CN107302167A - It is a kind of that the method that cable carries out reliable abnormity interconnection is substituted in small space - Google Patents
It is a kind of that the method that cable carries out reliable abnormity interconnection is substituted in small space Download PDFInfo
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- CN107302167A CN107302167A CN201710717875.7A CN201710717875A CN107302167A CN 107302167 A CN107302167 A CN 107302167A CN 201710717875 A CN201710717875 A CN 201710717875A CN 107302167 A CN107302167 A CN 107302167A
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- interconnection
- abnormity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The method that cable carries out reliable abnormity interconnection is substituted in small space the invention provides a kind of, specific method is：Metal shell according to required for the abnormity interconnection of practical application object designs；Grease and inorganic pollution are removed to the grade metal housing for completing digital-to-analogue milling manufacturing procedure；One layer of dielectric insulating film is deposited in the metal shell inner surface by electrostatic spraying, 3D printing or injection molding manner；On the dielectric insulating film surface of forming using laser micro-cladding and fine etching, the 3-dimensional metal band line that size is set is made；The component and connector for realizing that interconnection needs are welded and/or are bonded on the conformal circuit for make metal tape line.Compared with prior art, it is able to ensure that microminiature High Density Integration electronics internal module and module, formed between extension set and extension set it is a kind of reliable interconnected without cable abnormity, realizes circuit and structure-integrated integrated, meets that microminiature High Density Integration electronics are reliable, efficient dress connection demand.
Description
Technical field
The method that cable carries out reliable abnormity interconnection, more particularly to one are substituted in small space the present invention relates to a kind of
Plant and be applied to integrated circuit fields, for microminiature High Density Integration electronics, cable progress is substituted in small space
The method of reliable abnormity interconnection.
Background technology
Cable is indispensable part in electromechanical product and system, is module and module, and extension set is interconnected with extension set
Main Means, had a wide range of applications in practice in engineerings such as communications industry, power electronics industries.Due to cable own dimensions
Relatively large, large number of during for electronics intraconnection, occupancy inner space is more, ties up space needed for circuit board,
The interconnection needs under small space inside microminiature High Density Integration electronics can not be met.
In order to solve this problem, it is common practice to use small size inside microminiature High Density Integration electronics
Cable, as far as possible reduce cable installing space.The problem of this method is present be：1）Intensive cable wiring will cause electronics to fill
Standby internal wiring is complicated, and space is nervous and connects up error-prone；2）Intensive cable wiring will cause workload to increase suddenly, assembly difficulty
Increase, wire harness is fragile, so as to cause efficiency of assembling and reliability substantially to reduce.
If can be done in the special-shaped interconnecting integrated circuit of electronics small space regional ensemble, the internal substantial amounts of cable of substitution
Few lead greatly improves electronics even without lead connection while can then significantly improving efficiency of assembling inside to electronics
Reliability.However, the technology difficulty that reliable abnormity interconnection is made in small space is very big, main cause is in electronics
Portion space is limited, it is impossible to carry more surface-mounted integrated circuits or interconnecting cable, needs directly in the integrated three-dimensional of metal shell inwall
Special-shaped interconnection circuit.
A kind of conformal circuit and preparation method thereof is proposed in Chinese patent CN201510760302, this method is mainly logical
Too drastic light irradiation makes the mixtures such as oxidant, plastics, solvent formation laser-treated layer, then is plated in shape on laser-treated layer by changing
Into conformal circuit.Methods described is the method for making conformal circuit on plastic body surface, it is impossible to realize metal housing surface system
Make conformal circuit；And the conformal circuit due to being that using changing plating manufacture, electric circuit metal layer is loose, and porous, electric conductivity is just
70% or so of normal wire, it is impossible to realize high speed signal and radio signal transmission.
A kind of increasing material manufacturing method on 3D components is proposed in Chinese patent CN201610314553, specific practice is to carry
For the component with first surface；Powder is adhered into first surface；And, from oriented energy source beams directed come with corresponding to
The pattern fusing powder of the layer of structure.This method realizes that the labyrinth of same material is molded using 3D printing technique, realizes knot
The printing manufacture of component, it is impossible to realize three-dimensional circuit manufacture application.
