CN107278025A - A kind of thin film circuit is electromagnetically shielded method for packing - Google Patents
A kind of thin film circuit is electromagnetically shielded method for packing Download PDFInfo
- Publication number
- CN107278025A CN107278025A CN201710673705.3A CN201710673705A CN107278025A CN 107278025 A CN107278025 A CN 107278025A CN 201710673705 A CN201710673705 A CN 201710673705A CN 107278025 A CN107278025 A CN 107278025A
- Authority
- CN
- China
- Prior art keywords
- circuit
- solder
- edge sealing
- packing
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
Abstract
Method for packing is electromagnetically shielded the invention provides a kind of thin film circuit, specific method is：First, the substrate front side for completing array arrangement circuit production is pasted onto on high temperature gummed tape；The 2nd, solder is covered in the back side and side of circuit wafer；3rd, high temperature gummed tape is removed；4th, the metal cover of size corresponding with each circuit burst is chosen, will be rolled under metal cover in edge sealing insertion substrate cavity, edge sealing outer rim is alignd with circuit wafer bottom, inwall is close to circuit；5th, the array structure clamped is overturn, makes bottom surface solder upward, fixed, the batch for realizing metal cover and film circuit wafer by Reflow Soldering welds encapsulation.Compared with prior art, device level radiofrequency signal electromagnetic shielding is realized, compared with machine metal housing packaged type volume weight reduction by more than 90%, cost reduction by more than 20%.Device uses batch assembling mode simultaneously, can support automatic assembling, improving productivity about 20%.
Description
Technical field
Method for packing is electromagnetically shielded the present invention relates to a kind of thin film circuit, more particularly to one kind is suitable for inclusion on metal
Lid side is welded, and realizes the thin film circuit electromagnetic shielding method for packing of radio frequency signal shield function；Suitable for thin film circuit it is integrated,
Weld, the technology, particularly device level technique such as electromagnetic shielding.
Background technology
In order to solve the problem of radiofrequency signal is disturbed, traditional microwave thin film circuit is used is placed on metal by circuit wafer
In cavity by way of metal shell is shielded.Preferable shield effectiveness can be so reached, but there is circuit volume in this method
The excessive shortcoming of weight, significantly impacts the miniaturization of microwave membrane circuit and integrated.And in novel electron equipment application,
To enhance product performance, reduce product weight, circuit wafer miniaturization and it is integrated be indispensable.If can be by shielding construction
It is incorporated into thin film circuit devices, realizes the device level electromagnetic shielding of thin film circuit itself, microwave thin-film electro can be greatly improved
The integrated level on road, can also greatly save material reduces cost, and the technology to thin film circuit in microwave radio field, which develops, to be had
It is of great importance.
The method that current use metal shell Surface Mount visible in the industry is packaged in thin film circuit front, but the side of this method one
Face needs positive integrated large area pad, and circuit cost is high, and volume is big, and encapsulation, batch productibility on the other hand need to be welded piece by piece
It is poor.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of cost is low, the thin-film electro that small volume, batch productibility are high
Road is electromagnetically shielded method for packing.
The technical solution adopted by the present invention is as follows：
A kind of thin film circuit is electromagnetically shielded method for packing, and specific method is：
First, the substrate front side for completing array arrangement circuit production is pasted onto on high temperature gummed tape；
The 2nd, solder is covered in the back side and side of circuit wafer；
3rd, high temperature gummed tape is removed；
4th, the metal cover of size corresponding with each circuit burst is chosen, will be rolled under metal cover in edge sealing insertion substrate cavity,
Edge sealing outer rim is set to be alignd with circuit wafer bottom, inwall is close to circuit；
5th, the array structure clamped is overturn, make bottom surface solder upwards, it is fixed, by Reflow Soldering realize metal cover with it is thin
The batch welding encapsulation of film circuit wafer；
In the step one, in each circuit burst front for the substrate for completing array arrangement circuit production, one layer is first coated
After solder mask film, then on the solder mask film of coating paste high temperature gummed tape；
Circuit substrate is in the presence of high-temperature solder, and the high temperature gummed tape can be maintained on circuit substrate and not fall off.
Methods described also includes：Complete after welding, required individual devices are obtained by the way of laser burst.
