CN107297598A - Preparation technology without glue aluminum cellular board - Google Patents

Preparation technology without glue aluminum cellular board Download PDF

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Publication number
CN107297598A
CN107297598A CN201710451643.1A CN201710451643A CN107297598A CN 107297598 A CN107297598 A CN 107297598A CN 201710451643 A CN201710451643 A CN 201710451643A CN 107297598 A CN107297598 A CN 107297598A
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Prior art keywords
composite
panel
board
plate
cellular
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CN201710451643.1A
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CN107297598B (en
Inventor
金建伟
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Jiangsu Sheng Xing Metal Plate Co Ltd
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Jiangsu Sheng Xing Metal Plate Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203Fluxing, i.e. applying flux onto surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206Cleaning
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16SCONSTRUCTIONAL ELEMENTS IN GENERAL; STRUCTURES BUILT-UP FROM SUCH ELEMENTS, IN GENERAL
    • F16S1/00Sheets, panels, or other members of similar proportions; Constructions comprising assemblies of such members

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention belongs to cellular board technical field, and in particular to the preparation technology without glue aluminum cellular board, comprise the following steps:1. prepare composite panel, composite bottom board and honeycomb core, 2. in composite panel, composite bottom board surface coating scaling powder, 3. composite panel, honeycomb core, composite bottom board are assembled using fixture, 4. scaling powder is sprayed again in composite panel, honeycomb core, composite bottom board faying face after assembling, 5. entering soldering oven carries out soldering, no glue cellular board is obtained, the present invention can improve strength of brazed joint, prevent composite plate from being deformed in high temperature brazing, improve cellular board Forming Quality.

