CN107378232B - 一种激光加工晶圆的方法及系统 - Google Patents
一种激光加工晶圆的方法及系统 Download PDFInfo
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- CN107378232B CN107378232B CN201710574399.8A CN201710574399A CN107378232B CN 107378232 B CN107378232 B CN 107378232B CN 201710574399 A CN201710574399 A CN 201710574399A CN 107378232 B CN107378232 B CN 107378232B
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- laser
- laser beam
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- wafer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
- H01L21/02354—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light using a coherent radiation, e.g. a laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710574399.8A CN107378232B (zh) | 2017-07-14 | 2017-07-14 | 一种激光加工晶圆的方法及系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710574399.8A CN107378232B (zh) | 2017-07-14 | 2017-07-14 | 一种激光加工晶圆的方法及系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107378232A CN107378232A (zh) | 2017-11-24 |
CN107378232B true CN107378232B (zh) | 2019-03-15 |
Family
ID=60340706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201710574399.8A Active CN107378232B (zh) | 2017-07-14 | 2017-07-14 | 一种激光加工晶圆的方法及系统 |
Country Status (1)
Country | Link |
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CN (1) | CN107378232B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109616433B (zh) * | 2018-12-03 | 2021-03-12 | 上海华力微电子有限公司 | 一种晶圆转速监控装置及监控方法 |
CN109530928B (zh) * | 2018-12-27 | 2021-03-05 | 北京中科镭特电子有限公司 | 一种激光加工芯片的方法及装置 |
CN109530929B (zh) * | 2018-12-27 | 2021-03-19 | 北京中科镭特电子有限公司 | 一种激光加工芯片的方法 |
CN110587159A (zh) * | 2019-09-23 | 2019-12-20 | 广东工业大学 | 一种实时监测激光加工性能的系统及方法 |
CN111859626A (zh) * | 2020-06-28 | 2020-10-30 | 西安中科微精光子制造科技有限公司 | 一种boe的设计方法及基于boe的激光加工装置 |
JP2023153432A (ja) * | 2020-09-01 | 2023-10-18 | 株式会社ブイ・テクノロジー | レーザ加工装置及びレーザ加工方法 |
JP2023153433A (ja) * | 2020-09-02 | 2023-10-18 | 株式会社ブイ・テクノロジー | レーザ加工装置及びレーザ加工方法 |
CN115916451B (zh) * | 2020-10-16 | 2024-02-20 | 百超激光有限公司 | 用于计算空间和时间分辨的、组合的设定点数据集的方法、控制单元和激光切割系统 |
CN116423048B (zh) * | 2023-06-09 | 2023-08-15 | 中国船舶集团有限公司第七〇七研究所 | 一种光电控焦激光焊接装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5016223B2 (ja) * | 2006-01-06 | 2012-09-05 | 積水化学工業株式会社 | 基材外周処理装置 |
CN202494863U (zh) * | 2012-04-06 | 2012-10-17 | 胡贞 | 一种通过对高斯光斑检测定位的均匀光刻系统 |
JP6425368B2 (ja) * | 2012-04-27 | 2018-11-21 | 株式会社ディスコ | レーザー加工装置及びレーザー加工方法 |
JP2013230478A (ja) * | 2012-04-27 | 2013-11-14 | Disco Corp | レーザー加工装置及びレーザー加工方法 |
CN102896421B (zh) * | 2012-07-30 | 2015-12-02 | 沈明亚 | 采用lcos的激光微加工系统及其加工方法 |
CN106298636B (zh) * | 2015-05-22 | 2019-05-14 | 中芯国际集成电路制造(上海)有限公司 | 一种超低k介质材料刻蚀深度的控制方法 |
CN106938370B (zh) * | 2015-12-30 | 2019-12-24 | 上海微电子装备(集团)股份有限公司 | 一种激光加工系统及方法 |
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2017
- 2017-07-14 CN CN201710574399.8A patent/CN107378232B/zh active Active
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Publication number | Publication date |
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CN107378232A (zh) | 2017-11-24 |
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TR01 | Transfer of patent right |
Effective date of registration: 20190603 Address after: 100176 Beijing Daxing District Beijing Economic and Technological Development Zone Patentee after: Beijing Zhongke Radium Electronics Co., Ltd. Address before: No. 3, North Tu Cheng West Road, Chaoyang District, Beijing Patentee before: Institute of Microelectronics, Chinese Academy of Sciences |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Method and system for processing wafer by adopting laser Effective date of registration: 20200114 Granted publication date: 20190315 Pledgee: Beijing Zhongke micro Intellectual Property Service Co., Ltd. Pledgor: Beijing Zhongke Radium Electronics Co., Ltd. Registration number: Y2020990000053 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220614 Granted publication date: 20190315 Pledgee: Beijing Zhongke Micro Intellectual Property Service Co.,Ltd. Pledgor: BEIJING ZHONGKE LEITE ELECTRONICS Co.,Ltd. Registration number: Y2020990000053 |
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