CN107251163A - Conductive material and connection structural bodies - Google Patents
Conductive material and connection structural bodies Download PDFInfo
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- CN107251163A CN107251163A CN201680010595.6A CN201680010595A CN107251163A CN 107251163 A CN107251163 A CN 107251163A CN 201680010595 A CN201680010595 A CN 201680010595A CN 107251163 A CN107251163 A CN 107251163A
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- scolding tin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/06—Polythioethers from cyclic thioethers
- C08G75/08—Polythioethers from cyclic thioethers from thiiranes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
Abstract
A kind of conductive material of present invention offer, transparent excellent, the excellent heat resistance of solidfied material of its solidfied material, therefore it is not easy to change.The conductive material of the present invention has multiple electroconductive particles, Thermocurable compound and the thermal curing agents of scolding tin included in the outer surface part of conductive part, and the Thermocurable compound includes the Thermocurable compound with thiiranes group and triazine skeleton.
Description
Technical field
The present invention relates to a kind of conductive material for including the electroconductive particle with scolding tin.Moreover, it relates to a kind of
Use the connection structural bodies for having above-mentioned conductive material.
Background technology
The anisotropic conductive material such as anisotropic conductive paste and anisotropic conductive film is well known.With regard to above-mentioned each
For anisotropy conductive material, electroconductive particle is dispersed in adhesive.
In order to obtain various connection structural bodies, above-mentioned anisotropic conductive material has been used for such as flexible printing substrate
With the connection (COF (Chipon of the connection (FOG (Filmon Glass)) of glass substrate, semiconductor chip and flexible printing substrate
Film)), the connection (COG (Chipon Glass)) of semiconductor chip and glass substrate and flexible printing substrate and glass ring
Connection (FOB (Filmon Board)) of oxygen substrate etc..
Utilizing electricity of the above-mentioned anisotropic conductive material to such as electrode of flexible printing substrate and glass epoxy substrate
When pole is electrically connected, configuration includes the anisotropic conductive material of epoxy conductive particle on glass epoxy substrate.Then,
Lamination flexible printing substrate, and heated and pressurizeed.Thus, solidified anisotropic conductive material, and via conduction
Property particle electrode being electrically connected, so as to obtain connection structural bodies.
As an example of above-mentioned anisotropic conductive material, recorded in following patent documents 1 a kind of each to different
Property conductive material, its contain electroconductive particle and will not be completed under the fusing point of the electroconductive particle solidification resin component.Make
For above-mentioned electroconductive particle, specifically, it can enumerate：Tin (Sn), indium (In), bismuth (Bi), silver-colored (Ag), copper (Cu), zinc (Zn), lead
(Pb), the alloy of cadmium (Cd), gallium (Ga), the silver-colored metal such as (Ag) and thallium (Tl) or these metals.
Recorded in patent document 1：By high in the fusing point than above-mentioned electroconductive particle, and the solidification of above-mentioned resin component
At a temperature of will not completing, the resin heating stepses heated to anisotropic conductive resin；With make above-mentioned resin component consolidate
The resin component curing schedule of change, being electrically connected electrode.In addition, the figure of useful patent document 1 described in patent document 1
Temperature distribution history shown in 8 is installed., will not be complete at a temperature of anisotropic conductive resin is heated in patent document 1
Into in the resin component of solidification, electroconductive particle is melted.
There is a kind of splicing tape disclosed in following patent documents 2, it is included：Resin bed containing heat-curing resin, weldering
Glass putty and curing agent, above-mentioned solder powder and above-mentioned curing agent are present in above-mentioned resin bed.The splicing tape is membranaceous, is not paste
Shape.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2004-260131 publications
Patent document 2：WO2008/023452A1
The content of the invention
The technical problems to be solved by the invention
In the anisotropic conductive paste of conventional solder powder or the electroconductive particle containing surface with soldering-tin layer,
Sometimes solidfied material is transparent low.Also, the heat resistance of solidfied material is low sometimes, the solidfied material under high temperature changes colour.
It is an object of the present invention to provide a kind of conductive material, transparent excellent, the heat resistance of solidfied material of its solidfied material
It is excellent therefore not easy to change.In addition, it is an object of the present invention to provide a kind of use the attachment structure for having above-mentioned conductive material
Body.
Technical scheme for solving technical problem
According to the wide in range aspect of the present invention there is provided a kind of conductive material, a kind of conductive material, it is included：
There is multiple electroconductive particles, Thermocurable compound and the heat cure of scolding tin in the outer surface part of conductive part
Agent, the Thermocurable compound includes the Thermocurable compound with thiiranes group and triazine skeleton.
In certain particular aspects of the conductive material of the present invention, the heat cure with thiiranes group and triazine skeleton
Property compound fusing point be more than 140 DEG C.
The present invention conductive material certain particular aspects, the conductive material include with thiiranes group and three
The different Thermocurable compound of the Thermocurable compound of piperazine skeleton.
In certain particular aspects of the conductive material of the present invention, the acid number of the electroconductive particle is more than 0.1mg/KOH,
Below 10mg/KOH.
In certain particular aspects of the conductive material of the present invention, the conductive material contains fluxing agent.
In certain particular aspects of the conductive material of the present invention, the fluxing agent is with amide groups and aromatic backbone
Fluxing agent, or the fluxing agent have an amide groups, and are carboxylic acid or carboxylic acid anhydrides and the change containing amino that pKa is less than 9.5
The reactant of compound.
In certain particular aspects of the conductive material of the present invention, the fluxing agent is solid at 25 DEG C.
In certain particular aspects of the conductive material of the present invention, the conductive material contains carbodiimide compound.
In certain particular aspects of the conductive material of the present invention, the electroconductive particle is scolding tin particle.
In certain particular aspects of the conductive material of the present invention, the conductive material, which contains, is not adhered to the electric conductivity
The insulating properties particle of particle surface.
In certain particular aspects of the conductive material of the present invention, the average grain diameter of the electroconductive particle is more than 1 μm, 40
Below μm.
In certain particular aspects of the conductive material of the present invention, the weight % of conductive material 100, the electroconductive particle
Content is more than 10 weight % and below 80 weight %.
It is liquid at 25 DEG C, the conductive material is electroconductive paste in certain particular aspects of the conductive material of the present invention
Agent.
According to the wide in range aspect of the present invention there is provided a kind of connection structural bodies, it includes：Surface has at least one first electricity
First connecting object part of pole；Surface has the second connecting object part of at least one second electrode；Described first is connected
The connecting portion that object Part and the second connecting object part are connected is connect, the material of the connecting portion is described conduction
Material, the first electrode and the second electrode realize electrical connection by the solder sections in the connecting portion.
In certain particular aspects of the connection structural bodies of the present invention, along the first electrode, the connecting portion and described the
When the stack directions of two electrodes observes the mutually opposing part of the first electrode and the second electrode, in the described first electricity
More than 50% in the area 100% of pole and the mutually opposing part of the second electrode, it is configured with the scolding tin in the connecting portion
Portion.
The conductive material of the invention effect present invention has multiple electric conductivity of scolding tin included in the outer surface part of conductive part
Particle, Thermocurable compound, thermal curing agents, above-mentioned Thermocurable compound are included with thiiranes group and triazine skeleton
Thermocurable compound, therefore, transparent excellent, the excellent heat resistance of solidfied material of solidfied material, thus it is not easy to change.
Brief description of the drawings
Fig. 1 is to schematically show the connection structural bodies obtained using the conductive material of an embodiment of the invention
Profile.
Fig. 2 (a)~(c) is for illustrating that the conductive material using an embodiment of the invention manufactures connection structural bodies
Method an example each operation profile.
Fig. 3 is the profile for the variation for representing connection structural bodies.
Fig. 4 is the profile for the first case for representing the electroconductive particle available for conductive material.
Fig. 5 is the profile for the second case for representing the electroconductive particle available for conductive material.
Fig. 6 is the profile of the 3rd for representing the electroconductive particle available for conductive material.
Description of symbols
1st, 1X ... connection structural bodies
2 ... first connecting object parts
2a ... first electrodes
3 ... second connecting object parts
3a ... second electrodes
4th, 4X ... connecting portions
4A, 4XA ... solder sections
4B, 4XB ... solidfied material portion
11 ... conductive materials
11A ... scolding tin particle (electroconductive particle)
11B ... Thermocurable compositions
21 ... electroconductive particles (scolding tin particle)
31 ... electroconductive particles
32 ... substrate particles
33 ... conductive parts (conductive part with scolding tin)
The conductive parts of 33A ... second
33B ... solder sections
41 ... electroconductive particles
42 ... solder sections
Embodiment
Hereinafter, the details of the present invention is illustrated.
(conductive material)
The conductive material of the present invention contains multiple electroconductive particles and adhesive.Above-mentioned electroconductive particle has conductive part.
Above-mentioned electroconductive particle has scolding tin in the outer surface part of conductive part.Scolding tin is contained in conductive part, is a part for conductive part
Or all.Above-mentioned adhesive is the composition in addition to electroconductive particle for being contained in above-mentioned conductive material.
The conductive material of the present invention contains Thermocurable composition as above-mentioned adhesive.Above-mentioned Thermocurable composition contains heat
Curability compound and thermal curing agents.
In the conductive material of the present invention, above-mentioned Thermocurable compound includes the heat with thiiranes group and triazine skeleton
Curability compound.
In the present invention, due to possessing above-mentioned composition, it is thus possible to improve the transparency of solidfied material, and due to solid
The excellent heat resistance of compound, therefore, also can not be easy to change even if solidfied material is exposed under high temperature.
Also, in the present invention, even if electrode width is narrow, the scolding tin in electroconductive particle can also be efficiently configured to
On electrode.In the case where electrode width is narrow, there is the tendency for being difficult the scolding tin of electroconductive particle to be gathered on electrode, but
In the present invention, even if electrode width is narrow, scolding tin can also be fully gathered on electrode.In the present invention, on due to possessing
The composition stated, therefore in the case of being electrically connected electrode, the scolding tin in electroconductive particle is easily located at opposed up and down
Electrode between, the scolding tin in electroconductive particle can be efficiently configured on electrode (line).In addition, in the present invention, electrode
When width is wide, the scolding tin in electroconductive particle is further efficiently configured on electrode.
In addition, a part for the scolding tin in electroconductive particle is difficult to be configured on the region (interval) for not forming electrode,
The amount for being configured at the scolding tin in the region for not forming electrode can be made less.In the present invention, it can make to be not at opposed
Interelectrode scolding tin is effectively moved between opposed electrode.It is thus possible to improve interelectrode conducting reliability.Moreover, can
To prevent interelectrode electrical connection adjacent on the horizontal side that can not be attached, insulating reliability can be improved.
And, in the present invention it is possible to improve the heat resistance of the solidfied material of conductive material.Particularly in optical semiconductor device
In the case of using conductive material, generated heat in light irradiation, the solidfied material of conductive material is exposed under high temperature.The present invention
Conductive material due to the excellent heat resistance of solidfied material, therefore optical semiconductor device can be preferred for.Especially because using
Thermocurable compound with thiiranes group and triazine skeleton, therefore, the heat resistance of the solidfied material of conductive material are improved.
In addition, in the present invention it is possible to improve the refractive index of the solidfied material of conductive material.Particularly in the present invention, by
In Thermocurable compound of the use with thiiranes group and triazine skeleton, therefore, the refractive index of the solidfied material of conductive material
Improve.From the viewpoint of the refractive index of solidfied material for further improving conductive material, preferably above-mentioned Thermocurable compound
Comprising the Thermocurable compound with triazine skeleton, more preferably comprising the Thermocurable with thiiranes group and triazine skeleton
Compound, in the present invention, above-mentioned Thermocurable compound include the Thermocurable with thiiranes group and triazine skeleton
Compound.The refractive index of above-mentioned Thermocurable compound is preferably more than 1.75, and more preferably more than 1.8, preferably less than 1.9,
More preferably less than 1.85.When the refractive index of above-mentioned Thermocurable compound is more than above-mentioned lower limit, can further it improve
The refractive index of the solidfied material of conductive material.
The refractive index of above-mentioned Thermocurable compound can use the accurate refractometers of KALNEW to be measured.As above-mentioned
KALNEW precision refractometers, for example, can be used " KPR-3000 " of Shimadzu Scisakusho Ltd's manufacture.
And, in the present invention it is possible to reduce the water absorption rate of the solidfied material of conductive material.Particularly in the present invention, by
There is the Thermocurable compound of thiiranes group and triazine skeleton in use, therefore the water absorption rate of the solidfied material of conductive material becomes
It is low.From the viewpoint of the further water absorption rate of the solidfied material of reduction conductive material, preferably above-mentioned Thermocurable compound bag
Containing the Thermocurable compound with triazine skeleton, more preferably comprising the Thermocurable with thiiranes group and triazine skeleton
Compound, in the present invention, above-mentioned Thermocurable compound include the Thermocurable chemical combination with thiiranes group and triazine skeleton
Thing.The water absorption rate of above-mentioned Thermocurable compound is preferably less than 2%, and more preferably less than 1.5%.Above-mentioned Thermocurable chemical combination
When the water absorption rate of thing is below the above-mentioned upper limit, the water absorption rate of the solidfied material of conductive material can be further reduced.Above-mentioned thermosetting
The lower limit of the water absorption rate of the property changed compound is not particularly limited.The water absorption rate of above-mentioned Thermocurable compound can for 0.1% with
On.From the viewpoint of the further water absorption rate of the solidfied material of reduction conductive material, preferably above-mentioned Thermocurable compound
Water absorption rate is relatively low.
The water absorption rate of above-mentioned Thermocurable compound can be measured as follows.
Being thermally cured property compound 5g is put into moisture meter, and the weight after being dried 5 hours at 105 DEG C is measured,
It is possible thereby to calculate water absorption rate.As above-mentioned moisture meter, for example, " MOC63u " of Shimadzu Scisakusho Ltd's manufacture can be used.
And, in the present invention it is possible to prevent interelectrode dislocation.In the present invention, conductive material is being configured at
On the first connecting object part on surface during overlapping second connecting object part, in the electrode and second of the first connecting object part
In the state of the alignment of the electrode of connecting object part deviates, even in the first connecting object part and the second connecting object part
In the case of overlapping, it can also be deviateed and corrected, and the electrode to the first connecting object part and the second connection pair
As the electrode of part is attached (self alignment effect).
In order that scolding tin is further efficiently configured on electrode, above-mentioned conductive material is liquid preferably at 25 DEG C,
Preferably conductive paste.In order to which scolding tin is further efficiently configured on electrode, above-mentioned conductive material is viscous at 25 DEG C
It is preferably more than 10Pas to spend (η 25), more preferably more than 50Pas, more preferably more than 100Pas, is preferably
Below 800Pas, more preferably below 600Pas, more preferably below 500Pas.Above-mentioned viscosity (η 25) can be with
Suitably adjusted according to the species and use level of gradation composition.In addition, by the use of filler, viscosity can be made higher.
Above-mentioned viscosity (η 25) such as can use E types viscosimeter (Toki Sangyo Co., Ltd. manufacture " TVE22L "),
It is measured under conditions of 25 DEG C and 5rpm.