Description

Preparation technology without glue aluminum cellular board
Technical field
The invention belongs to cellular board technical field, and in particular to the preparation technology without glue aluminum cellular board.
Background technology
Cellular board is because lightweight, specific strength is high, rigidity is big, stability is good, heat-and sound-insulating and pollution-free etc. a series of Advantage, is used widely in the fields such as Aero-Space, aircraft, train, ship, building.It is common both at home and abroad at present Either core is compound in itself or between panel and core for cellular board, is adhesive means, connected mode is physical bond, Its intensity, service life and the working environment of permission are largely restricted by Adhensive performance.The honeycomb of gluing shaping Plate mechanical property is relatively low, structure built on the sand, moreover, pollution can be produced in gluing connected mode reproduction, not environmentally.To understand Certainly the problem, at present, use method for welding formed honeycomb plate more.
Soldering is to make solder using metal material more low-melting than mother metal, and weldment and solder heat are melted to higher than solder Point, less than mother metal fusion temperature, mother metal is soaked using liquid solder, is filled play movement and is connected with mother metal phase counterdiffusion realization The method of weldment.Cellular board is aluminium sheet, and Area comparison when soldering is big, and aluminium sheet is very easy to deformation in the case of heated. Prior art is typically that aluminium sheet and the cellular board for scribbling brazing flux are sent directly into soldering oven to carry out high temperature brazing, although this method Technique is simple, but usually easily occurs aluminium sheet deformation, so as to influence the surface smoothness of composite plate, influences product quality.
The content of the invention
The technical problems to be solved by the invention are to be directed to drawbacks described above there is provided the preparation technology without glue aluminum cellular board, The cellular board deformation of lead welding and shaping is small, and cellular board quality is high.
The technical scheme that the present invention solves the use of its technical problem is as follows:
Preparation technology without glue aluminum cellular board, it is characterised in that comprise the following steps:
A, prepare panel, bottom plate and cellular sandwich:Take aluminium sheet to cut into block standby, obtain panel, bottom plate, panel bottom plate is thick Degree is consistent;Aluminium foil strip is taken to be fabricated to cellular sandwich by mechanization, cellular sandwich size coordinates with panel, base plate size;
B, prepare composite panel, composite bottom board:Solder layer is coated to the panel lower surface obtained in step, answered Panel is closed, solder layer is coated to the plate upper surface obtained in stepb, composite bottom board is obtained, solder layer thickness is thick with panel The ratio between degree is 20:3;
C, welding pretreatment:With the composite panel, the surface of composite bottom board obtained in cleaning solvent cleaning B, and Dried after the surface of the cellular sandwich obtained in step A, cleaning;
D, scaling powder is sprayed for the first time:Scaling powder is sprayed to lower surface, the composite bottom board of the composite panel after cleaning is dried Upper surface;
E, clamping:By the composite bottom board upper table obtained in step D being placed on fixture up, by what is obtained in step C Cellular sandwich row is located on composite bottom board upper surface, and the composite panel lower surface obtained in step D the honeycomb directed downwardly that is placed in is pressed from both sides On core, composite bottom board, cellular sandwich, composite panel corner are to it, and clamp obtains clamping part;
F, scaling powder is sprayed again:By cellular sandwich of the scaling powder brushing after clamping and composite panel, composite bottom board At abutted surface;
G, enter slice weldering:Soldering oven soldering is sent into after clamping part drying after being handled through step F, preheated, heating is equal Warm soldering, cooling, obtain no glue aluminum cellular board;
H, to obtained in step G without glue aluminum cellular board carry out surface clean, set surface protection coating.
Further, the solder layer in described step B is the solder layer of Al-Si eutectic compositions, helps weldering in step D, F Agent is to constitute the brazing flux aqueous solution by Nocolok powderies brazing flux and water.
Further, the soldering oven in described step G is continuous tunnel furnace formula furnace brazing stove, described heating samming pricker The temperature of weldering is 600 DEG C -610 DEG C, and described being cooled to is air-cooled, and drying temperature is 300-550 DEG C, drying time period 5-15min.
Further, described step E folder fixture includes upper fixture, lower clamp, and upper fixture includes upper bracket, upper porous Plate, upper porous plate is fixed on upper bracket surface, and upper bracket is made up of the cross tube staggeredly of upper square box, upper square inframe, under Fixture includes lower carriage, lower porous plate, and lower porous plate is fixed on lower support surface, and upper porous plate, lower porous plate are relative up and down, under Support by lower square box, under square inframe staggeredly sheer pole constitute, upper square box, cross tube, lower square box, sheer pole are equal For the rectangular steel tube of Q235 carbon steels, upper porous plate, under the degree of porous thickness of slab be 3mm, material is Q235 carbon steel, on The relative face of porous plate, lower porous plate is provided with multiple equally distributed high temperature springs, and upper square box, the side of lower square box four are all provided with There is the side lever stretched out, side lever is provided with screw hole, and side lever is connected by screw locking up and down.
Further, the described cross tube up unbalanced arrangement in shape inframe portion.
Further, gained panel, the size of bottom plate are 100cm*100cm in described step A
Further, the reliability of Welding is high, is difficult sealing-off, and stable connection makes cellular board have what is more consolidated Structure, cellular board has preferable mechanical property, can use in harsh environments, expands the application of cellular board, Without gemel connection, pollutant is not produced in production, more meets the requirement of environmental protection, scaling powder layer is arranged on solder surface, on the one hand just In the operation of welding, the protectiveness of another aspect butt-welding fitting and solder is more preferable, it is to avoid weldment and solder are aoxidized in brazing process, Improve welding effect.
