CN107275423B - A kind of processing method promoting black silion cell transfer efficiency - Google Patents

A kind of processing method promoting black silion cell transfer efficiency Download PDF

Info

Publication number
CN107275423B
CN107275423B CN201710419442.3A CN201710419442A CN107275423B CN 107275423 B CN107275423 B CN 107275423B CN 201710419442 A CN201710419442 A CN 201710419442A CN 107275423 B CN107275423 B CN 107275423B
Authority
CN
China
Prior art keywords
processing method
transfer efficiency
cell transfer
silion cell
black silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710419442.3A
Other languages
Chinese (zh)
Other versions
CN107275423A (en
Inventor
王英超
徐卓
王红芳
李锋
王振
张建旗
陈志军
刘莹
刘志强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yingli Energy China Co Ltd
Original Assignee
Yingli Energy China Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yingli Energy China Co Ltd filed Critical Yingli Energy China Co Ltd
Priority to CN201710419442.3A priority Critical patent/CN107275423B/en
Publication of CN107275423A publication Critical patent/CN107275423A/en
Application granted granted Critical
Publication of CN107275423B publication Critical patent/CN107275423B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0236Special surface textures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0216Coatings
    • H01L31/02161Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02167Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/02168Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0236Special surface textures
    • H01L31/02363Special surface textures of the semiconductor body itself, e.g. textured active layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264Inorganic materials
    • H01L31/028Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Sustainable Energy (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The present invention relates to technical field of solar batteries, specifically disclose a kind of processing method promoting black silion cell transfer efficiency.The processing method includes at least following steps:It takes after making herbs into wool black silicon original piece to be put into mixed acid solution to be cleaned, cleaning process requires to be not accompanied by bubbling in slot;It is cleaned washing rear black silicon original piece and being put into pure water, cleaning process requires in rinse bath with being bubbled;It is subsequently placed into hydrofluoric acid solution and cleans;It places into pure water and cleans, cleaning process requires in rinse bath with bubbling;The black silicon chip that finally drying optimizes to surface texture in drying tank.The processing method provided by the present invention, change black silicon face structure using cleaning, improve reflectivity, promote battery efficiency, with technological process, simple, technical conditions require the low and links process time short, production cost is reduced, the characteristics of effectively raising the transformation efficiency of battery, be conducive to large-scale industrial production.

