CN107246553A - One kind can directly exchange driving LED pieces - Google Patents
One kind can directly exchange driving LED pieces Download PDFInfo
- Publication number
- CN107246553A CN107246553A CN201710635340.5A CN201710635340A CN107246553A CN 107246553 A CN107246553 A CN 107246553A CN 201710635340 A CN201710635340 A CN 201710635340A CN 107246553 A CN107246553 A CN 107246553A
- Authority
- CN
- China
- Prior art keywords
- led
- substrate
- pieces
- wafer
- metal pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000002184 metal Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000000084 colloidal system Substances 0.000 claims abstract description 12
- 241000218202 Coptis Species 0.000 claims abstract description 9
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 238000005868 electrolysis reaction Methods 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000011800 void material Substances 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000002223 garnet Substances 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 238000005286 illumination Methods 0.000 abstract description 10
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000005457 optimization Methods 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000010411 cooking Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
Driving LED pieces can be directly exchanged the invention provides one kind, belong to field of LED illumination.Wherein, described one kind, which can directly exchange driving LED pieces, includes LED wafer, gold thread, fluorescent colloid, metal pins, substrate, rectifier bridge diode wafer group, constant current IC wafers, 0603 type Chip-R.Described one kind can directly exchange driving LED pieces without lamp bracket, no-reflection cover, without external conversion electric power, without cell-shell, be directly inserted in by two metal pins of lamp piece on the lamp socket for have been turned on civil power and illumination functions can be achieved.Farthest the part of optimization LED is constituted and product structure the present invention on the premise of LED lighting demand is met, provide the user one kind can both realize illumination functions, the LED illumination product of cheaper, enhances Consumer's Experience, improves user satisfaction again.
Description
Technical field
The present invention relates to field of LED illumination, there is high efficiency and heat radiation ability in particular to one kind and can be directly by handing over
The electrically driven (operated) LED pieces in city are flowed, this LED pieces possesses the illumination functions of LED bulb.
Background technology
Progressively withdrawn from the market with the incandescent lamp of highly energy-consuming, the illuminating product that LED type illuminating product turns into optimal is just rapid
Capture illumination market.Common patch-type LED and filament LED is required to external civil power conversion electric power, by alternating current
Be converted to direct current and then supply LED luminescence components, driving LED luminescence components light.This two classes LED lamp, is required to simultaneously
LED luminescence components are attached on specific fitting structure（Such as lamp bracket, reflection shield, cell-shell）It can use.Therefore, how by new
Technical scheme, allow LED lamp can be not added with civil power conversion electric power and unnecessary fitting structure can reach it is normal using will
It is vast lighting engineering personnel engineering technology problem in the urgent need to address to ask.
The content of the invention
It is an object of the invention to create it is a kind of it is brand-new can directly exchange driving LED pieces, this LED pieces without lamp bracket,
No-reflection cover, without conversion electric power, without cell-shell, be directly inserted in by two metal pins of lamp piece on the lamp socket for have been turned on civil power i.e.
Illumination functions can be achieved.The present invention farthest optimizes the part of LED on the premise of ensureing to meet LED lighting demand
Composition and product structure, provide the user one kind can both realize illumination functions, and the LED illumination product of cheaper, strengthen
Consumer's Experience, improves user satisfaction.