The beneficial effects of the invention are as follows:Using such scheme, technique is simple, can effectively prevent composite plate from becoming in soldering Shape, greatly improves the quality of cellular board after shaping, and cellular board plate face is smooth, sound construction, is adapted to manufacture Large-dimension honeycomb plate, Production efficiency is high.
Brief description of the drawings
By detailed description below in conjunction with the accompanying drawings, the present invention is foregoing will to be become with other objects, features and advantages Obviously.
Fig. 1 is the top view of upper fixture in the present invention.
Fig. 2 is the cross-sectional view at upper fixture porous plate in the present invention.
Fig. 3 is a kind of embodiment schematic diagram of upper fixture support in the present invention.
Fig. 4 is the another embodiment schematic diagram of upper fixture support in the present invention.
Embodiment
The present invention will be further described below in conjunction with the accompanying drawings.
Embodiment 1:Produce manufacturing and designing without glue aluminum cellular board weld jig:
Fixture includes upper fixture, lower clamp, and upper fixture, lower clamp clamp cellular board embryo material therebetween, upper fixture, folder The structure of tool is identical, by the cross bar on support, support, porous plate constitute, take Q235 carbon steels rectangular steel tube and Open-work steel plate thick 3mm, the single pipe fitting that rectangular steel tube is cut into, open-work steel plate cuts into single porous plate, single pipe Part includes frame tube, cross bar, frame tube progress split is welded into the upper bracket of frame type, lower carriage, referring to figs. 1 to Fig. 3 institutes Show, cross bar interweaved in length and breadth and is welded on upper bracket, on lower carriage, form fenestral fabric, cross bar oblique weld upper bracket, under On support, the sizing grid of cross bar formation differs, and porous plate is welded on into upper bracket, lower support surface, forms physical dimension all Consistent upper fixture, lower clamp, porous plate surface are fixed with 50 high temperature springs, and high temperature spring is uniformly distributed, high temperature spring with it is many Orifice plate plate face keeps vertical, and the side lever that upper bracket, the side edge welding of lower carriage stretch out, side lever is provided with screw hole, side Locking is connected by screw between bar, upper fixture, the locking of lower clamp is realized, upper fixture, lower clamp by after honeycomb board component clamping, High temperature spring is tightly squeezed in composite plate, is made the overall stress of composite plate, can greatly be suppressed composite plate deformation in soldering, Improve the Forming Quality of cellular board.
Preparation technology without glue aluminum cellular board, comprises the following steps:
A, prepare panel, bottom plate and cellular sandwich:3003 rustproof aluminium sheets of 1mm thickness are taken to cut into 100cm*100cm blocks Shape is standby, obtains panel, bottom plate that size is 100cm*100cm, panel, base plate thickness are consistent;Take 6061 swaged forging aluminium materials Thin-walled tube coupling, cutting stock is into single tube coupling high 17mm, and single size is 28 × 0.4 × 17mm of φ, in single joint Drilling processes core bore on the wall of side;
B, prepare composite panel, composite bottom board:The solder of 400 model Al-Si eutectic compositions is taken, solder composite molding is existed Panel, backplate surface, obtain composite panel, composite bottom board, the thickness of solder layer is 0.15mm, in panel, bottom plate table before welding Face elder generation composite soldering layer, makes solder layer in the thickness uniformity of plate face, and is easy to control the thickness of solder layer, simplifies preparation Technique, while ensureing the reliable quality of soldering, the thickness of solder layer is big in the present invention, it is ensured that have enough fusing solder fillings Gap, improves welded rate and avoids weld cracking, can not only fill out the gap between interlayer and panel, bottom plate after solder layer fusing It is full, and there may also be part and penetrate into the gap of interlayer and play welding, so as to lift the integral rigidity of soldering cellular board.
C, welding pretreatment:The surface of composite panel, composite bottom board is cleaned with alcohol, and with the single tube coupling of alcohol washes Dried after surface, removing stain standby;
D, scaling powder is sprayed for the first time:Take Nocolok powders to be configured to the scaling powder aqueous solution with water, the scaling powder aqueous solution is sprayed Being sprinkled upon composite panel, composite bottom board has on the surface of solder layer, and the scaling powder aqueous solution that Nocolok powders are configured to is a kind of Almost free from corrosion fluoride chemical substance, can be configured to a certain proportion of aqueous solution, be easy to be coated in the brazing surface of workpiece On, play oxide film dissolving, improve wetting and capillary flow effect after brazing filler metal melts, and postwelding residue will not be made to component Into damaging destruction, it is sprayed directly on solder layer, in welding, scaling powder can be merged preferably with solder, and raising is helped The using effect of solder flux, improves soldering effect;
E, clamping:The composite bottom board for having sprayed the scaling powder aqueous solution is lain in a horizontal plane in lower clamp, composite bottom board is combined The side for having solder layer upwards, is arranged in what single tube coupling obtained in step C or so connected on composite bottom board, single tube coupling The core bore formed after arrangement on cellular sandwich, the single pocket of single tube coupling inner chamber then for cellular sandwich, single tube coupling makes adjacent Pocket is communicated, and can be bonded, is fixed by glue between single tube coupling, then composite panel is placed into cellular sandwich top, Composite panel is compounded with the side of solder layer downwards, and upper fixture is placed into composite surface by composite panel, composite bottom board corner to it On plate, and upper fixture, lower clamp connection are locked with screw, obtain clamping part;