Description

A kind of processing method promoting black silion cell transfer efficiency
Technical field
The invention belongs to technical field of solar batteries, and in particular to a kind of processing side promoting black silion cell transfer efficiency Method.
Background technology
Black silicon refers to that can absorb the lower semi-conducting material of most of visible light, reflectivity, because of these characteristics, black silicon Compared with general silicon materials, photoelectric conversion efficiency can be substantially improved, so the application prospect of the black silicon technology of photovoltaic art is very It is important.
Currently, the preparation method of black silicon mainly has two methods of dry and wet.Dry method include laser ablation and react from Son etching, wet method refer to metal catalyst solution etching.It is also very low that two kinds of preparation methods obtain all very big reflectivity of black silicon surface area, Short circuit current can be effectively promoted, but the increase of black silicon surface area can impact passivation technology, surface recombination is serious, makes Open-circuit voltage declines, and cannot finally battery conversion efficiency be made to improve.Therefore, how to take into account surface texture and reduce surface recombination, It is present the technical issues of being badly in need of solving.However, prior art flow is complicated, the process time for cleaning link is longer, is produced into This height is unfavorable for large-scale industrial production.
Invention content
For technological process complexity, the process time for cleaning link is longer, and production cost is high, is unfavorable for large-scale industry The problem of production, provides a kind of processing method promoting black silion cell transfer efficiency.
In order to solve the above technical problems, the technical solution used in the present invention is:
A kind of processing method promoting black silion cell transfer efficiency, includes at least following steps:
(1)The black silicon original piece after making herbs into wool is started the cleaning processing using mixed acid solution, is required in rinse bath not when cleaning With bubbling;
(2)The black silicon original piece handled by step (1) is started the cleaning processing using pure water, cleaning process requires rinse bath In be bubbled;
(3)Black silicon original piece by step (2) processing is put into hydrofluoric acid solution and is started the cleaning processing;
(4)Using pure water, to step (3), treated that black silicon original piece starts the cleaning processing, and cleaning process requires in rinse bath With bubbling;
(5)Processing will be dried by the black silicon original piece of step (4) processing.
Further, the step(1)In, cleaning temperature is 15-25 DEG C, scavenging period 10s-300s.
Further, the mixed acid solution is mixed by hydrofluoric acid and nitric acid.
Further, the volume ratio of hydrofluoric acid and nitric acid is 1 in the mixed acid:60-70.
Further, a concentration of 30-37% of quality before the hydrofluoric acid mixing;Mass concentration 50- before the nitric acid mixing 65%。
Further, the step(2)In, the temperature of pure water is 20-25 DEG C, scavenging period 2-8min.
Further, the step(3)In, hydrofluoric acid mass concentration is 5-9%.
Further, the step(3)In, scavenging period 1-2min.
Further, the step(4)In, the temperature of pure water is 20-25 DEG C, scavenging period 2-8min.
Further, the drying process temperature is 70-90 DEG C, time 10-20min.
It is using advantageous effect caused by above-mentioned technical proposal:A kind of black silion cell transfer efficiency of promotion of the present invention Processing method.Change black silicon face structure using cleaning, improve black silicon face structure, improves reflectivity, reduce table Face is compound, improves the open-circuit voltage Voc of solar cell, short circuit current Isc, be finally reached promoted battery efficiency as a result, having Technological process is simple, technical conditions require the low and links process time short, reduces production cost, effectively raises battery Transformation efficiency, the characteristics of being conducive to large-scale industrial production.
Description of the drawings
Fig. 1 is black silion cell fabrication processing figure according to the present invention.
Fig. 2 is the black silicon wafer surface cleaning process flow chart of the present invention.
Fig. 3 is the surface texture scanning electron microscope (SEM) photograph of the black silicon original piece used in the embodiment of the present invention.
Fig. 4 is the surface texture scanning electron microscope (SEM) photograph of the black silicon chip after the optimization that the embodiment of the present invention is prepared.
Specific implementation mode
With reference to specific embodiment, the present invention is described in further detail.
A kind of processing method promoting black silion cell transfer efficiency of the present invention is selected when being cleaned to black silicon original piece Mixed acid solution, hydrofluoric acid and nitric acid volume ratio are 1 in mixed acid:60-70, hydrofluoric acid concentration reduction can be such that the reaction time prolongs Long, excessive concentration, reaction can be more violent, is difficult to control;It is more acute due to reacting when being cleaned with mixed acid solution It is strong, accelerate the activity of mixed acid solution without starting bubbling function;And in washing, it is to make in slot to start bubbling function Water activity get up, accelerate cleaning.
Embodiment 1
(1)Take the black silicon original piece of making herbs into wool back reflection rate 9% by 2.5L hydrofluoric acid(Concentration 35%)With 150L nitric acid(60%)Group At mixed acid in clean 10s, cleaning process requires to be not accompanied by bubblings in slot, and temperature control is at 20 DEG C;
(2)8min is cleaned washing rear black silicon original piece and being put into pure water, with being bubbled in rinse bath, the temperature control of pure water exists 25℃;
(3)1 min is cleaned in a concentration of 9% hydrofluoric acid solution;
(4)5 min are cleaned washing rear black silicon original piece and being put into pure water, with being bubbled in rinse bath, the temperature control of pure water At 23 DEG C;
(5)20 min are finally dried in 70 DEG C of drying tanks, obtain the black silicon original piece of surface texture optimization.
The black silicon chip after optimization is prepared, black silicon original piece is characterized with the black silicon chip after optimization by scanning electron microscope, as a result As shown in Figure 3 and Figure 4, the black silicon chip surface structure after cleaning has clear improvement.
Embodiment 2
(1)Take the black silicon original piece of making herbs into wool back reflection rate 8% by 2L hydrofluoric acid(Concentration 35%)With 130L nitric acid(50%)Composition Mixed acid in clean 40s, cleaning process requires to be not accompanied by bubblings in slot, and temperature control is at 25 DEG C;
(2)5 min are cleaned washing rear black silicon original piece and being put into pure water, with being bubbled in rinse bath, the temperature control of pure water At 23 DEG C;
(3)2 min are cleaned in a concentration of 5% hydrofluoric acid solution;
(4)8 min are cleaned washing rear black silicon original piece and being put into pure water, with being bubbled in rinse bath, the temperature control of pure water At 20 DEG C;
(5)10min finally is dried in 90 DEG C of drying tanks, obtains the black silicon original piece of surface texture optimization.
Embodiment 3
(1)Take the black silicon original piece of making herbs into wool back reflection rate 10% by 3L hydrofluoric acid(Concentration 37%)With 180L nitric acid(65%)Group At mixed acid in clean 300s, cleaning process requires to be not accompanied by bubblings in slot, and temperature control is at 15 DEG C;
(2)8 min are cleaned washing rear black silicon original piece and being put into pure water, with being bubbled in rinse bath, the temperature control of pure water At 20 DEG C;
(3)1.5 min are cleaned in a concentration of 7% hydrofluoric acid solution;
(4)2 min are cleaned washing rear black silicon chip and being put into pure water, with being bubbled in rinse bath, the temperature control of pure water exists 25℃;
(5)15min finally is dried in 80 DEG C of drying tanks, obtains the black silicon original piece of surface texture optimization.
By the black silicon original piece for the surface texture optimization that above technical scheme is prepared, reflectivity is carried out and conversion is imitated The corresponding test of rate, the results are shown in table below.
It can be obtained by data in table, a kind of processing method promoting black silion cell transfer efficiency of the present invention utilizes cleaning Change black silicon face structure, improve black silicon face structure, improve reflectivity 5%, reduce surface recombination, improves solar cell Open-circuit voltage Voc, short circuit current Isc, the transformation efficiency of battery effectively raises 0.25%-0.30%, and technological process letter Single, technical conditions require the low and links process time short, at low cost, are conducive to large-scale industrial production.
The basic principles, main features and advantages of the present invention have been shown and described above.The technology of the industry Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, the present invention Claimed range is delineated by the appended claims, the specification and equivalents thereof from the appended claims.