Embodiments of the invention are that following manner is realized：
The embodiment of the present invention, which is to provide one kind, can directly exchange driving LED pieces, and described one kind can directly exchange driving LED
Piece includes LED wafer, gold thread, fluorescent colloid, metal pins, substrate, rectifier bridge diode wafer group, constant current IC wafers, electrolysis
Copper wire, 0603 type Chip-R.Described substrate, is made by hard material, and such hard material can be metal, pottery
Porcelain, sapphire, acrylic etc., are provided with the electrolysis copper wire of specific function on substrate, electrolysis copper wire is other on substrate
Component is provided and is conductively connected；Described rectifier bridge diode wafer group, is arranged on mains electricity input end；Described resistance and constant current
IC wafers are arranged on the output end of rectifier bridge diode wafer group, and the output end access LED wafer of the constant current IC wafers lights
Group；Described LED wafer is arranged on the luminous groups of LED wafer die bond substrate regions composition LED of substrate, LED die bond substrate regions
Hollow out arranged for interval；Described fluorescent colloid is coated in the two sides of substrate by special coating processes, by substrate and substrate
Component it is fully wrapped around；Described metal pins are arranged on one end of substrate, and this metal pins is civil power and the electricity of LED pieces
The joint in source；Rectifier bridge diode wafer, LED wafer, constant current IC wafers, resistance that described gold thread is used in connecting substrate etc.
Component and electrolysis copper wire；Described fluorescent glue is formed by the fluorescent material with specific Ratio of filler bitumen and silica gel modulation.
The beneficial effect of the embodiment of the present invention is：
The embodiment of the present invention, which provides one kind, can directly exchange driving LED pieces（Hereinafter LED pieces）, civil power passes through described
The metal pins of LED pieces are powered to LED pieces, in the other end of LED pieces metal pins are set by being electrolysed copper wire
Rectifier bridge diode wafer group, described rectifier bridge diode wafer group is made up of 4 bridge heap diode wafers, works as civil power
After leading to rectifier bridge diode wafer group through metal pins, electric main will be rectified into direct current.Electric main is rectified bridge
Lead to the compound action of 0603 type resistance and constant current IC wafers, 0603 type resistance and constant current IC wafers after diode wafer group rectification
It is that the direct current that will be received supplies LED wafer group in the form of constant current, so far the electric wiring of LED pieces is to complete,
Electric main without setting the conversion electric power that the exchange outside independently of LED pieces turns direct current that the drive to LED pieces can be achieved again
It is dynamic.
In LED wafer group region, substrate has been configured to be spaced the structure of hollow out.The structure of this interval hollow out can increase
The area of dissipation of LED light-emitting zones, and openwork part can provide cross-ventilation function for LED pieces, air is flowing through hollow out
The heat that LED wafer group gives out can be taken away during position, further increase the heat-sinking capability of LED pieces.
In LED wafer die bond region, substrate has been configured to concave inward structure, and the width of substrate female parts is less than LED crystalline substances
The width of piece.Because indent substrate width is less than the width of LED wafer, therefore after LED wafer is lit, LED wafer is not by substrate
The part of covering will have blue light to be transmitted to side of the substrate without LED wafer, and so far substrate two sides will all have what LED wafer was sent
Blue light is covered.After the both sides coating fluorescent glue of substrate, the blue light that LED wafer is sent is by 360 ° of exciting in fluorescent glue without dead angle
Fluorescent material and send white light, the blue light that LED wafer is sent is absorbed by fluorescent glue to greatest extent, so as to improve luminous flux
Output, this characteristic makes the characteristics of LED pieces possess specular removal, no color differnece.
The substrate of LED pieces, component are wrapped up entirely using fluorescent glue.This fluorescent glue has two kinds of functions, the first work(
Can be that fluorescent glue absorbs LED wafer blue light and sends white light there is provided the translation function of electric energy and luminous energy；Second of function be due to
Fluorescent glue is good insulating body, and fluorescent glue is wrapped up and will provided after substrate and component for LED pieces with the safety being electrically insulated entirely
Function.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be attached to what is used required in embodiment
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore is not construed as pair
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
Fig. 1 is the board structure and circuit layout of LED pieces provided in an embodiment of the present invention.
Fig. 2 is the component layout drawing of LED pieces provided in an embodiment of the present invention.
Fig. 3 is the substrate back partial enlarged drawing of a-quadrant in Fig. 2.
Fig. 4 is the use schematic diagram of LED pieces provided in an embodiment of the present invention.