A kind of stereo circuit and the connection method of metalwork and LDS days are disclosed in Chinese patent CN201610701271
Line.Specific method is to obtain LDS matrixes by LDS materials are molded, and at least a portion of metalwork is embedded in into LDS bases
Body, in LDS matrixes formation circuitous pattern by the way of laser laser carving, then in circuitous pattern and metal by the way of chemical plating
The surface of part forms conductive tie layers.The invention provides the connection method of a kind of LDS circuits and metalwork, but its electric circuit metal layer
Loose, porous, electric conductivity is compared with normal wires reduction by 30% or so, it is impossible to meet the demand of radio frequency model transmission.
The content of the invention
It is big, difficult that assembly working amount in small space is inherently eliminated the technical problem to be solved in the present invention is to provide one kind
Degree is big, and interlinking reliability is low, and the method that cable carries out reliable abnormity interconnection is substituted in small space.
The technical solution adopted by the present invention is as follows：It is a kind of that the side that cable carries out reliable abnormity interconnection is substituted in small space
Method, specific method is：
S1, the metal shell according to required for the abnormity interconnection of practical application object designs；
S2, grade metal housing removal grease and inorganic pollution to completing digital-to-analogue milling manufacturing procedure；
S3, by electrostatic spraying, 3D printing or injection molding manner the metal shell inner surface deposit one layer of dielectric insulating film；
S4, on the dielectric insulating film surface of forming using laser micro-cladding and fine etching, make three Vygens that size is set
Category band line；
S5, welding and/or bonding realization interconnection need on the conformal circuit for make metal tape line component and connector.
In the S2, the specific method step for removing pollutant is：
S2-1, the metal shell is dipped to more than decontamination 5min in fluid；
S2-2, to more than the metal casing body deionized water rinsing 5min after immersion；
S2-3, to deionization rinse after metal shell using organic solvent ultrasonic wave clean more than 10min.
The NaOH solution that fluid is removed for 2% 50% mass concentrations；The organic solvent is ethanol, acetone, butanone, different
One or more of compatibilities in propyl alcohol, toluene, trichloro ethylene and cyclohexanone.
The dielectric film thickness is more than or equal to 50 microns.
Realized for the making of the metal tape line of metal shell, including using three-dimensional modeling drawing three-dimensional wire model.
Metal in the metal tape line is one or more of combinations in gold, silver, copper, nickel and aluminium.
The three-dimensional modeling is to use CATIA or PRO/E instrument drawing three-dimensional wire models.
The deposit thickness of the metal tape line is more than or equal to 5 microns.
Methods described also includes：Connector is soldered to by circuit two ends using brazing mode and obtains special-shaped interconnection circuit knot
Structure.
The brazing mode uses 300 DEG C of welding temperature 150 DEG C, flatiron spot welding or reflow ovens Reflow Soldering；Wherein, return
Fluid welding time 5min 20min.
Compared with prior art, the beneficial effects of the invention are as follows：It is able to ensure that in microminiature High Density Integration electronics
Portion's module and module, form a kind of reliable without cable abnormity interconnection, realize circuit and structure-integrated between extension set and extension set
It is integrated, meet that microminiature High Density Integration electronics are reliable, efficient dress connection demand.
Brief description of the drawings
Fig. 1 is the overall circuit configuration schematic diagram of a wherein embodiment of the invention.
Fig. 2 is the structural element decomposing schematic representation in embodiment illustrated in fig. 1.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
This specification（Including summary and accompanying drawing）Disclosed in any feature, unless specifically stated otherwise, can be equivalent by other
Or the alternative features with similar purpose are replaced.I.e., unless specifically stated otherwise, each feature is a series of equivalent or class
Like an example in feature.
Specific embodiment 1
As depicted in figs. 1 and 2, a kind of that the method that cable carries out reliable abnormity interconnection is substituted in small space, specific method is：
S1, the metal shell 1 according to required for the abnormity interconnection of practical application object designs；
S2, the grade metal housing removal pollutant such as grease and inorganic pollution to completing the manufacturing procedures such as digital-to-analogue milling；
S3, by electrostatic spraying, 3D printing or injection molding manner the metal shell inner surface deposit one layer of dielectric insulating film
2；
S4, on the dielectric insulating film surface of forming using laser micro-cladding and fine etching, make three Vygens that size is set
Category band line 4；
S5, welding and/or bonding realization interconnection need on the conformal circuit for make metal tape line component and connector
3。
In this specific embodiment, the dielectric insulating film can be any one organic insulation；In metal shell
The high-quality conformal metal tape line being interconnected instead of cable is produced on surface, in the appropriate location of metal tape line graph（According to
Actual demand）Assembly and connection device and/or component, you can obtain the metal shell for being integrated with interconnection circuit.