Claims (10)

1. a kind of processing method promoting black silion cell transfer efficiency, which is characterized in that include at least following steps:
(1)The black silicon original piece after making herbs into wool is started the cleaning processing using mixed acid solution, requires when cleaning to be not accompanied by rinse bath It is bubbled;
(2)The black silicon original piece handled by step (1) is started the cleaning processing using pure water, cleaning process requires companion in rinse bath With bubbling;
(3)Black silicon original piece by step (2) processing is put into hydrofluoric acid solution and is started the cleaning processing;
(4)Using pure water, to step (3), treated that black silicon original piece starts the cleaning processing, and cleaning process requires adjoint in rinse bath It is bubbled;
(5)Processing will be dried by the black silicon original piece of step (4) processing.
2. a kind of processing method promoting black silion cell transfer efficiency according to claim 1, it is characterised in that:The step Suddenly(1)In, cleaning temperature is 15-25 DEG C, scavenging period 10s-300s.
3. a kind of processing method promoting black silion cell transfer efficiency according to claim 1, it is characterised in that:It is described mixed Acid solution is closed to be mixed by hydrofluoric acid and nitric acid.
4. a kind of processing method promoting black silion cell transfer efficiency according to claim 3, it is characterised in that:It is described mixed It is 1 to close the volume ratio of hydrofluoric acid and nitric acid in acid:60-70.
5. a kind of processing method promoting black silion cell transfer efficiency according to claim 3, it is characterised in that:The hydrogen A concentration of 30-37% of quality before fluoric acid mixing;Mass concentration 50-65% before the nitric acid mixing.
6. a kind of processing method promoting black silion cell transfer efficiency according to claim 1, it is characterised in that:The step Suddenly(2)In, the temperature of pure water is 20-25 DEG C, scavenging period 2-8min.
7. a kind of processing method promoting black silion cell transfer efficiency according to claim 1, it is characterised in that:The step Suddenly(3)In, hydrofluoric acid mass concentration is 5-9%.
8. a kind of processing method promoting black silion cell transfer efficiency according to claim 1, it is characterised in that:The step Suddenly(3)In, scavenging period 1-2min.
9. a kind of processing method promoting black silion cell transfer efficiency according to claim 1, it is characterised in that:The step Suddenly(4)In, the temperature of pure water is 20-25 DEG C, scavenging period 2-8min.
10. a kind of processing method promoting black silion cell transfer efficiency according to claim 1, it is characterised in that:It is described It is 70-90 DEG C to be dried temperature, time 10-20min.
CN201710419442.3A 2017-06-06 2017-06-06 A kind of processing method promoting black silion cell transfer efficiency Active CN107275423B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710419442.3A CN107275423B (en) 2017-06-06 2017-06-06 A kind of processing method promoting black silion cell transfer efficiency

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710419442.3A CN107275423B (en) 2017-06-06 2017-06-06 A kind of processing method promoting black silion cell transfer efficiency

Publications (2)

Publication Number Publication Date
CN107275423A CN107275423A (en) 2017-10-20
CN107275423B true CN107275423B (en) 2018-10-12

Family

ID=60065849

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710419442.3A Active CN107275423B (en) 2017-06-06 2017-06-06 A kind of processing method promoting black silion cell transfer efficiency

Country Status (1)

