CN107295748B - 贴片、热压自动互换平台装置 - Google Patents
贴片、热压自动互换平台装置 Download PDFInfo
- Publication number
- CN107295748B CN107295748B CN201710416297.3A CN201710416297A CN107295748B CN 107295748 B CN107295748 B CN 107295748B CN 201710416297 A CN201710416297 A CN 201710416297A CN 107295748 B CN107295748 B CN 107295748B
- Authority
- CN
- China
- Prior art keywords
- hot pressing
- cushion cap
- favourable turn
- patch
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Press Drives And Press Lines (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710416297.3A CN107295748B (zh) | 2017-06-06 | 2017-06-06 | 贴片、热压自动互换平台装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710416297.3A CN107295748B (zh) | 2017-06-06 | 2017-06-06 | 贴片、热压自动互换平台装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107295748A CN107295748A (zh) | 2017-10-24 |
CN107295748B true CN107295748B (zh) | 2019-04-23 |
Family
ID=60094252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710416297.3A Active CN107295748B (zh) | 2017-06-06 | 2017-06-06 | 贴片、热压自动互换平台装置 |
Country Status (1)
Country | Link |
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CN (1) | CN107295748B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107846835B (zh) * | 2017-10-27 | 2024-01-09 | 东莞东聚电子电讯制品有限公司 | 一种带加热功能的贴片装置 |
CN113895133B (zh) * | 2021-10-18 | 2023-06-13 | 珠海奔彩电子股份有限公司 | 芯片贴合机及芯片贴合机的贴膜方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000043193A (ja) * | 1998-07-27 | 2000-02-15 | Matsushita Electric Works Ltd | 積層板の製造方法 |
JP2004012231A (ja) * | 2002-06-05 | 2004-01-15 | Ibiden Engineering Kk | プリント配線板通電検査治具の検査装置 |
US7089160B2 (en) * | 2002-01-08 | 2006-08-08 | International Business Machines Corporation | Model for modifying drill data to predict hole locations in a panel structure |
CN203884083U (zh) * | 2014-04-28 | 2014-10-15 | 广州超音速自动化科技有限公司 | 柔性电路板的补强贴合装置 |
CN204603193U (zh) * | 2015-05-14 | 2015-09-02 | 信丰迅捷兴电路科技有限公司 | 印刷电路板对位铆合承载装置 |
CN105744755A (zh) * | 2016-03-22 | 2016-07-06 | 中南林业科技大学 | 一种中型电子元件贴插作业头及其贴插方法 |
-
2017
- 2017-06-06 CN CN201710416297.3A patent/CN107295748B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000043193A (ja) * | 1998-07-27 | 2000-02-15 | Matsushita Electric Works Ltd | 積層板の製造方法 |
US7089160B2 (en) * | 2002-01-08 | 2006-08-08 | International Business Machines Corporation | Model for modifying drill data to predict hole locations in a panel structure |
JP2004012231A (ja) * | 2002-06-05 | 2004-01-15 | Ibiden Engineering Kk | プリント配線板通電検査治具の検査装置 |
CN203884083U (zh) * | 2014-04-28 | 2014-10-15 | 广州超音速自动化科技有限公司 | 柔性电路板的补强贴合装置 |
CN204603193U (zh) * | 2015-05-14 | 2015-09-02 | 信丰迅捷兴电路科技有限公司 | 印刷电路板对位铆合承载装置 |
CN105744755A (zh) * | 2016-03-22 | 2016-07-06 | 中南林业科技大学 | 一种中型电子元件贴插作业头及其贴插方法 |
Also Published As
Publication number | Publication date |
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CN107295748A (zh) | 2017-10-24 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Longgang District of Shenzhen City, Guangdong province 518000 Cui Lu 28 SEG Navigation Technology Park 2 4 floor Applicant after: Shenzhen city public Intelligent Technology Co Ltd Address before: Longgang District of Shenzhen City, Guangdong province 518000 Cui Lu 28 SEG Navigation Technology Park 2 4 floor Applicant before: Shenzhen city public Intelligent Automation Co. Ltd. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 518000, 4 floor, manufacturing center, SEG navigation science and Technology Park, 28 Cui Bao Road, Longgang City, Longgang District, Shenzhen, Guangdong. Applicant after: Shenzhen City flag public intelligence technology Co., Ltd. Address before: 518000 4 building, 2 navigation technology park, 28 Cui Bao Road, Longgang District, Shenzhen, Guangdong Applicant before: Shenzhen City flag public intelligence technology Co., Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200116 Address after: Unit 1501, Rongchao Xincheng building, No.52 Ruyi Road, Longcheng street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Shiyi Electronic Co., Ltd Address before: 518000, 4 floor, manufacturing center, SEG navigation science and Technology Park, 28 Cui Bao Road, Longgang City, Longgang District, Shenzhen, Guangdong. Patentee before: Shenzhen City flag public intelligence technology Co., Ltd. |