CN107160747A - Without glue aluminum cellular board - Google Patents
Without glue aluminum cellular board Download PDFInfo
- Publication number
- CN107160747A CN107160747A CN201710454611.7A CN201710454611A CN107160747A CN 107160747 A CN107160747 A CN 107160747A CN 201710454611 A CN201710454611 A CN 201710454611A CN 107160747 A CN107160747 A CN 107160747A
- Authority
- CN
- China
- Prior art keywords
- honeycomb core
- panel
- cellular board
- bottom plate
- solder layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 230000001413 cellular effect Effects 0.000 title claims abstract description 49
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 239000003292 glue Substances 0.000 title claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 48
- 238000005476 soldering Methods 0.000 claims abstract description 24
- 239000000843 powder Substances 0.000 claims abstract description 19
- 238000005219 brazing Methods 0.000 claims description 21
- 239000005030 aluminium foil Substances 0.000 claims description 17
- 239000011148 porous material Substances 0.000 claims description 11
- 230000004907 flux Effects 0.000 claims description 10
- 239000007864 aqueous solution Substances 0.000 claims description 5
- 230000005496 eutectics Effects 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229910018125 Al-Si Inorganic materials 0.000 claims description 3
- 229910018520 Al—Si Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 30
- 230000000694 effects Effects 0.000 abstract description 14
- 230000007613 environmental effect Effects 0.000 abstract description 6
- 238000005507 spraying Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 7
- 238000005056 compaction Methods 0.000 description 6
- 241000256844 Apis mellifera Species 0.000 description 5
- 239000003344 environmental pollutant Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 231100000719 pollutant Toxicity 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention belongs to cellular board technical field, honeycomb core, panel, bottom plate specifically related to without glue aluminum cellular board, including aluminum, honeycomb core are arranged between panel, bottom plate, panel, the bottom plate medial surface relative with honeycomb core are compounded with solder layer, solder layer surface improves welding effect provided with scaling powder layer, honeycomb core upper and lower ends face correspondence and panel, bottom plate medial surface soldering connection, stabilized structure, it is pollution-free with preferable mechanical property, more meet environmental requirement.
Description
Technical field
The invention belongs to cellular board technical field, and in particular to without glue aluminum cellular board.
Background technology
Cellular board is because lightweight, specific strength is high, rigidity is big, stability is good, heat-and sound-insulating and pollution-free etc. a series of
Advantage, is used widely in the fields such as Aero-Space, aircraft, train, ship, building.It is common both at home and abroad at present
Either core is compound in itself or between panel and core for cellular board, is adhesive means, connected mode is physical bond,
Its intensity, service life and the working environment of permission are largely restricted by Adhensive performance.Such as in high humidity, shake
Under dynamic working environment frequent, too high or too low for temperature, the easy degumming of panel causes in use, to bear load remote
Reach far away failed using the yield limit of material, mechanical property is relatively low, structure built on the sand, moreover, gluing connection side
Pollution can be produced in formula reproduction, not environmentally.
The content of the invention
The technical problems to be solved by the invention are that there is provided without glue aluminum cellular board, stabilized structure, tool for drawbacks described above
There is preferable mechanical property, it is pollution-free, more meet environmental requirement.
The technical scheme that the present invention solves the use of its technical problem is as follows：
Honeycomb core, panel, bottom plate without glue aluminum cellular board, including aluminum, honeycomb core are arranged between panel, bottom plate, institute
Panel, the bottom plate the stated medial surface relative with honeycomb core are compounded with solder layer, and solder layer surface is provided with scaling powder layer, on honeycomb core
Lower both ends of the surface correspondence and panel, bottom plate medial surface soldering connection, the reliability of Welding are high, are difficult sealing-off, stable connection makes
Cellular board has more firm structure, and cellular board has preferable mechanical property, can used in harsh environments, expands
The application of cellular board, no gemel connection does not produce pollutant in production, more meet the requirement of environmental protection, and scaling powder layer is set
On solder surface, on the one hand it is easy to the operation of welding, the protectiveness of another aspect butt-welding fitting and solder is more preferable, it is to avoid weldment and pricker
Material is aoxidized in brazing process, improves welding effect.
