CN107278058A - One kind is used for printed wiring board buried via hole, the copper-plated technique of blind hole filling perforation - Google Patents
One kind is used for printed wiring board buried via hole, the copper-plated technique of blind hole filling perforation Download PDFInfo
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- CN107278058A CN107278058A CN201610218518.1A CN201610218518A CN107278058A CN 107278058 A CN107278058 A CN 107278058A CN 201610218518 A CN201610218518 A CN 201610218518A CN 107278058 A CN107278058 A CN 107278058A
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- Prior art keywords
- copper
- filling perforation
- blind hole
- buried via
- via hole
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention provides a kind of for printed wiring board buried via hole, blind hole filling perforation copper-plating technique, and 1) buried via hole, blind hole filling perforation copper-plating technique are included after copper electroplating groove working solution completely discharge, are rinsed well with running water；2) continue to use deionized water wash cycles；3) the filling perforation copper plating agent aqueous solution is added to copper electroplating groove；4) heating copper electroplating groove is to 22 25 DEG C；5) cycle filter pump is started；6) printed wiring board for treating electroless copper is inserted in the filling perforation copper plating agent aqueous solution；7) using the 2.5A/dm of current density 1.52Electroplated；And 8) printed wiring board, running water cleaning, hot blast drying are taken out.Buried via hole, blind hole, can be fully filled with by buried via hole, the blind hole filling perforation copper-plating technique of the present invention by way of electro-coppering, so as to improve buried via hole, the conducting of blind hole height, high reliability request, production process is pollution-free, is adapted to industrialized production.
Description
Technical field
The invention belongs to printed wiring board processing technique field, specifically, it is related to a kind of for printed wiring board buried via hole, the copper-plated technique of blind hole filling perforation.
Background technology
Buried via hole since printed wiring board high density duplex technology develops, most of blind hole is after electroless copper, to pass through blind hole copper facing → filling holes with resin → belt-sanding → plating buried via hole face copper → pressing, the single order blind hole that totally four processes could be completed, complete second order, three ranks, quadravalence is stacked, then need that aforementioned four process is repeated, it is which kind of is various to well imagine process, cost is height how, process-cycle is length how, moreover filling not full and causing quality defect occur often in resin filling perforation, serious meeting causes substantial amounts of scrap, this is also high stacking buried via hole, blind hole printed wiring board high processing costs, scrappage height (typically all 3% or so), process-cycle is long, therefore it is badly in need of a kind of new technique to solve the above problems.
The content of the invention
In order to solve above-mentioned the deficiencies in the prior art part, it is used for printed wiring board buried via hole, blind hole filling perforation copper-plating technique it is an object of the invention to provide one kind, to replace past resin landfill hole, blind hole technology, and because process that resin filling perforation is brought is various, process-cycle length, high processing costs and/or scrappage height etc., meet buried via hole, the high conducting of blind hole, high reliability, efficient production requirement.
To achieve these goals, it is used for printed wiring board buried via hole, blind hole filling perforation copper-plating technique the invention provides one kind, it is characterised in that the buried via hole, blind hole filling perforation copper-plating technique comprise the following steps：1) by after copper electroplating groove working solution completely discharge, rinsed well with running water；2) continue to use deionized water wash cycles；3) the filling perforation copper plating agent aqueous solution is added to copper electroplating groove, the filling perforation copper plating agent includes sulfuric acid, copper sulphate, hydrochloric acid, sodium polydithio-dipropyl sulfonate, that strong green and EPE2900；4) heating copper electroplating groove is to 22-25 DEG C；5) cycle filter pump is started；6) printed wiring board for treating electroless copper is inserted in the filling perforation copper plating agent aqueous solution；7) using current density 1.5-2.5A/dm2Electroplated；And 8) printed wiring board, running water cleaning, hot blast drying are taken out.