F, scaling powder is sprayed again:The scaling powder aqueous solution prepared in step D is sprayed on composite panel, honeycomb folder again At core, the abutted surface of composite bottom board, scaling powder is sprayed again, and the scaling powder layer abrasion caused in clamping process is supplemented, Ensure scaling powder covering solder layer, oxide-film is removed to solder layer, soldering effect is improved;
G, enter slice weldering:Processing first is dried in clamping part, using tunnel type drying equipment, clamping part is placed into dry On the transmission mechanism of dry equipment, clamping part is dried in running on tunnel type drying equipment in clamping part, carried out Streamlined is produced, 150-260 DEG C of drying temperature, dries duration 5-15min, and dried clamping part sends into continuous tunnel furnace formula gas shielded Soldering oven is carried out on soldering processing, the transmission crawler belt that dried clamping part is placed into tunnel type furnace brazing stove, clamping Part obtains no colloid cellular board behind the preheating zone of tunnel type furnace brazing stove, heating samming brazing area, cooling zone successively, in advance The heat temperature of hot-zone is 300 DEG C, preheats duration 10min, and clamping part is forced to heat, is that soldering is prepared, heats samming pricker The temperature of weldering is 605 DEG C, soldering duration 15min, and heating samming brazing area is passed through nitrogen and protected, the type of cooling after soldering To use blower fan air blast cooling, duration 20min is cooled down, is come out of the stove after cooling close to room temperature, modularization, streamline are carried out to cellular board Soldering is produced, without using glue in life, environmental protection more, and improves the bulk strength of cellular board, panel, cellular sandwich, bottom Plate has in soldering integrally to be wrapped by fixture, during soldering, and fixture counter plate, the entirety of bottom plate is wrapped effectively to press down The deformation of panel processed, bottom plate, porous plate coordinates high temperature spring, and counter plate, bottom plate plate face carry out compacting tightly, both can guarantee that height Clamped under temperature in thickness direction, in-plane can be made to have certain flexible free degree again, plate face bulge phenomenon can be avoided in soldering, Avoid ftractureing at soldering, welded rate is substantially improved, compared to existing process, welded rate improves 70%-85%, cellular board total quality It is improved significantly, solder layer thickness is big, not only meets the soldering demand between cellular sandwich and panel, bottom plate, also has and partly ooze Enter the joint of the single pipe fitting of cellular sandwich, play welding in gap, so as to lift the integral rigidity of soldering cellular board;
It H, will obtain being removed from the molds without glue aluminum cellular board in step G, examine weld seam, panel, bottom deformation rate, Surface clean, the setting of surface protection coating are carried out after qualified to cellular board, the clamping marking of fixture is removed by Chemical cleaning, Set coating to make cellular board that there is more preferable rotproofness, improve surface quality.
Embodiment 2:Produce manufacturing and designing without glue aluminum cellular board weld jig:
Fixture include upper fixture, lower clamp, upper fixture, lower clamp by cellular board embryo material clamp therebetween, upper fixture, under Clamp structure is consistent, the open-work steel plate for taking the rectangular steel tube and 3mm of Q235 carbon steels thick, and rectangular steel tube is cut into Single pipe fitting, open-work steel plate cuts into single porous plate, and single pipe fitting includes frame tube, cross bar, and frame tube is spelled Upper bracket, the lower carriage for being welded into frame type are closed, shown in reference picture 2 to Fig. 4, cross bar interweaves in length and breadth is welded on upper bracket, lower branch On frame, fenestral fabric is formed, sizing grid is consistent, porous plate is welded on into upper bracket, lower support surface, in porous plate surface Uniform 50 high temperature springs of welding, high temperature spring is vertical with porous plate holding, up and down the phase up and down of the high temperature spring on porous plate It is right, form physical dimension all consistent upper fixture, lower clamp, the side lever that upper bracket, the side edge welding of lower carriage stretch out, Side lever is provided between screw hole, side lever and is connected by screw locking, realizes upper fixture, the locking of lower clamp.
Preparation technology without glue aluminum cellular board, comprises the following steps:
A, prepare panel, bottom plate and cellular sandwich:3003 rustproof aluminium sheets of 1mm thickness are taken to cut into 100cm*100cm blocks Shape is standby, obtains panel, bottom plate that size is 100cm*100cm, panel, base plate thickness are consistent;Take 6061 swaged forging aluminium materials Thin-walled tube coupling, cutting stock is into single tube coupling high 17mm, and single size is 28 × 0.4 × 17mm of φ, in single joint Drilling processes core bore on the wall of side;
B, prepare composite panel, composite bottom board:The solder of 400 model Al-Si eutectic compositions is taken, solder composite molding is existed Panel, backplate surface, obtain composite panel, composite bottom board, the thickness of solder layer is 0.15mm, in panel, bottom plate table before welding Face elder generation composite soldering layer, makes solder layer in the thickness uniformity of plate face, and is easy to control the thickness of solder layer, simplifies preparation Technique, while ensureing the reliable quality of soldering, the thickness of solder layer is big in the present invention, it is ensured that have enough fusing solder fillings Gap, improves welded rate and avoids weld cracking, can not only fill out the gap between interlayer and panel, bottom plate after solder layer fusing It is full, and there may also be part and penetrate into the gap of interlayer and play welding, so as to lift the integral rigidity of soldering cellular board.
C, welding pretreatment:The surface of composite panel, composite bottom board is cleaned with alcohol, and with the single tube coupling of alcohol washes Dried after surface, removing stain standby;