Further, described solder layer is the solder layer of Al-Si eutectic compositions, and the solder composition of this kind of solder layer is equal
Even, solder cooling velocity is fast, and wetability, fusion zone is narrow, can reach the effect of transient melting, sprawls rapidly, improves welding
Intensity.
Further, described solder layer thickness is the 10%-20% of plate thickness, plate thickness and base plate thickness one
Cause, solder layer thickness sets reasonable, be in certain proportionate relationship with panel, base plate thickness, can not only be by honeybee after solder layer fusing
Gap between nest core and panel, bottom plate, which is filled up, realizes soldering connection, and can also have part penetrate into honeycomb core gap in
Welding is acted on, so as to lift the integral rigidity of soldering cellular board.
Further, described scaling powder layer is sprayed on solder layer surface, and spraying operation is convenient, can effectively remove solder layer
The oxide on surface, improves the wetting after brazing filler metal melts and capillary flow effect, and postwelding residue does not result in damage to component
Wound property it is broken.
Further, described scaling powder layer is to constitute the brazing flux aqueous solution by Nocolok powderies brazing flux and water, corrosion-free
Property, improve soldering effect, it is to avoid butt-welding fitting, weld cause corrosion.
Further, described honeycomb core is compressing by aluminium foil strip, is easy to the manufacturing of honeycomb core, meanwhile, make honeybee
The more lightweight of nest core.
Further, honeycomb core is connected by multiple pockets or so and constituted, and the cross section of pocket is circle, and pocket wall is provided with
Lumen pore, lumen pore makes adjacent pocket intercommunication.
Further, the brazing temperature of soldering connection is 604 DEG C -615 DEG C, and brazing temperature is interval rationally, it is ensured that soldering is imitated
While fruit, maximized reduction panel, the thermal deformation of bottom plate improve the molding effect of cellular board, make cellular board surfacing.
Further, described panel, on bottom plate medial surface correspondence with being provided with indenture at honeycomb core upper and lower side soldering.
The beneficial effects of the invention are as follows：Using such scheme, soldering connection between panel, bottom plate and honeycomb core, no glue, production
In do not produce pollutant, more environmentally friendly, connection reliability is high, improves the structural strength and mechanical property of formed honeycomb plate, honeycomb
Plate body construction is consolidated, and meets the use requirement in severe rugged environment, the use scope of cellular board of expansion, and reliable is connected
Connecing property extends the service life of cellular board.
Brief description of the drawings
By detailed description below in conjunction with the accompanying drawings, the present invention is foregoing will to be become with other objects, features and advantages
Obviously.
Fig. 1 be the present invention be welding before section view.
Fig. 2 is the structural representation of pocket in the embodiment of the present invention 1.
Fig. 3 is unwelded preceding schematic cross-section at indenture on panel of the present invention.
Fig. 4 is the schematic cross-section after being welded on panel of the present invention at indenture.
Fig. 5 is the elevational schematic view of panel in the embodiment of the present invention 1.
Fig. 6 is the elevational schematic view of panel in the embodiment of the present invention 2.
Fig. 7 is the cross section structure schematic diagram at connecting pole in the embodiment of the present invention 2.
Fig. 8 is the cross section structure schematic diagram at connecting pole in the embodiment of the present invention 3
Wherein：1 is panel, and 2 be honeycomb core, and 21 be pocket, and 22 be lumen pore, and 3 be bottom plate, and 4 be solder layer, and 5 be scaling powder
Layer, 6 be connecting pole, and 7 be indenture.
Embodiment
The present invention will be further described below in conjunction with the accompanying drawings.