The present invention is using cleaning, forming media, and three dimensional wiring, the process route of assembling interconnection successfully develop narrow and small sky
Between in substitute cable carry out module interconnection technology.By the integrated conformal circuit of housing, the connection of cable is substituted, each electricity is realized
The interconnection on road, hence it is evident that add production efficiency and product reliability.
The present invention is inherently eliminated in small space without introducing any circuit board or cable in the housing and assembles work
Measure and difficulty is big, the problem of interlinking reliability is low.Obtained conformal interconnection circuit and housing is integrated, saves empty
Between, assembling is simple, and reliability is high compared with cable connection reliability.In addition, present invention process is relatively simple, production yield rate is high, can
Practical requirement is met well.
In addition to the constraint in terms of the dielectric thickness brought by molding mode, the technology is to shell structure form and routing path
Limitation is smaller, can various complex casings the integrated conformal band line in surface, be module, the system such as extension set brings effectively highly reliable
Interconnection, is that function and structure design provide the bigger free degree.Most small band linear dimension achieved by the present invention is 0.1mm,
Much smaller than cable dimensions.
Specific embodiment 2
On the basis of specific embodiment 1, in the S2, the specific method step for removing pollutant is：
S2-1, the metal shell is dipped to more than decontamination 5min in fluid；
S2-2, to more than the metal casing body deionized water rinsing 5min after immersion；
S2-3, to deionization rinse after metal shell using organic solvent ultrasonic wave clean more than 10min.
Specific embodiment 3
On the basis of specific embodiment 2, according to the characteristics of metal shell, configuration cleaning volume, in this specific embodiment, institute
State NaOH solution of the fluid for 2% 50% mass concentrations；The organic solvent be ethanol, acetone, butanone, isopropanol, toluene,
One or more of compatibilities in trichloro ethylene and cyclohexanone.
Specific embodiment 4
On the basis of one of specific embodiment 1 to 3, the dielectric film thickness is more than or equal to 50 microns.
Specific embodiment 5
On the basis of one of specific embodiment 1 to 4, built for the making of the metal tape line of metal shell, including using three-dimensional
Mould drawing three-dimensional wire model is realized.
Specific embodiment 6
On the basis of one of specific embodiment 1 to 5, the metal in the metal tape line is one in gold, silver, copper, nickel and aluminium
Plant or several combinations.
Specific embodiment 7
On the basis of one of specific embodiment 5 to 6, the three-dimensional modeling is using instrument drawing three-dimensionals such as CATIA or PRO/E
Wire model.Make for convenience, 1 is drawn when being drawn in this specific embodiment:1 three dimensional wiring model.
Specific embodiment 8
On the basis of one of specific embodiment 1 to 7, the deposit thickness of the metal tape line is more than or equal to 5 microns.
Specific embodiment 9
On the basis of one of specific embodiment 1 to 8, methods described also includes：Connector is soldered to by electricity using brazing mode
Road two ends obtain special-shaped interconnection circuit structure.
Specific embodiment 10
On the basis of specific embodiment 9, the brazing mode use 300 DEG C of welding temperature 150 DEG C, flatiron spot welding or return
Flow stove Reflow Soldering；Wherein, Reflow Soldering time 5min 20min.
Claims (10)
1. a kind of substitute the method that cable carries out reliable abnormity interconnection in small space, specific method is：
S1, the metal shell according to required for the abnormity interconnection of practical application object designs；
S2, grade metal housing removal grease and inorganic pollution to completing digital-to-analogue milling manufacturing procedure；
S3, by electrostatic spraying, 3D printing or injection molding manner the metal shell inner surface deposit one layer of dielectric insulating film；
S4, on the dielectric insulating film surface of forming using laser micro-cladding and fine etching, make three Vygens that size is set
Category band line；
S5, welding and/or bonding realization interconnection need on the conformal circuit for make metal tape line component and connector.