D, scaling powder is sprayed for the first time:Take Nocolok powders to be configured to the scaling powder aqueous solution with water, the scaling powder aqueous solution is sprayed Being sprinkled upon composite panel, composite bottom board has on the surface of solder layer, and the scaling powder aqueous solution that Nocolok powders are configured to is a kind of Almost free from corrosion fluoride chemical substance, can be configured to a certain proportion of aqueous solution, be easy to be coated in the brazing surface of workpiece On, play oxide film dissolving, improve wetting and capillary flow effect after brazing filler metal melts, and postwelding residue will not be made to component Into damaging destruction, it is sprayed directly on solder layer, in welding, scaling powder can be merged preferably with solder, and raising is helped The using effect of solder flux, improves soldering effect;
E, clamping:The composite bottom board for having sprayed the scaling powder aqueous solution is lain in a horizontal plane in lower clamp, composite bottom board is combined The side for having solder layer upwards, is arranged in what single tube coupling obtained in step C or so connected on composite bottom board, single tube coupling The core bore formed after arrangement on cellular sandwich, the single pocket of single tube coupling inner chamber then for cellular sandwich, single tube coupling makes adjacent Pocket is communicated, and can be bonded, is fixed by glue between single tube coupling, then composite panel is placed into cellular sandwich top, Composite panel is compounded with the side of solder layer downwards, and upper fixture is placed into composite surface by composite panel, composite bottom board corner to it On plate, and upper fixture, lower clamp connection are locked with screw, obtain clamping part;
F, scaling powder is sprayed again:The scaling powder aqueous solution prepared in step D is sprayed on composite panel, honeycomb folder again At core, the abutted surface of composite bottom board, scaling powder is sprayed again, and the scaling powder layer abrasion caused in clamping process is supplemented, Ensure scaling powder covering solder layer, oxide-film is removed to solder layer, soldering effect is improved;
G, enter slice weldering:Processing first is dried in clamping part, using tunnel type drying equipment, clamping part is placed into dry On the transmission mechanism of dry equipment, clamping part is dried in running on tunnel type drying equipment in clamping part, carried out Streamlined is produced, 150-260 DEG C of drying temperature, dries duration 5-15min, and dried clamping part sends into continuous tunnel furnace formula gas shielded Soldering oven is carried out on soldering processing, the transmission crawler belt that dried clamping part is placed into tunnel type furnace brazing stove, clamping Part obtains no colloid cellular board behind the preheating zone of tunnel type furnace brazing stove, heating samming brazing area, cooling zone successively, in advance The heat temperature of hot-zone be 300 DEG C, preheat duration 10min, by clamping part force heat, be that soldering is prepared, heating samming pricker The temperature of weldering is 605 DEG C, soldering duration 15min, heating samming brazing area be passed through nitrogen and protected, the cooling side after soldering Formula is to use blower fan air blast cooling, cools down duration 20min, is come out of the stove after cooling close to room temperature, and modularization, flowing water are carried out to cellular board Line soldering produce, without using glue in life, environmental protection more, and improve cellular board bulk strength, panel, cellular sandwich, Bottom plate has in soldering integrally to be wrapped by fixture, during soldering, and fixture counter plate, the entirety of bottom plate are wrapped can be effective Suppress panel, the deformation of bottom plate, porous plate coordinates high temperature spring, and counter plate, bottom plate plate face carry out compacting tightly, both can guarantee that Clamped under high temperature in thickness direction, in-plane can be made to have certain flexible free degree again, plate face bulge can be avoided to show in soldering As, it is to avoid ftractureed at soldering, welded rate is substantially improved, compared to existing process, welded rate improves 70%-85%, and cellular board is overall Quality is improved significantly, and solder layer thickness is big, not only meets the soldering demand between cellular sandwich and panel, bottom plate, also portion Point penetrate into the joint of single pipe fitting of cellular sandwich, play welding in gap, so as to lift the entirety of soldering cellular board Rigidity;
It H, will obtain being removed from the molds without glue aluminum cellular board in step G, examine weld seam, panel, bottom deformation rate, Surface clean, the setting of surface protection coating are carried out after qualified to cellular board, the clamping marking of fixture is removed by Chemical cleaning, Set coating to make cellular board that there is more preferable rotproofness, improve surface quality.
The folder fixture that soldering oven in step G is further, described step E includes upper fixture, lower clamp, upper fixture Including upper bracket, upper porous plate, upper porous plate is fixed on upper bracket surface, and upper bracket is by upper square box, the friendship of upper square inframe Wrong cross tube is constituted, and lower clamp includes lower carriage, lower porous plate, and lower porous plate is fixed on lower support surface, upper porous plate, under Porous plate is relative up and down, lower carriage by lower square box, under square inframe staggeredly sheer pole constitute, upper square box, cross tube, Lower square box, sheer pole are the rectangular steel tube of Q235 carbon steels, upper porous plate, under the degree of porous thickness of slab be 3mm, material It is Q235 carbon steel, the relative face of upper porous plate, lower porous plate is provided with multiple equally distributed high temperature springs, upper square Frame, the side of lower square box four are equipped with the side lever stretched out, and side lever is provided with screw hole, and side lever is connected by screw lock up and down Tightly.
It is described above, be only presently preferred embodiments of the present invention, any formal limitation not done to the present invention, it is every according to According to any simple modification, equivalent variations made in technical spirit of the invention to above example, the guarantor of the present invention is each fallen within Within the scope of shield.