Above-mentioned conductive material can be used as conductive paste and conducting film etc..Above-mentioned conductive paste is preferably that anisotropy is led
Electric paste, above-mentioned conducting film is preferably anisotropic conductive film.Scolding tin from by electroconductive particle is further effectively matched somebody with somebody
From the viewpoint of being placed on electrode, above-mentioned conductive material is preferably conductive paste.Above-mentioned conductive material is preferred for the electricity of electrode
Connection.Above-mentioned conductive material is preferably circuit connection material.
Hereinafter, each composition for being contained in above-mentioned conductive material is illustrated.
(electroconductive particle)
Above-mentioned electroconductive particle the electrode of connecting object part being electrically connected.Above-mentioned electroconductive particle is in conductive part
Outer surface part there is scolding tin.Above-mentioned electroconductive particle can be the scolding tin particle formed by scolding tin.Above-mentioned scolding tin particle exists
The outer surface part of conductive part has scolding tin.The core of above-mentioned scolding tin particle and the outer surface part of conductive part are by scolding tin
Formed.Above-mentioned scolding tin particle is the core of above-mentioned scolding tin particle and the outer surface of electric conductivity is the particle of scolding tin.It is above-mentioned
Electroconductive particle can have substrate particle and this be configured at conductive part on the surface of substrate particle.In this case, it is above-mentioned
Electroconductive particle has scolding tin in the outer surface part of conductive part.
It should be noted that compared with having used the situation of above-mentioned scolding tin particle, having used and having possessed what is do not formed by scolding tin
In the case of the electroconductive particle of substrate particle and the solder sections being configured on the surface of substrate particle, electroconductive particle is difficult to gather
Combine on electrode, the mutual scolding tin zygosity of electroconductive particle is low, and accordingly, there exist the electroconductive particle being moved on electrode is easy
The tendency being moved to outside electrode, the tendency that there is the inhibition of interelectrode dislocation also step-down.Therefore, above-mentioned electroconductive particle
The scolding tin particle preferably formed by scolding tin.
From the viewpoint of the generation for connecting resistance and effectively suppressing hole from connection structural bodies is effectively reduced,
It is preferred that there is carboxyl or amino in the outer surface (outer surface of scolding tin) of above-mentioned electroconductive particle, preferably there is carboxyl, preferably deposit
In amino.It is preferred that in the outer surface (outer surface of scolding tin) of above-mentioned electroconductive particle via Si-O keys, ehter bond, ester bond or following formula
(X) represent group and be covalently bonded with the group containing carboxyl or amino.Group containing carboxyl or amino can contain carboxylic
Both base and amino.It should be noted that in following formula (X)s, right part and left part represent to be bonded position.
[chemical formula 1]
There is hydroxyl on the surface of scolding tin.Compared with using the situation of the bondings such as other coordinate bonds (chelate coordination), lead to
Crossing makes the hydroxyl be closed with the radicals covalent bonds containing carboxyl, can form stronger bonding, therefore, it can obtain that electricity can be reduced
The connection resistance of interpolar and the electroconductive particle for suppressing hole generation.
In above-mentioned electroconductive particle, it can not contained in speciation of the surface of scolding tin with the group containing carboxyl
Coordination bonding, can also not contain the bonding being coordinated based on chelate.
Connection resistance from connection structural bodies is effectively reduced, and effectively from the viewpoint of the generation of suppression hole,
Above-mentioned electroconductive particle preferably use with can be with hydroxyl reaction functional group, and with carboxyl or amino compound (it is following,
Sometimes referred to as compound X), by making above-mentioned to obtain with the hydroxyl reaction on the functional group of hydroxyl reaction and the surface of scolding tin
Arrive.In above-mentioned reaction, covalent bond is formed.By making the hydroxyl on scolding tin surface and above-mentioned in above-claimed cpd X can be with hydroxyl
The functional group reactionses of reaction, can be readily derived and be covalently bonded with the conduction of the group containing carboxyl or amino on scolding tin surface
Property particle, can also obtain being covalently bonded with the group containing carboxyl or amino via ehter bond or ester bond on the surface of scolding tin
Scolding tin particle.By making above-mentioned functional group that can be with hydroxyl reaction and the hydroxyl reaction on above-mentioned scolding tin surface, above-mentionedization can be made
Compound X is chemically bound in the surface of scolding tin with the form of covalent bond.
As above-mentioned functional group that can be with hydroxyl reaction, hydroxyl, carboxyl, ester group and carbonyl etc. can be enumerated.It is preferred that hydroxyl or
Carboxyl.Above-mentioned can be able to be hydroxyl with the functional group of hydroxyl reaction, or carboxyl.
As with can be with the functional group of hydroxyl reaction compound, can enumerate：Levulic acid, glutaric acid, glycolic, amber
Amber acid, malic acid, oxalic acid, malonic acid, adipic acid, 5- ketone caproic acid, 3- hydracrylic acids, 4-Aminobutanoicacid, 3- mercaptopropionic acids, 3- mercaptos
Base isobutyric acid, 3- methylpropanethioates, 3- phenylpropionic acids, 3- phenylisobutyrics, 4-phenylbutyrate, capric acid, dodecylic acid, 14
Alkanoic acid, pentadecanoic acid, hexadecanoic acid, palmitoleic acid, Heptadecanoic acide, stearic acid, oleic acid, octadecenoic acid, linoleic acid, (9,
12,15)-leukotrienes, nonadecylic acid, arachidic acid, decane diacid and dodecanedioic acid etc..It is preferred that glutaric acid or glycolic.It is above-mentioned
With independent a kind can be used with the compound of the functional group of hydroxyl reaction, two or more can also be applied in combination.Above-mentioned tool
Having can be preferably the compound with least one carboxyl with the compound of the functional group of hydroxyl reaction.
Above-claimed cpd X preferably there is fluxing agent to act on, the shape that above-claimed cpd X is preferably bonded on scolding tin surface
Under state there is fluxing agent to act on.The oxide-film on scolding tin surface and the surface of electrode can be removed with fluxing agent action compound
Oxide-film.Carboxyl has fluxing agent effect.
As with fluxing agent action compound, it can enumerate：Levulic acid, glutaric acid, glycolic, butanedioic acid, 5- ketone oneself
Acid, 3- hydracrylic acids, 4-Aminobutanoicacid, 3- mercaptopropionic acids, 3- mercaptoisobutyric acids, 3- methylpropanethioates, 3- phenylpropionic acids, 3-
Phenylisobutyric and 4-phenylbutyrate etc..It is preferred that glutaric acid or glycolic.It is above-mentioned that there is fluxing agent action compound can use
Independent a kind, two or more can also be applied in combination.
Connection resistance from connection structural bodies is effectively reduced, and effectively from the viewpoint of the generation of suppression hole,
Above-mentioned in above-claimed cpd X can be preferably hydroxyl or carboxyl with the functional group of hydroxyl reaction.Above-mentioned in above-claimed cpd X can
Functional group with hydroxyl reaction can be hydroxyl, or carboxyl.It is above-mentioned can be carboxyl with the functional group of hydroxyl reaction
In the case of, above-claimed cpd X preferably has at least two carboxyl.By the part for making compound with least two carboxyl
The hydroxyl reaction on the surface of carboxyl and scolding tin, can obtain and be covalently bonded with the electric conductivity of the group containing carboxyl on the surface of scolding tin
Particle.
The manufacture method of above-mentioned electroconductive particle for example possesses following process：Using electroconductive particle, to electric conductivity grain
Son, with can be mixed with the functional group of hydroxyl reaction and compound, catalyst and the solvent of carboxyl.In above-mentioned electric conductivity grain
In the manufacture method of son, by above-mentioned mixed processes, it can be readily derived and be covalently bonded with the surface of scolding tin containing carboxyl
Group electroconductive particle.
In addition, in the manufacture method of above-mentioned electroconductive particle, electroconductive particle is preferably used, and to electric conductivity grain
It is sub, above-mentioned to have and be mixed simultaneously with the functional group of hydroxyl reaction and compound, above-mentioned catalyst and the above-mentioned solvent of carboxyl
Heating.By mixing and heating process, it can further be readily derived and be covalently bonded with the surface of scolding tin containing carboxyl
Group electroconductive particle.
As above-mentioned solvent, it can enumerate：The alcoholic solvents such as methanol, ethanol, propyl alcohol, butanol or acetone, methyl ethyl ketone, second
Acetoacetic ester, toluene and dimethylbenzene etc..Above-mentioned solvent is preferably organic solvent, more preferably toluene.Above-mentioned solvent can use list
Only a kind, two or more can also be applied in combination.
As above-mentioned catalyst, p-methyl benzenesulfonic acid, benzene sulfonic acid and 10- camphorsulfonic acids etc. can be enumerated.Above-mentioned catalyst is preferred
For p-methyl benzenesulfonic acid.Above-mentioned catalyst can use independent a kind, and two or more can also be applied in combination.
It is preferred that being heated in above-mentioned mixing.Heating-up temperature is preferably more than 90 DEG C, more preferably more than 100 DEG C, excellent
Elect less than 130 DEG C, more preferably less than 110 DEG C as.
Connection resistance from connection structural bodies is effectively reduced, and effectively from the viewpoint of the generation of suppression hole,
Above-mentioned electroconductive particle is obtained preferably through process：Using isocyanate compound, and make above-mentioned isocyanate compound with
The hydroxyl reaction on scolding tin surface.In above-mentioned reaction, covalent bond is formed.By the hydroxyl and above-mentioned isocyanic acid on the surface for making scolding tin
Ester compounds react, and can be readily derived and be covalently bonded with the nitrogen-atoms of the group from NCO on the surface of scolding tin
Electroconductive particle., can be in scolding tin by making above-mentioned isocyanate compound and the hydroxyl reaction on the surface of above-mentioned scolding tin
Surface makes the group from NCO be chemically bonded with the form of covalent bond.
Furthermore it is possible to make silane coupler easily be reacted with the group from NCO.Due to that can hold
Change places and obtain above-mentioned electroconductive particle, therefore, the above-mentioned group containing carboxyl is by using the silane coupler with carboxyl
Reaction and be imported into, or after the reaction of silane coupler has been used, preferably by making the change with least one carboxyl
Compound is imported into being derived from the radical reaction of silane coupler.Above-mentioned electroconductive particle, which is preferably as follows, to be obtained：Using above-mentioned different
Cyanate esters, and make the hydroxyl reaction of above-mentioned isocyanate compound and scolding tin surface, then, make that there is at least one carboxylic
The compound reaction of base.
Connection resistance from connection structural bodies is effectively reduced, and effectively from the viewpoint of the generation of suppression hole,
It is preferred that the above-mentioned compound with least one carboxyl has multiple carboxyls.
As above-mentioned isocyanate compound, it can enumerate：Diphenyl methane -4,4 '-diisocyanate (MDI), six methylenes
Group diisocyanate (HDI), toluene di-isocyanate(TDI) (TDI) and IPDI (IPDI) etc..This can be used
Isocyanate compound beyond a little.React the surface of the compound and scolding tin, then, make residual isocyanate base and with this
Residual isocyanate base has reactivity and the compound with carboxyl is reacted, it is possible thereby to which the group represented via formula (X) exists
Scolding tin surface imports carboxyl.
As above-mentioned isocyanate compound, the chemical combination with unsaturated double-bond and with NCO can be used
Thing.Such as 2- acryloyloxyethyl isocyanates and 2- isocyanatoethyl methacrylates can be enumerated.Make the chemical combination
The NCO of thing reacts on the surface of scolding tin, then, makes have reactivity containing the unsaturated double-bond relative to residual
Functional group and the compound reaction with carboxyl, it is possible thereby to which the group represented via formula (X) imports carboxyl on the surface of scolding tin.
As above-mentioned silane coupler, 3- isocyanates propyl-triethoxysilicane (SHIN-ETSU HANTOTAI silicone plants of formula can be enumerated
" KBE-9007 " of commercial firm's manufacture) and 3- isocyanates the propyl trimethoxy silicane (" Y- of MOMENTIVE companies manufacture
5187 ") etc..Above-mentioned silane coupler can use independent a kind, and two or more can also be applied in combination.
As the above-mentioned compound with least one carboxyl, it can enumerate：Levulic acid, glutaric acid, glycolic, amber
Acid, malic acid, oxalic acid, malonic acid, adipic acid, 5- ketone caproic acid, 3- hydracrylic acids, 4-Aminobutanoicacid, 3- mercaptopropionic acids, 3- sulfydryls
Isobutyric acid, 3- methylpropanethioates, 3- phenylpropionic acids, 3- phenylisobutyrics, 4-phenylbutyrate, capric acid, dodecylic acid, the tetradecane
Acid, pentadecanoic acid, hexadecanoic acid, palmitoleic acid, Heptadecanoic acide, stearic acid, oleic acid, octadecenoic acid, linoleic acid, (9,12,
15)-leukotrienes, nonadecylic acid, arachidic acid, decane diacid and dodecanedioic acid etc..It is preferred that glutaric acid, adipic acid or glycolic.
The above-mentioned compound with least one carboxyl can use independent a kind, and two or more can also be applied in combination.
Using above-mentioned isocyanate compound, and make the hydroxyl reaction of above-mentioned isocyanate compound and scolding tin surface, so
Afterwards, a part of carboxyl and the hydroxyl reaction on scolding tin surface in the compound with multiple carboxyls are made, it is possible thereby to make containing carboxyl
Group residual.
In the manufacture method of above-mentioned electroconductive particle, using electroconductive particle, using isocyanate compound, and make
The hydroxyl reaction of isocyanate compound and scolding tin surface is stated, then, the compound with least one carboxyl is reacted, obtains
The surface bond electroconductive particle of group containing carboxyl of the group represented via above-mentioned formula (X) in scolding tin.Led above-mentioned
In the manufacture method of conductive particles, by above-mentioned process, it can be readily derived to have imported on the surface of scolding tin and contain carboxyl
Group electroconductive particle.
As the specific manufacture method of above-mentioned electroconductive particle, following method can be enumerated.Disperse electroconductive particle
In organic solvent, silane coupler of the addition with NCO.Thereafter, on the surface using the scolding tin of electroconductive particle
The catalysts of hydroxyl and NCO, make silane coupler be covalently bonded to the surface of scolding tin.Then, by making bonding
It is hydrolyzed in the alkoxy of the silicon atom of silane coupler and generates hydroxyl.Make the carboxylic of the compound with least one carboxyl
Base and the hydroxyl reaction of generation.
In addition, as the specific manufacture method of above-mentioned electroconductive particle, following method can be enumerated.Make electroconductive particle
It is scattered in organic solvent, compound of the addition with NCO and unsaturated double-bond.Thereafter, using the weldering of electroconductive particle
The hydroxyl on the surface of tin and the catalysts of NCO, form covalent bond.Thereafter, make with unsaturated double-bond and carboxyl
Compound and the unsaturated double-bond that is imported react.
As the hydroxyl and the catalysts of NCO on the surface of the scolding tin of electroconductive particle, it can enumerate：Tin class
Catalyst (dibutyltin dilaurate etc.), amines catalyst (triethylenediamine etc.), carboxylate catalyst (lead naphthenate, second
Sour potassium etc.) and trialkyl phosphine catalyst (triethyl phosphine etc.) etc..