2. in the method according to claim 1 for carrying out reliable abnormity interconnection, the S2, remove the specific method of pollutant
Step is：
S2-1, the metal shell is dipped to more than decontamination 5min in fluid；
S2-2, to more than the metal casing body deionized water rinsing 5min after immersion；
S2-3, to deionization rinse after metal shell using organic solvent ultrasonic wave clean more than 10min.
It is described to go fluid to be 2% 50% mass concentrations 3. the method according to claim 2 for carrying out reliable abnormity interconnection
NaOH solution；The organic solvent be ethanol, acetone, butanone, isopropanol, toluene, trichloro ethylene and cyclohexanone in one kind or
Several compatibilities.
4. the method according to claim 1 for carrying out reliable abnormity interconnection, the dielectric film thickness is more than or equal to 50
Micron.
5. the method according to claim 1 for carrying out reliable abnormity interconnection, for the making of the metal tape line of metal shell,
Including being realized using three-dimensional modeling drawing three-dimensional wire model.
6. the metal in the method according to claim 1 for carrying out reliable abnormity interconnection, the metal tape line is gold, silver,
One or more of combinations in copper, nickel and aluminium.
7. the method according to claim 5 for carrying out reliable abnormity interconnection, the three-dimensional modeling is to use CATIA or PRO/
E instrument drawing three-dimensional wire models.
8. the method according to claim 1 for carrying out reliable abnormity interconnection, the deposit thickness of the metal tape line is more than etc.
In 5 microns.
9. the method according to claim 1 for carrying out reliable abnormity interconnection, methods described also includes：Will using brazing mode
Connector is soldered to circuit two ends and obtains special-shaped interconnection circuit structure.
10. the method according to claim 9 for carrying out reliable abnormity interconnection, the brazing mode uses welding temperature 150
DEG C 300 DEG C, flatiron spot welding or reflow ovens Reflow Soldering；Wherein, Reflow Soldering time 5min 20min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710717875.7A CN107302167B (en) | 2017-08-21 | 2017-08-21 | A method of it substituting cable in small space and carries out reliable abnormity interconnection |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710717875.7A CN107302167B (en) | 2017-08-21 | 2017-08-21 | A method of it substituting cable in small space and carries out reliable abnormity interconnection |
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| Publication Number | Publication Date |
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| CN107302167A true CN107302167A (en) | 2017-10-27 |
| CN107302167B CN107302167B (en) | 2019-02-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114050659A (en) * | 2021-11-16 | 2022-02-15 | 中国电子科技集团公司第二十九研究所 | Microminiature composite energy device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1764345A (en) * | 2004-10-20 | 2006-04-26 | 华为技术有限公司 | Printed circuit board and its processing method |
| CN102110673A (en) * | 2010-10-27 | 2011-06-29 | 中国科学院上海微系统与信息技术研究所 | Wafer level MMCM (microwave multichip module) packaging structure using photosensitive BCB (benzocyclobutene) as dielectric layer and method |
| CN103474417A (en) * | 2013-09-29 | 2013-12-25 | 中国科学院微电子研究所 | Three-dimensional interconnection structure and preparation method thereof |
| US20140138129A1 (en) * | 2012-11-16 | 2014-05-22 | Qualcomm Incorporated | Substrate having a low coefficient of thermal expansion (cte) copper composite material |
-
2017
- 2017-08-21 CN CN201710717875.7A patent/CN107302167B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1764345A (en) * | 2004-10-20 | 2006-04-26 | 华为技术有限公司 | Printed circuit board and its processing method |
| CN102110673A (en) * | 2010-10-27 | 2011-06-29 | 中国科学院上海微系统与信息技术研究所 | Wafer level MMCM (microwave multichip module) packaging structure using photosensitive BCB (benzocyclobutene) as dielectric layer and method |
| US20140138129A1 (en) * | 2012-11-16 | 2014-05-22 | Qualcomm Incorporated | Substrate having a low coefficient of thermal expansion (cte) copper composite material |
| CN103474417A (en) * | 2013-09-29 | 2013-12-25 | 中国科学院微电子研究所 | Three-dimensional interconnection structure and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114050659A (en) * | 2021-11-16 | 2022-02-15 | 中国电子科技集团公司第二十九研究所 | Microminiature composite energy device |
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| CN107302167B (en) | 2019-02-12 |
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