CN107864551A - One kind point pre-fixes thin film circuit electromagnetic shielding method for packing - Google Patents
One kind point pre-fixes thin film circuit electromagnetic shielding method for packing Download PDFInfo
- Publication number
- CN107864551A CN107864551A CN201711048409.0A CN201711048409A CN107864551A CN 107864551 A CN107864551 A CN 107864551A CN 201711048409 A CN201711048409 A CN 201711048409A CN 107864551 A CN107864551 A CN 107864551A
- Authority
- CN
- China
- Prior art keywords
- film circuit
- circuit board
- cavity
- thin film
- electromagnetic shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses one kind point to pre-fix thin film circuit electromagnetic shielding method for packing, including：Step (a) obtains the film circuit board for being provided with fixed plate；The metallic cavity for being provided with connection sheet matched with the film circuit board size is made in step (b)；Step (c) pre-fixes the film circuit board and the metallic cavity.Film circuit board fixed plate and metallic cavity connection sheet are pre-fixed by point, it is possible to achieve rapidly and accurately film circuit board is fixed in metallic cavity and forms electromagnetic armouring structure, simple to operate, cost is low.
Description
Technical field
The present invention relates to circuit package, the especially encapsulation of circuit electromagnetic shielding.
Background technology
Conventional films circuit is generally put into component in the form of " nude film ", by welding wire, welding outbound course, realizes circuit
Interconnection between circuit.Electromagnetic isolation between circuit is realized typically by way of processing wire chamber on housing.And
The fields such as high frequency, communication, because cavity volume limits, inconvenience carries out large-area metal chamber processing, it is difficult to evades the electricity between circuit
Magnetic disturbance.To realize electromagnetic compatibility good between circuit and circuit, it is desirable to which ceramic membrane circuit possesses electromagnetic shielding capability.Pottery
Porcelain thin film circuit possesses the Electro Magnetic Compatibility and product stability that electromagnetic shielding encapsulation can greatly improve the said goods, especially exists
RF application, electromagnetic shielding encapsulation has been an indispensable technology.
The content of the invention
The present invention can realize in many ways, including method, system, device, be discussed below the present invention's
Several embodiments.
A kind of method that thin film circuit electromagnetic shielding encapsulation is pre-fixed as point, one embodiment of the present of invention include：
Step (a) obtains the film circuit board for being provided with fixed plate；
The metallic cavity for being provided with connection sheet matched with the film circuit board size is made in step (b)；
Step (c) pre-fixes the film circuit board and the metallic cavity.
Other aspects and advantages of the present invention become obvious according to detailed description below in conjunction with the accompanying drawings, the accompanying drawing
The principle of the present invention is illustrated by way of example.
Brief description of the drawings
Examples of the present invention will be described by way of reference to the accompanying drawings, wherein：
Fig. 1 is that thin film circuit electromagnetic shielding encapsulation point pre-fixes method flow diagram disclosed in the embodiment of the present invention；
Fig. 2 is film circuit board structural representation disclosed in the embodiment of the present invention,
Wherein, 1-circuit substrate, 1-1-gate array, 1-2-cavity, 1-3-film circuit board, 1-4-fixation
Plate；
Fig. 3 is metallic cavity structural representation disclosed in the embodiment of the present invention,
Wherein 2-sheet metal, 2-1-seam, 2-2-seam, 2-3-seam, 2-4-connection sheet, 2-5-metallic cavity.
Embodiment
All features disclosed in this specification, or disclosed all methods or during the step of, except mutually exclusive
Feature and/or step beyond, can combine in any way.
Any feature disclosed in this specification, unless specifically stated otherwise, can be equivalent by other or with similar purpose
Alternative features are replaced.I.e., unless specifically stated otherwise, each feature is an example in a series of equivalent or similar characteristics
.
Metal shell can be used to carry out the electromagnetic shielding encapsulation of thin film circuit in the industry at present, but on the one hand this method need to integrate
Large area pad, cost are high, and aligning accuracy is poor, on the other hand need to control the thermograde welded twice, and processing compatibility is poor.
For above-mentioned technical problem, the invention provides one kind quickly, to be accurately fixed on gold by film circuit board
The point that electromagnetic armouring structure is formed in category cavity pre-fixes method.