Connection resistance from connection structural bodies is effectively reduced, and effectively from the viewpoint of the generation of suppression hole,
The above-mentioned compound with least one carboxyl is preferably the compound that following formula (1) is represented.The compound that following formula (1) is represented
With fluxing agent effect.In addition, the compound that following formula (1) is represented in the state of scolding tin surface is directed in there is fluxing agent to make
With.
[chemical formula 2]
In above-mentioned formula (1), X represents functional group that can be with hydroxyl reaction, and R represents the divalent organic group of carbon number 1~5.
The organic group can contain carbon atom, hydrogen atom and oxygen atom.The organic group can be the divalent hydrocarbon of carbon number 1~5
Base.The main chain of above-mentioned organic group is preferably the alkyl of divalent.In organic group, can be bonded on the alkyl of divalent carboxyl or
Hydroxyl.Such as citric acid is included in the compound that above-mentioned formula (1) represents.
The above-mentioned compound with least one carboxyl is preferably the compound that following formula (1A) or following formula (1B) are represented.
The above-mentioned compound with least one carboxyl is preferably the compound that following formula (1A) is represented, more preferably following formula (1B) table
The compound shown.
[chemical formula 3]
In above-mentioned formula (1A), R represents the organic group of the divalent of carbon number 1~5.R and above-mentioned formula in above-mentioned formula (1A)
(1) R in is same.
[chemical formula 4]
In above-mentioned formula (1B), R represents the divalent organic group of carbon number 1~5.R and above-mentioned formula in above-mentioned formula (1B)
(1) R in is same.
It is preferred that the surface bond in scolding tin has the group that following formula (2A) or following formula (2B) are represented.It is preferred that in the table of scolding tin
Face is bonded with the group of following formula (2A) expression, is more preferably bonded with the group of following formula (2B) expression.It should be noted that
In following formula (2A) and following formula (2B), left part represents to be bonded position.
[chemical formula 5]
In above-mentioned formula (2A), R represents the organic group of the divalent of carbon number 1~5.R and above-mentioned formula in above-mentioned formula (2A)
(1) R in is same.
[chemical formula 6]
In above-mentioned formula (2B), R represents the divalent organic group of carbon number 1~5.R and above-mentioned formula in above-mentioned formula (2B)
(1) R in is same.
From the viewpoint of scolding tin wettability of the surface is improved, the molecular weight of the above-mentioned compound with least one carboxyl
Preferably less than 10000, more preferably less than 1000, more preferably less than 500.
It is not polymer in the above-mentioned compound with least one carboxyl, and above-mentioned there is at least one carboxyl
Compound structural formula it is confirmable in the case of, above-mentioned molecular weight means the molecular weight that can be calculated by the structural formula.Separately
Outside, in the case that the above-mentioned compound with least one carboxyl is polymer, it is intended that weight average molecular weight.
From the aspect of the coherency of electroconductive particle can be effectively improved when being conductively connected, above-mentioned electroconductive particle
It is preferred that conductive particle main body and the anionic polymer being configured on the surface of above-mentioned electroconductive particle main body.It is above-mentioned
Electroconductive particle is preferably entered by the way that electroconductive particle main body to be used as to the compound of anionic polymer or anionic polymer
Row is surface-treated and obtained.Above-mentioned electroconductive particle is preferably the compound shape as anionic polymer or anionic polymer
Into surface treatment.Above-mentioned anionic polymer and it can be used respectively individually as the compound of above-mentioned anionic polymer
1 kind, two or more can also be applied in combination.Above-mentioned anionic polymer is the polymer with acidic groups.
As the method being surface-treated with anionic polymer to electroconductive particle main body, it can enumerate using following poly-
Compound makes the side of the carboxyl of anionic polymer and the hydroxyl reaction of electroconductive particle body surfaces as anionic polymer
Method, the polymer is (methyl) acrylate copolymer for for example closing (methyl) acrylic acid copolymer；By dicarboxylic acids and two
Alcohol is synthesized and two ends have the polyester polymers of carboxyl；Obtained by the intermolecular dehydration condensation of dicarboxylic acids and two ends
Polymer of the end with carboxyl；Synthesized by dicarboxylic acids and diamines and two ends have the polyester polymers of carboxyl；And with carboxylic
Base modified polyvinylalcohol (Japan synthesis KCC manufacture " Gohsenex T ") etc..
As the anionicsite of above-mentioned anionic polymer, above-mentioned carboxyl can be enumerated, in addition, toluene sulphur can be enumerated
Acyl group (p-H3CC6H4S (=O)2-), azochlorosulfonate acid ion base (- SO3 -) and phosphate ion base (- PO4 -) etc..
In addition, following methods can be enumerated as other methods of surface treatment：Using with electroconductive particle main body
The functional group that the hydroxyl on surface is reacted, and also there is the compound by the polymerizable functional group of addition, condensation reaction, and
The compound is set to carry out polymerization on the surface of electroconductive particle main body.It is used as the hydroxyl with the surface of electroconductive particle main body
The functional group that base is reacted, can enumerate carboxyl and NCO etc., be used as what is polymerize by addition, condensation reaction
Functional group, can enumerate hydroxyl, carboxyl, amino and (methyl) acryloyl group.
The weight average molecular weight of above-mentioned anionic polymer is preferably more than 2000, and more preferably more than 3000, be preferably
Less than 10000, more preferably less than 8000., can be with when above-mentioned weight average molecular weight is more than above-mentioned lower limit and below the above-mentioned upper limit
An adequate amount of electric charge and fluxing agent are imported on the surface of electroconductive particle.Thus, it can be effectively improved when being conductively connected
The coherency of electroconductive particle, and can effectively remove in the connection of connecting object part the oxide-film on the surface of electrode.
When above-mentioned weight average molecular weight is more than above-mentioned lower limit and below the above-mentioned upper limit, easily in the table of electroconductive particle main body
Anionic polymer is configured on face, the coherency of electroconductive particle can be effectively improved when being conductively connected, can be in electrode
On further effectively configure electroconductive particle.
Above-mentioned weight average molecular weight represents the Weight-average molecular with polystyrene basis determined using gel permeation chromatography (GPC)
Amount.
It polymerize obtained from being surface-treated using the compound as anionic polymer to electroconductive particle main body
The weight average molecular weight of thing can be obtained as follows：The scolding tin in electroconductive particle is melted, is divided using polymer will not be caused
Watery hydrochloric acid of solution etc. removes electroconductive particle, then, determines the weight average molecular weight of the polymer of residual.
Then, on one side referring to the drawings, while the concrete example of explanation electroconductive particle.
Fig. 4 is the profile for the first case for representing the electroconductive particle available for conductive material.
Electroconductive particle 21 shown in Fig. 4 is scolding tin particle.The entirety of electroconductive particle 21 is formed by scolding tin.Electric conductivity grain
The substrate particle that son 21 does not have in core, is not core shell particle.The core of electroconductive particle 21 and the appearance of conductive part
Face part is formed by scolding tin.
Fig. 5 is the profile for the second case for representing the electroconductive particle available for conductive material.
The conduction that electroconductive particle 31 shown in Fig. 5 possesses substrate particle 32 and is configured on the surface of substrate particle 32
Portion 33.Conductive part 33 is coated to the surface of substrate particle 32.Electroconductive particle 31 is led for the surface of substrate particle 32
Coating particles formed by the electric cladding of portion 33.
Conductive part 33 has the second conductive part 33A and solder sections 33B (the first conductive part).Electroconductive particle 31 is in base material grain
Possesses the second conductive part 33A between 32 and solder sections 33B of son.Therefore, electroconductive particle 31 possesses：Substrate particle 32, it is configured at
The second conductive part 33A on the surface of the substrate particle 32 and solder sections 33B being configured on the second conductive part 33A outer surface.
Fig. 6 is the profile of the 3rd for representing the electroconductive particle available for conductive material.
As described above, the conductive part 33 in electroconductive particle 31 has 2 Rotating fields.Electroconductive particle 41 shown in Fig. 6 is made
For the conductive part of individual layer, with solder sections 42.Electroconductive particle 41 possesses：Substrate particle 32 and it is configured at the table of substrate particle 32
Solder sections 42 on face.
As above-mentioned substrate particle, resin particle, the inorganic particulate in addition to metallic, organic inorganic hybridization can be enumerated
Particle and metallic etc..Above-mentioned substrate particle is preferably substrate particle in addition to metal, preferably resin particle, except metal
Inorganic particulate or organic inorganic hybridization particle outside particle.Above-mentioned substrate particle can be copper particle.Above-mentioned substrate particle can
Can be core shell particle with core and the shell that is configured on the surface of the core.Above-mentioned core can be organic core, and above-mentioned shell can be with
For inorganic shell.
As the resin for forming above-mentioned resin particle, various organic matters are preferably used.As for forming above-mentioned tree
The resin of fat granule, can be enumerated for example：Polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, poly- isobutyl
The vistanexes such as alkene, polybutadiene；The acrylic resin such as polymethyl methacrylate and PMA；Makrolon,
Polyamide, phenol formaldehyde resin, melamine resin, benzoguanamin formaldehyde resin, urea-formaldehyde resin, phenolic resin,
Melmac, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, poly- pair
PET, polysulfones, polyphenylene oxide, polyacetals, polyimides, polyamidoimide, polyether-ether-ketone, polyether sulfone, two
Vinyl benzene polymer and divinylbenzene analog copolymer etc..As above-mentioned divinylbenzene analog copolymer etc., two can be enumerated
Vinyl benzene-styrol copolymer and divinylbenzene-(methyl) acrylate copolymer etc..Due to can be by above-mentioned resin particle
The hardness of son is readily controlled in preferred scope, and therefore, the resin for forming above-mentioned resin particle is preferably to make a kind or 2
There is the polymer that the polymerizable monomer of ethylenically unsaturated group is aggregated into more than kind.
Polymerize the polymerizable monomer with ethylenically unsaturated group and in the case of obtaining above-mentioned resin particle,
There is the polymerizable monomer of ethylenically unsaturated group as this, the monomer of non-crosslinked property and the monomer of bridging property can be enumerated.
As the monomer of above-mentioned non-crosslinked property, it can enumerate for example：The polystyrene class list such as styrene, α-methylstyrene
Body；The carboxylic monomers such as (methyl) acrylic acid, maleic acid, maleic anhydride；(methyl) methyl acrylate, (methyl) acrylic acid second
Ester, (methyl) propyl acrylate, (methyl) butyl acrylate, (methyl) 2-EHA, (methyl) lauryl
Ester, (methyl) aliphatic acrylate, (methyl) stearyl acrylate ester, (methyl) cyclohexyl acrylate, (methyl) acrylic acid
Isobornyl thiocyanoacetate etc. (methyl) acrylic acid alkyl ester compound；It is (methyl) acrylic acid 2- hydroxyl ethyl esters, (methyl) glycerol acrylate, poly-
(methyl) acrylate compounds containing oxygen atom such as oxygen ethene (methyl) acrylate, (methyl) glycidyl acrylate；
The monomers containing nitrile such as (methyl) acrylonitrile；The vinyl ethers chemical combination such as methyl vinyl ether, ethyl vinyl ether, propyl vinyl ether
Thing；The vinyl acetate ester compounds such as vinyl acetate, vinyl butyrate, vinyl laurate, stearic acid vinyl ester；Ethene, third
The unsaturated hydrocarbons such as alkene, isoprene, butadiene；(methyl) acrylic acid trifluoromethyl ester, the fluorine ethyl ester of (methyl) acrylic acid five, chloroethene
Halogen containing monomers such as alkene, PVF, chlorostyrene etc..
As the monomer of above-mentioned bridging property, it can enumerate for example：Tetramethylol methane four (methyl) acrylate, tetra methylol
Methane three (methyl) acrylate, tetramethylol methane two (methyl) acrylate, trimethylolpropane tris (methyl) acrylic acid
Ester, dipentaerythritol six (methyl) acrylate, dipentaerythritol five (methyl) acrylate, three (methyl) propylene acid glycerols
Ester, two (methyl) glycerol acrylates, (poly-) ethylene glycol two (methyl) acrylate, (poly-) propane diols two (methyl) acrylic acid
Multifunctional (methyl) such as ester, (poly-) tetramethylene glycol two (methyl) acrylate, 1,4- butanediols two (methyl) acrylate
Acrylate compounds；Triallyl (different) cyanurate, triallyl trimellitate, divinylbenzene, diallyl are adjacent
Phthalic acid ester, diallyl acrylamide, diallyl ether, γ-(methyl) propenyloxy group propyl trimethoxy silicane, front three
Monomers of silane-containing such as epoxide silicyl styrene, vinyltrimethoxy silane etc..
The term of " (methyl) acrylate " represents acrylate and methacrylate.The term of " (methyl) acrylic acid "
Represent acrylic acid and methacrylic acid.The term of " (methyl) acryloyl group " represents acryloyl group and methylacryloyl.
It is polymerize the above-mentioned polymerizable monomer with ethylenically unsaturated group by using known method, can be obtained
To above-mentioned resin particle.As this method, it can enumerate for example：Suspension polymerisation is carried out in the presence of radical polymerization initiator
Method；And using noncrosslinking kind of particle, the method that monomer swell is made together with radical polymerization initiator and is polymerize
Deng.
In the case where above-mentioned substrate particle is inorganic particulate or organic inorganic hybridization particle except metal, as shape
Into the inorganic matter of substrate particle, silica, aluminium dioxide, barium titanate, zirconium oxide and carbon black etc. can be enumerated.Above-mentioned inorganic matter is excellent
Choosing is not metal.As the particle formed by above-mentioned silica, it is not particularly limited, can enumerates for example by making that there are 2
The silicon compound of water-disintegrable alkoxysilyl above is hydrolyzed and forms cross-linking polymer particle, then, according to need
Particle obtained from being burnt till.As above-mentioned organic inorganic hybridization particle, it can enumerate for example by the alkoxy by crosslinking
Silyl polymer and the organic inorganic hybridization particle of acrylic resin formation etc..
Above-mentioned organic inorganic hybridization particle is preferably the organic inorganic hybridization particle of core-shell-type, and it has core and is configured at this
Shell on the surface of core.Above-mentioned core is preferably to have movement.Above-mentioned shell is preferably inorganic shell.From being effectively reduced interelectrode connection
From the viewpoint of resistance, above-mentioned substrate particle is preferably the inorganic shell for having movement with being configured on the above-mentioned surface for having a movement
Organic inorganic hybridization particle.
As for forming the above-mentioned material for having a movement, the resin etc. for forming above-mentioned resin particle can be enumerated.
As the material for forming above-mentioned inorganic shell, the inorganic matter for forming above-mentioned substrate particle can be enumerated.For
Form the material preferably silica of above-mentioned inorganic shell.Above-mentioned inorganic shell on the surface of above-mentioned core preferably by utilizing colloidal sol
Gel method makes metal alkoxide that husk is made, then, the husk is sintered and is formed.Above-mentioned metal alkoxide is preferably silanol
Salt.Above-mentioned inorganic shell is preferably formed by silane alkoxide.
