CN107256841A - Rapid thermal annealing machine - Google Patents
Rapid thermal annealing machine Download PDFInfo
- Publication number
- CN107256841A CN107256841A CN201710400260.1A CN201710400260A CN107256841A CN 107256841 A CN107256841 A CN 107256841A CN 201710400260 A CN201710400260 A CN 201710400260A CN 107256841 A CN107256841 A CN 107256841A
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- Prior art keywords
- cooling chamber
- thermal annealing
- rapid thermal
- annealing machine
- cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
Abstract
The present invention proposes a kind of rapid thermal annealing machine, and it includes：Multiple cooling chamber that arrange successively, it is provided with the entrance for inputting material and the outlet for outputting material；And the first refrigerating module of the heat that inlet ambient and the entrance for absorbing from cooling chamber are inputted is arranged on, wherein, the entrance of a cooling chamber in two neighboring cooling chamber is connected with the outlet of another cooling chamber.The temperature difference of two neighboring cooling chamber can be further improved using this design, substrate is quickly cooled to realize, so as to reduce the cost of rapid thermal annealing machine by reducing the quantity mode of cooling chamber.
Description
Technical field
The present invention relates to a kind of rapid thermal annealing machine, more particularly to a kind of it is used to carry out the quick of rapid thermal annealing to substrate
Thermal annealing machine.
Background technology
LTPS technology (low-temperature polysilicon silicon technology) is gradually ripe and is widely used in making in the high-res products such as mobile phone.
, it is necessary to which the semiconductor devices in array substrate carries out quick thermal annealing process, example when making array base palte using LTPS technology
Such as in Activation (activation), Dehydrogenation (dehydrogenation) and Pre-compaction (preshrunk) process stage
It is required to carry out quick thermal annealing process.
Rapid thermal annealing is generally completed in rapid thermal annealing machine, and the shortcoming of existing pipeline system rapid thermal annealing machine exists
In：Mutually connected by each chamber in the inner, high temperature side temperature and low temperature side temperature inequality, array are easily caused in temperature descending section
Array base palte is easily caused when substrate is by temperature descending section and shrinks uneven；Simultaneously as each chamber is communicated, this is just difficult to
Significantly cool, be unfavorable for processing procedure adjustment and reduce cost by reducing the quantity of chamber.
The content of the invention
For above-mentioned technical problem, the purpose of the present invention is：Array base palte shrinks evenly when completing rapid thermal annealing；
The cost of manufacture of reduction rapid thermal annealing machine is realized by reducing chamber quantity.
The present invention proposes a kind of rapid thermal annealing machine, and it includes：Multiple cooling chamber that arrange successively, it is provided with for defeated
Enter the entrance of material and the outlet for outputting material；And be arranged on inlet ambient and be used to absorb the entrance from cooling chamber
First refrigerating module of the heat of input, wherein, the entrance of a cooling chamber in two neighboring cooling chamber cools with another
The outlet of room is connected.
In a specific embodiment, entrance of first refrigerating module around cooling chamber.
In a specific embodiment, first refrigerating module is cooling water pipe.
In a specific embodiment, rapid thermal annealing machine also second including being arranged on around the outlet of cooling chamber is cold
But module, the speed that the second refrigerating module absorbs heat is less than the speed that the first refrigerating module absorbs heat.
In a specific embodiment, the second refrigerating module is around the outlet of cooling chamber.
In a specific embodiment, shown rapid thermal annealing machine also includes outlet and the entrance phase of first cooling chamber
The firing chamber of connection and extended successively from firing chamber to cooling chamber direction all firing chambers and the transport mechanism of cooling chamber, institute
Stating transport mechanism is used to substrate passing through each cooling chamber successively since firing chamber.
In a specific embodiment, the rapid thermal annealing machine also includes being arranged in cooling chamber and positioned at conveyer
Main cooling tube below structure.
In a specific embodiment, the rapid thermal annealing machine also includes being arranged in cooling chamber and positioned at conveyer
Gas outlet that is above structure and setting down, the gas outlet is used to export cooling gas vertically downward.
In a specific embodiment, the cooling chamber is cuboid cavity, and the gas outlet is provided with five, wherein
Four gas outlets are set respectively close to the corner of cooling chamber, and a remaining gas outlet is arranged on the middle part of four gas outlets, if
Put the outlet speed that the outlet speed in the gas outlet at middle part is more than any of remaining four gas outlet gas outlet.
