CN108172654A - Solar cell pond piece component and its assemble method - Google Patents
Solar cell pond piece component and its assemble method Download PDFInfo
- Publication number
- CN108172654A CN108172654A CN201711387629.6A CN201711387629A CN108172654A CN 108172654 A CN108172654 A CN 108172654A CN 201711387629 A CN201711387629 A CN 201711387629A CN 108172654 A CN108172654 A CN 108172654A
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- CN
- China
- Prior art keywords
- solar cell
- piece component
- pond piece
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000000034 method Methods 0.000 title claims abstract description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000006071 cream Substances 0.000 claims abstract description 28
- 238000005476 soldering Methods 0.000 claims abstract description 6
- 238000007639 printing Methods 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 239000011889 copper foil Substances 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229920002799 BoPET Polymers 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 28
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 5
- 238000009826 distribution Methods 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 229910000831 Steel Inorganic materials 0.000 description 12
- 239000010959 steel Substances 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 238000004070 electrodeposition Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000002161 passivation Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The present invention relates to solar battery sheet component and assemble method, solar battery sheet component includes：Solar battery sheet, low-temperature lead-free tin cream and flexible circuit board.Connection method between cell piece and flexible circuit board is that solar battery sheet is welded on flexible PCB by reflow soldering using low-temperature lead-free tin cream.The present invention has prevented traditional handicraft because welding quality influences the collection efficiency problem of photovoltaic module electric current using solderless charged pool group serial connection technology；It is welded between cell piece and flexible circuit board using low-temperature lead-free tin cream, reflow peak temperature control causes solar battery sheet to rupture or hidden split phenomenon hereinafter, avoiding at 190 DEG C due to welding temperature is excessively high；Simultaneously because substantially reduce production cost without using silver paste.Using flexible board as welding wiring board, the thickness of solar cell module can be greatly reduced, there is the characteristics of limitation of component entirety wiring space is few, and Distribution density is high, and flexibility ratio is high, and processing step is few.
Description
Technical field
The present invention relates to cell piece component fields, more particularly to solar cell pond piece component and its assemble method.
Background technology
Generating efficiency is always the hot issue that photovoltaic industry researcher most pays close attention to and the solar cell phase of traditional structure
Than the transfer efficiency higher of IBC batteries.This is because the contact of positive and negative polarities metal is transferred completely into the cell piece back side by it, make
The cell piece front of the sun is faced in all black, can't see the metal wire that most photovoltaic cell fronts are presented completely, therefore have
Higher short circuit current, while the back side can allow wider metal grid lines to reduce series resistance so as to improve fill factor；
In addition the open loop voltage gain that battery front-surface field (Front Surface Field, FSF) and well passivated zone of action are come,
So that the unobstructed battery in this front just has high conversion efficiency.
Battery assembling mode has larger impact to transfer efficiency.Since positive and negative anodes metal grid lines are all in cell backside, IBC
The battery series connection method being attached using conductive welding or conducting resinl general at present.Wherein, welding quality also influences photovoltaic group
The collection efficiency of part electric current；Conductive welding is high using silver paste and cell piece link cost, and connection temperature height can lead to tin-coated copper
Welding expanded by heating, cooling after-contraction cause cell piece flexural deformation even to rupture or hidden split.In addition, the larger shadow of conducting resinl impedance
Ring transfer efficiency.New technology continues to bring out thus, if patent CN201310215117.7 is connected using no welding or narrow welding,
But complicated integral structure, process is more, of high cost, and welding manner is soldering iron welding temperature height.Patent CN200510056540.2 is adopted
Improve the adhesive property between solar cell device jointing and collector, but still exist with unleaded SnAgCu solders
Cell piece rupture caused by welding temperature height hidden splits risk.Patent CN201710071353.4 is being welded to solve IBC batteries
The technical issues of easily bending afterwards, by the way that welding bench table top is become curved surface from plane, but also do not break away from welding connection
The rapid wear problem occurred in the process.Patent CN201410272336.3 uses the highly conductive silver paste of low-temperature setting, although can be significantly
It reduces because of influence of the welding temperature height to welding quality, but the use of silver paste causes production cost high.In addition, traditional electricity
Pond piece assembling mode is also there are wiring space limitation, the problem of Distribution density is low, flexibility ratio difference and more step.