The particle diameter of above-mentioned core is preferably more than 0.5 μm, more preferably more than 1 μm, preferably less than 100 μm, more preferably
Less than 50 μm, more preferably less than 40 μm, most preferably particularly preferably less than 30 μm, less than 15 μm.The grain of above-mentioned core
When footpath is more than above-mentioned lower limit and below the above-mentioned upper limit, the electric conductivity still more preferably for interelectrode electrical connection can obtain
Substrate particle, can be preferred for the purposes of electroconductive particle by particle.For example, the particle diameter of above-mentioned core be above-mentioned lower limit more than and
When below the above-mentioned upper limit, in the case of using above-mentioned electroconductive particle being attached electrode, electroconductive particle and electrode
Contact area fully become big, and substrate particle surface formed conductive part when, be difficult to form the electroconductive particle of cohesion.
In addition, the interelectrode interval connected via electroconductive particle will not be excessive, and conductive part is difficult from substrate particle
Sur-face peeling.
For the particle diameter of above-mentioned core, in above-mentioned core in the case of just spherical, it is intended that diameter, is just spherical in above-mentioned core
In the case of shape in addition, it is intended that maximum gauge.In addition, the particle diameter of core means to enter core using arbitrary particle size determination device
Average grain diameter obtained from row is determined.It can for example utilize and employ the graphical analysis after laser light scattering, resistance change, shooting
Deng principle particle size distribution machine.
The thickness of above-mentioned shell is preferably more than 100nm, more preferably more than 200nm, preferably less than 5 μm, more preferably 3
Below μm.When the thickness of above-mentioned shell is more than above-mentioned lower limit and below the above-mentioned upper limit, it can obtain for interelectrode electrical connection more
Substrate particle, can be preferred for the purposes of electroconductive particle by further preferred electroconductive particle.The thickness of above-mentioned shell is 1
The average thickness of individual substrate particle.By the control of sol-gal process, the thickness of above-mentioned shell can be controlled.
In the case where above-mentioned substrate particle is metallic, as the metal for forming the metallic, it can enumerate
Silver, copper, nickel, silicon, gold and titanium etc..In the case where above-mentioned substrate particle is metallic, the metallic is preferably copper particle.
But, above-mentioned substrate particle is not preferably metallic.
The particle diameter of above-mentioned substrate particle is preferably more than 0.1 μm, more preferably more than 1 μm, more preferably 1.5 μm with
On, particularly preferably more than 2 μm, preferably less than 100 μm, more preferably less than 50 μm, be still more preferably less than 40 μm,
More preferably less than 20 μm, be still more preferably less than 10 μm, particularly preferably less than 5 μm, most preferably 3 μm with
Under.When the particle diameter of above-mentioned substrate particle is more than above-mentioned lower limit, the contact area of electroconductive particle and electrode becomes big, therefore, can
Further to improve interelectrode conducting reliability, the electricity connected via electroconductive particle can be further reduced
The connection resistance of interpolar.When the particle diameter of above-mentioned substrate particle is below the above-mentioned upper limit, electroconductive particle is easily compressed,
Interelectrode connection resistance can be further reduced, and can further reduce interelectrode interval.
For the particle diameter of above-mentioned substrate particle, in substrate particle in the case of just spherical, diameter to be represented, in base material grain
In the case that son is not just spherical, maximum gauge is represented.
The particle diameter of above-mentioned substrate particle is particularly preferably more than 2 μm, less than 5 μm.The particle diameter of above-mentioned substrate particle be 2 μm with
When in upper, less than 5 μm of scope, can further reduce interelectrode interval, even and if thicken the thickness of conductive layer, can also
Obtain small electroconductive particle.
On the surface of above-mentioned substrate particle formed conductive part method, and on the surface of above-mentioned substrate particle or on
Formation solder sections method on the surface of the second conductive part is stated to be not particularly limited.It is used as the above-mentioned conductive part of formation and above-mentioned solder sections
Method, can enumerate for example：The method that conflicts using the method for electroless plating, using electric plating method, using physics, utilize
The method of mechanico-chemical reaction, the method using physical vapor deposition or physical absorption and containing metal dust or metal will be contained
The paste coating of powder and adhesive is in the method on the surface of substrate particle etc..Preferably by electroless plating, plating or physics
Conflict method.As the method for above-mentioned utilization physical vapor deposition, the side such as vacuum evaporation, ion plating and ion sputtering can be enumerated
Method.In addition, in the method that above-mentioned utilization physics conflicts, such as Theta composer can be used, and (Co., Ltd.'s moral longevity works
It is manufactured) etc..
Fusing point of the fusing point of above-mentioned substrate particle preferably than above-mentioned conductive part and above-mentioned solder sections is high.Above-mentioned substrate particle
Fusing point is preferably greater than 160 DEG C, more preferably above 300 DEG C, further preferably more than 400 DEG C, particularly preferably more than 450 DEG C.Need
Illustrate, the fusing point of above-mentioned substrate particle can be less than 400 DEG C.The fusing point of above-mentioned substrate particle can be less than 160 DEG C.
The softening point of above-mentioned substrate particle is preferably more than 260 DEG C.The softening point of above-mentioned substrate particle can be less than 260 DEG C.
Above-mentioned electroconductive particle can have the solder sections of individual layer.Above-mentioned electroconductive particle can have the conductive part of multilayer
(solder sections, the second conductive part).That is, can be with the conductive part of more than 2 layers of lamination in above-mentioned electroconductive particle.It is above-mentioned to lead
In the case that electric portion is more than 2 layers, above-mentioned electroconductive particle preferably has scolding tin in the outer surface part of conductive part.
Above-mentioned scolding tin is preferably the metal (low-melting-point metal) below 450 DEG C of fusing point.Above-mentioned solder sections are preferably fusing point 450
Metal level (low-melting-point metal layer) below DEG C.Above-mentioned low-melting-point metal layer is the layer containing low-melting-point metal.Above-mentioned electric conductivity
Scolding tin in particle is preferably the metallic (low-melting-point metal particle) below 450 DEG C of fusing point.Above-mentioned low-melting-point metal particle
For the particle containing low-melting-point metal.The low-melting-point metal represents the metal that fusing point is less than 450 DEG C.The fusing point of low-melting-point metal
Preferably less than 300 DEG C, more preferably less than 160 DEG C.In addition, the scolding tin in above-mentioned electroconductive particle preferably comprises tin.It is above-mentioned
In scolding tin in solder sections in the contained weight % of metal 100 and in above-mentioned electroconductive particle in the contained weight % of metal 100,
The content of tin is preferably more than 30 weight % more preferably more than 40 weight %, more preferably more than 70 weight %, especially
Preferably more than 90 weight %.When the content of contained tin is more than above-mentioned lower limit in scolding tin in above-mentioned electroconductive particle, lead
The conducting reliability of conductive particles and electrode is further improved.
It should be noted that the content of above-mentioned tin can use high-frequency inductive coupling plasma body emission spectrophotometer
(" ICP-AES " of Horiba Ltd's manufacture) or fluorescent x-ray analyzer (Shimadzu Scisakusho Ltd's system
" EDX-800HS " made) etc. be measured.
Due to there is the electroconductive particle of above-mentioned scolding tin using the outer surface part in conductive part, scolding tin occur melting and with
Electrode engagement, scolding tin makes conducting between electrode.For example, due to scolding tin and electrode, easily the face of progress contacts rather than a contact, therefore
Connect resistance reduction.In addition, having the electroconductive particle of scolding tin, scolding tin and electrode by using the outer surface part in conductive part
Bond strength improve, as a result, be further not likely to produce the stripping of scolding tin and electrode, conducting reliability is effectively improved.
The low-melting-point metal for constituting above-mentioned solder sections and above-mentioned scolding tin particle is not particularly limited.The low-melting-point metal is preferred
Alloy for tin or containing tin.The alloy can be enumerated：Tin-silver alloy, tin-copper alloy, tin-silver-copper alloy, tin-bismuth alloy electroplating,
Tin-zinc alloy, Sn-In alloy etc..From the aspect of the wetability to electrode is excellent, above-mentioned low-melting-point metal be preferably tin, tin-
Silver alloy, tin-silver-copper alloy, tin-bismuth alloy electroplating, Sn-In alloy.More preferably tin-bismuth alloy electroplating, Sn-In alloy.
The material for constituting above-mentioned scolding tin (solder sections) is preferably based on JIS Z3001：It is 450 DEG C to weld term, liquidus curve
Following filling metal.As the composition of above-mentioned scolding tin, the gold such as containing zinc, gold, silver, lead, copper, tin, bismuth, indium can be enumerated
Category composition.Preferably low melting point and unleaded tin-indium system (117 DEG C of eutectics) or Sn-Bi system (139 DEG C of eutectics).That is, above-mentioned weldering
Tin does not preferably contain lead, is preferably the scolding tin containing tin and indium or the scolding tin containing tin and bismuth.
It can contain to further improve the scolding tin in the bond strength of above-mentioned scolding tin and electrode, above-mentioned electroconductive particle
There are the metals such as nickel, copper, antimony, aluminium, zinc, iron, gold, titanium, phosphorus, germanium, tellurium, cobalt, bismuth, manganese, chromium, molybdenum, palladium.In addition, from further carrying
From the viewpoint of the bond strength of high scolding tin and electrode, the scolding tin in above-mentioned electroconductive particle preferably comprise nickel, copper, antimony, aluminium or
Zinc.From the viewpoint of the scolding tin and the bond strength of electrode in further raising solder sections or electroconductive particle, for carrying
In the weight % of scolding tin 100 of the content of these metals of high bond strength in above-mentioned electroconductive particle, preferably 0.0001 weight
Measure more than %, preferably below 1 weight %.
Fusing point of the fusing point of above-mentioned second conductive part preferably than above-mentioned solder sections is high.The fusing point of above-mentioned second conductive part is preferred
More than 160 DEG C, more preferably above 300 DEG C, further preferably more than 400 DEG C, still more preferably more than 450 DEG C, particularly preferably
More than 500 DEG C, most preferably more than 600 DEG C.Melted because the fusing point of above-mentioned solder sections is low, therefore when being conductively connected.On
The second conductive part is stated preferably not melt when being conductively connected.Above-mentioned electroconductive particle preferably makes scolding tin melt and use, and preferably makes
Above-mentioned solder sections are melted and used, and are preferably melted above-mentioned solder sections and above-mentioned second conductive part is melted and is used.Pass through
Make the fusing point of above-mentioned second conductive part higher than the fusing point of above-mentioned solder sections, melt can when being conductively connected only above-mentioned solder sections
Without melting above-mentioned second conductive part.
The absolute value of the difference of the fusing point of the fusing point of above-mentioned solder sections and above-mentioned second conductive part more than 0 DEG C, preferably 5 DEG C with
On, more preferably more than 10 DEG C, more preferably more than 30 DEG C, particularly preferably more than 50 DEG C, most preferably 100 DEG C with
On.
Above-mentioned second conductive part preferably comprises metal.The metal for constituting above-mentioned second conductive part is not particularly limited.As
The metal, can be enumerated for example：Gold, silver, copper, platinum, palladium, zinc, lead, aluminium, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium and cadmium and it
Alloy etc..In addition, as above-mentioned metal, tin-doped indium oxide (ITO) can be used.Above-mentioned metal can use independent 1
Kind, two or more can also be applied in combination.
Above-mentioned second conductive part is preferably nickel dam, palladium layers, layers of copper or layer gold, more preferably nickel dam or layer gold, further excellent
Elect layers of copper as.Electroconductive particle preferably has nickel dam, palladium layers, layers of copper or layer gold, more preferably with nickel dam or layer gold, further excellent
Choosing has layers of copper.By the way that the electroconductive particle with these preferred conductive parts is used for into interelectrode connection, interelectrode company
Connecting resistance further step-down.In addition, solder sections can the further easily shape on the surface of these preferred conductive parts
Into.
The thickness of above-mentioned solder sections is preferably more than 0.005 μm, more preferably more than 0.01 μm, preferably less than 10 μm,
More preferably less than 1 μm, more preferably less than 0.3 μm.The thickness of solder sections be above-mentioned lower limit more than and the above-mentioned upper limit with
When lower, can obtain sufficient electric conductivity, and electroconductive particle will not become it is really up to the mark, electric conductivity grain is made when being attached between electrode
Son is fully deformed.
The average grain diameter of above-mentioned electroconductive particle is preferably more than 0.5 μm, more preferably more than 1 μm, more preferably 3
More than μm, preferably less than 100 μm, more preferably less than 50 μm, more preferably less than 40 μm, particularly preferably 30 μm with
Under.When above-mentioned electroconductive particle is more than above-mentioned lower limit and below the above-mentioned upper limit, the scolding tin in electroconductive particle can more enter one
Step is efficiently configured on electrode, and the scolding tin in electroconductive particle is easily more configured between electrode, and conducting reliability is more entered
One step is improved.
" average grain diameter " of above-mentioned electroconductive particle represents number average bead diameter.The average grain diameter of electroconductive particle for example by using
Electron microscope or the arbitrary electroconductive particle of observation by light microscope 50, calculate average value and obtain.
The coefficient of variation of the particle diameter of above-mentioned electroconductive particle is preferably more than 5%, and more preferably more than 10%, be preferably
Less than 40%, more preferably less than 30%., can when the coefficient of variation of above-mentioned particle diameter is more than above-mentioned lower limit and below the above-mentioned upper limit
Further effectively to configure the scolding tin in electroconductive particle on electrode.But, the change of the particle diameter of above-mentioned electroconductive particle
Different coefficient can be less than 5%.
The above-mentioned coefficient of variation (CV values) is represented with following formula.
CV values (%)=(ρ/Dn) × 100
ρ：The standard deviation of the particle diameter of electroconductive particle
Dn：The average value of the particle diameter of electroconductive particle
The shape of above-mentioned electroconductive particle is not particularly limited.The shape of above-mentioned electroconductive particle can be spherical, also may be used
Think the shape beyond flat equal sphere shape.
The acid number of above-mentioned electroconductive particle is preferably more than 0.1mg/KOH, more preferably more than 1mg/KOH, is preferably
Below 10mg/KOH, more preferably below 7mg/KOH.When above-mentioned acid number is more than above-mentioned lower limit and below the above-mentioned upper limit, solidification
The heat resistance of thing is further improved, and the discoloration of solidfied material is further inhibited.
Above-mentioned acid number can be measured as follows.Phenolphthalein is put into ethanol, in having been carried out with 0.1N-KOH
The solution 50ml of sum, is put into electroconductive particle 1g, is disperseed by ultrasonication, then, is titrated with 0.1N-KOH.
In the above-mentioned weight % of conductive material 100, the content of above-mentioned electroconductive particle is preferably more than 1 weight %, more preferably
For more than 2 weight %, particularly preferably more preferably more than 10 weight %, most preferably more than 20 weight %, 30 weights
Measure more than %, more preferably preferably below 80 weight %, more preferably below 60 weight %, below 50 weight %.On
When stating the content of electroconductive particle for more than above-mentioned lower limit and below the above-mentioned upper limit, the scolding tin in electroconductive particle can more be entered
One step is efficiently configured on electrode, and the scolding tin in electroconductive particle is easily more configured between electrode, and conducting reliability is more
Further improve.From the viewpoint of conducting reliability is further improved, the content of preferably above-mentioned electroconductive particle is more.