Country Link
CN (1) CN107275423B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109659392B (en) * 2018-12-05 2020-06-12 中国科学院长春光学精密机械与物理研究所 Method for reducing gold-half contact resistance on microstructure silicon material and microstructure silicon material
CN114029300B (en) * 2021-03-12 2023-03-31 重庆康佳光电技术研究院有限公司 Method for cleaning graphite plate
CN114864744B (en) * 2022-05-05 2024-04-02 普乐新能源科技(泰兴)有限公司 Efficient cleaning method and system for nano silicon slurry

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104505430A (en) * 2014-12-04 2015-04-08 常州大学 High-efficiency polycrystalline black silicon cell
CN105206709A (en) * 2015-10-10 2015-12-30 浙江晶科能源有限公司 Treatment method used for optimizing black silicon surface structure
CN106449373A (en) * 2016-11-30 2017-02-22 中利腾晖光伏科技有限公司 Heterojunction cell texturing and washing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050148198A1 (en) * 2004-01-05 2005-07-07 Technion Research & Development Foundation Ltd. Texturing a semiconductor material using negative potential dissolution (NPD)
JP5724718B2 (en) * 2011-07-25 2015-05-27 株式会社Sumco Method for producing solar cell wafer, method for producing solar cell, and method for producing solar cell module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104505430A (en) * 2014-12-04 2015-04-08 常州大学 High-efficiency polycrystalline black silicon cell
CN105206709A (en) * 2015-10-10 2015-12-30 浙江晶科能源有限公司 Treatment method used for optimizing black silicon surface structure
CN106449373A (en) * 2016-11-30 2017-02-22 中利腾晖光伏科技有限公司 Heterojunction cell texturing and washing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Fabrication of Ozone Bubble Cleaning System and its Application to Clean Silicon Wafers of a Solar Cell;J.K.Yoon et al;《Journal of Electrical Engineering & Technology》;20150131;全文 *

Also Published As

Publication number Publication date
CN107275423A (en) 2017-10-20

Similar Documents

Publication Publication Date Title
CN112542531B (en) Silicon wafer pretreatment and heterojunction battery preparation method
CN107275423B (en) A kind of processing method promoting black silion cell transfer efficiency
CN102343352B (en) Recovery method for solar silicon slice
CN102154711A (en) Monocrystal silicon cleaning liquid and precleaning process
CN107658367A (en) A kind of Wet chemical processing method of hetero-junction solar cell
CN109585583A (en) A kind of process for etching for solar battery sheet production
CN110922970A (en) PERC battery back polishing additive and technology
CN110943144A (en) Texturing and cleaning method for heterojunction battery
CN103700733A (en) Cleaning treatment method of N-type crystalline silicon substrate of solar cell
CN102270702A (en) Rework process for texturing white spot monocrystalline silicon wafer
CN110993724A (en) Texturing and cleaning method for heterojunction solar cell
CN102005504A (en) Silicon wafer fine hair making method capable of improving solar cell conversion efficiency
CN103606595B (en) The recycling of the rear defective Monocrystalline silicon cell piece of sintering and grid line recovery method thereof
CN110137302A (en) The cleaning of silicon heterojunction solar battery crystalline silicon substrate and etching method and silicon heterojunction solar battery
CN114864744B (en) Efficient cleaning method and system for nano silicon slurry
CN105304765B (en) A kind of silicon heterogenous solar cell and preparation method thereof
CN114351257A (en) Additive for rapid texturing of HIT solar cell and texturing process
CN114292708A (en) Silicon wafer cleaning agent for cleaning solar cell before texturing and use method
CN102593247A (en) Method for preparing solar cell mono-crystalline silicon substrate with smooth pyramid structure on surface
CN108389972A (en) A kind of application of the additive with zwitterion synergistic effect in perovskite solar cell light-absorption layer
CN106981547A (en) A kind of monocrystalline that handles is done over again the method for piece
CN101447530B (en) Process for cleaning sizing agent used for etching silicon dioxide mask
CN107482081B (en) Solar cell, preparation method thereof and solar cell
CN105655445A (en) Surface finish cleaning method for RIE silicon wafer
CN108766869A (en) A kind of silicon chip of solar cell slot type cleaning method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB03 Change of inventor or designer information

Inventor after: Wang Yingchao

Inventor after: Xu Zhuo

Inventor after: Wang Hongfang

Inventor after: Li Feng

Inventor after: Wang Zhen

Inventor after: Zhang Jianqi

Inventor after: Chen Zhijun

Inventor after: Liu Ying

Inventor after: Liu Zhiqiang

Inventor before: Wang Yingchao

Inventor before: Xu Zhuo

Inventor before: Wang Hongfang

Inventor before: Li Feng

Inventor before: Wang Zhen

CB03 Change of inventor or designer information
GR01 Patent grant
GR01 Patent grant