Fig. 5 is the electrical schematic diagram of LED pieces provided in an embodiment of the present invention.
Icon：1- bridge heap diode pads；2- gold threads weld zone；3-0603 type Chip-R pads；4- metal pins are consolidated
Determine area；5- constant currents IC exports weld zone；6- constant current IC wafer FX；7-LED chip fixed bits；8- substrates void region；
9- substrates；10-LED chipset cascades weld zone；11- gold threads；12-LED chips；13- bridge heap diode wafers；14-0603 types
Resistance；15- metal pins；16- lamp sockets；17- commutation diodes sets of wafers cascades pad；18-LED chip die bond substrates；
19- constant current IC wafers；20- fluorescent colloids.
Embodiment
It is right below in conjunction with the accompanying drawing in the embodiment of the present invention to make the technical scheme of the embodiment of the present invention clearer
Technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is a part of the invention
Embodiment, rather than whole embodiments.
Therefore, the detailed description of embodiments of the invention below to providing in the accompanying drawings is not intended to limit claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiment in the present invention, this area is common
The every other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model that the present invention is protected
Enclose.
It should be noted that：Similar label represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi accompanying drawing
In be defined, then it further need not be defined and explained in subsequent accompanying drawing.
Fig. 1 is refer to, Fig. 1 is the board structure and circuit layout of LED pieces provided in an embodiment of the present invention.Institute in figure
Some dash areas are the conducting wires that cathode copper makes, and this conducting wire is closely attached on substrate.4 poles of rectification two
Pipe wafer pad（1）It is arranged on substrate（9）Upper end, size be 45mil square region；Diode wafer pad（1）
Line space be 1mm, column pitch is 4.8mm, and upper two pads of rectifier bridge diode wafer pad group are provided with gold thread welding
Area（2）.Metal pins fixed area is provided between 4 commutation diode wafer pad groups（4）, 0603 type Chip-R pad
（3）, constant current IC FX（6）Pad is cascaded with commutation diode sets of wafers（17）.Described metal pins fixed area（4）
Two metal pins be fixed as spacing 3.3-4mm, this spacing ensure that when city is electrically accessed that zero line and live wire are in and not climb electricity
Safe spacing.In substrate（9）LED wafer die bond region, by substrate（9）It is arranged to void region（8）With LED die bond substrates
（18）The structure being intervally arranged, wherein void region（8）Width be 1.0mm, LED die bond substrates（18）Width be 0.5mm.
In every LED die bond substrate（18）The LED wafer fixed bit that 7 groups of spacing are 2.8mm is set（7）, LED wafer fixed bit（7）It is in
Existing inner concave shape, indent most narrow partial width is 0.25mm, and the starting position of concave inward structure is where two short sides of LED wafer
Position.LED wafer group cascades weld zone（10）It is arranged on the two ends in LED die bonds region.
Referring to Fig.1 and 2, Fig. 2 is the component layout drawing of LED pieces provided in an embodiment of the present invention.First in Fig. 1
Jackshaft heap diode pad（1）, 0603 type Chip-R pad（3）, metal pins fixed area（4）Coating a layer thickness is
0.1mm tin paste layer, then places bridge heap diode wafer on corresponding position（13）, 0603 type resistance（14）, metal draws
Pin（15）.Place after corresponding component, by whole substrate（9）Maximum temperature is sent into allow tin cream to melt in 240 DEG C of Reflow Soldering
Change, make bridge heap diode wafer（13）, 0603 type resistance（14）, metal pins（15）It is firm to combine in substrate（9）On.