It is in the specific method of each burst front surface coated solder mask film：Complete the substrate of array arrangement circuit production
After one layer of solder mask film of front surface coated, the welding resistance ring of each circuit burst is obtained by photolithography patterning.
The solder mask film is Kapton.
In the step 2, the specific method at solder is covered in into circuit wafer the back side and side is：Using immersion melting
The mode of solder or coated with solder so that solder covers the back side and side of circuit wafer.
By at least one time folding edge sealing insertion substrate cavity of metal cover, edge sealing outer rim is set to be alignd with circuit wafer bottom.
By in folding edge sealing insertion substrate cavity under metal cover two relative or neighbor two, make edge sealing outer rim and circuit wafer
Align bottom.
By the long side of metal cover it is relative two under in folding edge sealing insertion substrate cavity, make edge sealing outer rim and circuit wafer bottom pair
Together.
Compared with prior art, the beneficial effects of the invention are as follows：Device level radiofrequency signal electromagnetic shielding is realized, it is more mechanical
Process metal shell packaged type volume weight reduction by more than 90%, cost reduction by more than 20%.Device is assembled using batch simultaneously
Mode, can support automatic assembling, improving productivity about 20%.
Brief description of the drawings
Fig. 1 is lid encapsulating structure schematic diagram on the array arrangement circuit production substrate of a wherein embodiment of the invention.
Fig. 2 is the metal cover structure chart of the upper lid of embodiment illustrated in fig. 1.
Fig. 3 is the diagrammatic cross-section after the upper high temperature gummed tape of stickup at the dotted line of embodiment illustrated in fig. 1.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
This specification（Including summary and accompanying drawing）Disclosed in any feature, unless specifically stated otherwise, can be equivalent by other
Or the alternative features with similar purpose are replaced.I.e., unless specifically stated otherwise, each feature is a series of equivalent or class
Like an example in feature.
Specific embodiment 1
A kind of thin film circuit is electromagnetically shielded method for packing, and as shown in Figure 1, Figure 2 and Figure 3, specific method is：
First, the front of substrate 1 for completing array arrangement circuit production is pasted onto on high temperature gummed tape 3-2；
The 2nd, solder is covered in the back side 3-3 and side 3-4 of circuit wafer；
3rd, high temperature gummed tape is removed；
4th, the metal cover 2 of size corresponding with each circuit burst is chosen, edge sealing 2-1 insertion substrates will be rolled under metal cover and are led to
In chamber 1-3, edge sealing outer rim is set to be alignd with circuit wafer bottom, inwall is close to circuit；
5th, the array structure clamped is overturn, make bottom surface solder upwards, it is fixed, by Reflow Soldering realize metal cover with it is thin
The batch welding encapsulation of film circuit wafer；
In the step one, in each circuit burst front for the substrate for completing array arrangement circuit production, one layer is first coated
After solder mask film, then on the solder mask film of coating paste high temperature gummed tape；
Circuit substrate is in the presence of high-temperature solder, and the high temperature gummed tape can be maintained on circuit substrate and not fall off.
In substrate front, substrate front is adjacent to as barrier layer using high temperature gummed tape, due to having high temperature gummed tape and welding resistance ring
Block, solder will not to design circuit impact.After after high-temperature solder cooling, high temperature gummed tape is removed, you can realize film
Metallize altogether at the side back side of circuit wafer.
Complete after substrate preparation, choose the sheet metal of size corresponding with circuit, punching press bending, acquisition has lower hem
2-1 metal cover structure, for being embedded in substrate cavity.
Finally, upper enclosure 1-1 is enclosed on above thin film circuit 1-2 one by one, lower hem 2-1 edges insertion substrate chamber groove 1-
To realize rapid-aligning in 3, flanging lower edge is concordant with circuit bottom 3-3.After the completion of nesting, capping and substrate are overturn in the lump,
Insert heating in baking oven and carry out Reflow Soldering, complete housing and welded with circuit.
Thin film circuit electromagnetic shielding method for packing involved in the present invention uses front metal housing and bottom substrate metal
The mode of change realizes device level radiofrequency signal electromagnetic shielding, compared with the reduction of machine metal housing packaged type volume weight
More than 90%, cost reduction by more than 20%.Device uses batch assembling mode simultaneously, can support automatic assembling, improving productivity
About 20%.