In a specific embodiment, it is additionally provided with and is arranged at the top of the cooling chamber and in level in the cooling chamber
Multiple temp controlling heaters arranged in arrays on face, from Way out of the entrance of cooling chamber to cooling chamber, Temperature controlled heater
Heating power in reduction trend.
After the technical scheme in the present invention, hot-air is from during the entrance input of cooling chamber, and the first refrigerating module can be fast
Speed cools to it, and this reduces the temperature that entrance side leans in cooling chamber so that in the temperature and cooling chamber of cooling chamber's entrance side
Quite, thus, contraction of the material in cooling chamber is evenly for the temperature of other parts.So just can further it improve accordingly
The temperature difference of two neighboring cooling chamber, is quickly cooled to realize to substrate, so as to the quantity by reducing cooling chamber
Mode reduce the cost of rapid thermal annealing machine.
Brief description of the drawings
The invention will be described in more detail below based on embodiments and refering to the accompanying drawings.Wherein：
Fig. 1 be one embodiment of the present of invention in rapid thermal annealing machine schematic top plan view；
Fig. 2 be one embodiment of the present of invention in the first cooling chamber schematic elevation view.
In the accompanying drawings, identical part uses identical reference.Accompanying drawing is not drawn according to actual ratio.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in figure 1, rapid thermal annealing machine 1 is pipelined fabric.Rapid thermal annealing machine 1 includes heating zone 2, with heating up
The adjacent cooling area 3 in area 2 and the transport mechanism 6 for sequentially passing through heating zone 2 and cooling area 3.Transport mechanism 6 is used to transport thing
Material, will make material pass sequentially through heating zone 2 and cooling area 3.In the present embodiment, the material is the substrate 5 of rectangle, the substrate 5
It can be array base palte.Substrate 5 is rapidly heated when by heating zone 2, for example, be promoted to 1000 DEG C, substrate 5 is passing through drop
By fast cooling during warm area 3, for example, it is down to room temperature.
The heating zone 2 of rapid thermal annealing machine 1 includes multiple firing chambers 21 arranged successively.Firing chamber 21 is configured to cuboid
Chamber.Warming heater (not shown) is provided with each firing chamber 21.Warming heater be used for substrate 5 is heated with
So that the temperature of substrate 5 is improved.Warming heater is arranged on the top of firing chamber 21.Warming heater can be infrared heating
Device.Warming heater is provided with multiple, and the top of firing chamber 21 is arranged in array-like.Each warming heater can be controlled individually
Make and realize the collapsed shape that substrate 5 is adjusted according to the shape need of substrate 5.Firing chamber 21 is provided with entrance 22 and outlet
23.The entrance 22 of firing chamber 21 is used for input substrate 5, and the outlet of firing chamber 21 is used for output substrate 5.In two adjacent heatings
In room 21, the outlet of previous firing chamber 21 and the entrance of latter firing chamber 21 are mutually connected.
As shown in Fig. 2 the cooling area 3 of rapid thermal annealing machine 1 includes multiple cooling chamber 31 arranged successively.The structure of cooling chamber 31
Make as rectangular fluid chamber.The cooling component for cooling to substrate 5 is provided with cooling chamber 31.Cooling chamber 31 is provided with entrance
38 and outlet 39.Entrance 38 and outlet 39 are separately positioned on the relative two side wall of cooling chamber 31.The entrance of cooling chamber 31
The horizontally extending strip in cross section is configured to outlet.The entrance 38 of cooling chamber 31 is used for input substrate 5, cooling
The outlet 39 of room 31 is used for output substrate 5.In adjacent Liang Ge cooling chamber 31, the outlet of previous cooling chamber 31 with it is latter
The entrance of cooling chamber 31 is mutually connected.The outlet 23 of last firing chamber 21 and first cooling in cooling area 3 in heating zone 2
The entrance 38 of room 31 is interconnected.