Embodiment 1：Referring to figs. 1 to Fig. 5, no glue aluminum cellular board includes honeycomb core 2, panel 1, the bottom plate 3, honeybee of aluminum
Nest core 2 is arranged between panel 1, bottom plate 3, from 1mm thickness, the panel 1 of 3003 antirust aluminium materials, bottom plate 3, panel 1, bottom plate 3
The medial surface connected with honeycomb core 2 is compounded with the solder layer 4 of 0.15mm thickness, and panel, the solder layer thickness of bottom plate are 15%,
3003 rustproof aluminum alloys have excellent deformation processing and brazing property, also with good corrosion resistance, and solder layer selects 400 model Al-
The solder of Si eutectic compositions, the surface spraying scaling powder layer 5 of solder layer 4, scaling powder layer 5 is by Nocolok powderies brazing flux and water structure
Into the brazing flux aqueous solution, non-corrosiveness, the operation of spraying is convenient, and spraying is uniform, sprays before welding, honeycomb core 2 is by multiple pockets
21 or so connect composition, and the cross section of pocket 21 is circle, and pocket wall is provided with lumen pore 22, and lumen pore 22 makes adjacent pocket 21 mutual
Logical, honeycomb core is compressing by aluminium foil strip, corrugated through mechanical compaction preliminary working from below thickness 0.1mm aluminium foil strip
Or S shapes, then the aluminium foil strip after preliminary working being assembled into through mechanical compaction cellular, pocket is enclosed by the warp architecture of aluminium foil strip
Into, it is easy to the manufacturing of honeycomb core 2, meanwhile, make the more lightweight of honeycomb core 2, promote the lifting of cellular board overall performance,
Panel 1, the inner side edge of bottom plate 3 are provided with cellular indenture 7, and indenture 7 is connected by single collar marks to be constituted, the shape of indenture 7 and nest
Cavity wall top, bottom are agreed with, and indenture 7 is inside arc-shaped recess, and the depth 0.03mm of indenture 7, the depth of indenture 7 sets reasonable, and
During cooperation, the clearance requirement between weldment is disclosure satisfy that, during welding, by between the sandwiched panel 1 of honeycomb core 2, bottom plate 3, panel 1, bottom plate 3
Between indenture 7 and honeycomb core 2 it is relative, the width of indenture 7 agrees with pocket wall, the mountain end portion of pocket 21 is embedded in indenture 7, puts
Enter in welding equipment, set 605 DEG C of welding temperature, weld 10min, the reliability of Welding is high, is difficult sealing-off, makes cellular board
With more firm structure, indenture 7 further enhances the welding effect between honeycomb core 2 and panel 1, bottom plate 3, and solder layer 4 melts
Quickly entered after change at indenture 7, the gap that can be adequately filled up between honeycomb core 2 and panel 1, bottom plate 2 is filled out, and at indenture 7
The parcel shape structure of parcel pocket end is formed, strengthens soldering strength, the thickness ratio setting of solder layer 4 and panel 1, bottom plate 3 is closed
Reason, on the premise of soldering strength is ensured, moreover it is possible to there is part to penetrate into the gap of the aluminium foil interband of honeycomb core 2 and play welding,
Structural soundness is improved, so as to lift the integral rigidity of soldering cellular board, makes the cellular board after shaping that there is preferable mechanics
Performance, can be used in harsh environments, expand the application of cellular board, and scaling powder layer 5 can effectively remove solder layer
The oxide on surface, improves the wetting after brazing filler metal melts and capillary flow effect, and postwelding residue does not result in damage to component
Wound property it is broken, no gemel connection does not produce pollutant in production, more meet the requirement of environmental protection.