Therefore, the collection efficiency for how reducing the photovoltaic module electric current caused by welding quality problems is low, and welding temperature height is made
Into solar battery sheet rupture or it is hidden split the phenomena impair entirety solar energy service life, reduce integral solder cost, cell piece assembling is matched
Space of lines limitation is few, improves Distribution density and flexibility ratio, and it is researcher pays close attention in industry emphasis and urgently to reduce preparation process
It solves the problems, such as.
Invention content
The purpose of the present invention is to solve at least one of problem above, the present invention provides a kind of solar cell pond piece group
Part and its assemble method.Using assembling mode of the present invention, simple structure, high yield rate, one integral piece long lifespan, operation is flexibly
Degree is high.
According to an aspect of the present invention, a kind of solar cell pond piece component is provided, including IBC cell pieces and flexible wires
Road plate, the surface of the flexible circuit board are equipped with dew copper trepanning, and the IBC cell pieces are welded on described by low-temperature lead-free tin cream
Reveal copper tapping.
Wherein, the low-temperature lead-free tin cream is one in SnBi, SnBiCu, SnBiAg, SnBiSb, SnBiSbAg and SnIn
Kind is a variety of.
Wherein, flexible circuit board includes multilayer laminate constructions, and multilayer laminate constructions are respectively from top to bottom the first PET film
Layer, the first copper foil layer, the second copper foil layer and the second PET film layer, and between the first copper foil layer and the second copper foil layer and second
Pass through adhesive bonding between copper foil layer and the second PET film layer.
Wherein, the thickness of the flexible circuit board is 0.1-2mm.
Wherein, the solar battery sheet is IBC cell pieces, including N-type silicon substrate, in the front of the N-type silicon substrate
It is followed successively by N+ layers, silicon dioxide passivation layer and anti-reflection layer, anti-reflection layer surface combination pubescence structure, in the back of the body of the N-type silicon substrate
Staggered form junction, silicon dioxide passivation layer and the metal electrode that face is staggeredly spaced for P+ and N+, gold is offered in silicon dioxide layer
Belong to contact hole, realize contact of the metal electrode with emitter region.
According to another aspect of the present invention, the assemble method of the solar cell pond piece component is provided, is included the following steps：
Low-temperature lead-free tin cream is printed respectively at the leakage copper of flexible circuit board；
In the corresponding solar cell patch of the surface mount of every place's low-temperature lead-free tin cream；
The flexible circuit board reflow soldering of solar cell patch will be pasted with.
Wherein, in the step of reflow soldering, the peak temperature of reflow oven temperatures is 190 DEG C.
Wherein, it in the step of printing low-temperature lead-free tin cream, is printed using printing machine, 5-10 kilograms of scraper pressure.
Wherein, it in the step of being pasted with solar cell patch, is printed using printing machine, print speed printing speed 25-
150mm/sec。
Wherein, the solar battery sheet is IBC cell pieces.
The invention has the advantages that：
1st, using the present invention using low-temperature lead-free tin cream as connecting material, compared to silver paste price, cost can reduce 2-3 times
And environmental protection.
2nd, welding temperature peak value is at 190 DEG C or so, eliminates caused by welding temperature height solar battery sheet rupture or hidden splits
Phenomena impair entirety solar battery life.
3rd, because without using welding, reducing the low problem of collection efficiency of the photovoltaic module electric current caused by welding quality problems.
4th, as welding wiring board the thickness of IBC battery components can be greatly reduced, component entirety wiring is empty in flexible circuit board
Between less-restrictive, Distribution density is high, and flexibility ratio is high, and processing step is few.
