CN107239088A - 一种激光加工晶圆的控制方法及系统 - Google Patents
一种激光加工晶圆的控制方法及系统 Download PDFInfo
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- CN107239088A CN107239088A CN201710574394.5A CN201710574394A CN107239088A CN 107239088 A CN107239088 A CN 107239088A CN 201710574394 A CN201710574394 A CN 201710574394A CN 107239088 A CN107239088 A CN 107239088A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D27/00—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
- G05D27/02—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109085558A (zh) * | 2018-09-21 | 2018-12-25 | 深圳市速腾聚创科技有限公司 | 相控阵激光雷达及其控制方法 |
CN109530931A (zh) * | 2018-12-27 | 2019-03-29 | 北京中科镭特电子有限公司 | 一种激光加工芯片的方法及装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1799753A (zh) * | 2005-01-05 | 2006-07-12 | 株式会社迪斯科 | 激光束加工机 |
CN202494863U (zh) * | 2012-04-06 | 2012-10-17 | 胡贞 | 一种通过对高斯光斑检测定位的均匀光刻系统 |
CN102896421A (zh) * | 2012-07-30 | 2013-01-30 | 沈明亚 | 采用lcos的激光微加工系统及其加工方法 |
JP2013230477A (ja) * | 2012-04-27 | 2013-11-14 | Disco Corp | レーザー加工装置及びレーザー加工方法 |
CN106938370A (zh) * | 2015-12-30 | 2017-07-11 | 上海微电子装备有限公司 | 一种激光加工系统及方法 |
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2017
- 2017-07-14 CN CN201710574394.5A patent/CN107239088B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1799753A (zh) * | 2005-01-05 | 2006-07-12 | 株式会社迪斯科 | 激光束加工机 |
CN202494863U (zh) * | 2012-04-06 | 2012-10-17 | 胡贞 | 一种通过对高斯光斑检测定位的均匀光刻系统 |
JP2013230477A (ja) * | 2012-04-27 | 2013-11-14 | Disco Corp | レーザー加工装置及びレーザー加工方法 |
CN102896421A (zh) * | 2012-07-30 | 2013-01-30 | 沈明亚 | 采用lcos的激光微加工系统及其加工方法 |
CN106938370A (zh) * | 2015-12-30 | 2017-07-11 | 上海微电子装备有限公司 | 一种激光加工系统及方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109085558A (zh) * | 2018-09-21 | 2018-12-25 | 深圳市速腾聚创科技有限公司 | 相控阵激光雷达及其控制方法 |
CN109085558B (zh) * | 2018-09-21 | 2023-12-29 | 深圳市速腾聚创科技有限公司 | 相控阵激光雷达及其控制方法 |
CN109530931A (zh) * | 2018-12-27 | 2019-03-29 | 北京中科镭特电子有限公司 | 一种激光加工芯片的方法及装置 |
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Effective date of registration: 20190530 Address after: 100176 Beijing Daxing District Beijing Economic and Technological Development Zone Patentee after: Beijing Zhongke Radium Electronics Co., Ltd. Address before: No. 3, North Tu Cheng West Road, Chaoyang District, Beijing Patentee before: Institute of Microelectronics, Chinese Academy of Sciences |
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Denomination of invention: Control method and system of laser processing wafer Effective date of registration: 20200114 Granted publication date: 20181009 Pledgee: Beijing Zhongke micro Intellectual Property Service Co., Ltd. Pledgor: Beijing Zhongke Radium Electronics Co., Ltd. Registration number: Y2020990000053 |
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Date of cancellation: 20220614 Granted publication date: 20181009 Pledgee: Beijing Zhongke Micro Intellectual Property Service Co.,Ltd. Pledgor: BEIJING ZHONGKE LEITE ELECTRONICS Co.,Ltd. Registration number: Y2020990000053 |