Continue referring to Fig. 2, LED die bond substrates（18）It is substrate（9）One of part.In LED wafer die bond base
Plate（18）LED wafer fixed bit（7）The die bond insulating cement KER3200-T5 of upper one layer of silicon composition of spot printing, is then set using special
It is standby by LED wafer（12）Be placed into the surface put and coated KER3200-T5 insulating cements, after the completion of 160 DEG C of oven cooking cycle of feeding
2 hours, insulation adhesive curing is allowed, so that LED wafer（12）It is firmly fixed to substrate（9）LED wafer die bond substrate（18）
On.In constant current IC wafer FX（6）Using with LED wafer（12）The same fixed form fixes a constant current IC wafer
(19), constant current IC wafers herein（19）The electric current that the output size that can stablize after energization is 8mA.
Fig. 3 is refer to, Fig. 3 is the substrate back partial enlarged drawing of a-quadrant in Fig. 2.It will be seen that solid from figure
Set LED wafer（12）Afterwards, from the back side of substrate, due to the presence of concave inward structure, LED wafer（12）Back portion is exposed
In substrate（9）Outside, such a structure is conducive to LED wafer（12）After lighting, LED wafer（12）The blue light directive substrate sent
The back side.
The component for completing to complete LED pieces after above step is installed.
Fig. 2 and Fig. 5 are refer to, Fig. 5 is the electrical schematic diagram of LED pieces provided in an embodiment of the present invention.As shown in Figure 5
Electrical schematic diagram uses gold thread（11）Each component on substrate is electrically connected.Selected gold thread（11）It is a diameter of
0.8mil, welding manner welds for special board ultrasonic wave discharge mode.
The electrical structure for completing to complete LED pieces after above-mentioned steps makes.Next need to be in substrate（9）Two sides apply
Cover one layer of fluorescent colloid（20）, fluorescent colloid（20）Need that 360 ° of omnidirectionals are seamless wraps substrate.Described fluorescent colloid
（20）Nitride red fluorescent powder and yttrium-aluminium-garnet yellowish green fluorescent powder is used to be allocated in mixing viscosity for 40000cps silica gel
Form, wherein red fluorescence powder：Yellowish green fluorescent powder：Silica gel=1:4:20.Fluorescent colloid is coated（20）Afterwards, by whole substrate
The oven cooking cycle of 150 DEG C of feeding 4 hours, makes fluorescent colloid（20）It is fully cured.Finished product after solidification is to have obtained final production
Product.
For the convenience for intuitively embodying the novelty for the LED pieces that the present invention is provided and using, Fig. 4, Fig. 4 refer to
For the use schematic diagram of LED pieces provided in an embodiment of the present invention.Lamp socket in Fig. 4（16）Provide the user, lamp socket（16）Inside set
The metal pins of the LED pieces provided with the present invention are provided（15）Suitable female seat, this female seat directly with the zero line of civil power with
Live wire is connected.Insertion lamp socket of the LED pieces that the present invention is provided regardless of direction（16）LED pieces can be achieved afterwards lights photograph
It is bright.
Claims (8)
1. one kind can directly exchange driving LED pieces, it is characterised in that described one kind can directly exchange driving LED pieces bag
Include LED wafer, gold thread, fluorescent colloid, metal pins, substrate, rectifier bridge diode wafer group, constant current IC wafers, electrolysis copper cash
Road, 0603 type Chip-R.
2. fluorescent colloid according to claim 1 is by being mixed with a certain proportion of Nitride phosphor and yttrium-aluminium-garnet fluorescence
Powder viscosity reconciles for 40000cps silica gel and formed.
3. metal pins according to claim 1 are made up of two bonding jumpers, two bonding jumpers are arranged on described one kind
The same one end of driving LED pieces can directly be exchanged.
4. substrate according to claim 1 has die bond substrate and the spaced apart structure in void region in LED die bonds region
Make.
5. substrate according to claim 1 is made up of hard material, its material can be metal, ceramics, sapphire, Ya Ke
Power plate.
6. rectifier bridge diode wafer group according to claim 1 is by 4 same specifications, the commutation diode wafer of same model
Composition.
