CN108032003A - It is a kind of for Cu-Sn-Ti solder powders into lotion - Google Patents
It is a kind of for Cu-Sn-Ti solder powders into lotion Download PDFInfo
- Publication number
- CN108032003A CN108032003A CN201711229840.5A CN201711229840A CN108032003A CN 108032003 A CN108032003 A CN 108032003A CN 201711229840 A CN201711229840 A CN 201711229840A CN 108032003 A CN108032003 A CN 108032003A
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- Prior art keywords
- lotion
- solder
- mixture
- aqueous polyurethane
- poly
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Powder Metallurgy (AREA)
Abstract
The present invention relates to welding technology field, it is desirable to provide it is a kind of for Cu Sn Ti solder powders into lotion.This is made of into lotion the component of following weight percent content：Poly- (2 ethyl, 2 oxazoline) 15% 25%；Polypropylene carbonate 0.5% 5%；Soluble starch 5.5% 8.5%；Aqueous polyurethane emulsion 30% 50%；Pentaerythrite 0.25% 1%；Glycerine 5% 9%；Deionized water 10% 40%.The present invention be mixed and made into paste solder into lotion and Cu Sn Ti solder powders after, available for the vacuum brazing of cBN consolidations, solve the scattering problem of additional cemented carbide particle, further increase the comprehensive performance of solder layer.The carbon residual provided by the invention formed into lotion in Process of Vacuum Brazing is suitable, is not in that excessive carbon residual causes the defects of a large amount of so that the problem of seriously reducing assembly property after vacuum brazing.
Description
Technical field
The present invention relates to welding technology field, and in particular to it is a kind of for Cu-Sn-Ti solder powders into lotion.
Background technology
Cubic boron nitride (cBN) has excellent mechanical performance and chemical stability, it is not easy to and iron family element generationization
Reaction is learned, therefore its product is very suitable for high rigidity, the metals of good toughness such as processing ferrous alloy, nickel-base alloy and titanium alloy
Material.Further, since the size of cBN abrasive particles is smaller, it is therefore desirable to could be used by consolidation.It is widely used at present to consolidate
Knot method is that cBN particles are brazed by solder, so as to fulfill the higher connection of intensity.In the solder being brazed for cBN
In system, Cu-Sn-Ti systems solder has the intensity of higher and more preferable corrosion resistance compared to Ag-Cu systems solder；And
Compare and nickel-based solder, then with relatively low fusing point, therefore with energy saving advantage and relatively low to equipment requirement.
It is not only that cBN needs the solder group born attrition and attack, consolidated in itself during actual use
Divide the effect for similarly receiving attrition and attack, therefore, how to further improve the wear-resisting of brazing filler metal compositions useful and undermine corrosion resistance
Then become the key for further improving cBN consolidation workpiece performances.In order to further improve the property of Cu-Sn-Ti system solders
Can, generally use adds the method for cemented carbide particle into solder, but is often extremely difficult to preferably uniform in solder
Scattered effect.
The content of the invention
The technical problem to be solved in the present invention is overcome deficiency of the prior art, there is provided one kind is used for Cu-Sn-Ti prickers
Feed powder body into lotion.
To solve technical problem, solution of the invention is：
There is provided it is a kind of for Cu-Sn-Ti solder powders into lotion, be made of the component of following weight percent content
's：
Poly- (2- ethyl -2- oxazolines)：15%-25%
Polypropylene carbonate：0.5%-5%
Soluble starch：5.5%-8.5%
Aqueous polyurethane emulsion：30%-50%
Pentaerythrite：0.25%-1%
Glycerine：5%-9%
Deionized water：10%-40%.
In the present invention, the matter average molecular weight of poly- (the 2- ethyl -2- oxazolines) is 200000.
In the present invention, the matter average molecular weight of the polypropylene carbonate is 500000.
In the present invention, the aqueous polyurethane emulsion is the Dispercoll U54 type aqueous polyurethane emulsions of Cohan wound,
Solid content is 50%.
It is of the present invention to be prepared into lotion by following methods：
(1) each component is weighed by the percentage by weight；
(2) will poly- (2- ethyl -2- oxazolines), polypropylene carbonate and glycerine add mixer in, mixing 2 it is small when after stop
Only, it is cooled to room temperature, obtains mixture one；
(3) soluble starch, pentaerythrite are added in deionized water, warming while stirring is continued stirring until to 100 DEG C
Substantially uniformity, obtains mixture two；
(4) mixture one is added in mixture two, hand operated mixing is ground 10-20 times after 30-60 seconds with three-roll grinder
To substantially uniformity, mixture three is obtained；
(5) aqueous polyurethane emulsion is added in mixture three, hand operated mixing is ground after 30-60 seconds with three-roll grinder
3-6 times to substantially uniformity, obtain Cu-Sn-Ti solder powders into lotion.
