CN107239088B - 一种激光加工晶圆的控制方法及系统 - Google Patents
一种激光加工晶圆的控制方法及系统 Download PDFInfo
- Publication number
- CN107239088B CN107239088B CN201710574394.5A CN201710574394A CN107239088B CN 107239088 B CN107239088 B CN 107239088B CN 201710574394 A CN201710574394 A CN 201710574394A CN 107239088 B CN107239088 B CN 107239088B
- Authority
- CN
- China
- Prior art keywords
- laser
- wafer
- liquid crystal
- silicon
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D27/00—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
- G05D27/02—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710574394.5A CN107239088B (zh) | 2017-07-14 | 2017-07-14 | 一种激光加工晶圆的控制方法及系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710574394.5A CN107239088B (zh) | 2017-07-14 | 2017-07-14 | 一种激光加工晶圆的控制方法及系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107239088A CN107239088A (zh) | 2017-10-10 |
CN107239088B true CN107239088B (zh) | 2018-10-09 |
Family
ID=59991537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710574394.5A Active CN107239088B (zh) | 2017-07-14 | 2017-07-14 | 一种激光加工晶圆的控制方法及系统 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107239088B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109085558B (zh) * | 2018-09-21 | 2023-12-29 | 深圳市速腾聚创科技有限公司 | 相控阵激光雷达及其控制方法 |
CN109530931B (zh) * | 2018-12-27 | 2021-01-12 | 北京中科镭特电子有限公司 | 一种激光加工芯片的方法及装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1799753A (zh) * | 2005-01-05 | 2006-07-12 | 株式会社迪斯科 | 激光束加工机 |
CN202494863U (zh) * | 2012-04-06 | 2012-10-17 | 胡贞 | 一种通过对高斯光斑检测定位的均匀光刻系统 |
CN102896421A (zh) * | 2012-07-30 | 2013-01-30 | 沈明亚 | 采用lcos的激光微加工系统及其加工方法 |
JP2013230477A (ja) * | 2012-04-27 | 2013-11-14 | Disco Corp | レーザー加工装置及びレーザー加工方法 |
CN106938370A (zh) * | 2015-12-30 | 2017-07-11 | 上海微电子装备有限公司 | 一种激光加工系统及方法 |
-
2017
- 2017-07-14 CN CN201710574394.5A patent/CN107239088B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1799753A (zh) * | 2005-01-05 | 2006-07-12 | 株式会社迪斯科 | 激光束加工机 |
CN202494863U (zh) * | 2012-04-06 | 2012-10-17 | 胡贞 | 一种通过对高斯光斑检测定位的均匀光刻系统 |
JP2013230477A (ja) * | 2012-04-27 | 2013-11-14 | Disco Corp | レーザー加工装置及びレーザー加工方法 |
CN102896421A (zh) * | 2012-07-30 | 2013-01-30 | 沈明亚 | 采用lcos的激光微加工系统及其加工方法 |
CN106938370A (zh) * | 2015-12-30 | 2017-07-11 | 上海微电子装备有限公司 | 一种激光加工系统及方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107239088A (zh) | 2017-10-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107378232B (zh) | 一种激光加工晶圆的方法及系统 | |
CN101126905B (zh) | 具有对焦机构的直写光刻装置 | |
CN105008085A (zh) | 激光加工装置和激光加工方法 | |
CN103034062B (zh) | 用于晶片边缘曝光的方法、光学模块和自动聚焦系统 | |
TWI629573B (zh) | Exposure system, exposure device and exposure method | |
CN104115068B (zh) | 装置、光刻设备、用于引导辐射的方法以及装置制造方法 | |
TWI584334B (zh) | 具有準直感測器和射束測量感測器的帶電粒子微影系統 | |
CN105050764A (zh) | 用于使用两个可旋转的衍射光学元件形成多个激光束组的设备和方法 | |
CN103597404A (zh) | 光刻设备、可编程图案形成装置以及光刻方法 | |
JP5916755B2 (ja) | 干渉格子を試料上に形成するための装置 | |
CN212569305U (zh) | 一种激光光束整形装置 | |
TW201029782A (en) | Laser machining device | |
CN105817758A (zh) | 一种飞秒激光加工多彩结构色的方法、加工系统及采集系统 | |
CN107239088B (zh) | 一种激光加工晶圆的控制方法及系统 | |
CN103317228B (zh) | 飞秒激光微加工的同步监测装置 | |
TW201535065A (zh) | 微影系統 | |
US20130329222A1 (en) | Inspecting apparatus and method for manufacturing semiconductor device | |
CN115026449A (zh) | 一种紧聚焦飞秒激光光束的准直性调校方法及装置 | |
CN107665821B (zh) | 一种激光退火装置及方法 | |
CN104678710B (zh) | 边缘曝光装置 | |
CN110064839A (zh) | 一种激光退火装置 | |
CN104280851B (zh) | 一种调焦调平自身零平面调整装置和方法 | |
CN112781839B (zh) | 一种透镜性能测试系统 | |
CN107378258B (zh) | 一种激光加工晶圆的方法及系统 | |
CN206057795U (zh) | 光学引擎装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190530 Address after: 100176 Beijing Daxing District Beijing Economic and Technological Development Zone Patentee after: Beijing Zhongke Radium Electronics Co., Ltd. Address before: No. 3, North Tu Cheng West Road, Chaoyang District, Beijing Patentee before: Institute of Microelectronics, Chinese Academy of Sciences |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Control method and system of laser processing wafer Effective date of registration: 20200114 Granted publication date: 20181009 Pledgee: Beijing Zhongke micro Intellectual Property Service Co., Ltd. Pledgor: Beijing Zhongke Radium Electronics Co., Ltd. Registration number: Y2020990000053 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220614 Granted publication date: 20181009 Pledgee: Beijing Zhongke Micro Intellectual Property Service Co.,Ltd. Pledgor: BEIJING ZHONGKE LEITE ELECTRONICS Co.,Ltd. Registration number: Y2020990000053 |