Further illustrated as to buried via hole of the present invention, blind hole filling perforation copper-plating technique, preferably, sulfuric acid is every liter 55-65 milliliters, copper sulphate is every liter 200-220 grams, hydrochloric acid is every liter 0.2-0.3 milliliters, sodium polydithio-dipropyl sulfonate is every liter 0.005-0.007 grams, and it is every liter 0.003-0.005 milliliters to be good for that green, and EPE2900 is every liter 0.1-0.3 milliliters.
Further illustrated as to buried via hole of the present invention, blind hole filling perforation copper-plating technique, it is preferable that the triblock polymer that the EPE2900 is made up of oxirane ED and expoxy propane PD.
Further illustrated as to buried via hole of the present invention, blind hole filling perforation copper-plating technique, it is preferable that the pH of the filling perforation copper plating agent aqueous solution<2, proportion is 1.20-1.25g/cm3。
Further illustrated as to buried via hole of the present invention, blind hole filling perforation copper-plating technique, it is preferable that step 2) in, the time of the deionized water cleaning is 30 minutes.
Further illustrated as to buried via hole of the present invention, blind hole filling perforation copper-plating technique, it is preferable that step 7) in, the time of the plating is 48-80 minutes.
Further illustrated as to buried via hole of the present invention, blind hole filling perforation copper-plating technique, it is preferable that step 8) in, the time of the running water cleaning is 1-2 minutes.
Further illustrated as to buried via hole of the present invention, blind hole filling perforation copper-plating technique, it is preferable that step 8) in, the temperature of the hot blast drying is 70-80 DEG C, and the time of the hot blast drying is 4-6 minutes.
Buried via hole, the blind hole filling perforation copper-plating technique of the present invention has the advantages that：(1) this procedure is only needed just to enter pressing working procedure using filling perforation copper facing, compared with resin filling perforation (plating blind hole → filling holes with resin → belt-sanding → plating buried via hole face copper) four procedures of need are allowed for access pressing working procedure, processing time is shortened, production efficiency is improved.(2) the not full quality defect of resin filling perforation can be solved the problems, such as, scrappage is reduced to 0.03% by original 3%.(3) can prevent the copper plating bath in copper facing caused by the bad closure in blind hole aperture accompany including situation occur, can more reduce in solder joint solder because cavity formed by blowing.(4) filling perforation copper facing can be completed disposably with electrically interconnection.(5) compared with resin filling perforation, the copper-plated reliability of blind hole filling perforation is higher.(6) blind hole filling perforation copper facing can not only be accomplished to pad the welding of interior blind hole, can also be by the way of folded hole up and down, to substitute the through hole between part level or holostrome time.(7) blind hole filling perforation copper facing is due to being that plating metallic copper fills up buried via hole, in the hole of blind hole space, therefore, it is possible to carry powerful electric property.(8) raw material sources are wide, and cheap, cost is low, and production process is pollution-free, therefore is with a wide range of applications in printed wiring board field.
Embodiment
In order that auditor can further appreciate that structure, feature and the other purposes of the present invention, as follows in conjunction with appended preferred embodiment detailed description, appended preferred embodiment is merely to illustrate technical scheme, and the non-limiting present invention.
Embodiment 1
First copper electroplating groove working solution is discharged completely, and rinsed well with running water；Then deionized water wash cycles are used 30 minutes.After the completion of cleaning, configure 1 liter of filling perforation copper plating agent aqueous solution, wherein, filling perforation copper plating agent include 55 milliliters of sulfuric acid, 200 grams of copper sulphate, 0.2 milliliter of hydrochloric acid, 0.005 gram of SPS (sodium polydithio-dipropyl sulfonate), 0.1 milliliter of EPE2900 (triblock polymer being made up of oxirane ED and expoxy propane PD), be good for that green 0.003 milliliter, the pH of the filling perforation copper plating agent aqueous solution is 1, and proportion is 1.20g/cm3.1 liter of filling perforation copper plating agent aqueous solution is added to copper electroplating groove, heating copper electroplating groove is to 22 DEG C.Start cycle filter pump, the printed wiring board for treating electroless copper is inserted in the filling perforation copper plating bath；Using current density 2.0A/dm2Electroplated, after 60 minutes, take out printed wiring board, running water is cleaned 1 minute；Last 70 DEG C of hot blasts are dried up for 4 minutes.