Claims (6)

1. the preparation technology without glue aluminum cellular board, it is characterised in that comprise the following steps:
A, prepare panel, bottom plate and cellular sandwich:Take aluminium sheet to cut into block standby, obtain panel, bottom plate, panel base plate thickness one Cause;Aluminium foil strip is taken to be fabricated to cellular sandwich by mechanization, cellular sandwich size coordinates with panel, base plate size;
B, prepare composite panel, composite bottom board:Solder layer is coated to the panel lower surface obtained in step, composite surface is obtained Plate, the plate upper surface that obtains in stepb is coated by solder layer, obtains composite bottom board, solder layer thickness and plate thickness it Than for 20:3;
C, welding pretreatment:With the composite panel, the surface of composite bottom board obtained in cleaning solvent cleaning B, and step A In the obtained surface of cellular sandwich, dried after cleaning;
D, scaling powder is sprayed for the first time:Scaling powder is sprayed to lower surface, the composite bottom board upper table of the composite panel after cleaning is dried Face;
E, clamping:By the composite bottom board upper table obtained in step D being placed on fixture up, the honeycomb that will be obtained in step C Sandwich row is located on composite bottom board upper surface, is placed in the composite panel lower surface obtained in step D is directed downwardly on cellular sandwich, Composite bottom board, cellular sandwich, composite panel corner are to it, and clamp obtains clamping part;
F, scaling powder is sprayed again:Cellular sandwich of the scaling powder brushing after clamping and composite panel, composite bottom board are connected At face;
G, enter slice weldering:Soldering oven soldering, preheated, heating samming pricker are sent into after clamping part drying after being handled through step F Weldering, cooling, obtain no glue aluminum cellular board;
H, to obtained in step G without glue aluminum cellular board carry out surface clean, set surface protection coating.
2. the preparation technology according to claim 1 without glue aluminum cellular board, it is characterised in that:In described step B Solder layer is that the scaling powder in the solder layer of Al-Si eutectic compositions, step D, F is to constitute pricker by Nocolok powderies brazing flux and water The agent aqueous solution.
3. the preparation technology according to claim 1 without glue aluminum cellular board, it is characterised in that:In described step G Soldering oven is continuous tunnel furnace formula furnace brazing stove, and the temperature of described heating samming soldering is 600 DEG C -610 DEG C, described cooling To be air-cooled.
4. the preparation technology according to claim 1 without glue aluminum cellular board, it is characterised in that:Described step E folder Fixture includes upper fixture, lower clamp, and upper fixture includes upper bracket, upper porous plate, and upper porous plate is fixed on upper bracket surface, upper branch Frame is made up of the cross tube staggeredly of upper square box, upper square inframe,
Lower clamp includes lower carriage, lower porous plate, and lower porous plate is fixed on above and below lower support surface, upper porous plate, lower porous plate Relatively, lower carriage by lower square box, under square inframe staggeredly sheer pole constitute, upper square box, cross tube, lower square box, Sheer pole is the rectangular steel tube of Q235 carbon steels, upper porous plate, under the degree of porous thickness of slab be 3mm, material is Q235 Carbon steel, the relative face of upper porous plate, lower porous plate be provided with multiple equally distributed high temperature springs, upper square box, under it is square The side of frame four is equipped with the side lever stretched out, and side lever is provided with screw hole, and side lever is connected by screw locking up and down.
5. the preparation technology according to claim 1 without glue aluminum cellular board, it is characterised in that:Described cross tube is upper Unbalanced arrangement inside square box.
6. the preparation technology according to claim 1 without glue aluminum cellular board, it is characterised in that:Institute in described step A Obtain panel, the size of bottom plate is 100cm*100cm.
CN201710451643.1A 2017-06-15 2017-06-15 Preparation process without glue aluminum honeycomb plate Active CN107297598B (en)

