | Active solder and formation of conductive trace |
| US6413649B2 (en) * | 1998-03-06 | 2002-07-02 | The Morgan Crucible Company Plc | Silver-copper-nickel infiltration brazing filler metal and composites made therefrom |
| JP2003034585A (en) * | 2001-07-19 | 2003-02-07 | Toshiba Corp | Joint body of nitride-based ceramic member and metal member, and nitride-based ceramic circuit board using the same |
| JP2004172081A (en) * | 2002-11-20 | 2004-06-17 | Lg Electronics Inc | Magnetron and joining method between magnetron members |
| JP2012115846A (en) * | 2010-11-29 | 2012-06-21 | Kyocera Corp | Brazing material, circuit board using the same, and electronic device |
| US8287673B2 (en) | 2004-11-30 | 2012-10-16 | The Regents Of The University Of California | Joining of dissimilar materials |
| CN106041238A (en) * | 2016-06-13 | 2016-10-26 | 西安理工大学 | Probe shell structure for measuring specific retention of petroleum well and seal welding material of probe shell structure |
| CN107322187A (en) * | 2017-09-05 | 2017-11-07 | 广州先艺电子科技有限公司 | A kind of active soldering paste of silver-bearing copper titanium |
| WO2018221493A1 (en) * | 2017-05-30 | 2018-12-06 | デンカ株式会社 | Ceramic circuit board and module using same |
| CN110576275A (en) * | 2019-10-18 | 2019-12-17 | 太原理工大学 | Laser brazing in-situ reaction AgCuTiZr brazing filler metal and preparation method thereof |
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-
1993
- 1993-10-29 JP JP29236493A patent/JP3495770B2/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09321400A (en) * | 1995-10-18 | 1997-12-12 | Cts Corp | Active solder and formation of conductive trace |
| US6413649B2 (en) * | 1998-03-06 | 2002-07-02 | The Morgan Crucible Company Plc | Silver-copper-nickel infiltration brazing filler metal and composites made therefrom |
| JP2003034585A (en) * | 2001-07-19 | 2003-02-07 | Toshiba Corp | Joint body of nitride-based ceramic member and metal member, and nitride-based ceramic circuit board using the same |
| JP2004172081A (en) * | 2002-11-20 | 2004-06-17 | Lg Electronics Inc | Magnetron and joining method between magnetron members |
| US8287673B2 (en) | 2004-11-30 | 2012-10-16 | The Regents Of The University Of California | Joining of dissimilar materials |
| JP2012115846A (en) * | 2010-11-29 | 2012-06-21 | Kyocera Corp | Brazing material, circuit board using the same, and electronic device |
| CN106041238A (en) * | 2016-06-13 | 2016-10-26 | 西安理工大学 | Probe shell structure for measuring specific retention of petroleum well and seal welding material of probe shell structure |
| CN106041238B (en) * | 2016-06-13 | 2018-09-25 | 西安理工大学 | A kind of oil well surveys specific retention probing shell structure and its sealing materials |
| WO2018221493A1 (en) * | 2017-05-30 | 2018-12-06 | デンカ株式会社 | Ceramic circuit board and module using same |
| CN110709369A (en) * | 2017-05-30 | 2020-01-17 | 电化株式会社 | Ceramic circuit board and module using the same |
| JPWO2018221493A1 (en) * | 2017-05-30 | 2020-04-02 | デンカ株式会社 | Ceramic circuit board and module using the same |
| US11570890B2 (en) | 2017-05-30 | 2023-01-31 | Denka Company Limited | Ceramic circuit board and module using same |
| CN107322187A (en) * | 2017-09-05 | 2017-11-07 | 广州先艺电子科技有限公司 | A kind of active soldering paste of silver-bearing copper titanium |
| CN110576275A (en) * | 2019-10-18 | 2019-12-17 | 太原理工大学 | Laser brazing in-situ reaction AgCuTiZr brazing filler metal and preparation method thereof |
| WO2023276466A1 (en) * | 2021-06-30 | 2023-01-05 | Ｄｏｗａメタルテック株式会社 | Metal-ceramic bonded substrate, manufacturing method thereof, and brazing material |
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|---|---|
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