From experimental result it can be seen that：The technique makes buried via hole, the space in hole are fully filled with by way of electro-coppering, to improve high conducting, high reliability and the highdensity requirement (referring to table 1, the relevant parameter that different blind hole aperture/blind hole hole depths influence on blind hole copper facing filling rate is listed in table 1) of printed wiring board interconnection.In addition, being reduced to 0.03% by original 3% through statistics scrappage.
Table 1
Embodiment 2
First copper electroplating groove working solution is discharged completely, and rinsed well with running water；Then deionized water wash cycles are used 30 minutes.After the completion of cleaning, configure 1 liter of filling perforation copper plating agent aqueous solution, wherein, filling perforation copper plating agent includes 65 milliliters of sulfuric acid, 220 grams of copper sulphate, 0.3 milliliter of hydrochloric acid, 0.007 gram of SPS (sodium polydithio-dipropyl sulfonate), 0.2 milliliter of EPE2900 (triblock polymer being made up of oxirane ED and expoxy propane PD), that strong green 0.005 milliliter filling perforation copper plating bath, the pH of the filling perforation copper plating agent aqueous solution is 1.3, and proportion is 1.23g/cm3.1 liter of filling perforation copper plating agent aqueous solution is added to copper electroplating groove, heating copper electroplating groove is to 25 DEG C.Start cycle filter pump, the printed wiring board for treating electroless copper is inserted in the filling perforation copper plating bath；Using current density 2.5A/dm2Electroplated, after 48 minutes, take out printed wiring board, running water is cleaned 2 minutes；Last 80 DEG C of hot blasts are dried up for 6 minutes.
From experimental result it can be seen that：The technique makes buried via hole, the space in hole are fully filled with by way of electro-coppering, to improve high conducting, high reliability and the highdensity requirement of printed wiring board interconnection, (referring to table 2, the relevant parameter that different blind hole aperture/blind hole hole depths influence on blind hole copper facing filling rate is listed in table 2).In addition, being reduced to 0.03% by original 3% through statistics scrappage.
Table 2
Embodiment 3
First copper electroplating groove working solution is discharged completely, and rinsed well with running water；Then deionized water wash cycles are used 30 minutes.After the completion of cleaning, configure 1 liter of filling perforation copper plating agent aqueous solution, wherein, filling perforation copper plating agent includes 60 milliliters of sulfuric acid, 210 grams of copper sulphate, 0.25 milliliter of hydrochloric acid, 0.3 milliliter of 0.006 gram of SPS (sodium polydithio-dipropyl sulfonate), EPE2900 (triblock polymer being made up of oxirane ED and expoxy propane PD), is good for that green 0.004 milliliter filling perforation copper plating bath, the pH of the filling perforation copper plating agent aqueous solution is 1.9, and proportion is 1.25g/cm3.1 liter of filling perforation copper plating agent aqueous solution is added to copper electroplating groove, heating copper electroplating groove is to 23 DEG C.Start cycle filter pump, the printed wiring board for treating electroless copper is inserted in the filling perforation copper plating bath；Using current density 1.5A/dm2Electroplated, after 80 minutes, take out printed wiring board, running water is cleaned 1.5 minutes；Last 75 DEG C of hot blasts are dried up for 5 minutes.
From experimental result it can be seen that：The technique makes buried via hole, the space in hole are fully filled with by way of electro-coppering, to improve high conducting, high reliability and the highdensity requirement of printed wiring board interconnection, scrappage is reduced to 0.03% (referring to table 3, the relevant parameter that different blind hole aperture/blind hole hole depths influence on blind hole copper facing filling rate is listed in table 3) by original 3%.In addition, being reduced to 0.03% by original 3% through statistics scrappage.