Embodiment 2：Referring to figs. 1 to Fig. 7, no glue aluminum cellular board includes honeycomb core 2, panel 1, the bottom plate 3, honeybee of aluminum
Nest core 2 is arranged between panel 1, bottom plate 3, from 2mm thickness, the panel 1 of 3003 antirust aluminium materials, bottom plate 3, panel 1, bottom plate 3
The medial surface connected with honeycomb core 2 is compounded with the solder layer 4 of 0.14mm thickness, and the upper and lower surface of honeycomb core 2 is equally compounded with
Solder layer 4 thick 0.14mm, strengthening the rustproof aluminum alloy of soldering effect 3003 has excellent deformation processing and brazing property, also with good
Good corrosion resistance, solder layer selects the solder of 400 model Al-Si eutectic compositions, the surface spraying scaling powder layer 5 of solder layer 4, scaling powder
Layer 5 is to constitute the brazing flux aqueous solution by Nocolok powderies brazing flux and water, and non-corrosiveness, the operation of spraying is convenient, and spraying is uniform,
Before welding by scaling powder spraying on panel 1, bottom plate 3, the solder side of honeycomb core 2, honeycomb core 2 is connected by multiple pockets 21 or so
Constitute, pocket 21 is regular hexagon, pocket wall is provided with lumen pore 22, and lumen pore 22 makes the adjacent intercommunication of pocket 21, and honeycomb core is by aluminium foil
With compressing, from below thickness 0.08mm aluminium foil strip, through mechanical compaction preliminary working into a bent shape, then by after preliminary working
Aluminium foil strip is assembled into hexagonal honeycomb shape through mechanical compaction, and pocket is surrounded by the warp architecture of aluminium foil strip, is easy to honeycomb core 2
Manufacture, meanwhile, make the more lightweight of honeycomb core 2, promote the lifting of cellular board overall performance, panel 1, the inner side of bottom plate 3
Side is provided with the indenture 7 of hexagonal honeycomb shape, and the shape of indenture 7 is agreed with pocket wall top, bottom, and indenture 7 is recessed for inside arc
Fall into, the depth 0.02mm of indenture 7, it is reasonable that the depth of indenture 7 is set, and when coordinating, disclosure satisfy that the clearance requirement between weldment, panel 1,
Connecting pole 6 is uniformly provided between bottom plate 3, the one end of connecting pole 6 is welded with the internal face of bottom plate 3, soldering connection between the other end and panel 1,
The height of connecting pole 6 and honeycomb core 2 are highly consistent, and connecting pole 6 is arranged in pocket 21, before welding, and connecting pole 6 is first welded on into bottom
On plate 3, then honeycomb core 2 is positioned on bottom plate 3, then panel 1 is positioned on honeycomb core 2, the indenture 7 between panel 1, bottom plate 3
Relative with honeycomb core 2, using clamp, the width of indenture 7 agrees with pocket wall, makes the mountain end portion insertion indenture 7 of pocket 21
It is interior, it is put into welding equipment, sets 605 DEG C of welding temperature, weld 10min, the reliability of Welding is high, is difficult sealing-off, makes
Cellular board has more firm structure, and indenture 7 further enhances the welding effect between honeycomb core 2 and panel 1, bottom plate 3, solder
Quickly entered after the fusing of layer 4 at indenture 7, the gap that can be adequately filled up between honeycomb core 2 and panel 1, bottom plate 2 is filled out, and recessed
The parcel shape structure of parcel pocket end is formed at trace 7, strengthens soldering strength, between the one side reinforced panel of connecting pole 6, bottom plate
Connectivity, while strengthen to the supportive of honeycomb core counter plate, bottom plate, can suppress at panel, bottom deformation, especially pocket pair
Panel, the bottom deformation answered, improve cellular board molding effect, and the thickness ratio setting of solder layer 4 and panel 1, bottom plate 3 is reasonable,
On the premise of ensureing soldering strength, moreover it is possible to there is part to penetrate into the gap of the aluminium foil interband of honeycomb core 2 and play welding, improve
Structural soundness, so as to lift the integral rigidity of soldering cellular board, makes the cellular board after shaping have preferable mechanical property, energy
It is enough to use in harsh environments, the application of cellular board is expanded, scaling powder layer 5 can effectively remove the oxygen of solder layer surface
Compound, improves the wetting after brazing filler metal melts and capillary flow effect, and postwelding residue component is not resulted in it is damaging broken,
Without gemel connection, pollutant is not produced in production, more meets the requirement of environmental protection.