Basic embodiment：
One kind point pre-fixes thin film circuit electromagnetic shielding method for packing, including：
Step (a) obtains the film circuit board for being provided with fixed plate；
The metallic cavity for being provided with connection sheet matched with the film circuit board size is made in step (b)；
Step (c) pre-fixes the film circuit board and the metallic cavity.
Further, the positive side surface of the film circuit board is covered with metal film.Film circuit board front and
Side is all covered with metal film, can be with the metal interconnection effect of effective guarantee circuit side.
Further, obtaining the method for the film circuit board for being provided with fixed plate includes：
Step (a-1) opens up the array cavity for being shorter than circuit length in circuit substrate along gate array；
Step (a-2) is offering the circuit substrate plating metal on surface film of cavity, and needed for the making of circuit substrate surface
Circuitous pattern；
The film circuit board that step (a-3) is met the size requirements according to circuitous pattern burst to obtain, it is cut cavity
The circuit substrate at both ends forms the fixed plate of film circuit board.
Film circuit board is obtained according to circuitous pattern clipper circuit substrate and forms circuit FX, because the length of cavity
Degree is slightly shorter than gate array length, and after cutting cavity, the circuit substrate at cavity both ends is that may make up the fixation of film circuit board
Plate.
Further, the film circuit board is the square in I-shaped structure that respectively there is a fixed plate on four summits
Shape film circuit board.When circuit region is shaped as rectangle in circuit substrate, the cavity opened up is parallel to gate array.Cutting is logical
After chamber, rectangular circuit array and the circuit substrate at cavity both ends after the cutting of both sides form I-shaped shape, wherein rectangular circuit battle array
The circuit substrate on four summits of row forms four fixed plates of rectangular film circuit substrate.
Further, the circuit substrate surface splash-proofing sputtering metal of cavity is being offered in step (a-2), is realizing circuit substrate
Front surface and cavity inner surface covering metal film.Due to the physical characteristic of sputtering, metallic diaphragm will be deposited on circuit substrate simultaneously
Front surface and cavity inner surface.After cutting cavity, it is ensured that the front surface of film circuit board is all covered with gold with side surface
Belong to film, the effective guarantee metal interconnection effect of circuit side.
Further, height of the metallic cavity bottom away from connection sheet is identical with the thickness of the film circuit board.
This kind design can ensure metallic cavity connection sheet attaching film circuit substrate fixed plate.Meanwhile metallic cavity upper surface distance
Connection sheet also has certain altitude, after metallic cavity connection sheet attaching film circuit substrate fixed plate, metallic cavity upper surface with it is thin
Certain gap between film circuit substrate be present, available for completing the subsequent fixed of metallic cavity and film circuit board.
Further, the film circuit board pre-fixes method with the metallic cavity and included：
The metallic cavity is positioned over the film circuit board surface by step (c-1)；
Step (c-2) engages the metallic cavity side and the film circuit board side；
Step (c-3) is aligned and pre-fixes the film circuit board fixed plate and the metallic cavity connection sheet.
First, pre-prepared colloid, solder etc. fix material in the fixed plate of film circuit board, metallic cavity are positioned over thin
Film circuit substrate surface, the fixed plate of the connection sheet alignment thin film circuit substrate of metal shell, engaging metal housing side with it is thin
Film circuit substrate side, fast positioning is completed, method is pre-fixed by point, rapidly and accurately can be fixed film circuit board
Electromagnetic armouring structure is formed in metallic cavity.The device that point pre-fixes possesses certain structural strength, can be labelled, altogether follow-up
Sizing is kept in the assembly technologies such as crystalline substance.The design of metallic cavity effectively ensure that the continuity of shielding cavity, and can assemble
Fast automatic welding is realized by capillary effect in journey, if being not provided with metallic cavity, shielding can only be completed by punching, shielding
Region is interrupted, and shield effectiveness is poor, the incompatible situation of successive plates level welding temperature easily occurs.
Further, pad can be integrated in the film circuit board fixed plate.For fixed material, it can not also make
Use pad.
Further, when metallic cavity wall thickness is in more than 0.2mmm, metallic cavity side wall can be directly used as connection sheet.