(Thermocurable compound)
Above-mentioned Thermocurable compound is the compound that can be solidified by heating.As above-mentioned Thermocurable compound,
It can enumerate：Oxetane compound, epoxide, episulfide compound, (methyl) acyclic compound, phenol chemical combination
Thing, amino-compound, unsaturated polyester compound, urethanes, polysiloxane compound and polyimide compound etc..
It is excellent from the viewpoint of making the curability and viscosity of conductive material further good and further improving connection reliability
Ring selection oxygen compound or episulfide compound.Above-mentioned Thermocurable compound can use independent a kind, can also be applied in combination
Two or more.
In the present invention, above-mentioned Thermocurable compound includes the Thermocurable with thiiranes group and triazine skeleton
Compound.By the use of the specific Thermocurable, the transparency raising of solidfied material, the heat resistance of solidfied material is improved.In addition, logical
Crossing above-mentioned Thermocurable compound has triazine skeleton, and the dielectric constant of solidfied material is effectively reduced.
As the Thermocurable compound with triazine skeleton, triazine triglycidyl group ether etc. can be enumerated, can be enumerated day
Produce the manufacture of chemical industry Co., Ltd. TEPIC series (TEPIC-G, TEPIC-S, TEPIC-SS, TEPIC-HP, TEPIC-L,
TEPIC-PAS, TEPIC-VL, TEPIC-UC) etc..The above-mentioned Thermocurable compound with thiiranes group and triazine skeleton can
To be obtained for example, by the epoxy radicals of the above-mentioned Thermocurable compound with triazine skeleton is transformed into thiiranes group.Will
The method that epoxy radicals is transformed to thiiranes group is known.
The fusing point of the above-mentioned Thermocurable compound with thiiranes group and triazine skeleton is preferably more than 140 DEG C, more
Preferably more than 150 DEG C.When above-mentioned fusing point is more than above-mentioned lower limit, electroconductive particle is further efficiently configured to electrode
Between.During the fusing point of the above-mentioned Thermocurable compound with thiiranes group and triazine skeleton is preferably above-mentioned electroconductive particle
It is more than the fusing point of scolding tin.
Above-mentioned Thermocurable compound can be included and the Thermocurable compound with thiiranes group and triazine skeleton
Different Thermocurable compounds.The above-mentioned thermosetting different from the Thermocurable compound with thiiranes group and triazine skeleton
The property changed compound can be the Thermocurable compound without thiiranes group, can be the heat cure without triazine skeleton
Property compound, or epoxide.
As above-mentioned epoxide, aromatic epoxy compound can be enumerated.Preferably resorcinol type epoxide,
The crystallinity epoxides such as naphthalene type epoxide, biphenyl type epoxy compound, diphenyl ketone type epoxide.It is preferred that
Under normal temperature (23 DEG C) it is solid and melting temperature is epoxide below the fusing point of scolding tin.Melting temperature is preferably 100 DEG C
Hereinafter, more preferably less than 80 DEG C, preferably more than 40 DEG C.By using above-mentioned preferred epoxide, in the company of being fitted with
The stage of object Part is connect, viscosity is high, when assigning acceleration by the impact such as transport, the first connecting object portion can be suppressed
The dislocation of part and the second connecting object part, moreover, heat during by solidifying, can substantially reduce the viscosity of conductive material,
The cohesion of scolding tin can be made effectively to carry out.
In the above-mentioned weight % of conductive material 100, the overall content of above-mentioned Thermocurable compound is preferably 20 weight %
More than, more preferably more than 40 weight %, more preferably more than 50 weight %, preferably below 99 weight %, more preferably
For below 98 weight %, particularly preferably more preferably below 90 weight %, below 80 weight %.Above-mentioned Thermocurable
, can be further effective by the scolding tin in electroconductive particle when the content of compound is more than above-mentioned lower limit and below the above-mentioned upper limit
Ground is configured on electrode, further suppresses interelectrode dislocation, further improves interelectrode conducting reliability.From more entering
One step is improved from the viewpoint of impact resistance, and the content of preferably above-mentioned Thermocurable compound is more.
In the above-mentioned weight % of conductive material 100, the above-mentioned Thermocurable compound with thiiranes group and triazine skeleton
Content be preferably more than 10 weight % more preferably more than 20 weight %, preferably below 90 weight %, more preferably 80 weights
Measure below %.The content of the above-mentioned Thermocurable compound with thiiranes group and triazine skeleton for it is more than above-mentioned lower limit and on
When stating below the upper limit, the transparency and heat resistance of solidfied material are effectively improved.
(thermal curing agents)
Above-mentioned thermal curing agents make above-mentioned Thermocurable compound carry out heat cure.As above-mentioned thermal curing agents, have：Imidazoles is consolidated
Agent, phenol cured agent, polythiol hardener, amine hardener, anhydride curing agent, hot cationic initiator (hot cation curing agent)
And hot radical producing agent etc..Above-mentioned thermal curing agents can use independent a kind, and two or more can also be applied in combination.
From the viewpoint of conductive material can be made further promptly to solidify at low temperature, above-mentioned thermal curing agents are preferred
For imidazole curing agent, polythiol hardener or amine hardener.In addition, from improving by above-mentioned Thermocurable compound and above-mentioned thermosetting
From the viewpoint of storage stability when agent is mixed, above-mentioned thermal curing agents are preferably the curing agent of latency.Latency
Curing agent be preferably latency imidazole curing agent, latency polythiol hardener or latency amine hardener.It should be noted that
Above-mentioned thermal curing agents can be coated with polymer substances such as polyurethane resin or polyester resin.
As above-mentioned imidazole curing agent, it is not particularly limited, can enumerates：2-methylimidazole, 2-ethyl-4-methylimidazole,
1- cyano ethyl -2- phenylimidazoles, 1- cyano ethyl -2- phenylimidazoles trimellitate, 2,4- diaminourea -6- [2 '-methyl
Imidazole radicals-(1 ')]-ethyl-s-triazine and 2,4- diaminourea -6- [2 '-methylimidazolyl-(1 ')]-ethyl-s-triazine isocyanide urea
Sour addition product etc..
As above-mentioned polythiol hardener, it is not particularly limited, trimethylolpropane tris -3-thiopropionate, season can be enumerated
Penta four -3-thiopropionate of tetrol and six -3-thiopropionate of dipentaerythritol etc..
The solubility parameter of above-mentioned polythiol hardener is preferably more than 9.5, and preferably less than 12.Above-mentioned solubility parameter profit
Calculated with Fedors methods.For example, the solubility parameter of trimethylolpropane tris -3-thiopropionate is 9.6, two seasons penta 4
The solubility parameter of six -3-thiopropionate of alcohol is 11.4.
As above-mentioned amine hardener, it is not particularly limited, can enumerates：Hexamethylene diamine, eight methylene diamines, ten methylenes
Double (3- aminopropyls) -2,4,8,10- four spiral shell [5.5] hendecanes of base diamines, 3,9-, double (4- aminocyclohexyls) methane,
Phenylenediamine and diamino diphenyl sulfone etc..
As above-mentioned hot cationic initiator (hot cation curing agent), iodine cationoid curing agent, oxygen can be enumerated
Cationoid curing agent and sulfonium cationoid curing agent etc..As above-mentioned iodine cationoid curing agent, double (tertiary fourths of 4- can be enumerated
Base phenyl) iodine hexafluoro phosphite etc..As above-mentioned oxygen cationoid curing agent, trimethyl oxygen tetrafluoro boric acid can be enumerated
Salt etc..As above-mentioned sulfonium cationoid curing agent, three p-methylphenyl sulfonium hexafluoro phosphites etc. can be enumerated.
As above-mentioned hot radical producing agent, it is not particularly limited, azo-compound and organic peroxide etc. can be enumerated.
As above-mentioned azo-compound, azobis isobutyronitrile (AIBN) etc. can be enumerated.As above-mentioned organic peroxide, two uncles can be enumerated
Butylperoxide and methyl-ethyl-ketone peroxide etc..
The reaction start temperature of above-mentioned thermal curing agents is preferably more than 50 DEG C, more preferably more than 70 DEG C, further preferably
For more than 80 DEG C, preferably less than 250 DEG C, more preferably less than 200 DEG C, more preferably less than 150 DEG C, particularly preferably
Less than 140 DEG C.When the reaction start temperature of above-mentioned thermal curing agents is more than above-mentioned lower limit and below the above-mentioned upper limit, scolding tin more enters one
Step is efficiently configured on electrode.The reaction start temperature of above-mentioned thermal curing agents is particularly preferably more than 80 DEG C, less than 140 DEG C.
From the viewpoint of scolding tin is further efficiently configured on electrode, the reaction of above-mentioned thermal curing agents starts temperature
The fusing point spent preferably than the scolding tin in above-mentioned electroconductive particle is high, more preferably high more than 5 DEG C, further preferably high more than 10 DEG C.
The reaction start temperature of above-mentioned thermal curing agents means the temperature that the rise of the exothermal peak in DSC starts.
The content of above-mentioned thermal curing agents is not particularly limited.Relative to overall 100 weight of above-mentioned Thermocurable compound
Part, the contents of above-mentioned thermal curing agents is preferably more than 0.01 parts by weight, more than more preferably 1 parts by weight, preferably 200 parts by weight
Hereinafter, more preferably below 100 parts by weight, below more preferably 75 parts by weight.The content of thermal curing agents is above-mentioned lower limit
During the above, easily cure sufficiently conductive material.When the content of thermal curing agents is below the above-mentioned upper limit, have neither part nor lot in after hardening
The remaining thermal curing agents of solidification are difficult residual, and the heat resistance of solidfied material is further improved.
(fluxing agent)
Above-mentioned conductive paste preferably comprises fluxing agent., can be by scolding tin further effectively by the use of fluxing agent
It is configured on electrode.The fluxing agent is not particularly limited.As fluxing agent, it can use general used in scolding tin engagement etc.
Fluxing agent.
As above-mentioned fluxing agent, it can enumerate for example：Zinc chloride, the mixture of zinc chloride and inorganic halides, zinc chloride and
Mixture, fuse salt, phosphoric acid, the derivative of phosphoric acid, organohalogen compounds, hydrazine, organic acid and rosin of inorganic acid etc..It is above-mentioned fluxing
Agent can use independent a kind, and two or more can also be applied in combination.
As above-mentioned fuse salt, ammonium chloride etc. can be enumerated.As above-mentioned organic acid, lactic acid, citric acid, tristearin can be enumerated
Acid, glutamic acid and glutaric acid etc..As above-mentioned rosin, activation rosin and disactivation rosin etc. can be enumerated.Above-mentioned fluxing agent is preferred
For the organic acid with more than 2 carboxyls, rosin.Above-mentioned fluxing agent can be the organic acid with more than 2 carboxyls, can also
For rosin.By using the organic acid with more than 2 carboxyls, rosin, interelectrode conducting reliability is further improved.
Above-mentioned rosin is the rosin using rosin acid as principal component.Fluxing agent is preferably rosin, more preferably rosin acid.
By using the preferred fluxing agent, interelectrode conducting reliability is further improved.
Above-mentioned fluxing agent is preferably the fluxing agent with amide groups and aromatic backbone, or be preferably with amide groups and
Carboxylic acid or carboxylic acid anhydrides and pKa for the reactant of less than 9.5 compound containing amino fluxing agent.In this case, conduction material
The storage stability of material is improved, and in interelectrode connection, the composition in addition to electroconductive particle is difficult excessive flowing, can be with
Improve bonding force and improve conducting reliability.
Above-mentioned fluxing agent is preferably the fluxing agent with amide groups and aromatic backbone；Preferably also with amide groups,
And be the carboxylic acid or carboxylic acid anhydrides and the reactant of the pKa compounds containing amino for being less than 9.5.Above-mentioned fluxing agent can be independent
It is used singly, or in combination of two or more kinds.
It should be noted that being the compound containing amino that carboxylic acid or carboxylic acid anhydrides are less than 9.5 with pKa in above-mentioned fluxing agent
Reactant in the case of, it is impossible to according to structure or characteristic directly to having used pKa in the compound containing amino of particular range
The scope of reactant be determined.
From making when effectively improving the storage stability of conductive material, being attached between electrode in addition to electroconductive particle
Composition be further difficult from the viewpoint of flowing, above-mentioned fluxing agent preferably at 25 DEG C be solid.
Above-mentioned fluxing agent can for example be obtained by making carboxylic acid or carboxylic acid anhydrides be reacted with the compound containing amino.
As above-mentioned carboxylic acid or carboxylic acid anhydrides, it can enumerate：Butanedioic acid, glutaric acid, adipic acid, pimelic acid, suberic acid and apple
Acid etc..
As the above-mentioned compound containing amino, benzylamine, aniline and diphenylamine etc. can be enumerated.From effectively improving conduction material
The storage stability of material, make the composition in addition to electroconductive particle is not further runny to see when being attached between electrode
Point sets out, and the above-mentioned compound containing amino is preferably aromatic amines compound.
The active temperature (fusing point) of above-mentioned fluxing agent is preferably more than 50 DEG C, more preferably more than 70 DEG C, further preferably
For more than 80 DEG C, preferably less than 200 DEG C, more preferably less than 190 DEG C, be still more preferably less than 160 DEG C, further excellent
Elect less than 150 DEG C as, be still more preferably less than 140 DEG C.The active temperature of above-mentioned fluxing agent be above-mentioned lower limit more than and on
When stating below the upper limit, fluxing agent effect is further effectively played, and scolding tin is further efficiently configured on electrode.It is above-mentioned
The active temperature (fusing point) of fluxing agent is preferably more than 80 DEG C, less than 190 DEG C.The active temperature (fusing point) of above-mentioned fluxing agent is especially
Preferably more than 80 DEG C, less than 140 DEG C.
As the above-mentioned fluxing agent that the active temperature (fusing point) of fluxing agent is more than 80 DEG C, less than 190 DEG C, it can enumerate：Amber
Amber acid (186 DEG C of fusing point), glutaric acid (96 DEG C of fusing point), adipic acid (152 DEG C of fusing point), pimelic acid (104 DEG C of fusing point), suberic acid
Dicarboxylic acids such as (142 DEG C of fusing points), benzoic acid (122 DEG C of fusing point), malic acid (130 DEG C of fusing point) etc..
In addition, the boiling point of above-mentioned fluxing agent is preferably less than 200 DEG C.
From the viewpoint of scolding tin is further efficiently configured on electrode, the fusing point of preferably above-mentioned fluxing agent is than upper
The fusing point height of the scolding tin in electroconductive particle is stated, it is more preferably high more than 5 DEG C, it is further preferably high more than 10 DEG C.
From the viewpoint of scolding tin is further efficiently configured on electrode, the fusing point of preferably above-mentioned fluxing agent is than upper
The reaction start temperature for stating thermal curing agents is high, more preferably high more than 5 DEG C, further preferably high more than 10 DEG C.
Above-mentioned fluxing agent can be scattered in conductive material, can also be attached on the surface of electroconductive particle.