Specific embodiment 2
On the basis of specific embodiment 1, methods described also includes：Complete after welding, institute is obtained by the way of laser burst
The individual devices needed.After the completion of integral solder, self-shileding thin film circuit devices needed for being obtained by circuit size burst.
Specific embodiment 3
On the basis of specific embodiment 1 or 2, it is in the specific method of each burst front surface coated solder mask film：Complete battle array
The substrate front side of rowization arrangement circuit production is coated after one layer of solder mask film, and each circuit burst is obtained by photolithography patterning
Welding resistance ring 3-1.After the completion of, substrate front is adjacent to using high temperature gummed tape 3-2, barrier layer is used as.
Specific embodiment 4
On the basis of one of specific embodiment 1 to 3, in this specific embodiment, the solder mask film is Kapton.
Specific embodiment 5
On the basis of one of specific embodiment 1 to 4, in the step 2, solder is covered in the back side and side of circuit wafer
Specific method be：By the way of immersion fusion welding or coated with solder so that solder covers the back side and side of circuit wafer.
The substrate for posting adhesive tape is immersed in fusion welding, circuit bottom surface 3-3 and circuit side 3-4 is covered solder；Or
Depending on concrete condition, by solder-coated at the back side and side of the circuit wafer for the substrate for posting adhesive tape by the way of coated with solder.
After after high-temperature solder cooling, high temperature gummed tape is removed, you can realize that the side back side of film circuit wafer is metallized altogether.
Specific embodiment 6
On the basis of one of specific embodiment 1 to 5, by least one time folding edge sealing insertion substrate cavity of metal cover, make
Edge sealing outer rim is alignd with circuit wafer bottom.Do not influenceing metal cover stability, it is not easy in the case of coming off, can be only by gold
Under category capping one in folding edge sealing insertion substrate cavity, edge sealing outer rim is set to be alignd with circuit wafer bottom.
Specific embodiment 7
On the basis of one of specific embodiment 1 to 6, by folding edge sealing insertion substrate under metal cover two relative or neighbor two
In cavity, edge sealing outer rim is set to be alignd with circuit wafer bottom.Based on metal cover stability, it is not easy in the case of coming off, by gold
Under category capping two relative or neighbor two in folding edge sealing insertion substrate cavity, edge sealing outer rim is set to be alignd with circuit wafer bottom.
Specific embodiment 8
On the basis of one of specific embodiment 1 to 7, in this specific embodiment, by the long side of metal cover it is relative two under roll over
In edge sealing insertion substrate cavity, edge sealing outer rim is set to be alignd with circuit wafer bottom.
Claims (8)
1. a kind of thin film circuit is electromagnetically shielded method for packing, specific method is：
First, the substrate front side for completing array arrangement circuit production is pasted onto on high temperature gummed tape；
The 2nd, solder is covered in the back side and side of circuit wafer；
3rd, high temperature gummed tape is removed；
4th, the metal cover of size corresponding with each circuit burst is chosen, will be rolled under metal cover in edge sealing insertion substrate cavity,
Edge sealing outer rim is set to be alignd with circuit wafer bottom, inwall is close to circuit；
5th, the array structure clamped is overturn, make bottom surface solder upwards, it is fixed, by Reflow Soldering realize metal cover with it is thin
The batch welding encapsulation of film circuit wafer；
Circuit substrate is in the presence of high-temperature solder, and the high temperature gummed tape can be maintained on circuit substrate and not fall off；
In the step one, in each circuit burst front for the substrate for completing array arrangement circuit production, one layer is first coated
After solder mask film, then on the solder mask film of coating paste high temperature gummed tape.
2. thin film circuit according to claim 1 is electromagnetically shielded method for packing, methods described also includes：Complete after welding,
Required individual devices are obtained by the way of laser burst.
3. thin film circuit according to claim 1 is electromagnetically shielded method for packing, in each burst front surface coated solder mask film
Specific method be：After the substrate front side for completing array arrangement circuit production coats one layer of solder mask film, pass through photoetching figure
Shape obtains the welding resistance ring of each circuit burst.
4. thin film circuit according to claim 3 is electromagnetically shielded method for packing, the solder mask film is Kapton.
5. thin film circuit according to claim 1 is electromagnetically shielded in method for packing, the step 2, solder is covered in electricity
The back side of road piece and the specific method of side are：By the way of immersion fusion welding or coated with solder so that solder covering electricity
The back side and side of road piece.