Description of the drawings
By reading the detailed description of hereafter preferred embodiment, it is various other the advantages of and benefit it is common for this field
Technical staff will become clear.Attached drawing is only used for showing the purpose of preferred embodiment, and is not considered as to the present invention
Limitation.And throughout the drawings, the same reference numbers will be used to refer to the same parts.In the accompanying drawings：
Fig. 1 shows the flexible wires equipped with lead-free tin cream of the solar cell pond piece component according to embodiment of the present invention
The vertical view of road plate；
Fig. 2 shows the side views of the flexible circuit board of the solar cell pond piece component according to embodiment of the present invention；
Fig. 3 shows the schematic diagram of the IBC cell pieces of the solar cell pond piece component according to embodiment of the present invention；
Fig. 4 shows the flow chart of the assemble method of the solar cell pond piece component according to embodiment of the present invention.
Specific embodiment
The illustrative embodiments of the disclosure are more fully described below with reference to accompanying drawings.Although this public affairs is shown in attached drawing
The illustrative embodiments opened, it being understood, however, that may be realized in various forms the disclosure without the reality that should be illustrated here
The mode of applying is limited.It is to be able to be best understood from the disclosure, and can be by this public affairs on the contrary, providing these embodiments
The range opened completely is communicated to those skilled in the art.
A kind of solar cell pond piece component, including IBC cell pieces 1 and flexible circuit board 2, as shown in Figure 1, flexible circuitry
The surface of plate 2 is equipped with dew copper trepanning, and IBC cell pieces 1 are welded on dew copper tapping by low-temperature lead-free tin cream.Wherein low-temperature lead-free
Tin cream is one or more in SnBi, SnBiCu, SnBiAg, SnBiSb, SnBiSbAg and SnIn.
As shown in Fig. 2, flexible circuit board 2 include equal first copper foil layer, 210 and second copper foil layer 220, the first copper foil layer and
Second copper foil layer is all covered with PET film 230, wherein being bonding between the second copper foil layer and the PET film for being covered in its surface
Oxidant layer, the two are adhesive phase between the first copper foil layer and the second copper foil layer by adhesive bonding, the PET of the first copper foil layer
The opposite face of the PET film covering surface of the opposite face of film covering surface and the second copper foil layer passes through adhesive bonding.Normal conditions
Under, flexible circuitry plate thickness can be between 0.1-2mm, preferably between 0.1-1mm, more preferably between 0.1-0.4mm.Choosing
The thin wiring board of thickness is selected cost can be greatly reduced and and increase flexibility to adapt to not under the requirement for meeting use intensity
Same use condition.
Solar battery sheet 1 can be specially IBC cell pieces in force, as shown in figure 3, in a specific embodiment
In, IBC cell pieces include N-type silicon substrate 10, be followed successively by the front of N-type silicon substrate phosphorus-diffused layer, silicon dioxide passivation layer and
Anti-reflection layer, anti-reflection layer surface combination pubescence structure 20, the staggered form junction being spaced of interlocking at the back side of N-type silicon substrate for P+ and N+
30th, silicon dioxide passivation layer 40 and metal electrode, metal electrode are divided into N-type region metal electrode 50 and p type island region metal electrode 60,
Silicon dioxide layer corresponds to N-type region metal electrode and the position of corresponding p type island region metal electrode offers metal contact hole respectively, realizes
N-type region metal electrode is contacted with the N+ regions of staggered form junction, p type island region metal electrode is contacted with the P+ regions in staggered form section.
The invention further relates to the assemble methods to the solar cell pond piece component, will pass through the side of specific embodiment below
Formula is further described in detail this method.