It is higher than the fusing point of scolding tin by the fusing point of fluxing agent, scolding tin can be made effectively to condense in electrode part.This be because
For：In the case of heat being assigned in engagement, the electrode that will be formed on connecting object part and the connecting object portion of electrode perimeter
When the part of part is compared, the thermal conductivity of the connecting object element portion of the thermal conductivity ratio electrode perimeter of electrode part is high, by
This, the quick heating of electrode part.Scolding tin hair in more than electroconductive particle in the stage of the fusing point of scolding tin, electroconductive particle
Raw dissolving, but the fusing point (active temperature) that the oxide film thereon on surface is not up to fluxing agent is formed at, therefore, it is not removed.
Under the state, the temperature of electrode part reaches the fusing point (active temperature) of fluxing agent first, therefore, preferentially comes leading on electrode
The oxide film thereon on the surface of the scolding tin in conductive particles is removed, or using the fluxing agent through overactivation by electroconductive particle
The electric charge on the surface of scolding tin enters to neutralize, thus, and scolding tin can be to carrying out wetting extension on the surface of electrode.Thus, it is possible to make scolding tin
Effectively condense on electrode.
In the above-mentioned weight % of conductive material 100, the content of above-mentioned fluxing agent is preferably more than 0.5 weight % preferably 30
Below weight %, more preferably below 25 weight %.Above-mentioned conductive material can not contain fluxing agent.The content of fluxing agent is upper
When stating more than lower limit and below the above-mentioned upper limit, further it is difficult to form oxide film thereon on the surface of scolding tin and electrode, also, can
Further effectively to remove the oxide film thereon on the surface for being formed at scolding tin and electrode.
(insulating properties particle)
From the interval the connecting object part being attached the solidfied material using conductive material and utilize electric conductivity
Interval between the connecting object part that scolding tin in particle is attached is carried out from the viewpoint of accurately controlling, preferably above-mentioned
Conductive material contains insulating properties particle.In above-mentioned conductive material, above-mentioned insulating properties particle can be not attached to electroconductive particle
Surface.In above-mentioned conductive material, above-mentioned insulating properties particle preferably discretely exists with above-mentioned electroconductive particle.
The average grain diameter of above-mentioned insulating properties particle is preferably more than 10 μm, more preferably more than 20 μm, more preferably
More than 25 μm, preferably less than 100 μm, more preferably more preferably less than 75 μm, less than 50 μm.Above-mentioned substrate particle
When average grain diameter is more than above-mentioned lower limit and below the above-mentioned upper limit, between the connecting object part connected by the solidfied material of conductive material
Interval and by electroconductive particle scolding tin connection connecting object part between interval further become appropriate.
As the material of above-mentioned insulating properties particle, the resin of insulating properties and the inorganic matter of insulating properties etc. can be enumerated.As upper
The resin of insulating properties is stated, can be enumerated as forming the above-mentioned tree that the resin for the resin particle that may be used as substrate particle is enumerated
Fat.As the inorganic matter of above-mentioned insulating properties, it can enumerate as the inorganic of the inorganic particulate that substrate particle is may be used as being formed
The above-mentioned inorganic matter that thing is enumerated.
It is the concrete example of insulative resin as the material of above-mentioned insulating properties particle, can enumerates：TPO, (methyl) third
Olefine acid ester polymer, (methyl) acrylate copolymer, block polymer, thermoplastic resin, the cross-linking agent of thermoplastic resin, heat
Curable resin and water-soluble resin etc..
As said polyolefins class, it can enumerate：Polyethylene, vinyl-vinyl acetate copolymer and ethylene-acrylate are common
Polymers etc..As above-mentioned (methyl) acrylate polymer, it can enumerate：Poly- (methyl) methyl acrylate, poly- (methyl) acrylic acid
Ethyl ester and poly- (methyl) butyl acrylate etc..As above-mentioned block polymer, it can enumerate：Polystyrene, cinnamic acrylic ester
Copolymer, SB types styrene-butadiene block copolymer and SBS types styrene-butadiene block copolymer and they
Hydride etc..As above-mentioned thermoplastic resin, polyvinyl and ethylenic copolymer etc. can be enumerated.It is used as above-mentioned heat cure
Property resin, can enumerate epoxy resin, phenolic resin and melmac etc..As above-mentioned water-soluble resin, it can enumerate：Poly- second
Enol, polyacrylic acid, polyacrylamide, PVP, PEO and methylcellulose etc..It is preferred that water-soluble
Resin, more preferably polyvinyl alcohol.
It is the concrete example of insulating properties inorganic matter as the material of above-mentioned insulating properties particle, silica and organic nothing can be enumerated
Machine hybrid particle etc..As the particle formed by above-mentioned silica, it is not particularly limited, the grain for example obtained as follows can be enumerated
Son：Silicon compound with more than 2 water-disintegrable alkoxysilyls is hydrolyzed and cross-linking polymer particle is formed, so
Afterwards, burnt till as needed.As above-mentioned organic inorganic hybridization particle, the alkoxysilyl for example by being crosslinked can be enumerated
Polymer and the organic inorganic hybridization particle of acrylic resin formation etc..
In the above-mentioned weight % of conductive material 100, the content of above-mentioned insulating properties particle is preferably more than 0.1 weight %, more excellent
Elect as more than 0.5 weight %, preferably below 10 weight %, more preferably below 5 weight %.Above-mentioned conductive material can be free of
There is insulating properties particle.When the content of insulating properties particle is more than above-mentioned lower limit and below the above-mentioned upper limit, by the solidification of conductive material
Thing connection connecting object part between interval and by electroconductive particle scolding tin connection connecting object part between
Every further becoming appropriate.
(carbodiimide compound)
From the viewpoint of the transparency and heat resistance for effectively improving solidfied material, preferably above-mentioned conductive material contains carbonization
Diimine compounds.
As above-mentioned carbodiimide compound, it can enumerate：1,3- DICs, double (2,6- diisopropyls
Phenyl) carbodiimide, 1- ethyls -3- (3- dimethylaminopropyls) carbodiimide hydrochloride, 1- (3- (dimethylamino) third
Base) -3- ethyl carbodiimides, N, N '-dicyclohexylcarbodiimide, N, N '-DIC, N- cyclohexyl-N ' -
(2- morpholines ethyl) carbodiimide-tosilate, poly- carbodiimide compound, the ring-type carbon of terminal isocyanate group modification
Change diimine compound, diisocyanate is gathered carbonization two obtained from being polymerize in the presence of carbodiimides catalyst
Group with imine moiety etc..It is big and be not likely to produce from the aspect of degassing from molecular weight, preferably polycarbodiimide compound.
As the commercially available product of above-mentioned polycarbodiimide compound, can enumerate such as CARBODILITE V02B,
CARBODILITE V04K, CARBODILITE V05 (being the manufacture of Nisshinbo Co., Ltd.) etc..
From the viewpoint of the transparency and heat resistance for effectively improving solidfied material, in the above-mentioned weight % of conductive material 100,
The content of above-mentioned carbodiimide compound is preferably more than 0.01 weight %, more preferably more than 0.1 weight %, preferably 5
Below weight %, more preferably below 3 weight %.
(other compositions)
Above-mentioned conductive material can contain such as coupling agent, opacifier, reactive diluent, defoamer, stream as needed
It is flat agent, filler, extender, softening agent, plasticizer, polymerization catalyst, curing catalysts, colouring agent, antioxidant, thermally-stabilised
The various additives such as agent, light stabilizer, ultra-violet absorber, lubricant, antistatic additive and fire retardant.
(manufacture method of connection structural bodies and connection structural bodies)
The connection structural bodies of the present invention includes：Surface has the first connecting object part of at least one first electrode；Table
Face has the second connecting object part of at least one second electrode；By above-mentioned first connecting object part and above-mentioned second connection
The connecting portion that object Part is connected.In the connection structural bodies of the present invention, the material of above-mentioned connecting portion is above-mentioned conduction
Material.Above-mentioned connecting portion is the solidfied material of above-mentioned conductive material.Above-mentioned connecting portion is formed by above-mentioned conductive material.In this hair
In bright connection structural bodies, above-mentioned first electrode and above-mentioned second electrode are realized by the solder sections in above-mentioned connecting portion and are electrically connected
Connect.
The manufacture method of above-mentioned connection structural bodies possesses following process：Using above-mentioned conductive material, have extremely on surface
On the surface of first connecting object part of a few first electrode, the process for configuring above-mentioned conductive material；In above-mentioned conduction material
On the surface opposite with above-mentioned first connecting object component side of material, configuration surface has the second of at least one second electrode to connect
Connect object Part and make above-mentioned first electrode and the opposed process of above-mentioned second electrode；By the way that above-mentioned conductive material is heated to
More than the fusing point for stating scolding tin in electroconductive particle, formed by above-mentioned conductive material by above-mentioned first connecting object part and above-mentioned
The connecting portion that second connecting object part is connected, and by above-mentioned first electrode and above-mentioned second electrode in above-mentioned connecting portion
The process that is electrically connected of solder sections.It is preferred that above-mentioned conductive material is heated into above-mentioned Thermocurable composition, Thermocurable
It is more than the solidification temperature of compound.
In the connection structural bodies of the present invention and the manufacture method of above-mentioned connection structural bodies, due to using specific conduction material
Expect, therefore the scolding tin in multiple electroconductive particles is easily gathered between first electrode and second electrode, can be effective by scolding tin
Ground is configured on electrode (line).In addition, a part for scolding tin is difficult to be configured at the region (interval) for not forming electrode, it can make
The amount for being configured at the scolding tin in the region for not forming electrode is less.Therefore the conducting between first electrode and second electrode can be made
Reliability is improved.Furthermore, it is possible to prevent the electrical connection between the adjacent electrode on the transverse direction that can not be attached, Ke Yiti
High insulating reliability.
In addition, in order to which the scolding tin in multiple electroconductive particles is efficiently configured on electrode, and make to be configured at no shape
Amount into the scolding tin in the region of electrode is less, as above-mentioned conductive material, preferably uses conductive paste and without using conducting film.
The thickness of interelectrode solder sections is preferably more than 10 μm, more preferably more than 20 μm, preferably less than 100 μm,
More preferably less than 80 μm.(scolding tin in the area 100% exposed of electrode connects scolding tin wetting areas on the surface of electrode
Area) be preferably more than 50%, more preferably more than 70%, preferably less than 100%.
The present invention connection structural bodies manufacture method in, be configured at the process of above-mentioned second connecting object part and
In the process for forming above-mentioned connecting portion, above-mentioned second connecting object part is applied to above-mentioned conductive material preferably without pressurization
Weight, configuring the process of above-mentioned second connecting object part and formed in the process of above-mentioned connecting portion, preferred pair is above-mentioned to be led
Electric material does not apply the moulding pressure of the power of the weight more than above-mentioned second connecting object part.In these cases, multiple
In solder sections, the uniformity of soldering tin amount can be further improved.And it is possible to make the thickness of solder sections further effectively
Thickening, the scolding tin in multiple electroconductive particles is easily more gathered between electrode, can make the weldering in multiple electroconductive particles
Tin is further efficiently configured on electrode (line).In addition, a part for the scolding tin in multiple electroconductive particles is difficult configuration
In the region (interval) for not forming electrode, the electric conductivity grain for being configured at the region for not forming electrode can be further reduced
The amount of scolding tin in son.It therefore, it can further improve interelectrode conducting reliability.Furthermore, it is possible to further prevent
Electrical connection between the adjacent electrode on transverse direction that can not be attached, can further improve insulating reliability.
Also, it was found that：Configuring the process of above-mentioned second connecting object part and formed in the process of above-mentioned connecting portion, such as
Fruit applies the weight of above-mentioned second connecting object part without pressurization to above-mentioned conductive material, then formed connecting portion it
Before, be configured at the region (interval) for not forming electrode scolding tin be further easily gathered in first electrode and second electrode it
Between, the scolding tin in multiple electroconductive particles can be made further to be efficiently configured on electrode (line).In the present invention, will not
Connected using conducting film using the composition of conductive paste and without pressurization to apply above-mentioned second to above-mentioned conductive paste
The composition of the weight of object Part is combined and used, in order to obtain the effect of the present invention with further high level with very big
Meaning.
It should be noted that in WO2008/023452A1, having it from making solder powder be flowed in electrode surface extruding
From the viewpoint of effect ground is mobile, records and pressurizeed in bonding with specified pressure, for moulding pressure, further
In terms of the viewpoint for being reliably formed soldering tin, for example, record and be set to more than 0MPa, preferably more than 1MPa, and record i.e.
Make it is intended that put on splicing tape pressure be 0MPa, can also be by the deadweight for the part being configured on splicing tape to splicing tape
Apply the pressure specified.In WO2008/023452A1, record intentionally put on splicing tape pressure can be 0MPa,
But to the situation for imparting the pressure for exceeding 0MPa and the difference of the effect for the situation for being set to 0MPa, recorded without any.In addition,
In WO2008/023452A1, to using being not membranaceous but the importance of the conductive paste of pasty state, also without any understanding.
In addition, if then easily being adjusted using conductive paste without using conducting film based on the coating weight of conductive paste
The thickness of connecting portion and solder sections.On the other hand, in the conductive film, there are the following problems：For the thickness to connecting portion or enter
Row variations or modifications, it is necessary to prepare the conducting film of different-thickness, or prepare the conducting film of appointed thickness.In addition, conducting film is with leading
Electric paste is compared, and the melt viscosity of conducting film can not be fully reduced under the melting temperature of scolding tin, exists and tends to interfere with scolding tin
The tendency being condensed.
Hereinafter, on one side referring to the drawings, while the specific embodiment of the explanation present invention.
Fig. 1 is to schematically show the connection structural bodies obtained using the conductive material of an embodiment of the invention
Profile.
Connection structural bodies 1 shown in Fig. 1 possesses：First connecting object part 2, the second connecting object part 3, by first connect
Connect the connecting portion 4 that the connecting object part 3 of object Part 2 and second is connected.Connecting portion 4 is formed by above-mentioned conductive material.
In present embodiment, above-mentioned conductive material contains electroconductive particle and adhesive.In present embodiment, conductive material is used as conduction
Property particle, contains scolding tin particle.In present embodiment, adhesive contains Thermocurable compound and thermal curing agents.By above-mentioned heat
Curability compound and above-mentioned thermal curing agents are referred to as Thermocurable composition.
Connecting portion 4 has：Multiple scolding tin particle buildups and the solder sections 4A being bonded with each other；Carried out with Thermocurable composition
Heat cure and solidfied material portion 4B.
First connecting object part 2 has multiple first electrode 2a in surface (upper surface).Second connecting object part 3 exists
Surface (lower surface) has multiple second electrode 3a.First electrode 2a and second electrode 3a realize electrical connection by solder sections 4A.
Therefore, the first connecting object part 2 and the second connecting object part 3 realize electrical connection by solder sections 4A.It should be noted that
In connecting portion 4, in different region (the solidfied material portions of the solder sections 4A from being gathered between first electrode 2a and second electrode 3a
4B parts) in, in the absence of scolding tin.In the region (solidfied material portion 4B part) different from solder sections 4A, it is not present and solder sections
The scolding tin that 4A departs from.It should be noted that if a small amount of, being then gathered between first electrode 2a and second electrode 3a
Regions (solidfied material portion 4B parts) different solder sections 4A, may have scolding tin.