Transport mechanism 6 sequentially passes through each firing chamber 21 and cooling chamber 31.Transport mechanism 6 extends along direction conveying base
Plate.In the present embodiment, transport mechanism 6 is drum conveying line.Transport mechanism 6 is arranged on each firing chamber 21 and cooling chamber 31
Bottom.Transport mechanism 6 includes multiple driving drums 61 and drive device.It is multiple in each firing chamber 21 and cooling chamber 31
Driving drum 61 is arranged at the bottom of each chamber.Drive device is used to drive multiple driving drums 61 to same direction to turn
It is dynamic.In cooling chamber 31, transport mechanism 6 extends to the outlet of cooling chamber from the entrance of cooling chamber 31.Substrate 5 is usually carried at
In pallet 4, pallet 4, which is placed on driving drum 61, to be transmitted roller 61 and drives.Transport mechanism 6 will carry the pallet 4 of substrate 5
When passing sequentially through firing chamber 21, the temperature of substrate 5 is raised successively.Transport mechanism 6 passes sequentially through the pallet 4 for carrying substrate 5
During cooling chamber 31, the temperature of substrate 5 is reduced successively.The pallet 4 for carrying substrate 5 is transported to some cooling chamber by transport mechanism 6
It can be stayed for some time after in 31 in the cooling chamber 31 so that the reduction certain amplitude of substrate 5 (such as 100 DEG C), is then conveyed again
Go out the cooling chamber 31.
Cooling component includes the first refrigerating module 32 being arranged on around the entrance 38 of cooling chamber 31.First refrigerating module 32
For absorbing the heat from the entrance input of cooling chamber 31.Hot-air is from during the input of the entrance of cooling chamber 31, the first refrigerating module
32 can cool rapidly to it, and this reduces the temperature that entrance side leans in cooling chamber 31 so that the temperature of the entrance side of cooling chamber 31
Suitable with the temperature of other parts in cooling chamber 31, thus, contraction of the substrate 5 in cooling chamber 31 is evenly.First cooling mould
Block 32 is preferably cooling water pipe.Coolant supply apparatus injects coolant into cooling water pipe.Coolant is led in cooling water pipe
It is out-of-date to take away the heat that the entrance of cooling chamber 31 is persistently inputted.Preferably, the first refrigerating module 32 is set around the entrance of cooling chamber 31
Put.So, the middle part of the first refrigerating module 32 forms a passage, and the passage can be by carrying the pallet 4 of substrate 5, simultaneously
It can be cooled when thermal current is by the passage.
Cooling component also includes the second refrigerating module 33 being arranged on around the outlet of cooling chamber 31.Second refrigerating module 33 is inhaled
The speed for receiving heat is less than the speed that the first refrigerating module 32 absorbs heat.Second refrigerating module 33 is used to absorb the cooling chamber 31
Outlet side heat so that the temperature of the entrance side of cooling chamber 31 and outlet side is closer.Thus, substrate 5 is in cooling chamber 31
Shrink more uniform.Second refrigerating module 33 is preferably cooling water pipe.Coolant supply apparatus injects cooling into cooling water pipe
Liquid.Coolant in cooling water pipe by when take away the heat in the exit of cooling chamber 31.Preferably, the second refrigerating module 33 is surround
The outlet of cooling chamber 31 is set.So, the middle part of the second refrigerating module 33 forms a passage, and the passage can be by carrying base
The pallet 4 of plate 5, while can be cooled when thermal current is by the passage, so it is avoided that heat is output into next cooling chamber
31。
The component that cools also includes main cooling tube 34.Main cooling tube 34 is connected with coolant supply apparatus, coolant supply
Device is used to input coolant into main cooling tube 34.Main cooling tube 34 is cooling passage, and the coolant can be water.Master is cold
But pipe 34 is arranged on the bottom of transport mechanism 6, and positioned at the central region of the lower section of cooling chamber 31.The main arrangement Man Gai of cooling tube 34 areas
Domain.Main cooling tube 34 tortuous extension in the region, for example, S-type extension in the horizontal plane.Main cooling tube 34 is used for cooling
The cooling of the lower section of room 31.Main cooling tube 34 is mainly cooled down from the lower section of pallet 4 to the substrate 5 in pallet 4 and pallet 4.
The specific heat capacity of coolant is generally larger, and cooling is carried out to the lower space of cooling chamber 31 using main cooling tube 34 can reduce whole cooling
Temperature fluctuation in room 31.