The assemble method X1 of 1 solar cell pond piece component of embodiment
The flexible circuit board that thickness is 0.1mm is placed below printing machine, is fixed, the steel mesh trepanning design of printing machine
Size is corresponded with IBC cell pieces electrode position, steel mesh thickness 0.1mm.SnBi alloy tin creams are printed on printing machine soft
Property wiring board on, be suspended to pressure as 5kg, IBC cell pieces are placed in corresponding tin cream by print speed printing speed 25mm/sec, chip mounter
It on position, after AOI detections are qualified, is put into reflow ovens, reflow oven temperatures peak temperature sets 190 DEG C, completes final welding.
The assemble method X2 of 2 solar cell pond piece component of embodiment
The flexible circuit board that thickness is 0.25mm is placed below printing machine, is fixed, the steel mesh trepanning of printing machine is set
It counts size to correspond with IBC cell pieces electrode position, steel mesh thickness 0.08mm.With printing machine by SnBiCu alloy paste solder printings
In flexible circuit board, pressure is suspended to as 6kg, IBC cell pieces are placed with corresponding by print speed printing speed 50mm/sec, chip mounter
It on tin cream position, after AOI detections are qualified, is put into reflow ovens, reflow oven temperatures peak temperature sets 190 DEG C, completes final weldering
It connects.
The assemble method X3 of 3 solar cell pond piece component of embodiment
The flexible circuit board that thickness is 0.4mm is placed below printing machine, is fixed, the steel mesh trepanning design of printing machine
Size is corresponded with IBC cell pieces electrode position, steel mesh thickness 0.15mm.SnSbBi alloy tin creams are printed on printing machine
In flexible circuit board, pressure is suspended to as 7kg, IBC cell pieces are placed in corresponding tin by print speed printing speed 75mm/sec, chip mounter
It on cream position, after AOI detections are qualified, is put into reflow ovens, reflow oven temperatures peak temperature sets 190 DEG C, completes final welding.
The assemble method X4 of 4 solar cell pond piece component of embodiment
The flexible circuit board that thickness is 1mm is placed below printing machine, is fixed, the steel mesh trepanning design ruler of printing machine
It is very little to be corresponded with IBC cell pieces electrode position, steel mesh thickness 0.12mm.SnIn alloy tin creams are printed on flexibility with printing machine
On wiring board, pressure is suspended to as 8kg, IBC cell pieces are placed in corresponding tin cream by print speed printing speed 100mm/sec, chip mounter
It on position, after AOI detections are qualified, is put into reflow ovens, reflow oven temperatures peak temperature sets 190 DEG C, completes final welding.
The assemble method X5 of 5 solar cell pond piece component of embodiment
The flexible circuit board that thickness is 1.5mm is placed below printing machine, is fixed, the steel mesh trepanning design of printing machine
Size is corresponded with IBC cell pieces electrode position, steel mesh thickness 0.15mm.With printing machine by SnSbBiAg alloy paste solder printings
In flexible circuit board, pressure is suspended to as 9kg, IBC cell pieces are placed in correspondence by print speed printing speed 100mm/sec, chip mounter
Tin cream position on, after AOI detections are qualified, be put into reflow ovens, reflow oven temperatures peak temperature sets 190 DEG C, completes final
Welding.
The assemble method X6 of 6 solar cell pond piece component of embodiment
The flexible circuit board that thickness is 2mm is placed below printing machine, is fixed, the steel mesh trepanning design ruler of printing machine
It is very little to be corresponded with IBC cell pieces electrode position, steel mesh thickness 0.15mm.SnBiAg alloy tin creams are printed on printing machine soft
Property wiring board on, be suspended to pressure as 10kg, IBC cell pieces are placed in corresponding tin by print speed printing speed 150mm/sec, chip mounter
On cream position, IBC cell pieces are placed on corresponding tin cream position by chip mounter, after AOI detections are qualified, are put into reflow ovens,
Reflow oven temperatures peak temperature sets 190 DEG C, completes final welding.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, the change or replacement that can be readily occurred in,
It should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with the protection model of the claim
Subject to enclosing.