As shown in figure 1, in connection structural bodies 1, multiple scolding tin particle buildups in first electrode 2a and second electrode 3a it
Between, after multiple scolding tin particles are melted, then the moistened surface and extension of the fused mass of scolding tin particle to electrode consolidated
Change, form solder sections 4A.Therefore, solder sections 4A and first electrode 2a and solder sections 4A and second electrode 3a connection area
Become big.That is, by using scolding tin particle, the electric conductivity grain of the metals such as nickel, gold or copper is divided into the outer surface portion using conductive part
The situation of son is compared, and solder sections 4A and first electrode 2a and solder sections 4A and second electrode 3a contact area become big.Cause
This, conducting reliability and connection reliability in connection structural bodies 1 are improved.
It should be noted that in the connection structural bodies 1 shown in Fig. 1, solder sections 4A's is entirely located in first electrode 2a,
Opposed region between two electrode 3a.For the connection structural bodies 1X of the variation shown in Fig. 3, shown in only connecting portion 4X and Fig. 1
Connection structural bodies 1 it is different.Connecting portion 4X has solder sections 4XA and solidfied material portion 4XB.It is many as connection structural bodies 1X
Solder sections 4XA is located at the opposed region of first electrode 2a, second electrode 3a, and a part of of solder sections 4XA can be from first electrode
2a, second electrode 3a opposed region is spilled over to side.Side is spilled over to from the opposed region of first electrode 2a, second electrode 3a
Solder sections 4XA be solder sections 4XA a part, be not from solder sections 4XA depart from scolding tin.It should be noted that this implementation
In mode, it is possible to reduce the amount of the scolding tin departed from from solder sections, during the scolding tin departed from from solder sections may reside in solidfied material portion.
If reducing the usage amount of scolding tin particle, connection structural bodies 1 is readily obtained.If increasing the use of scolding tin particle
Amount, then be readily obtained connection structural bodies 1X.
From the viewpoint of conducting reliability is further improved, in connection structural bodies 1, connection structural bodies 1X, along the
One electrode 2a, connecting portion 4, connecting portion 4X and second electrode 3a stack direction observe first electrode 2a and second electrode 3a phase
Mutually during opposed part, preferred 50% in the area 100% of first electrode 2a and second electrode 3a mutually opposing part
Connecting portion 4, the solder sections 4A in connecting portion 4X, solder sections 4XA are configured above.
From the viewpoint of conducting reliability is further improved, along above-mentioned first electrode, above-mentioned connecting portion and above-mentioned the
When the stack directions of two electrodes observes the mutually opposing part of above-mentioned first electrode and above-mentioned second electrode, preferably above-mentioned the
More than 50% in the area 100% of the mutually opposing part of one electrode and above-mentioned second electrode (is more preferably more than 60%, enters
One step is preferably more than 70%, particularly preferably more than 80%, most preferably more than 90%), configure the weldering in above-mentioned connecting portion
Tin portion.
From the viewpoint of conducting reliability is further improved, along with above-mentioned first electrode, above-mentioned connecting portion and above-mentioned
When the mutually opposing part of above-mentioned first electrode and above-mentioned second electrode is observed in the vertical direction of the stack direction of second electrode,
It is preferred that in the mutually opposing part of above-mentioned first electrode and above-mentioned second electrode, solder sections in above-mentioned connecting portion are configured
More than 60% (more preferably more than 70%, more preferably more than 90%, particularly preferably more than 95%, be most preferably
More than 99%).
Then, using the conductive material of an embodiment of the invention, to one of the method for manufacture connection structural bodies 1
Example is illustrated.
First, the first connecting object part 2 that there is first electrode 2a in surface (upper surface) is prepared.Then, such as Fig. 2
(a) shown in, configured on the surface of the first connecting object part 2 containing Thermocurable composition 11B's and multiple scolding tin particle 11A
Conductive material 11 (the first process).The conductive material used contain Thermocurable compound and thermal curing agents as Thermocurable into
Divide 11B.
On the surface of the first electrode 2a provided with the first connecting object part 2, conductive material 11 is configured.In conductive material
After 11 configuration, scolding tin particle 11A be configured on first electrode 2a (line) and do not formed first electrode 2a region (
Every) on the two regions.
As the collocation method of conductive material 11, it is not particularly limited, can enumerates：Utilize the coating of point gum machine, screen printing
Brush and utilize spraying of ink discharge device etc..
In addition, preparing the second connecting object part 3 that there is second electrode 3a at surface (lower surface).Then, such as Fig. 2
(b) shown in, in the conductive material 11 on the surface of the first connecting object part 2, it is being connected with the first of conductive material 11 pair
As the side opposite side of part 2 surface on, configure the second connecting object part 3 (the second process).On the surface of conductive material 11
On from second electrode 3a sides configure the second connecting object part 3.Now, make first electrode 2a and second electrode 3a opposed.
Then, more than heating conductive material 11 to scolding tin particle 11A fusing point (the 3rd process).It is preferred that by conductive material 11
It is more than the solidification temperature for being heated to Thermocurable composition 11B (Thermocurable compound).In the heating, electrode is not being formed
Region exist scolding tin particle 11A be gathered between first electrode 2a and second electrode 3a (self-coagulation effect).Using leading
Electric paste and without using conducting film in the case of, scolding tin particle 11A be effectively gathered in first electrode 2a and second electrode 3a it
Between.In addition, scolding tin particle 11A is melted and is bonded with each other.In addition, Thermocurable composition 11B carries out heat cure.The result,
As shown in Fig. 2 (c), the connecting portion 4 that the first connecting object part 2 and the second connecting object part 3 are connected is by conduction material
Material 11 is formed.Connecting portion 4 is formed by conductive material 11, is engaged by multiple scolding tin particle 11A and forms solder sections 4A, is led to
Overheat curability composition 11B carries out heat cure and forms solidfied material portion 4B.If scolding tin particle 11A is fully moved, never
There is the mobile beginning positioned at scolding tin particle 11A between first electrode 2a and second electrode 3a, until scolding tin particle 11A is to first
Mobile completion between electrode 2a and second electrode 3a, can not keep the temperature at certain.
In present embodiment, in above-mentioned second process and above-mentioned 3rd process, preferably without pressurization.In the situation
Under, apply the weight of the second connecting object part 3 to conductive material 11.Therefore, in the formation of connecting portion 4, scolding tin particle 11A
Effectively it is gathered between first electrode 2a and second electrode 3a.It should be noted that in above-mentioned second process and the above-mentioned 3rd
In at least one process in process, if pressurizeed, scolding tin particle 11A is hindered to be gathered in first electrode 2a and second
The tendency of effect between electrode 3a is improved.
In addition, in present embodiment, due to without pressurization, therefore in the first connecting object portion for being coated with conductive material
On part during overlapping second connecting object part, even in the electrode and the electricity of the second connecting object part of the first connecting object part
In the state of the alignment of pole deviates, the first connecting object part and the second connecting object part carried out it is overlapping in the case of,
Its deviation can be corrected, makes the electrode of the first connecting object part and electrode connection (the autoregistration effect of the second connecting object part
Should).Because, melting of the self-coagulation between the electrode of the first connecting object part and the electrode of the second connecting object part
Scolding tin, scolding tin and conductive material between the electrode of its first connecting object part and the electrode of the second connecting object part
The area that other compositions connect is minimum, stable on energy, therefore, becomes the connection of the alignment of the attachment structure of minimum area
The power of structure works.Now, preferred conductive material is without solidification, and preferably under the temperature, time, in conductive material
The viscosity of composition in addition to electroconductive particle is substantially low.
As described above, can obtain the connection structural bodies 1 shown in Fig. 1.It should be noted that above-mentioned second process and above-mentioned
Three processes can be carried out continuously.In addition, after above-mentioned second process is carried out, the first obtained connecting object part can be made
2nd, the laminated body of the connecting object part 3 of conductive material 11 and second is transferred to heating part, carries out above-mentioned 3rd process.In order to carry out
Above-mentioned heating, can configure above-mentioned laminated body by the configuration of above-mentioned laminated body on heater block in heated space.
Above-mentioned heating-up temperature in above-mentioned 3rd process is preferably more than 140 DEG C, more preferably more than 160 DEG C, is preferably
Less than 450 DEG C, more preferably more preferably less than 250 DEG C, less than 200 DEG C.
As the heating means in above-mentioned 3rd process, it can enumerate using reflow ovens or use baking oven, by connection structural bodies
Entirety is heated to the method more than fusing point of scolding tin and more than the solidification temperature of Thermocurable compound；Or only partly to connection
The method that the connecting portion of structure is heated.
Above-mentioned first connecting object part, the second connecting object part are not particularly limited.It is used as the above-mentioned first connection pair
As part, the second connecting object part, specifically, it can enumerate：Semiconductor chip, semiconductor packages, LED chip, LED envelopes
The electronic unit such as dress, capacitor and diode and resin film, printed base plate, flexible printing substrate, flexible flat cable, just
Scratch with reference to electronic units such as the circuit substrates such as substrate, glass epoxy substrate and glass substrate etc..Above-mentioned first, second connecting object
Part is preferably electronic unit.
At least one of above-mentioned first connecting object part and above-mentioned second connecting object part are preferably resin film, scratched
Property printed base plate, flexible flat cable or rigid-flexible combination substrate.Above-mentioned second connecting object part is preferably resin film, flexible print
Brush substrate, flexible flat cable or rigid-flexible combination substrate.Resin film, flexible printing substrate, flexible flat cable and rigid-flexible combination
Substrate has flexibility height, than the property of relatively lightweight.In the case of conducting film being used in the connection of this connecting object part,
There is the poly- tendency being difficult to combine on electrode of scolding tin.On the other hand, by using conductive paste, even if using resin film, flexibility
Printed base plate, flexible flat cable or rigid-flexible combination substrate, can also be on electrode and abundant by the way that scolding tin is effectively gathered in
Improve interelectrode conducting reliability in ground.Using resin film, flexible printing substrate, flexible flat cable or rigid-flexible combination substrate
In the case of, compared with the situation of the connecting object part outside using semiconductor chip etc., further effectively obtain not
Carry out the raising effect of the interelectrode conducting reliability of pressurization generation.
As the electrode for being arranged at above-mentioned connecting object part, it can enumerate：Gold electrode, nickel electrode, tin electrode, aluminium electrode,
The metal electrodes such as copper electrode, molybdenum electrode, silver electrode, SUS electrodes and tungsten electrode.It is flexible printing in above-mentioned connecting object part
In the case of substrate, above-mentioned electrode is preferably gold electrode, nickel electrode, tin electrode, silver electrode or copper electrode.In above-mentioned connecting object
In the case that part is glass substrate, above-mentioned electrode is preferably aluminium electrode, copper electrode, molybdenum electrode, silver electrode or tungsten electrode.Need
Illustrate, can be the electrode only formed by aluminium, or in metal oxidation in the case where above-mentioned electrode is aluminium electrode
The surface stack of nitride layer has the electrode of aluminium lamination.As the material of above-mentioned metal oxide layer, it can enumerate doped with trivalent metallic element
Indium oxide and zinc oxide doped with trivalent metallic element etc..As the metallic element of above-mentioned trivalent, Sn, Al and Ga can be enumerated
Deng.
Hereinafter, embodiment and comparative example are enumerated, the present invention is specifically described.The present invention is not limited to following implementation
Example.
(1) there is the Thermocurable compound A of thiiranes group and triazine skeleton synthesis：
Methanol 1100mL and trimethyl thiourea 400g is added in the container for having mixer, cooler and thermometer,
The first solution is prepared in container.Thereafter, the temperature in container is maintained at 60 DEG C.
Then, while being stirred to the first solution for being maintained at 60 DEG C, while adding TEPIC- in first solution
After VL (Nissan Chemical Ind Ltd's manufacture) 600g and toluene 3600ml, further stirring 30 minutes, obtain containing epoxy
The solution of compound.
Then, while being stirred to the above-mentioned solution containing epoxide, under nitrogen flowing, in reacting it at 60 DEG C
5 hours.Thereafter, the solution in container is moved into separatory funnel and stands 2 hours, separate solution.Under making in separatory funnel
The solution discharge in portion, takes out supernatant.Toluene 950mL is added in the supernatant taken out and is stirred, 2 hours are stood.
Then, it is put into pure water in the supernatant for having toluene is added and stirs, repeats the discharge of bottom solution, thus carry out
Cleaning.
Thereafter, magnesium sulfate 200g is added in supernatant and is stirred 5 minutes.After stirring, magnesium sulfate is removed using filter paper, it is right
Solution is separated.It is dried under reduced pressure by using vacuum drier, removes the solvent of residual.As described above, being had
The Thermocurable compound A of thiiranes group and triazine skeleton.
Using chloroform as solvent, obtained Thermocurable compound A is carried out1H-NMR measure.The results verification is to epoxy
Base is transformed to episulfide base.
(2) there is the Thermocurable compound B of thiiranes group and triazine skeleton synthesis：
TEPIC-VL (Nissan Chemical Ind Ltd's manufacture) is changed to TEPIC-HP (Nissan Chemical Industries strain formula meetings
Society manufactures), temperature in container is changed to 80 DEG C, in addition, carries out, is had in the same manner as Thermocurable compound A
The Thermocurable compound B of thiiranes group and triazine skeleton.
Using chloroform as solvent, obtained Thermocurable compound B is carried out1H-NMR measure.The results verification is to epoxy
Base is transformed to episulfide base.Obtained Thermocurable compound B fusing point is 150 DEG C.
Thermocurable compound 1：Epoxide, " EP-3300 ", the epoxide equivalent 160g/eq of the manufacture of ADEKA companies
Thermocurable compound 2：Epoxide, " TEPIC-SS ", the epoxy of Nissan Chemical Ind Ltd's manufacture
Equivalent 100g/eq
Thermocurable compound 3：Epoxide, " TEPIC-VL ", the epoxy of Nissan Chemical Ind Ltd's manufacture
Equivalent 135g/eq
Thermal curing agents 1：Trimethylolpropane tris (3-thiopropionate), " TMMP " of the manufacture of SC organic chemistry Co., Ltd.
Latency epoxy thermosetting agent 1：" Fujicure7000 " of T＆KTOKA Co., Ltd. manufacture
Latency epoxy thermosetting agent 2：" HXA-3922HP " of ASAHI KASEI E-materials Co., Ltd. manufacture
The synthesis of fluxing agent 1：
The parts by weight of glutaric acid 25, the parts by weight of monomethyl glutarate 25 are put into 3 mouthfuls of flasks, under nitrogen stream, at 80 DEG C
Dissolved.Thereafter, the parts by weight of benzylamine 57 are added, it is reacted 2 hours under being depressurized at 150 DEG C, obtain being solid at 25 DEG C
, fluxing agent 1 with amide groups.