In the present invention, the rotating speed of mixer is 300-800 revs/min in the step (2).
Application method of the present invention into lotion：
It will be prepared into lotion by 15:85 mass ratio is mixed with Cu-Sn-Ti solder powders, obtains cream
Shape solder.Paste solder is used for the soldering of cBN particles, its usage amount presses the normal operation entails of cBN particles soldering.
Compared with prior art, the invention has the advantages that：
1st, it is of the invention be mixed and made into paste solder into lotion and Cu-Sn-Ti solder powders after, consolidated available for cBN
Vacuum brazing.Due to being uniformly mixed into paste with Cu-Sn-Ti system solder powders into lotion before vacuum brazing is carried out
Solder system, therefore a small amount of carbon residual formed in vacuum brazing can form TiC with the Ti component reactions in solder system
Sub- even dispersion is in the solder layer after vacuum brazing.So as to solve the scattering problem of additional cemented carbide particle, further
Improve the comprehensive performance of solder layer.
2nd, the present invention is by the screening of raw material, while the optimization of the proportioning between each raw material is determined by many experiments, real
Effective control of carbon left is showed.It is provided by the invention formed into lotion in Process of Vacuum Brazing carbon residual be it is suitable,
Be not in that excessive carbon residual causes the defects of a large amount of so that the problem of seriously reducing assembly property after vacuum brazing.
Embodiment
With reference to specific embodiment, the present invention is described in detail.Following embodiments will be helpful to the technology of this area
Personnel further understand the present invention, but the invention is not limited in any way.It should be pointed out that the ordinary skill to this area
For personnel, without departing from the inventive concept of the premise, various modifications and improvements can be made.These belong to the present invention
Protection domain.
Embodiment 1：
For Cu-Sn-Ti solder powders into lotion, it is made of the component of following weight percent content：
Poly- (2- ethyl -2- oxazolines)：15%
Polypropylene carbonate：5%
Soluble starch：8.5%
Aqueous polyurethane emulsion：30%
Pentaerythrite：1%
Glycerine：9%
Deionized water：31.5%.
The matter average molecular weight of poly- (the 2- ethyl -2- oxazolines) is 200000, and the matter average molecular weight of polypropylene carbonate is
500000；The Dispercoll U54 type aqueous polyurethane emulsions that aqueous polyurethane emulsion is created for Cohan, solid content 50%.
This includes the following steps into the preparation method of lotion：
1st, each component is weighed by the percentage by weight；
2nd, poly- (2- ethyl -2- oxazolines), polypropylene carbonate and glycerine are added in high-speed mixer (300 revs/min
Clock), mixing 2 it is small when after, stop mixing, after being cooled to room temperature, mixture is taken out, obtains mixture one；
3rd, soluble starch, pentaerythrite are added in deionized water, warming while stirring is continued stirring until to 100 DEG C
Substantially uniformity, obtains mixture two；
4th, mixture one is added in mixture two, hand operated mixing is after 30 seconds, and 10 times are ground to complete with three-roll grinder
Uniformly, mixture three is obtained；
5th, aqueous polyurethane emulsion is added in mixture three, hand operated mixing grinds 3 times extremely after 30 seconds, with three-roll grinder
Substantially uniformity, obtain Cu-Sn-Ti solder powders into lotion.
Embodiment 2:
For Cu-Sn-Ti solder powders into lotion, it is made of the component of following weight percent content：
Poly- (2- ethyl -2- oxazolines)：25%
Polypropylene carbonate：0.5%
Soluble starch：5.5%
Aqueous polyurethane emulsion：50%
Pentaerythrite：0.25%
Glycerine：5%
Deionized water：13.75%.
The matter average molecular weight of poly- (the 2- ethyl -2- oxazolines) is 200000, and the matter average molecular weight of polypropylene carbonate is
500000；The Dispercoll U54 type aqueous polyurethane emulsions that aqueous polyurethane emulsion is created for Cohan, solid content 50%.