Embodiment 3：Referring to figs. 1 to Fig. 8, no glue aluminum cellular board includes honeycomb core 2, panel 1, the bottom plate 3, honeybee of aluminum
Nest core 2 is arranged between panel 1, bottom plate 3, from 1mm thickness, the panel 1 of 3003 antirust aluminium materials, bottom plate 3, panel 1, bottom plate 3
The medial surface connected with honeycomb core 2 is compounded with the solder layer 4 of 0.15mm thickness, and panel, the solder layer thickness of bottom plate are 15%,
3003 rustproof aluminum alloys have excellent deformation processing and brazing property, also with good corrosion resistance, and solder layer selects 400 model Al-
The solder of Si eutectic compositions, the surface spraying scaling powder layer 5 of solder layer 4, scaling powder layer 5 is by Nocolok powderies brazing flux and water structure
Into the brazing flux aqueous solution, non-corrosiveness, the operation of spraying is convenient, and spraying is uniform, sprays before welding, honeycomb core 2 is by multiple pockets
21 or so connect composition, and the cross section of pocket 21 is circle, and pocket wall is provided with lumen pore 22, and lumen pore 22 makes adjacent pocket 21 mutual
Logical, honeycomb core is compressing by aluminium foil strip, corrugated through mechanical compaction preliminary working from below thickness 0.1mm aluminium foil strip
Or S shapes, then the aluminium foil strip after preliminary working being assembled into through mechanical compaction cellular, pocket is enclosed by the warp architecture of aluminium foil strip
Into, it is easy to the manufacturing of honeycomb core 2, meanwhile, make the more lightweight of honeycomb core 2, promote the lifting of cellular board overall performance,
Panel 1, the inner side edge of bottom plate 3 are provided with cellular indenture 7, and indenture 7 is connected by single collar marks to be constituted, the shape of indenture 7 and nest
Cavity wall top, bottom are agreed with, and indenture 7 is inside arc-shaped recess, and the depth 0.03mm of indenture 7, the depth of indenture 7 sets reasonable, and
During cooperation, the clearance requirement between weldment is disclosure satisfy that, columned connecting pole 6, connecting pole 6 are uniformly provided between panel 1, bottom plate 3
Upper and lower side is boss structure, and bottom boss face is welded with the internal face of bottom plate 3, soldering connection between upper end boss face and panel 1, even
Connect the height of post 6 and honeycomb core 2 is highly consistent, connecting pole 6 is arranged in pocket 21, before welding, and connecting pole 6 is first welded on into bottom plate
On 3, then honeycomb core 2 is positioned on bottom plate 3, then panel 1 is positioned on honeycomb core 2, the indenture 7 between panel 1, bottom plate 3 with
Honeycomb core 2 is relative, and using clamp, the width of indenture 7 agrees with pocket wall, makes in the mountain end portion insertion indenture 7 of pocket 21,
It is put into welding equipment, sets 605 DEG C of welding temperature, weld 10min, the reliability of Welding is high, is difficult sealing-off, makes honeycomb
Plate has more firm structure, and connecting pole 6 is two ends closure, the structure of internal cavities, rises and strengthens connection and strengthen internal
Mitigate weight while supporting role, indenture 7 further enhances the welding effect between honeycomb core 2 and panel 1, bottom plate 3, solder layer
Quickly entered after 4 fusings at indenture 7, the gap that can be adequately filled up between honeycomb core 2 and panel 1, bottom plate 2 is filled out, and in indenture 7
Place forms the parcel shape structure of parcel pocket end, strengthens soldering strength, and the thickness ratio of solder layer 4 and panel 1, bottom plate 3 is set
Rationally, on the premise of soldering strength is ensured, moreover it is possible to there is part to penetrate into the gap of the aluminium foil interband of honeycomb core 2 and play welding work
With improving structural soundness, so as to lift the integral rigidity of soldering cellular board, make the cellular board after shaping that there is preferable power
Performance is learned, can be used in harsh environments, the application of cellular board is expanded, scaling powder layer 5 can effectively remove solder
The oxide of layer surface, improves the wetting after brazing filler metal melts and capillary flow effect, and postwelding residue is not resulted in component
Damaging is broken, and no gemel connection does not produce pollutant in production, more meets the requirement of environmental protection.
It is described above, be only presently preferred embodiments of the present invention, any formal limitation not done to the present invention, it is every according to
According to any simple modification, equivalent variations made in technical spirit of the invention to above example, the guarantor of the present invention is each fallen within
Within the scope of shield.
Claims (9)
1. honeycomb core, panel, bottom plate without glue aluminum cellular board, including aluminum, honeycomb core are arranged between panel, bottom plate, it is special
Levy and be：Described panel, the bottom plate medial surface relative with honeycomb core are compounded with solder layer, and solder layer surface is provided with scaling powder
Layer, honeycomb core upper and lower ends face correspondence and panel, bottom plate medial surface soldering connection.