Fluxing agent 2：Monomethyl glutarate, Wako Pure Chemical Industries, Ltd.'s manufacture
Insulating properties particle：30 μm of average grain diameter, CV values 5%, 330 DEG C of softening point, Sekisui Chemical Co., Ltd manufacture,
Divinyl benzene crosslinked particle
Carbodiimide compound 1：CARBODILITE V02B (manufacture of Nisshinbo Co., Ltd.)
The preparation method of scolding tin particle 1：
Weighed in 3 mouthfuls of flasks SnBi scolding tin particle (" DS-10 " of the manufacture of Co., Ltd. of Mitsui Metal Co., Ltd., average grain diameter (in
It is worth 12 μm of particle diameter)) 200g, the silane coupler (" KBE- of silicone Co., Ltd. of SHIN-ETSU HANTOTAI manufacture with NCO
9007 ") 20g and acetone 70g.It is stirred at room temperature on one side, while addition 0.25g dibutyl tin laurate conduct
The hydroxyl of scolding tin particle surface and the catalysts of NCO, under agitation, small in heating 2 at 100 DEG C under blanket of nitrogen
When.Thereafter, methanol 120g and acetic acid 0.05g is added, under agitation, under blanket of nitrogen, in being heated 1 hour at 60 DEG C.
Thereafter, room temperature is cooled to, scolding tin particle is filtered with filter paper, by vacuum drying, 1 hour precipitation is carried out at room temperature
Agent, obtains scolding tin particle.
Above-mentioned scolding tin particle is put into 3 mouthfuls of flasks, addition acetone 45g, monoethyl adipatee 40g and phenyl-pentafluoride sulfonic acid
Two mesitylene base ammonium salt 0.2g, under agitation, under blanket of nitrogen after 65 DEG C make it react 1 hour, be dried in vacuo, thus
Carry out desolventizing.
Thereafter, above-mentioned scolding tin particle is put into 3 mouthfuls of flasks, addition acetone 85g, adipic acid 40g and lanthanum isopropoxide
0.5g, after its reaction being made at 65 DEG C 1 hour, is cooled to room temperature, scolding tin particle is filtered with filter paper, by scolding tin particle on filter paper
Cleaned with acetone 2 times, cleaned with hexane 1 time, thereafter, by vacuum drying, 1 hour desolventizing is carried out at room temperature.
After obtained scolding tin particle ball milling crusher machine, sieve is selected so that as the CV values specified.
Thus, scolding tin particle 1 is obtained.It is CV values 20%, acid number for obtained scolding tin particle 1：0.5mg/KOH.
The preparation method of scolding tin particle 2：
Scolding tin particle is cleaned 1 time with hexane on filter paper, in addition, carried out in the same manner as scolding tin particle 1, weldering is made
Tin particle 2.It is CV values 20%, acid number for obtained scolding tin particle 2：13mg/KOH.
Scolding tin particle A (SnBi scolding tin particle, 139 DEG C of fusing point, " DS-10 " of the manufacture of Co., Ltd. of Mitsui Metal Co., Ltd., average grain
Footpath (12 μm of median particle diameter)), acid number：0.2mg/KOH
(the CV values of scolding tin particle)
CV is determined with laser diffraction formula particle size distribution device (" LA-920 " that Horiba Ltd manufactures)
Value.
(acid number of scolding tin particle)
Phenolphthalein is put into ethanol, relative to the solution 50ml neutralized with 0.1N-KOH, is put into electroconductive particle
(scolding tin particle) 1g, is carried out after disperseing by ultrasonication, is titrated with 0.1N-KOH, thus obtain acid number.
(embodiment 1~5 and comparative example 1~3)
(1) making of anisotropic conductive paste
Coordinate the composition shown in following tables 1 with the use level shown in following tables 1, obtain anisotropic conductive paste.
Connection structural bodies is made as described below.
(2) making of connection structural bodies (L/S=75 μm/75 μm)
Preparation has the copper electrode pattern (thickness of copper electrode that L/S is 75 μm/75 μm, electrode length is 3mm in upper surface
12 μm) glass epoxy substrate (FR-4 substrates, thickness 0.6mm) (the first connecting object part).In addition, preparing in following table mask
Have the copper electrode pattern (12 μm of the thickness of copper electrode) that L/S is 75 μm/75 μm, electrode length is 3mm flexible printing substrate (by
The second connecting object part, the thickness 0.1mm of polyimides formation).
The overlapping area of glass epoxy substrate and flexible printing substrate is set to 1.5cm × 3mm, and the number of electrodes of connection is set to 75
It is right.
The upper surface of above-mentioned glass epoxy substrate, on the electrode of glass epoxy substrate apply just make after it is each to
Different in nature conductive paste, and make its thickness be 100 μm, form anisotropic conductive paste layer.Then, in anisotropic conductive paste
The above-mentioned flexible printing substrate of upper surface lamination of layer, and make electrode opposite each other, add in the upper surface mounting of flexible printing substrate
Hot head, from room temperature to 180 DEG C of periods, makes the interelectrode scolding tin particle coacervation of transverse direction, further makes scolding tin particle
Between electrode above and below condensing upon, and melt, thereafter, further heated 10 seconds at 180 DEG C, make anisotropic conductive paste
Layer solidification, obtains connection structural bodies.Now, the weight of above-mentioned flexible printing substrate is applied to anisotropic conductive paste layer and scratched
Property the bent degree of printed base plate not reflex action pressure.
(evaluation)
(1) viscosity
It is right under conditions of 25 DEG C and 5rpm using E types viscosimeter (" TVE22L " that Toki Sangyo Co., Ltd. manufactures)
Viscosity (η 25) of the anisotropic conductive paste just made at 25 DEG C is measured.
(2) storage stability
Anisotropic conductive paste is preserved 24 hours at 23 DEG C.After preservation, E types viscosimeter (Dong Ji industries society is used
Make " TVE22L "), under conditions of 25 DEG C and 5rpm, viscosity (η 25) of the anisotropic conductive paste at 25 DEG C is surveyed
It is fixed.Judge storage stability according to following benchmark.
[determinating reference of storage stability]
○○：The viscosity before viscosity/preservation after preservation is less than 1.2 times
○：The viscosity before viscosity/preservation after preservation is for more than 1.2 times and less than 1.5 times
△：The viscosity before viscosity/preservation after preservation is for more than 1.5 times and less than 2 times
×：The viscosity before viscosity/preservation after preservation is more than 2 times
(3) the preventing property of outflow of the composition in addition to electroconductive particle
In obtained connection structural bodies, the length for the part overflowed by using micro- sem observation from electrode is simultaneously surveyed
It is fixed, evaluate the preventing property of outflow of the composition in addition to electroconductive particle.Judge according to following benchmark in addition to electroconductive particle
Composition preventing property of outflow.
[determinating reference of the preventing property of outflow of the composition in addition to electroconductive particle]
○○：The length for the part overflowed from electrode is less than 150 μm
○：The length for the part overflowed from electrode is for more than 150 μm and less than 200 μm
△：The length for the part overflowed from electrode is for more than 200 μm and less than 300 μm
×：The length for the part overflowed from electrode is more than 300 μm
(4) thickness of solder sections
By carrying out section observation to obtained connection structural bodies, the thickness of the interelectrode solder sections above and below being located at is evaluated
Degree.
(5) the configuration precision 1 of the scolding tin on electrode
In obtained connection structural bodies, along the electricity of stack direction observation first of first electrode, connecting portion and second electrode
When pole and the mutually opposing part of second electrode, the area of the mutually opposing part of first electrode and second electrode is evaluated
In 100%, the ratio X of the area for the solder sections being configured with connecting portion.Judge the scolding tin on electrode according to following benchmark
Configure precision 1.
[determinating reference of the configuration precision 1 of the scolding tin on electrode]
○○：Ratio X is more than 70%
○：Ratio X is more than 60% and less than 70%
△：Ratio X is more than 50% and less than 60%
×：Ratio X is less than 50%
(6) the configuration precision 2 of the scolding tin on electrode
In obtained connection structural bodies, along the side vertical with the stack direction of first electrode, connecting portion and second electrode
During to the mutually opposing part for observing first electrode and second electrode, evaluate in the solder sections 100% in connecting portion, be configured at
The ratio Y of solder sections in the connecting portion of the mutually opposing part of first electrode and second electrode.Sentence according to following benchmark
The configuration precision 2 of scolding tin on fixed electrode.
[determinating reference of the configuration precision 2 of the scolding tin on electrode]
○○：Ratio Y is more than 99%
○：Ratio Y is more than 90% and less than 99%
△：Ratio Y is more than 70% and less than 90%
×：Ratio Y is less than 70%
(7) the interelectrode conducting reliability above and below
In obtained connection structural bodies (n=15), interelectrode 1 company above and below 4 terminal methods measure is utilized respectively
Connect the connection resistance at place.Calculate the average value of connection resistance.It should be noted that can be by the pass of voltage=electric current × resistance
System, by obtaining connection resistance to being measured voltage during certain electric current flowing.Judge to lead according to following benchmark
Logical reliability.
[determinating reference of conducting reliability]
○○：The average value for connecting resistance is below 50m Ω
○：The average value of resistance is connected more than 50m Ω and below 70m Ω
△：The average value of resistance is connected more than 70m Ω and below 100m Ω
×：The average value of resistance is connected more than 100m Ω, or produces bad connection
(8) the interelectrode insulating reliability abutted in the transverse direction
In obtained connection structural bodies (n=15), after being placed 100 hours in 85 DEG C, the atmosphere of humidity 85%,
Apply 15V between adjacent electrode on transverse direction, resistance value is determined at 25.Judge insulating reliability according to following benchmark.
[determinating reference of insulating reliability]
○○○：The average value for connecting resistance is 1014More than Ω
○○：The average value for connecting resistance is 108More than Ω and less than 1014Ω
○：The average value for connecting resistance is 106More than Ω and less than 108Ω
△：The average value for connecting resistance is 105More than Ω and less than 106Ω
×：The average value for connecting resistance is less than 105Ω
(9) the interelectrode dislocation above and below
In obtained connection structural bodies, in the electricity of stack direction observation first of first electrode, connecting portion and second electrode
When pole and the mutually opposing part of second electrode, whether the center line of evaluation first electrode and the center line of second electrode are right
Its, and the distance misplaced.According to the interelectrode dislocation above and below following benchmark judgements.
[determinating reference of interelectrode dislocation up and down]
○○：Dislocation is less than 15 μm
○：Misplace for more than 15 μm and less than 25 μm
△：Misplace for more than 25 μm and less than 40 μm
×：Misplace as more than 40 μm
(10) heat resistance (heat-resisting xanthochromia)
Prepare to be combined with the composition in addition to the scolding tin particle in conductive paste in the gradation composition shown in following tables 1
Complex, make the sheet material of thickness 0.6mm solidfied material.After being preserved 2000 hours at 150 DEG C, wavelength is determined
Transmissivity under 400nm, thus evaluates heat resistance (heat-resisting xanthochromia).Judge heat resistance according to following benchmark.
[determinating reference of heat resistance]
○○：Transmissivity after High temperature storage is more than 93%
○：Transmissivity after High temperature storage is more than 90% and less than 93%
△：Transmissivity after High temperature storage is more than 87% and less than 90%
×：Outside 00, zero and △ benchmark
Show the result in following tables 1.
[table 1]
In the case of flexible printing substrate is replaced using resin film, flexible flat cable and rigid-flexible combination substrate,
It can also see that same tendency.
Claims (15)
1. a kind of conductive material, it is included：
There are multiple electroconductive particles, Thermocurable compound and the thermal curing agents of scolding tin in the outer surface part of conductive part,
The Thermocurable compound includes the Thermocurable compound with thiiranes group and triazine skeleton.
2. conductive material as claimed in claim 1, wherein,
The fusing point of the Thermocurable compound with thiiranes group and triazine skeleton is more than 140 DEG C.
3. conductive material as claimed in claim 1 or 2, it is included and the Thermocurable with thiiranes group and triazine skeleton
The different Thermocurable compound of compound.
4. such as conductive material according to any one of claims 1 to 3, wherein,
The acid number of the electroconductive particle is more than 0.1mg/KOH, below 10mg/KOH.
5. such as conductive material according to any one of claims 1 to 4, it contains fluxing agent.
6. conductive material as claimed in claim 5, wherein,
The fluxing agent is the fluxing agent with amide groups and aromatic backbone, or
The fluxing agent has an amide groups, and is that carboxylic acid or carboxylic acid anhydrides and pKa are the anti-of less than 9.5 compound containing amino
Answer thing.
7. the conductive material as described in claim 5 or 6, wherein,
The fluxing agent is solid at 25 DEG C.
8. such as conductive material according to any one of claims 1 to 7, it contains carbodiimide compound.
9. such as conductive material according to any one of claims 1 to 8, wherein,
The electroconductive particle is scolding tin particle.
10. such as conductive material according to any one of claims 1 to 9, it, which contains, is not adhered to the electroconductive particle table
The insulating properties particle in face.
11. such as conductive material according to any one of claims 1 to 10, wherein,
The average grain diameter of the electroconductive particle is more than 1 μm, less than 40 μm.
12. the conductive material as any one of claim 1~11, wherein,
In the weight % of conductive material 100, the content of the electroconductive particle is more than 10 weight % and below 80 weight %.
13. the conductive material as any one of claim 1~12, it is liquid at 25 DEG C, and the conductive material is
Conductive paste.
14. a kind of connection structural bodies, it includes：
Surface has the first connecting object part of at least one first electrode；
Surface has the second connecting object part of at least one second electrode；
The connecting portion that the first connecting object part and the second connecting object part are connected,
The material of the connecting portion is the conductive material any one of claim 1~13,
The first electrode and the second electrode realize electrical connection by the solder sections in the connecting portion.
15. connection structural bodies as claimed in claim 14, wherein,
The first electrode and described the are observed along the stack direction of the first electrode, the connecting portion and the second electrode
During the mutually opposing part of two electrodes, the area 100% in the first electrode and the mutually opposing part of the second electrode
In more than 50%, be configured with the solder sections in the connecting portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015162196 | 2015-08-19 | ||
| JP2015-162196 | 2015-08-19 | ||
| PCT/JP2016/072776 WO2017029993A1 (en) | 2015-08-19 | 2016-08-03 | Electrically conductive material, and connecting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107251163A true CN107251163A (en) | 2017-10-13 |
Family
ID=58052169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680010595.6A Pending CN107251163A (en) | 2015-08-19 | 2016-08-03 | Conductive material and connection structural bodies |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2017029993A1 (en) |
| KR (1) | KR20180043191A (en) |
| CN (1) | CN107251163A (en) |
| TW (1) | TW201717215A (en) |
| WO (1) | WO2017029993A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110054865A (en) * | 2018-01-18 | 2019-07-26 | 味之素株式会社 | Resin combination |
| CN111196890A (en) * | 2018-11-20 | 2020-05-26 | 味之素株式会社 | Resin composition |
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- 2016-08-03 JP JP2016551862A patent/JPWO2017029993A1/en not_active Ceased
- 2016-08-03 KR KR1020177021433A patent/KR20180043191A/en unknown
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20180043191A (en) | 2018-04-27 |
| WO2017029993A1 (en) | 2017-02-23 |
| TW201717215A (en) | 2017-05-16 |
| JPWO2017029993A1 (en) | 2018-05-31 |
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