Embodiment
(1) film circuit board for being provided with fixed plate is obtained：
In circuit substrate (1), circuit length A-A ' cavity is slightly shorter than along gate array (1-1) layout profile cutting
(1-2), form array cavity.Offering cavity (1-2) circuit substrate (1) surface splash-proofing sputtering metal metal-coated membrane, circuit base
Plate (1) front surface is with cavity (1-2) inner surface covered with metal film.Obtained along cavity direction cutting cavity (1-2) and meet size
It is required that thin-film electro roadbed (1-3), be cut cavity both ends circuit substrate form film circuit board (1-3) fixed plate
(1-4).The fixed plate (1-4) on film circuit board (1-3) and four summits forms I-shaped shape, and film circuit board
The front surface of (1-3) is all covered with metal film with side surface.
(2) metallic cavity for being provided with connection sheet matched with film circuit board size is made
According to product size, sheet metal (2) is cut into the specification of needs, marked on sheet metal (2) needed for bending
Track (2-1), (2-2), one and film circuit board (1-3) thickness identical seam (2-3) are cut on four corners.Complete
Afterwards, by corner along seam (2-1) root to 90 degree of infolding, connection sheet (2-4) is formed, then sheet metal (2) is inside along track (2-2)
90 degree of folding, metallic cavity (2-5) is bent into by sheet metal (2).
(3) film circuit board and the metallic cavity are pre-fixed
(welded in film circuit board (1-3) fixed plate (1-4) if necessary to first can also be set in fixed plate (1-4)
Disk) on the fixed material of implantation, fixed material includes but is not limited to glue, solder, wire chamber (2-5) body is positioned over into thin-film electro roadbed
Plate (1-3) surface, the fixed plate (1-4) of alignment thin film circuit substrate (1-3) and the connection sheet (2-4) of metallic cavity (2-5), card
Close metallic cavity (2-5) side and film circuit board (1-3) side, metallic cavity (2-5) and film circuit board (1-3) place
In connection status, solidified using suitable temperature, you can obtain electromagnetic shielding device.
(4) film circuit board and the metallic cavity are fixedly connected with
Fixed material is penetrated into structure gap of the film circuit board (1-3) with metallic cavity (2-5) from bottom device,
Complete the final fixation for meeting reliability requirement.
Different aspect, embodiment, embodiment or the feature of the present invention can be used alone or be used in any combination.
Advantages of the present invention is numerous.Different aspect, embodiment or embodiments can produce one in advantages below
Or multiple advantages.It is one advantage of the present invention that：Film circuit board fixed plate and metallic cavity connection sheet are pre-fixed by point,
It can realize that rapidly and accurately film circuit board is fixed in metallic cavity and form electromagnetic armouring structure.The present invention's is another
Individual advantage is：Metallic diaphragm is deposited on circuit substrate front surface and cavity inner surface simultaneously, after cutting cavity, it is ensured that film
The front surface of circuit substrate and side surface be all covered with metal film, the metal interconnection effect of effective guarantee circuit side and shielding
The continuity of chamber.It is a further advantage of the present invention to：Film circuit board point pre-fixes that simple to operate, cost is low.
The invention is not limited in foregoing embodiment.The present invention, which expands to, any in this manual to be disclosed
New feature or any new combination, and disclose any new method or process the step of or any new combination.
Claims (9)
1. one kind point pre-fixes thin film circuit electromagnetic shielding method for packing, it is characterised in that including：
Step (a) obtains the film circuit board for being provided with fixed plate；
The metallic cavity for being provided with connection sheet matched with the film circuit board size is made in step (b)；
Step (c) pre-fixes the film circuit board and the metallic cavity.
2. a kind of point according to claim 1 pre-fixes thin film circuit electromagnetic shielding method for packing, it is characterised in that described
The positive side surface of film circuit board is covered with metal film.
3. a kind of point according to claim 1 pre-fixes thin film circuit electromagnetic shielding method for packing, its feature is in being set
Being equipped with the method for the film circuit board of fixed plate includes：
Step (a-1) opens up the array cavity for being shorter than circuit length in circuit substrate along gate array；
Step (a-2) is offering circuitous pattern needed for the circuit substrate plating metal on surface film of cavity and making；
The film circuit board that step (a-3) is met the size requirements according to circuitous pattern burst to obtain, it is cut cavity both ends
Circuit substrate form film circuit board fixed plate.