7. matrix arrangement is presented in the commutation diode wafer of 4 same specifications according to claim 6, same model, same at 4
0603 type resistance pad, constant current IC wafers are provided with specification, the commutation diode wafer area defined of copper model to fix
Region and metal pins FX.
8. fluorescent colloid according to claim 1 is wrapped 360 ° of omnidirectionals of component on substrate and substrate are seamless.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710635340.5A CN107246553A (en) | 2017-07-30 | 2017-07-30 | One kind can directly exchange driving LED pieces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710635340.5A CN107246553A (en) | 2017-07-30 | 2017-07-30 | One kind can directly exchange driving LED pieces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107246553A true CN107246553A (en) | 2017-10-13 |
Family
ID=60012995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710635340.5A Pending CN107246553A (en) | 2017-07-30 | 2017-07-30 | One kind can directly exchange driving LED pieces |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107246553A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108253318A (en) * | 2018-01-23 | 2018-07-06 | 宁波市杰立光电科技有限公司 | A kind of LEDG9 light bulbs with new structure |
| CN109801568A (en) * | 2019-03-26 | 2019-05-24 | 大连集思特科技有限公司 | A kind of LED tandem type transparent display screen |
| CN110388612A (en) * | 2019-07-02 | 2019-10-29 | 浙江阳光美加照明有限公司 | Color temperature-tunable LED light strand and the LED filament lamp for using the LED light strand |
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| CN102386311A (en) * | 2011-11-09 | 2012-03-21 | 珠海晟源同泰电子有限公司 | Integrated light-emitting diode (LED) light source and manufacturing method thereof |
| US20140197433A1 (en) * | 2010-01-22 | 2014-07-17 | Sharp Kabushiki Kaisha | Light emitting device |
| US20150176824A1 (en) * | 2007-03-15 | 2015-06-25 | Sharp Kabushiki Kaisha | Light emitting device and method for manufacturing the same |
| CN104893309A (en) * | 2015-06-10 | 2015-09-09 | 广州市爱易迪新材料科技有限公司 | Silica gel bracket, LED device and production method of LED device |
| CN105570733A (en) * | 2015-09-30 | 2016-05-11 | 浙江三磊科技有限公司 | LED module and LED point light source lamp |
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| US20150176824A1 (en) * | 2007-03-15 | 2015-06-25 | Sharp Kabushiki Kaisha | Light emitting device and method for manufacturing the same |
| US20140197433A1 (en) * | 2010-01-22 | 2014-07-17 | Sharp Kabushiki Kaisha | Light emitting device |
| CN102386311A (en) * | 2011-11-09 | 2012-03-21 | 珠海晟源同泰电子有限公司 | Integrated light-emitting diode (LED) light source and manufacturing method thereof |
| CN104893309A (en) * | 2015-06-10 | 2015-09-09 | 广州市爱易迪新材料科技有限公司 | Silica gel bracket, LED device and production method of LED device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108253318A (en) * | 2018-01-23 | 2018-07-06 | 宁波市杰立光电科技有限公司 | A kind of LEDG9 light bulbs with new structure |
| CN109801568A (en) * | 2019-03-26 | 2019-05-24 | 大连集思特科技有限公司 | A kind of LED tandem type transparent display screen |
| CN110388612A (en) * | 2019-07-02 | 2019-10-29 | 浙江阳光美加照明有限公司 | Color temperature-tunable LED light strand and the LED filament lamp for using the LED light strand |
| CN110388612B (en) * | 2019-07-02 | 2024-04-12 | 浙江阳光美加照明有限公司 | Color temperature-adjustable LED filament strip and LED filament lamp using same |
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Address after: Suining City, Sichuan province Hondar 629299 Shehong road Jiaxing County Shunxin triumph city 1-18-4 Applicant after: Huang Qin Address before: 629000 Suining City, Sichuan Province Hedong District de water Road No. 56 mile international 3-17-4 Applicant before: Huang Qin |
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Application publication date: 20171013 |