The component that cools also includes air cooled lamp group 35.Air cooled lamp group 35 includes air inlet pipe 36 and escape pipe 37.Air inlet pipe 36
For inputting cooling gas into cooling chamber 31.Cooling gas is preferably nitrogen.Escape pipe 37 is used for the gas in cooling chamber 31
Body discharges to maintain air pressure balance in cooling chamber 31.Air inlet pipe 36 is arranged on the top of cooling chamber 31 and extended downwardly.Air inlet pipe
36 gas outlet is arranged on the top of transport mechanism 6, outlet mouth down, and gas outlet is used to blow vertically downwards.Carrying
The pallet 4 for having substrate 5 is transported to the outlet of air inlet.Escape pipe 37 is arranged on the bottom of cooling chamber 31, in the present embodiment,
Escape pipe 37 is arranged on the lower section of main cooling tube 34.Air inlet pipe 36 is blown to cause substrate from the top of substrate 5 to substrate 5
5 coolings.The temperature for the reduction substrate 5 that surface of the cooling gas along substrate 5 in air inlet pipe 36 can be exceedingly fast when flowing fast through, and
The speed of the various pieces temperature of substrate 5 reduction is more uniform, while being also avoided that pollution substrate 5 using air-cooled.Preferably, air inlet
Pipe 36 is at least provided with five, and an air inlet pipe 36 is arranged on the middle part of cooling chamber 31, and remaining four air inlet pipe 36 is separately positioned on
On four angles of cooling chamber 31, the air flow rate that passes through of air inlet pipe 36 for being arranged on middle part is more than in remaining four any one and entered
The air flow rate of tracheae 36.So, gas outlet 80 is provided with five, wherein four gas outlets 80 are respectively close to the four of cooling chamber 31
Angle is set, and a remaining gas outlet 80 is arranged on the middle part of four gas outlets 80, is arranged on the outlet of the gas outlet 80 at middle part
Speed is more than the outlet speed of any of remaining four gas outlet 80 gas outlet 80.Four air inlet pipe 36 on corner can be distinguished
Auxiliary heat dissipation is carried out to four angles of substrate 5 so that the cooling rate everywhere on substrate 5 is evenly.The air inlet pipe 36 at middle part is defeated
The Wind Volume gone out can realize panel fast cooling, at the same also the air-flow on whole substrate 5 is guided so that air-flow be all from
Spread to the surrounding of substrate 5 at the middle part of substrate 5, it is to avoid form turbulent flow on the substrate 5 and cause substrate 5 cools uneven.
Multiple temp controlling heaters 7, such as 16 are additionally provided with each cooling chamber 31.Multiple temp controlling heaters 7 are arranged on
The top of cooling chamber 31.Multiple temp controlling heaters 7 are in rectangular arrangement in the horizontal plane.Temp controlling heater 7 is preferred to use infrared
Heater.Temp controlling heater 7 is radiated straight down in heating.So, when substrate 5 is laid under temp controlling heater 7
Fang Shi, one piece of region that the heat radiation of each temp controlling heater 7 is irradiated on substrate 5.From the entrance of cooling chamber 31 to cooling
On the direction of the outlet of room 31, the heating power of temp controlling heater 7 is in the trend reduced.So, temp controlling heater 7 can reduce drop
Greenhouse 31 inlet temperature is high and cooling greenhouse outlet temperature is low and the desuperheat degree of irregularity of substrate 5 brought.
Although by reference to preferred embodiment, invention has been described, is not departing from the situation of the scope of the present invention
Under, various improvement can be carried out to it and part therein can be replaced with equivalent.Especially, as long as in the absence of structure punching
Prominent, the every technical characteristic being previously mentioned in each embodiment can combine in any way.The invention is not limited in text
Disclosed in specific embodiment, but all technical schemes including falling within the scope of the appended claims.
Claims (10)
1. a kind of rapid thermal annealing machine, for carrying out rapid thermal annealing to substrate, it is characterised in that including：
Multiple cooling chamber that arrange successively, it is provided with the entrance for inputting material and the outlet for outputting material；And
It is arranged on the first refrigerating module of the heat that inlet ambient and the entrance for absorbing from cooling chamber are inputted；
Wherein, the entrance of a cooling chamber in two neighboring cooling chamber is connected with the outlet of another cooling chamber.