Table 3
In addition, through statistics, scrappage is reduced to 0.03% by original 3%.
It is to be understood that, foregoing invention content and embodiment are intended to prove the practical application of technical scheme provided by the present invention, should not be construed as limiting the scope of the present invention.Those skilled in the art are in spirit and principles of the present invention, when can various modifications may be made, equivalent substitution or improvement.Protection scope of the present invention is defined by appended claims.
Claims (8)
1. a kind of buried via hole, blind hole filling perforation copper-plating technique for printed wiring board, its feature exists
In the buried via hole, blind hole filling perforation copper-plating technique comprise the following steps：
1) by after copper electroplating groove working solution completely discharge, rinsed well with running water；
2) continue to use deionized water wash cycles；
3) the filling perforation copper plating agent aqueous solution is added to copper electroplating groove, the filling perforation copper plating agent includes sulphur
Acid, copper sulphate, hydrochloric acid, sodium polydithio-dipropyl sulfonate, that strong green and EPE2900；
4) heating copper electroplating groove is to 22-25 DEG C；
5) cycle filter pump is started；
6) printed wiring board for treating electroless copper is inserted in the filling perforation copper plating agent aqueous solution；
7) using current density 1.5-2.5A/dm2Electroplated；And
8) printed wiring board, running water cleaning, hot blast drying are taken out.
2. buried via hole according to claim 1, blind hole filling perforation copper-plating technique, its feature exist
In sulfuric acid is every liter 55-65 milliliters, and copper sulphate is every liter 200-220 grams, and hydrochloric acid is every liter
0.2-0.3 milliliters, sodium polydithio-dipropyl sulfonate is every liter 0.005-0.007 grams, is good for that and green is
Every liter 0.003-0.005 grams, EPE2900 is every liter 0.1-0.3 grams.
3. buried via hole according to claim 1 or 2, blind hole filling perforation copper-plating technique, it is special
Levy and be, the EPE2900 be made up of oxirane ED and expoxy propane PD three
Block polymer.
4. buried via hole according to claim 1 or 2, blind hole filling perforation copper-plating technique, it is special
Levy and be, the pH of the filling perforation copper plating agent aqueous solution<2, proportion is 1.20-1.25g/cm3。
5. buried via hole according to claim 1, blind hole filling perforation copper-plating technique, its feature exist
In step 2) in, the time of the deionized water cleaning is 30 minutes.
6. buried via hole according to claim 1, blind hole filling perforation copper-plating technique, its feature exist
In step 7) in, the time of the plating is 48-80 minutes.
7. buried via hole according to claim 1, blind hole filling perforation copper-plating technique, its feature exist
In step 8) in, the time of the running water cleaning is 1-2 minutes.
8. buried via hole according to claim 1, blind hole filling perforation copper-plating technique, its feature exist
In step 8) in, the temperature of the hot blast drying is 70-80 DEG C, the hot blast drying
Time is 4-6 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610218518.1A CN107278058A (en) | 2016-04-08 | 2016-04-08 | One kind is used for printed wiring board buried via hole, the copper-plated technique of blind hole filling perforation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610218518.1A CN107278058A (en) | 2016-04-08 | 2016-04-08 | One kind is used for printed wiring board buried via hole, the copper-plated technique of blind hole filling perforation |
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|---|---|
| CN107278058A true CN107278058A (en) | 2017-10-20 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610218518.1A Pending CN107278058A (en) | 2016-04-08 | 2016-04-08 | One kind is used for printed wiring board buried via hole, the copper-plated technique of blind hole filling perforation |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108866592A (en) * | 2018-07-11 | 2018-11-23 | 江西景旺精密电路有限公司 | A kind of PCB electro-plating method |
| CN110318079A (en) * | 2018-03-28 | 2019-10-11 | 东莞市斯坦得电子材料有限公司 | A kind of VCP copper-plating technique for flexible printed circuit board |
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