4. a kind of point according to claim 3 pre-fixes thin film circuit electromagnetic shielding method for packing, its feature is in described thin
Film circuit substrate is the rectangular film circuit substrate in I-shaped structure that respectively there is a fixed plate on four summits.
5. a kind of point according to claim 3 pre-fixes thin film circuit electromagnetic shielding method for packing, its feature is in step
(a-2) the circuit substrate surface splash-proofing sputtering metal of cavity is being offered in, is realizing that circuit substrate front surface covers with cavity inner surface
Lid metal film.
6. a kind of point according to claim 1 pre-fixes thin film circuit electromagnetic shielding method for packing, its feature is in the gold
It is identical with the thickness of the film circuit board to belong to height of the cavity bottom away from connection sheet.
7. a kind of point according to claim 1 pre-fixes thin film circuit electromagnetic shielding method for packing, its feature is in described thin
Film circuit substrate pre-fixes method with the metallic cavity to be included：
The metallic cavity is positioned over the film circuit board surface by step (c-1)；
Step (c-2) engages the metallic cavity side and the film circuit board side；Step (c-3) is aligned and pre-fixed
The film circuit board fixed plate and the metallic cavity connection sheet.
8. a kind of point according to claim 1 pre-fixes thin film circuit electromagnetic shielding method for packing, its feature is in can be in institute
State and pad is integrated in film circuit board fixed plate.
9. a kind of point according to claim 1 pre-fixes thin film circuit electromagnetic shielding method for packing, its feature is in the gold
Belong to cavity wall thickness in more than 0.2mmm, metallic cavity side wall can be directly used as connection sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711048409.0A CN107864551B (en) | 2017-10-31 | 2017-10-31 | A kind of point pre-fixes thin film circuit electromagnetic shielding packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711048409.0A CN107864551B (en) | 2017-10-31 | 2017-10-31 | A kind of point pre-fixes thin film circuit electromagnetic shielding packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107864551A true CN107864551A (en) | 2018-03-30 |
| CN107864551B CN107864551B (en) | 2019-11-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711048409.0A Active CN107864551B (en) | 2017-10-31 | 2017-10-31 | A kind of point pre-fixes thin film circuit electromagnetic shielding packaging method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548311A (en) * | 2018-10-15 | 2019-03-29 | 江苏万邦微电子有限公司 | A kind of component radiation hardened method |
| CN111599745A (en) * | 2020-06-01 | 2020-08-28 | 中国电子科技集团公司第十三研究所 | Terahertz diode circuit assembling plate and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101202275A (en) * | 2006-12-13 | 2008-06-18 | 新光电气工业株式会社 | Package having shield case |
| CN105489593A (en) * | 2015-12-24 | 2016-04-13 | 合肥祖安投资合伙企业(有限合伙) | Electromagnetic shield packaging assembly and manufacturing method therefor |
| CN107278025A (en) * | 2017-08-09 | 2017-10-20 | 中国电子科技集团公司第二十九研究所 | A kind of thin film circuit is electromagnetically shielded method for packing |
-
2017
- 2017-10-31 CN CN201711048409.0A patent/CN107864551B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101202275A (en) * | 2006-12-13 | 2008-06-18 | 新光电气工业株式会社 | Package having shield case |
| CN105489593A (en) * | 2015-12-24 | 2016-04-13 | 合肥祖安投资合伙企业(有限合伙) | Electromagnetic shield packaging assembly and manufacturing method therefor |
| CN107278025A (en) * | 2017-08-09 | 2017-10-20 | 中国电子科技集团公司第二十九研究所 | A kind of thin film circuit is electromagnetically shielded method for packing |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548311A (en) * | 2018-10-15 | 2019-03-29 | 江苏万邦微电子有限公司 | A kind of component radiation hardened method |
| CN111599745A (en) * | 2020-06-01 | 2020-08-28 | 中国电子科技集团公司第十三研究所 | Terahertz diode circuit assembling plate and preparation method thereof |
| CN111599745B (en) * | 2020-06-01 | 2022-12-06 | 中国电子科技集团公司第十三研究所 | Terahertz diode circuit assembling plate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107864551B (en) | 2019-11-12 |
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