6. the thin film circuit electromagnetic shielding method for packing according to one of claim 1 to 5, by under metal cover at least one
Roll in edge sealing insertion substrate cavity, edge sealing outer rim is alignd with circuit wafer bottom.
7. thin film circuit according to claim 6 is electromagnetically shielded method for packing, by metal cover two relative or neighbor two
Rolled under bar in edge sealing insertion substrate cavity, edge sealing outer rim is alignd with circuit wafer bottom.
8. thin film circuit according to claim 7 is electromagnetically shielded method for packing, by the long side of metal cover it is relative two under roll over
In edge sealing insertion substrate cavity, edge sealing outer rim is set to be alignd with circuit wafer bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710673705.3A CN107278025B (en) | 2017-08-09 | 2017-08-09 | A kind of thin film circuit electromagnetic shielding packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710673705.3A CN107278025B (en) | 2017-08-09 | 2017-08-09 | A kind of thin film circuit electromagnetic shielding packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107278025A true CN107278025A (en) | 2017-10-20 |
| CN107278025B CN107278025B (en) | 2019-10-25 |
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ID=60077114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710673705.3A Active CN107278025B (en) | 2017-08-09 | 2017-08-09 | A kind of thin film circuit electromagnetic shielding packaging method |
Country Status (1)
| Country | Link |
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| CN (1) | CN107278025B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864551A (en) * | 2017-10-31 | 2018-03-30 | 中国电子科技集团公司第二十九研究所 | One kind point pre-fixes thin film circuit electromagnetic shielding method for packing |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1233387A (en) * | 1996-08-18 | 1999-10-27 | 赫尔穆特·卡尔 | Process for shielding an electric or electronic circuit and shielding cap |
| CN1345528A (en) * | 1999-03-26 | 2002-04-17 | 艾利森公司 | Shielding apparatus for electronic derices |
| CN1774959A (en) * | 2003-04-15 | 2006-05-17 | 波零公司 | Electomagnetic interference shielding for a printed circuit board |
| CN2824507Y (en) * | 2005-08-22 | 2006-10-04 | 李世雄 | Central controlling box for automobile electrical appliance |
| CN201001253Y (en) * | 2007-01-16 | 2008-01-02 | 洪进富 | Shielding device for preventing electromagnetic interference |
| CN101202275A (en) * | 2006-12-13 | 2008-06-18 | 新光电气工业株式会社 | Package having shield case |
-
2017
- 2017-08-09 CN CN201710673705.3A patent/CN107278025B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1233387A (en) * | 1996-08-18 | 1999-10-27 | 赫尔穆特·卡尔 | Process for shielding an electric or electronic circuit and shielding cap |
| CN1345528A (en) * | 1999-03-26 | 2002-04-17 | 艾利森公司 | Shielding apparatus for electronic derices |
| CN1774959A (en) * | 2003-04-15 | 2006-05-17 | 波零公司 | Electomagnetic interference shielding for a printed circuit board |
| CN2824507Y (en) * | 2005-08-22 | 2006-10-04 | 李世雄 | Central controlling box for automobile electrical appliance |
| CN101202275A (en) * | 2006-12-13 | 2008-06-18 | 新光电气工业株式会社 | Package having shield case |
| CN201001253Y (en) * | 2007-01-16 | 2008-01-02 | 洪进富 | Shielding device for preventing electromagnetic interference |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864551A (en) * | 2017-10-31 | 2018-03-30 | 中国电子科技集团公司第二十九研究所 | One kind point pre-fixes thin film circuit electromagnetic shielding method for packing |
| CN107864551B (en) * | 2017-10-31 | 2019-11-12 | 中国电子科技集团公司第二十九研究所 | A kind of point pre-fixes thin film circuit electromagnetic shielding packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107278025B (en) | 2019-10-25 |
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| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Wenbo Inventor after: Qin Yueli Inventor after: Pan Yuhua Inventor after: Wang Chunfu Inventor after: Li Yanrui Inventor after: Zhou Jun Inventor before: Wang Wenbo Inventor before: Qin Yueli Inventor before: Wang Chunfu Inventor before: Li Yanrui Inventor before: Zhou Jun |
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