2. it is according to claim 1 without glue aluminum cellular board, it is characterised in that：Described solder layer be Al-Si eutectics into
The solder layer divided.
3. it is according to claim 1 without glue aluminum cellular board, it is characterised in that：Described solder layer thickness is plate thickness
10%-20%, plate thickness is consistent with base plate thickness.
4. it is according to claim 1 without glue aluminum cellular board, it is characterised in that：Described scaling powder layer is sprayed on solder layer
Surface.
5. according to claim 1,4 any one without glue aluminum cellular board, it is characterised in that：Described scaling powder layer is
The brazing flux aqueous solution is constituted by Nocolok powderies brazing flux and water.
6. it is according to claim 1 without glue aluminum cellular board, it is characterised in that：Described honeycomb core is pressed into by aluminium foil strip
Type.
7. it is according to claim 1 without glue aluminum cellular board, it is characterised in that：Honeycomb core is connected structure by multiple pockets or so
Into the cross section of pocket is circle, and pocket wall is provided with lumen pore, and lumen pore makes adjacent pocket intercommunication.
8. it is according to claim 1 without glue aluminum cellular board, it is characterised in that：The brazing temperature of soldering connection be 604 DEG C-
615℃。
9. it is according to claim 1 without glue aluminum cellular board, it is characterised in that：It is right on described panel, bottom plate medial surface
Should be with being provided with indenture at honeycomb core upper and lower side soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710454611.7A CN107160747A (en) | 2017-06-15 | 2017-06-15 | Without glue aluminum cellular board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710454611.7A CN107160747A (en) | 2017-06-15 | 2017-06-15 | Without glue aluminum cellular board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107160747A true CN107160747A (en) | 2017-09-15 |
Family
ID=59818746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710454611.7A Pending CN107160747A (en) | 2017-06-15 | 2017-06-15 | Without glue aluminum cellular board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107160747A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108526638A (en) * | 2018-04-16 | 2018-09-14 | 芜湖市泰能电热器具有限公司 | A kind of application method of aluminium solder |
| CN110732842A (en) * | 2019-10-23 | 2020-01-31 | 佛山市桐立新材料科技有限公司 | Preparation method of brazing aluminum honeycomb plate |
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|---|---|---|---|---|
| JPH05305426A (en) * | 1992-04-23 | 1993-11-19 | Sumitomo Light Metal Ind Ltd | Manufacture of brazed honeycomb panel |
| CN101579766A (en) * | 2009-06-08 | 2009-11-18 | 昆明理工大学 | Preparation method of braze welding type metal honeycomb plate |
| CN203654600U (en) * | 2014-01-08 | 2014-06-18 | 姬立志 | Novel honeycomb building plate material |
| CN105437645A (en) * | 2015-12-04 | 2016-03-30 | 张跃 | Metal cellular board for building structure |
| CN207291132U (en) * | 2017-06-15 | 2018-05-01 | 江苏晟兴和金属板业有限公司 | Without glue aluminum cellular board |
-
2017
- 2017-06-15 CN CN201710454611.7A patent/CN107160747A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05305426A (en) * | 1992-04-23 | 1993-11-19 | Sumitomo Light Metal Ind Ltd | Manufacture of brazed honeycomb panel |
| CN101579766A (en) * | 2009-06-08 | 2009-11-18 | 昆明理工大学 | Preparation method of braze welding type metal honeycomb plate |
| CN203654600U (en) * | 2014-01-08 | 2014-06-18 | 姬立志 | Novel honeycomb building plate material |
| CN105437645A (en) * | 2015-12-04 | 2016-03-30 | 张跃 | Metal cellular board for building structure |
| CN207291132U (en) * | 2017-06-15 | 2018-05-01 | 江苏晟兴和金属板业有限公司 | Without glue aluminum cellular board |
Cited By (2)
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| CN108526638A (en) * | 2018-04-16 | 2018-09-14 | 芜湖市泰能电热器具有限公司 | A kind of application method of aluminium solder |
| CN110732842A (en) * | 2019-10-23 | 2020-01-31 | 佛山市桐立新材料科技有限公司 | Preparation method of brazing aluminum honeycomb plate |
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