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Application Number Priority Date Filing Date Title
CN201710451643.1A CN107297598B (en) 2017-06-15 2017-06-15 Preparation process without glue aluminum honeycomb plate

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Application Number Priority Date Filing Date Title
CN201710451643.1A CN107297598B (en) 2017-06-15 2017-06-15 Preparation process without glue aluminum honeycomb plate

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CN107297598A true CN107297598A (en) 2017-10-27
CN107297598B CN107297598B (en) 2019-06-14

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CN108526638A (en) * 2018-04-16 2018-09-14 芜湖市泰能电热器具有限公司 A kind of application method of aluminium solder
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CN110732842A (en) * 2019-10-23 2020-01-31 佛山市桐立新材料科技有限公司 Preparation method of brazing aluminum honeycomb plate
CN110948188A (en) * 2019-12-20 2020-04-03 上海复合材料科技有限公司 High-precision honeycomb core processing method
CN111843098A (en) * 2020-07-23 2020-10-30 吉林大学 Clamp for brazing aluminum honeycomb panel and brazing process
CN113147107A (en) * 2021-03-09 2021-07-23 哈尔滨工业大学(威海) Honeycomb sandwich structure formed by C/C composite material and alloy and preparation method thereof
CN113733687A (en) * 2021-09-08 2021-12-03 河北工业大学 Manufacturing method of high-strength honeycomb composite board
CN114801409A (en) * 2022-04-26 2022-07-29 广州中樱汽车零部件有限公司 Production process of composite honeycomb board of automobile seat
CN116252019A (en) * 2023-04-18 2023-06-13 广东森铝科技有限公司 Clamp for brazing aluminum honeycomb plate for ship and brazing process

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CN108526638A (en) * 2018-04-16 2018-09-14 芜湖市泰能电热器具有限公司 A kind of application method of aluminium solder
CN108817638A (en) * 2018-07-25 2018-11-16 青岛归来科技有限公司 The preparation method of metal beehive core material and metal honeycomb plate
CN110732842A (en) * 2019-10-23 2020-01-31 佛山市桐立新材料科技有限公司 Preparation method of brazing aluminum honeycomb plate
CN110948188A (en) * 2019-12-20 2020-04-03 上海复合材料科技有限公司 High-precision honeycomb core processing method
CN111843098A (en) * 2020-07-23 2020-10-30 吉林大学 Clamp for brazing aluminum honeycomb panel and brazing process
CN111843098B (en) * 2020-07-23 2021-05-04 吉林大学 Clamp for brazing aluminum honeycomb panel and brazing process
CN113147107A (en) * 2021-03-09 2021-07-23 哈尔滨工业大学(威海) Honeycomb sandwich structure formed by C/C composite material and alloy and preparation method thereof
CN113733687A (en) * 2021-09-08 2021-12-03 河北工业大学 Manufacturing method of high-strength honeycomb composite board
CN114801409A (en) * 2022-04-26 2022-07-29 广州中樱汽车零部件有限公司 Production process of composite honeycomb board of automobile seat
CN116252019A (en) * 2023-04-18 2023-06-13 广东森铝科技有限公司 Clamp for brazing aluminum honeycomb plate for ship and brazing process
CN116252019B (en) * 2023-04-18 2023-09-15 广东森铝科技有限公司 Clamp for brazing aluminum honeycomb plate for ship and brazing process

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