2. rapid thermal annealing machine according to claim 1, it is characterised in that the first refrigerating module enters around cooling chamber
Mouthful.
3. rapid thermal annealing machine according to claim 1 or 2, it is characterised in that first refrigerating module is cooling water
Pipe.
4. rapid thermal annealing machine according to claim 1 or 2, it is characterised in that rapid thermal annealing machine also includes being arranged on
The second refrigerating module around the outlet of cooling chamber, the speed that the second refrigerating module absorbs heat absorbs less than the first refrigerating module
The speed of heat.
5. rapid thermal annealing machine according to claim 4, it is characterised in that the second refrigerating module goes out around cooling chamber
Mouthful.
6. rapid thermal annealing machine according to claim 1 or 2, it is characterised in that shown rapid thermal annealing machine also includes
Firing chamber and extended all liters successively from firing chamber to cooling chamber direction that mouth and the entrance of first cooling chamber are connected
Greenhouse and the transport mechanism of cooling chamber；
The transport mechanism is used to material passing through each cooling chamber successively since firing chamber.
7. rapid thermal annealing machine according to claim 6, it is characterised in that the rapid thermal annealing machine also includes being arranged on
Main cooling tube in cooling chamber and below transport mechanism.
8. rapid thermal annealing machine according to claim 6, it is characterised in that the rapid thermal annealing machine also includes being arranged on
Gas outlet that is in cooling chamber and above transport mechanism and setting down；
The gas outlet is used to export cooling gas vertically downward.
9. rapid thermal annealing machine according to claim 8, it is characterised in that the material is the substrate of rectangle, the drop
Greenhouse is cuboid cavity；
The gas outlet is provided with five, wherein four gas outlets are set respectively close to the corner of cooling chamber, remaining one goes out
Gas port is arranged on the middle part of four gas outlets；
The outlet speed for being arranged on the gas outlet at middle part is more than the outlet speed of any of remaining four gas outlet gas outlet.
10. rapid thermal annealing machine according to claim 6, it is characterised in that be additionally provided with and be arranged in the cooling chamber
The cooling chamber top and multiple temp controlling heaters arranged in arrays in the horizontal plane；
From Way out of the entrance of cooling chamber to cooling chamber, the heating power of Temperature controlled heater is in the trend reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710400260.1A CN107256841B (en) | 2017-05-31 | 2017-05-31 | Quick thermal annealing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710400260.1A CN107256841B (en) | 2017-05-31 | 2017-05-31 | Quick thermal annealing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107256841A true CN107256841A (en) | 2017-10-17 |
| CN107256841B CN107256841B (en) | 2020-07-03 |
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ID=60028235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710400260.1A Active CN107256841B (en) | 2017-05-31 | 2017-05-31 | Quick thermal annealing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107256841B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1973365A (en) * | 2004-05-12 | 2007-05-30 | 微传科技有限公司 | System for heat treatment of semiconductor device |
| US20110254208A1 (en) * | 2010-04-14 | 2011-10-20 | Babcock & Wilcox Technical Services Y-12, Llc | Heat treatment furnace |
| CN103503123A (en) * | 2011-05-03 | 2014-01-08 | 泰拉半导体株式会社 | In-line heat treatment device |
| CN105800920A (en) * | 2014-12-31 | 2016-07-27 | 中国科学院广州能源研究所 | Heat treatment device for thermochromic coating of flaky substrate |
-
2017
- 2017-05-31 CN CN201710400260.1A patent/CN107256841B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1973365A (en) * | 2004-05-12 | 2007-05-30 | 微传科技有限公司 | System for heat treatment of semiconductor device |
| US20110254208A1 (en) * | 2010-04-14 | 2011-10-20 | Babcock & Wilcox Technical Services Y-12, Llc | Heat treatment furnace |
| CN103503123A (en) * | 2011-05-03 | 2014-01-08 | 泰拉半导体株式会社 | In-line heat treatment device |
| CN105800920A (en) * | 2014-12-31 | 2016-07-27 | 中国科学院广州能源研究所 | Heat treatment device for thermochromic coating of flaky substrate |
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| Publication number | Publication date |
|---|---|
| CN107256841B (en) | 2020-07-03 |
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