Claims (10)
1. solar cell pond piece component, which is characterized in that including IBC cell pieces (1) and flexible circuit board (2), the flexibility
The surface of wiring board (2) is equipped with dew copper trepanning, and the IBC cell pieces (1) are welded on the dew copper by low-temperature lead-free tin cream and open
At hole.
2. solar cell pond piece component as described in claim 1, which is characterized in that
The low-temperature lead-free tin cream is one or more in SnBi, SnBiCu, SnBiAg, SnBiSb, SnBiSbAg and SnIn.
3. solar cell pond piece component as described in claim 1, which is characterized in that
The flexible circuit board (2) includes multilayer laminate constructions, and the multilayer laminate constructions are respectively from top to bottom the first PET thin
Film layer, the first copper foil layer, the second copper foil layer and the second PET film layer, and between first copper foil layer and the second copper foil layer with
And second pass through adhesive bonding between copper foil layer and the second PET film layer.
4. solar cell pond piece component as described in any one of claims 1-3, which is characterized in that
The thickness of the flexible circuit board (2) is 0.1-2mm.
5. solar cell pond piece component as described in any one of claims 1-3, which is characterized in that
The solar battery sheet (1) is IBC cell pieces.
6. the assemble method of solar cell pond piece component as described in any one of claims 1-3, which is characterized in that including following
Step：
Low-temperature lead-free tin cream is printed respectively at the leakage copper of flexible circuit board；
In the corresponding solar cell patch of the surface mount of every place's low-temperature lead-free tin cream；
The flexible circuit board reflow soldering of solar cell patch will be pasted with.
7. the assemble method of solar cell pond piece component as claimed in claim 6, which is characterized in that
In the step of reflow soldering, the peak temperature of reflow oven temperatures is 190 DEG C.
8. the assemble method of solar cell pond piece component as claimed in claim 6, which is characterized in that
In the step of printing low-temperature lead-free tin cream, printed using printing machine, 5-10 kilograms of scraper pressure.
9. the assemble method of solar cell pond piece component as claimed in claim 6, which is characterized in that
It in the step of being pasted with solar cell patch, is printed using printing machine, print speed printing speed 25-150mm/sec.
10. the assemble method of solar cell pond piece component as claimed in claim 6, which is characterized in that the solar-electricity
Pond piece is IBC cell pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711387629.6A CN108172654A (en) | 2017-12-20 | 2017-12-20 | Solar cell pond piece component and its assemble method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711387629.6A CN108172654A (en) | 2017-12-20 | 2017-12-20 | Solar cell pond piece component and its assemble method |
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| Publication Number | Publication Date |
|---|---|
| CN108172654A true CN108172654A (en) | 2018-06-15 |
Family
ID=62523242
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711387629.6A Pending CN108172654A (en) | 2017-12-20 | 2017-12-20 | Solar cell pond piece component and its assemble method |
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| Country | Link |
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| CN (1) | CN108172654A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109888044A (en) * | 2019-01-23 | 2019-06-14 | 茂迪太阳能科技（东莞）有限公司 | Welding method, device and the cell piece of IBC full back electrode cell piece |
| CN112490321A (en) * | 2019-09-10 | 2021-03-12 | 福建省辉锐电子技术有限公司 | FPCB (field programmable logic controller) welding strip welding method |
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| CN102441717A (en) * | 2010-07-27 | 2012-05-09 | 应用材料公司 | Methods of soldering to high efficiency thin film solar panels |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109888044A (en) * | 2019-01-23 | 2019-06-14 | 茂迪太阳能科技（东莞）有限公司 | Welding method, device and the cell piece of IBC full back electrode cell piece |
| CN109888044B (en) * | 2019-01-23 | 2021-11-26 | 茂迪太阳能科技（东莞）有限公司 | IBC full back electrode cell, welding method and welding device thereof |
| CN112490321A (en) * | 2019-09-10 | 2021-03-12 | 福建省辉锐电子技术有限公司 | FPCB (field programmable logic controller) welding strip welding method |
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Application publication date: 20180615 |