This includes the following steps into the preparation method of lotion：
1st, each component is weighed by the percentage by weight；
2nd, poly- (2- ethyl -2- oxazolines), polypropylene carbonate and glycerine are added in high-speed mixer (800 revs/min
Clock), mixing 2 it is small when after, stop mixing, after being cooled to room temperature, mixture is taken out, obtains mixture one；
3rd, soluble starch, pentaerythrite are added in deionized water, warming while stirring is continued stirring until to 100 DEG C
Substantially uniformity, obtains mixture two；
4th, mixture one is added in mixture two, hand operated mixing is after 1 minute, and 20 times are ground to complete with three-roll grinder
Uniformly, mixture three is obtained；
5th, aqueous polyurethane emulsion is added in mixture three, hand operated mixing is ground 6 times after 1 minute with three-roll grinder
To substantially uniformity, obtain Cu-Sn-Ti solder powders into lotion.
Embodiment 3:
For Cu-Sn-Ti solder powders into lotion, it is made of the component of following weight percent content：
Poly- (2- ethyl -2- oxazolines)：20%
Polypropylene carbonate：3%
Soluble starch：7%
Aqueous polyurethane emulsion：40%
Pentaerythrite：0.5%
Glycerine：7%
Deionized water：22.5%.
The matter average molecular weight of poly- (the 2- ethyl -2- oxazolines) is 200000, and the matter average molecular weight of polypropylene carbonate is
500000；Property polyaminoester emulsion be Cohan wound Dispercoll U54 type aqueous polyurethane emulsions, solid content 50%.
This includes the following steps into the preparation method of lotion：
2nd, each component is weighed by the percentage by weight；
2nd, poly- (2- ethyl -2- oxazolines), polypropylene carbonate and glycerine are added in high-speed mixer (600 revs/min
Clock), mixing 2 it is small when after, stop mixing, after being cooled to room temperature, mixture is taken out, obtains mixture one；
3rd, soluble starch, pentaerythrite are added in deionized water, warming while stirring is continued stirring until to 100 DEG C
Substantially uniformity, obtains mixture two；
4th, mixture one is added in mixture two, hand operated mixing is after 45 seconds, and 15 times are ground to complete with three-roll grinder
Uniformly, mixture three is obtained；
5th, aqueous polyurethane emulsion is added in mixture three, hand operated mixing grinds 5 times extremely after 45 seconds, with three-roll grinder
Substantially uniformity, obtain Cu-Sn-Ti solder powders into lotion.
Embodiment 4
For Cu-Sn-Ti solder powders into lotion, it is made of the component of following weight percent content：
Poly- (2- ethyl -2- oxazolines)：22.5%
Polypropylene carbonate：3%
Soluble starch：7%
Aqueous polyurethane emulsion：50%
Pentaerythrite：0.5%
Glycerine：7%
Deionized water：10%.
The matter average molecular weight of poly- (the 2- ethyl -2- oxazolines) is 200000, and the matter average molecular weight of polypropylene carbonate is
500000；Property polyaminoester emulsion be Cohan wound Dispercoll U54 type aqueous polyurethane emulsions, solid content 50%.
This includes the following steps into the preparation method of lotion：
3rd, each component is weighed by the percentage by weight；
2nd, poly- (2- ethyl -2- oxazolines), polypropylene carbonate and glycerine are added in high-speed mixer (600 revs/min
Clock), mixing 2 it is small when after, stop mixing, after being cooled to room temperature, mixture is taken out, obtains mixture one；
3rd, soluble starch, pentaerythrite are added in deionized water, warming while stirring is continued stirring until to 100 DEG C
Substantially uniformity, obtains mixture two；
4th, mixture one is added in mixture two, hand operated mixing is after 45 seconds, and 15 times are ground to complete with three-roll grinder
Uniformly, mixture three is obtained；
5th, aqueous polyurethane emulsion is added in mixture three, hand operated mixing grinds 5 times extremely after 45 seconds, with three-roll grinder
Substantially uniformity, obtain Cu-Sn-Ti solder powders into lotion.
Embodiment 5
For Cu-Sn-Ti solder powders into lotion, it is made of the component of following weight percent content：
Poly- (2- ethyl -2- oxazolines)：15%
Polypropylene carbonate：0.5%
Soluble starch：5.5%
Aqueous polyurethane emulsion：30%
Pentaerythrite：1%
Glycerine：8%
Deionized water：40%.
The matter average molecular weight of poly- (the 2- ethyl -2- oxazolines) is 200000, and the matter average molecular weight of polypropylene carbonate is
500000；The Dispercoll U54 type aqueous polyurethane emulsions that aqueous polyurethane emulsion is created for Cohan, solid content 50%.
This includes the following steps into the preparation method of lotion：
6th, each component is weighed by the percentage by weight；
7th, poly- (2- ethyl -2- oxazolines), polypropylene carbonate and glycerine are added in high-speed mixer (300 revs/min
Clock), mixing 2 it is small when after, stop mixing, after being cooled to room temperature, mixture is taken out, obtains mixture one；
8th, soluble starch, pentaerythrite are added in deionized water, warming while stirring is continued stirring until to 100 DEG C
Substantially uniformity, obtains mixture two；
9th, mixture one is added in mixture two, hand operated mixing is after 30 seconds, and 10 times are ground to complete with three-roll grinder
Uniformly, mixture three is obtained；
Aqueous polyurethane emulsion is added in mixture three, hand operated mixing is after 30 seconds, and 3 times are ground to complete with three-roll grinder
It is complete uniformly, obtain Cu-Sn-Ti solder powders into lotion.
Invention effect is verified
1st, by embodiment 1 be prepared into lotion by 15:85 ratio is mixed with Cu-25Sn-10Ti solder powders
Close, mixture is used for the soldering of cBN particles, its usage amount presses the normal operation entails of cBN particles soldering, and gained is sample
1。
2nd, cBN particle brazing operations are individually used for identical Cu-25Sn-10Ti solder powders, do not add the present invention's
Into lotion, gained is sample 2.
3rd, the cBN particle brazing products for taking two kinds of modes of operation to obtain, carry out it sandblasting test, sandblasting steady air current exists
5×105Pa, incidence angle are 90 °；Using the alumina powder of 400-600 microns of particle diameter as shot blasting particles, nozzle and brazing surface away from
From 110mm is maintained at, test surfaces area is 113mm2, mass loss of the test sample after sandblasting 180s, its test result
It is as shown in the table.
| Sample | Wear extent μ g/mm2 |
| Sample 1 | 103 |
| Sample 2 | 200 |
By upper table as can be seen that by the present invention be prepared into lotion add Cu-Sn-Ti solder powders after be used for
The brazing operation of cBN particles, can be substantially improved the abrasion resistance properties of solder layer, its technique effect is relative to without using into lotion
It is very significant for product.
The specific embodiment of the present invention is described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring the substantive content of the present invention.
Claims (4)
1. it is a kind of for Cu-Sn-Ti solder powders into lotion, it is characterised in that be by following weight percent content into
It is grouped：
Poly- (2- ethyl -2- oxazolines)：15%-25%
Polypropylene carbonate：0.5%-5%
Soluble starch：5.5%-8.5%
Aqueous polyurethane emulsion：30%-50%
Pentaerythrite：0.25%-1%
Glycerine：5%-9%
Deionized water：10%-40%.
It is 2. according to claim 1 into lotion, it is characterised in that the matter average molecular weight of poly- (the 2- ethyl -2- oxazolines)
For 200000.
It is 3. according to claim 1 into lotion, it is characterised in that the matter average molecular weight of the polypropylene carbonate is
500000。
It is 4. according to claim 1 into lotion, it is characterised in that the aqueous polyurethane emulsion is Cohan wound
Dispercoll U54 type aqueous polyurethane emulsions, solid content 50%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711229840.5A CN108032003B (en) | 2017-11-29 | 2017-11-29 | Paste forming body for Cu-Sn-Ti solder powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711229840.5A CN108032003B (en) | 2017-11-29 | 2017-11-29 | Paste forming body for Cu-Sn-Ti solder powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108032003A true CN108032003A (en) | 2018-05-15 |
| CN108032003B CN108032003B (en) | 2020-12-11 |
Family
ID=62094535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711229840.5A Active CN108032003B (en) | 2017-11-29 | 2017-11-29 | Paste forming body for Cu-Sn-Ti solder powder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108032003B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109955005A (en) * | 2019-04-30 | 2019-07-02 | 温州宏丰电工合金股份有限公司 | A kind of high thixotropic for sprayable soldering paste is at lotion and preparation method thereof |
| CN111390427A (en) * | 2020-04-21 | 2020-07-10 | 烟台市固光焊接材料有限责任公司 | High-performance adhesive composition for brazing and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111390427A (en) * | 2020-04-21 | 2020-07-10 | 烟台市固光焊接材料有限责任公司 | High-performance adhesive composition for brazing and preparation method thereof |
| CN111390427B (en) * | 2020-04-21 | 2021-08-06 | 烟台市固光焊接材料有限责任公司 | High-performance adhesive composition for brazing and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN108032003B (en) | 2020-12-11 |
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